TWI222839B - Method for encapsulation of electronic devices - Google Patents
Method for encapsulation of electronic devices Download PDFInfo
- Publication number
- TWI222839B TWI222839B TW091121839A TW91121839A TWI222839B TW I222839 B TWI222839 B TW I222839B TW 091121839 A TW091121839 A TW 091121839A TW 91121839 A TW91121839 A TW 91121839A TW I222839 B TWI222839 B TW I222839B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- sealing
- cap
- item
- spacer particles
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 48
- 238000005538 encapsulation Methods 0.000 title abstract 3
- 239000002245 particle Substances 0.000 claims abstract description 67
- 125000006850 spacer group Chemical group 0.000 claims abstract description 61
- 238000007789 sealing Methods 0.000 claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 88
- 239000010410 layer Substances 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 12
- 239000000565 sealant Substances 0.000 claims description 11
- 239000002346 layers by function Substances 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 10
- 239000012811 non-conductive material Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims 5
- 239000004838 Heat curing adhesive Substances 0.000 claims 1
- 238000007664 blowing Methods 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 239000012044 organic layer Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- DUGLMATUSUVYMV-UHFFFAOYSA-N 7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound C1=C(O2)C=CC2=C1 DUGLMATUSUVYMV-UHFFFAOYSA-N 0.000 description 1
- 241000208140 Acer Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 101150108558 PAD1 gene Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DSCZYJASEANQMS-UHFFFAOYSA-N [O-2].[Zn+2].[I+] Chemical compound [O-2].[Zn+2].[I+] DSCZYJASEANQMS-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- BGVWGPMAGMJLBU-UHFFFAOYSA-N ethenyl naphthalene-1-carboxylate Chemical compound C1=CC=C2C(C(=O)OC=C)=CC=CC2=C1 BGVWGPMAGMJLBU-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000002061 vacuum sublimation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/968,167 US8344360B2 (en) | 1999-12-17 | 1999-12-17 | Organic electronic devices with an encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI222839B true TWI222839B (en) | 2004-10-21 |
Family
ID=25513845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091121839A TWI222839B (en) | 1999-12-17 | 2002-09-24 | Method for encapsulation of electronic devices |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1430550A2 (ja) |
| JP (2) | JP2005505114A (ja) |
| CN (1) | CN100530755C (ja) |
| TW (1) | TWI222839B (ja) |
| WO (1) | WO2003030272A2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI712192B (zh) * | 2012-03-16 | 2020-12-01 | 美商環球展覽公司 | 電子裝置的邊緣阻隔薄膜 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI222839B (en) * | 1999-12-17 | 2004-10-21 | Osram Opto Semiconductors Gmbh | Method for encapsulation of electronic devices |
| US7394153B2 (en) | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
| ATE241253T1 (de) | 1999-12-17 | 2003-06-15 | Osram Opto Semiconductors Gmbh | Kapselung für organische leds |
| US7184202B2 (en) * | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
