TWI222760B - Light-emitting device array module - Google Patents

Abstract

The present invention is related to a light-emitting device array module, which is mainly composed of substrate, carrying base board, chip, driving circuit chip and plural metal wires for electric connection. The carrying base board is disposed on the substrate, on which at least one chip and driving circuit chip are formed. Light-emitting device array and bonding pad array are disposed on the chip. Plural metal wires are connected with the chip and the bonding pad array of the driving circuit chip for electric connection. The driving circuit is used to drive the light-emitting diode of the light-emitting device array, in which both bonding pad array and bonding pad region are disposed on the top portion for electric connection with the substrate through plural metal wires, so as to increase the product yield and lower the production cost.

Description

1222760 V. Description of the invention (l)

[Technical Field to which the Invention belongs] The present invention is a technique applied to a printer head. Technology of light-emitting element array module [Prior technology] Ught-emitting diode arrays are now used in printer heads of printers or copiers. As shown in the first figure, the principle of a typical light-emitting diode printer head includes: an optical lens = for focusing the light emitted by the light-emitting diode; a light source area 7 2, 嗖, a body array element and The optical element is used to make the light emitting diode light source project through the lens 7 1 to the relative position of the photoconductor drum 70 of the printer, and the subsequent mechanism operates to print the relative pattern. —5 As shown in the figure, the complex luminous head required for the complex luminous head and the complex array of wafers 8 are produced by welding the conductive pattern of the photodiode bonding, as shown in the second figure, which is traditional to include a printed circuit board (pr diode). The full length of the array chip 8 2 is mounted on the printing driving device 8 3 ′ and is arranged in parallel 2 and is mounted on the wire bonding array chip 8 2 electrically connected to the driving device 8; There must be the following disadvantages: • ▼ W, 4, ~ ,,, σ 4 and then no integrated circuit board) β 1, the end of the printed circuit board 8 1 is reached on the surface of the components; With a plurality of light emitting diode arrays, the circuit board 8 1 is on the element surface. 8 4 each drive device 8 3 is connected to each of them, and is electrically connected to the printed circuit board 8 1 ″ light source through a solder wire (wire X \). However, the above structure is manufactured and

1222760 V. Description of the invention (2) 1 · Product yield is low. · In the light-emitting diode, the light-emitting area of the diode is very small and the light-emitting area is 8 yuan. Next, a total of 5_ points of light-emitting diode wire bonding potentials must be formed. ^ The solder pads on δ 2 of the Mao Mao-polar array wafer are used to form about 5_ bonding wires. 8: Hitting ... and the density is too high, and Plural light-emitting two :::; :: slice wire =; brush circuit board " will cause difficulty in precision control = not 2. manufacturing cost is higher: the above structure must be connected to the system at approximately 5000 times. After the clothes are finished, for example, several groups are not bright, because the yuan = trial operation. If most of them are the entire group to be treated as scrap products, resulting in improper cost increase; 3. Setting ί ϊ Higher costs due to multiple The light-emitting diode array wafer must be one: two, so it must be achieved with a high-precision device compared to the cost of its machine. Combining the above factors, no improvement can be achieved in terms of equipment investment, manufacturing cost, and yield control. This will make the unit price of the product too high: = 孝 于 Here, the inventor is-pragmatic Keep improving ^ the spirit and the experience accumulated in the professional years, do everything in our power to think hard, research and improve repeatedly, and finally create this light-emitting element array module. [Summary of the Invention]

1222760, invention description (3) 口 The main purpose of the present invention is to provide a method that can reduce manufacturing costs and increase production. The yield LED array module mainly uses the method of adding at least one set of substrates and its predetermined shape to make the LED array chip and the dynamic circuit chip more accurate and easy. It can be set on it, and can detect the white and motion in advance, thereby improving the yield of the product and reducing the manufacturing cost.

In order to achieve the above-mentioned object, the present invention is mainly composed of a substrate, a base carrier board, a crystal, a driving circuit wafer, and a plurality of metal wires electrically connected. The base carrier board is disposed on the substrate, and a lateral protrusion is formed on the top thereof. Strips, so that at least one wafer and driving circuit are divided into two sides of the protruding strip, the wafer is provided with light-emitting elements = rows and pad arrays, and a number of metal wires are connected to the wafer and the driving circuit wafers. 4. For electrical connection, the driving circuit chip is used to drive the light-emitting diodes at the array of π pieces. The top surface is provided with a pad area in addition to the pad array. The metal wires are electrically connected to the substrate to form a complete electrical circuit. That is, it has the following functions of using the light-emitting diode array module of the present invention: 1 · Reduce manufacturing costs: By using the setting of the base substrate, the traditional light-emitting diode elements can be accurately arranged on the Work on the same axis. The base carrier boards that have completed the wire bonding process are bonded and fixed. Only t = the degree is not high. Equipment or manual high-precision construction is required. 2 High product yield: use the base carrier. Board settings are available in the number

# 双 anya Yue Pian and driver

1222760 is mounted on the carrier board and is mounted on the carrier board without increasing the cost of production. In addition to defective products, if there is any reason, it can reduce the manufacturing cost of the technology with short circuit and short working hours. Low-temperature adhesive bonding on wire-bonded manufacturing substrates affects the yield of neighboring products. Waste: The traditional solidification time can be avoided while avoiding traditional obstacles, not only maintaining the horizontal protrusions of the manufacturing cost. In addition to being able to keep high and improve, even if the area is not bright (on the substrate), the initial base board bonding method is difficult to repair and wasted. 'It can be placed on its side, manufacturing accuracy And product yield V. Description of the invention (4) The chip is bonded to its defective products; when it is shaped, the base load is low because it is replaced with a new one, and at the same time it can be reduced. Scrap, 4 · Since the wafer or driver is accurately positioned by the carrier, shrink 5 · Using this product, and can reduce the product market test, direct rejection or defective) In case of low temperature, maintenance cost is lower than wire bonding process After the production of the group is completed, the entire group of edges can be used as a baseline! Let it quickly and accurately reduce the maintenance cost, so that the resulting production costs ^ :: ΐ ί Bei clearly understand the detailed process and technical content of the present invention, Chu; The following diagrams and detailed explanations are provided for the review members to understand the spirit of the present invention: [Embodiment] Please refer to the third and fourth figures in FIG. The main group of the wafer 3, the wafer 4 and the drive circuit for the power of the present invention illustrates a cross-sectional view and a plane including a substrate 1, a carrier substrate 2, connected to a plurality of metal wires 5,

1222760 V. Description of the invention (5): Material = 1 2 Brush circuit board, ceramic substrate or other base carrier board 2 that can be used to make circuits is placed on the substrate 1 and is mainly used to fix 20 to a handle? 4 is arranged thereon, and the base carrier plate 2 is i with the number of low-temperature gels. The number of "up" is set according to the required light point. The second sheet is the second sheet. The second sheet is placed in a horizontal sheet. Person on. :: Picture 'The top surface of the base carrier board 2 distinguishes the first surface 2 and the surface.' P: 丨: The first surface 21 is for the wafer 3 to be bonded to it, and the driving circuit chip 4 is bonded to it ... In order to make the crystal orientation 7 = the wafer 4 is positioned more quickly when the crystal is solidified, the base carrier plate 2) is provided with a protruding protrusion 23, so that the side of the wafer 23 is positioned as a reference line against it. In this way, the smoke of 4-speed can also reduce the position of the displacement of the I. As shown in the sixth figure, every time a protrusion is set in the middle of the hair, it is also: "" column, the base contains 4.9 ^ ^ ^ ^ ^, 丌 Τ is formed in the same way on both sides 4 J 5 This structure shape will make the wafer more dreamy β ^ ^ & The base carrier board 2 is made of silicon material or other compatible materials. Eryekou also used the semiconductor etching (or other materials such as aluminum clothing: shape materials, etc.) manufacturing process to make the above two 遽, copper, or ㊉ can be used to quickly manually power the wafer 3 and the driver: Set the area, you can square 4 tail wafer 4 to position the wafer 3 is mainly used as a light emitting element array to generate brightness of the light source, its 31 and pad array (pa ^ at least on the top surface is provided with array ) 3 2, take:

1222760

The light-emitting element array 31 contains a plurality of light-emitting diodes, which is based on the number of light-emitting diodes. 4 ^ ^ 鲆 pad array 3 2 chip 4 is mainly used to drive ==: "welding, ... the drive" array 4! And the welding paddle area 4Γ, a welding paddle array 32 is formed on the top surface thereof to form a relative number of welding paddles, and = the electrical signal of the substrate i is transmitted to the driving circuit crystal, === dynamic lightning technology, “乂: welding of the pad 3 The pad array 3 2 and the driver: ·: column 41 for electrical connection, and the plural all-belonging line 6 is connected to the pad area 4 of the substrate worker and the driving circuit wafer 4, which constitutes a complete electrical circuit. & Jingzhi Luminescence 3 or drive to manufacture the number of chips to complete the circuit board) 2 structure and then manually enter the element array to move the circuit crystal according to the separate use 3 and drive settings and printing before the quality can be set first The accuracy of a fixed number of 1 0 0 0 or a number of joints in the present invention allows a plurality of sets to be set on a wafer bit, and an electric base substrate is printed on the wafer. In the end, it is reduced to 1. The reserve or special shape is the base carrier plate. The embodiment is set in the reserve to increase the production in advance. If you follow the structure, you can quickly set three substrates 1 at the same time. (Confirm that the yield line method of a single product is condensed on the substrate, but only if it is not on the substrate 1 that was not found during the previous test. One of the chip modules was found, because the base carrier board special piece 4 was solidified, and the labor cost was low. And a group of circuit chips 4, such as the in-line bonding process, have not yet used some test settings to immediately eliminate defective products. Light spot (for example, about 50,000 points) Several base loading operations of a hundred wires, so you can use a fine structure to save the manufacture of good products, or the light-emitting diodes on the substrate 2 bonded to 3 are not bright. (or

Page 13 1222760 V. Description of the invention (7) It is hoped that since it is fixed with low temperature glue, it can be replaced with a new base carrier plate 2 at low temperature without damaging the adjacent area. The operator = 5 As mentioned above, the structure of the present invention is used in the manufacturing process, which provides rapid positioning in the ":: wafer setting", which can eliminate the heart in the middle process: 丄 reduce unnecessary cost and waste , And the latter process can complete the processing with high accuracy and low requirements, and produce a mouth that meets the specifications. In addition, the improvement of defective products can also be lower = :, which can make the invention The price of the product has been reduced, which has greatly sapped the product. ^ As shown in the seventh figure, the light-emitting element array module of the present invention can also be applied to a watch head. The light-emitting element array module is used as a light source in a printer with an optical lens 9 1 (optical lens). , Focusing the light emitted from the light emitting element array of the light emitting element array f group, and projecting the light onto the image drum 90 (image drum). Among them, the preferred embodiment of this optical element is a cup lens array (r o d 1 e n s a r r a y). The eighth figure is a cross-sectional view of another embodiment of a base carrier board according to the present invention. In this embodiment, the shape of the base carrier board 8 is mainly changed, and the driving circuit chip 4 is directly bonded to the substrate 2 The base carrier plate 8 is only provided on the wafer 3, and the lateral side (vertical plane direction) of the protrusion 8 1 is provided on the top side, so that the single side of the wafer 3 can rest on it and manually To reduce production costs and investment in precision equipment, and the size of the base carrier plate 8 can be reduced.

Page 14 1222760 V. Description of the invention (8) Small, only silver is carved into the shape shown in the figure, which is easier in production and the cost can be further reduced. The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. That is to say, all equivalent changes and modifications made according to the scope of patent application of the present invention are covered by the patent scope of the present invention.

Page 15 1222760 Brief description of the drawings [Simplified description of the drawings] The first picture is the principle of the traditional light emitting diode printer head The second picture is the traditional light emitting diode as # ° 'The third picture is a section of the invention The schematic diagram of the structure of the source; the fourth diagram is a schematic plan view of the present invention; the fifth diagram is a schematic view of the base substrate of the present invention; the schematic diagram before the assembly of the chip and the driving circuit chip; the sixth diagram is another implementation of the invention.丨 schematic diagram before assembly ;, soil carrier plate and driver circuit wafer: the seventh figure is the present invention applied to a printer, the eighth figure is another embodiment of the 哉 M, meaning βI carrier board of the present invention; [Illustration of drawing number] Schematic diagram. 1 Base plate 2 Second surface 4 Projection strip 2 Base carrier board 2 1 First surface 2 3 Projection strip 2 5 Projection strip 3 2 Pad array 4 2 Pad area 7 1 Optical lens 3 1 Light emitting element array, j 4 driver circuit chip 4 1 pad array 5 metal wire 6 metal wire 7 0 photosensitive drum page 16 1222760 simple illustration of the picture 7 2 light source area 8 base carrier plate 81 protrusion 9 0 image drum 9 1 optical lens

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Claims (1)

1222760 6. Scope of patent application1. A light-emitting element and a substrate, on which a number of carrier plates are provided, and the sheets are bonded to the first; · If you apply for the light-emitting element 3 · If you apply for the substrate system by 4 · If you apply for the base carrier board system 5 · If you apply for the base carrier board top wafer 6 respectively · If you apply for the base carrier board top wafer 7 respectively Apply for a top-shaped wafer on one side, and there will be pads to connect them separately. Patent Fan Array Package Patent Fan Printed Electric Patent Fan Shi is equipped with the patent fan department and its patent fan department is located at 1¾ The scope of the patent is the first including the plural number of the first circuit board and the first material 1 Horizontal sides. The first array module is surrounded by two horizontally protruding first array modules, which includes a number of base substrates. The top surface of the first array module distinguishes the first surface and the second surface, at least one, and at least one driver circuit chip is bonded. At the second place, there are at least one light-emitting element array and a pad array. A circuit for driving the light-emitting element array, an array and a pad area are provided therein; '' a substrate and a driving circuit chip, and a 4A and a Japanese-Japanese film And the light-emitting element array module described in item j of the driving circuit. The light-emitting element array module described in item A is made of 苴. /. The light-emitting element array module described in the above item, in which. The light-emitting element array module according to the item, the protrusions provided in the protrusions, the Xiao chip and the light-emitting element array module described in the driving electric item, the three protrusions having a protrusion, and the wafer and the driving circuit are formed relatively. Low area. The light-emitting element array module according to the item, wherein Page 18 1222760 6. Scope of patent application (year 4taii) The main coat is etched to make its shape.嗲 美 ΐ: The light-emitting element array module described in item 1 of the patent scope, wherein the base substrate is glued on the substrate at low temperature. The light-emitting element array module described in Item 1 of the two-millimeter range can be used in a printer head. 10 kinds of light-emitting element array modules, including: /, a base carrier board and a plurality of driving circuit wafers having at least one upper sigma; a base carrier board having a plurality of wafers bonded to the top surface thereof, Side = shaped, with laterally protruding ridges and a plurality of wafers against its side; = number θθ plates, at the top surface of which are formed at least one light-emitting element array and a plurality of pad arrays of driving circuit wafers, which are provided with The top surface of the circuit for driving the light-emitting element array is provided with a pad array and a pad region; 'these metal wires electrically connect the substrate and the driving circuit wafer, and the wafer and the wafer, respectively. Electric circuit Page 19