TWI223289B - Dielectric structure, and capacitor and printed circuit board having the same and manufacturing method thereof - Google Patents

Dielectric structure, and capacitor and printed circuit board having the same and manufacturing method thereof Download PDF

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Publication number
TWI223289B
TWI223289B TW091134265A TW91134265A TWI223289B TW I223289 B TWI223289 B TW I223289B TW 091134265 A TW091134265 A TW 091134265A TW 91134265 A TW91134265 A TW 91134265A TW I223289 B TWI223289 B TW I223289B
Authority
TW
Taiwan
Prior art keywords
dielectric
dielectric layer
layer
plating
capacitor
Prior art date
Application number
TW091134265A
Other languages
English (en)
Chinese (zh)
Other versions
TW200301494A (en
Inventor
Craig S Allen
Maria Anna Rzeznik
S Matthew Cairns
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of TW200301494A publication Critical patent/TW200301494A/zh
Application granted granted Critical
Publication of TWI223289B publication Critical patent/TWI223289B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
TW091134265A 2001-11-26 2002-11-26 Dielectric structure, and capacitor and printed circuit board having the same and manufacturing method thereof TWI223289B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33338301P 2001-11-26 2001-11-26
US10/268,433 US6661642B2 (en) 2001-11-26 2002-10-10 Dielectric structure

Publications (2)

Publication Number Publication Date
TW200301494A TW200301494A (en) 2003-07-01
TWI223289B true TWI223289B (en) 2004-11-01

Family

ID=26953090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091134265A TWI223289B (en) 2001-11-26 2002-11-26 Dielectric structure, and capacitor and printed circuit board having the same and manufacturing method thereof

Country Status (5)

Country Link
US (1) US6661642B2 (https=)
EP (1) EP1315407A3 (https=)
JP (1) JP2004002956A (https=)
KR (1) KR20030043715A (https=)
TW (1) TWI223289B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132642B2 (en) * 2001-07-09 2006-11-07 Nartron Corporation Anti-entrapment systems for preventing objects from being entrapped by translating devices
US7162928B2 (en) * 2004-12-06 2007-01-16 Nartron Corporation Anti-entrapment system
US7293467B2 (en) * 2001-07-09 2007-11-13 Nartron Corporation Anti-entrapment system
US6872468B1 (en) 2003-10-09 2005-03-29 Motorola, Inc. Peelable circuit board foil
JP2005181958A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc レーザーアブレーションを用いる電子部品および光学部品の形成方法
US7193838B2 (en) 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
TWI268522B (en) * 2004-07-29 2006-12-11 Rohm And Haas Electronic Materials L L C Dielectric structure
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
EP1693484A3 (en) * 2005-02-15 2007-06-20 Rohm and Haas Electronic Materials, L.L.C. Plating Method
US7312591B2 (en) 2005-03-11 2007-12-25 Npc Corporation Powered panel moving system
KR100691437B1 (ko) * 2005-11-02 2007-03-09 삼성전기주식회사 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판
US7342373B2 (en) * 2006-01-04 2008-03-11 Nartron Corporation Vehicle panel control system
US9254536B2 (en) * 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material
US20110232758A1 (en) * 2010-03-25 2011-09-29 Rohm And Haas Electronic Materials Llc Thin film photovoltaic cell
US8415227B2 (en) * 2011-08-29 2013-04-09 Intermolecular, Inc. High performance dielectric stack for DRAM capacitor
WO2013151988A1 (en) * 2012-04-02 2013-10-10 Translith Systems, Llc Method and apparatus for the line narrowing of diode lasers
FR3045036B1 (fr) * 2015-12-15 2017-12-22 Commissariat Energie Atomique Procede de preparation d'une solution sol-gel utilisable pour la preparation d'une ceramique de titanate de baryum dope par du hafnium et/ou par au moins un element lanthanide
US10796990B2 (en) * 2018-09-19 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure, package structure, and manufacturing method thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143995A1 (de) * 1981-11-05 1983-05-19 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Dickschichtkondensator in druckschaltungstechnik
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JP2531906B2 (ja) 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 発泡重合体
US5835174A (en) 1995-10-12 1998-11-10 Rohm And Haas Company Droplets and particles containing liquid crystal and films and apparatus containing the same
JPH1056251A (ja) * 1996-08-08 1998-02-24 Sony Corp 電子部品内蔵プリント基板およびその製造方法
JP2001503197A (ja) 1996-08-12 2001-03-06 エナージーニアス，インコーポレイテッド 半導体スーパーキャパシタシステム、その製法、及び該製法による製品
US5742471A (en) 1996-11-25 1998-04-21 The Regents Of The University Of California Nanostructure multilayer dielectric materials for capacitors and insulators
US5895263A (en) 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US5856068A (en) * 1997-05-02 1999-01-05 Motorola, Inc. Method for fabricating a printed circuit board by curing under superatmospheric pressure
US6432472B1 (en) 1997-08-15 2002-08-13 Energenius, Inc. Method of making semiconductor supercapacitor system and articles produced therefrom
US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
JPH11297532A (ja) * 1998-04-15 1999-10-29 Murata Mfg Co Ltd 電子部品及びその製造方法
US6137192A (en) 1998-05-15 2000-10-24 Energenius, Inc. Embedded backup energy storage unit
US6093636A (en) 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method
US6420441B1 (en) 1999-10-01 2002-07-16 Shipley Company, L.L.C. Porous materials
US6623865B1 (en) 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
US6271273B1 (en) 2000-07-14 2001-08-07 Shipley Company, L.L.C. Porous materials

Also Published As

Publication number Publication date
TW200301494A (en) 2003-07-01
EP1315407A3 (en) 2005-05-25
KR20030043715A (ko) 2003-06-02
US20030128497A1 (en) 2003-07-10
JP2004002956A (ja) 2004-01-08
US6661642B2 (en) 2003-12-09
EP1315407A2 (en) 2003-05-28

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