| DE102004049955B4 (de) * | 2004-10-13 | 2008-12-04 | Schott Ag | Verfahren zur Herstellung eines optischen Bauelements, insbesondere einer OLED |
| KR100796618B1 (ko) | 2007-01-04 | 2008-01-22 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그의 제조방법 |
| KR100924137B1 (ko) * | 2008-01-31 | 2009-10-29 | 삼성모바일디스플레이주식회사 | 유기전계발광표시장치 및 그의 제조방법 |
| KR101589754B1 (ko) * | 2009-10-13 | 2016-01-28 | 엘지디스플레이 주식회사 | 유기전계발광표시장치와 이의 제조방법 |
| CN101859880B (zh) * | 2010-05-06 | 2012-10-03 | 友达光电股份有限公司 | 电致发光显示装置及其制备方法 |
| KR20120138307A (ko) | 2011-06-14 | 2012-12-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| CN104505469B (zh) * | 2015-01-04 | 2017-04-05 | 京东方科技集团股份有限公司 | 一种有机发光二极管显示基板及其封装方法 |
| CN105990373B (zh) * | 2015-02-25 | 2019-04-12 | 群创光电股份有限公司 | 显示装置及其制造方法 |
| TWI569370B (zh) * | 2015-02-25 | 2017-02-01 | 群創光電股份有限公司 | 顯示裝置及其製造方法 |
| CN110112323B (zh) * | 2019-06-14 | 2022-05-13 | 京东方科技集团股份有限公司 | 一种oled封装结构、封装方法及显示器件 |
| WO2023119374A1 (ja) * | 2021-12-20 | 2023-06-29 | シャープディスプレイテクノロジー株式会社 | 表示装置 |
| CN117202726A (zh) * | 2023-09-13 | 2023-12-08 | 绵阳惠科光电科技有限公司 | 显示面板及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234161A (ja) * | 1985-04-10 | 1986-10-18 | Matsushita Electric Ind Co Ltd | 密着型イメ−ジセンサ |
| JPS62188092U (ja) * | 1986-05-21 | 1987-11-30 | ||
| JP4114895B2 (ja) * | 1998-07-08 | 2008-07-09 | Ｔｄｋ株式会社 | 有機ｅｌ表示装置 |
| JP2000040586A (ja) * | 1998-07-21 | 2000-02-08 | Tdk Corp | 有機ｅｌ素子モジュール |
| JP4246830B2 (ja) * | 1999-01-14 | 2009-04-02 | Ｔｄｋ株式会社 | 有機ｅｌ素子 |
| US6383664B2 (en) * | 1999-05-11 | 2002-05-07 | The Dow Chemical Company | Electroluminescent or photocell device having protective packaging |
| DE69935261T2 (de) * | 1999-12-17 | 2007-06-21 | Osram Opto Semiconductors Gmbh | Verbesserte kapselung organischer led-vorrichtungen |
| ATE241253T1 (de) * | 1999-12-17 | 2003-06-15 | Osram Opto Semiconductors Gmbh | Kapselung für organische leds |
| CN1204444C (zh) * | 1999-12-17 | 2005-06-01 | 奥斯兰姆奥普托半导体有限责任公司 | 改进的有机发光二极管器件 |
| TWI222839B (en) * | 1999-12-17 | 2004-10-21 | Osram Opto Semiconductors Gmbh | Method for encapsulation of electronic devices |
| CN1292499C (zh) * | 2000-09-06 | 2006-12-27 | 奥斯兰姆奥普托半导体股份有限两合公司 | Oled装置的密封 |
-
2002
- 2002-09-24 TW TW091121839A patent/TWI222839B/zh not_active IP Right Cessation
- 2002-09-30 JP JP2003533357A patent/JP2005505114A/ja active Pending
- 2002-09-30 WO PCT/EP2002/010963 patent/WO2003030272A2/en active Application Filing
- 2002-09-30 CN CNB028186664A patent/CN100530755C/zh not_active Expired - Lifetime
- 2002-09-30 EP EP02772353A patent/EP1430550A2/en not_active Ceased
-
2009
- 2009-10-30 JP JP2009251324A patent/JP2010027624A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI712192B (zh) * | 2012-03-16 | 2020-12-01 | 美商環球展覽公司 | 電子裝置的邊緣阻隔薄膜 |
| US11075357B2 (en) | 2012-03-16 | 2021-07-27 | Universal Display Corporation | Edge barrier film for electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1430550A2 (en) | 2004-06-23 |
| CN1557028A (zh) | 2004-12-22 |
| JP2010027624A (ja) | 2010-02-04 |
| CN100530755C (zh) | 2009-08-19 |
| JP2005505114A (ja) | 2005-02-17 |
| WO2003030272A2 (en) | 2003-04-10 |
| WO2003030272A3 (en) | 2003-07-17 |
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| KR20140029439A (ko) | 유기 광전자 장치 및 그의 봉입 방법 | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |