TWI222713B - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit Download PDF

Info

Publication number
TWI222713B
TWI222713B TW092104408A TW92104408A TWI222713B TW I222713 B TWI222713 B TW I222713B TW 092104408 A TW092104408 A TW 092104408A TW 92104408 A TW92104408 A TW 92104408A TW I222713 B TWI222713 B TW I222713B
Authority
TW
Taiwan
Prior art keywords
wiring
macro instruction
external connection
target area
integrated circuit
Prior art date
Application number
TW092104408A
Other languages
English (en)
Chinese (zh)
Other versions
TW200305257A (en
Inventor
Takashi Eshima
Shogo Tajima
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200305257A publication Critical patent/TW200305257A/zh
Application granted granted Critical
Publication of TWI222713B publication Critical patent/TWI222713B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW092104408A 2002-03-19 2003-03-03 Semiconductor integrated circuit TWI222713B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002075483A JP2003273231A (ja) 2002-03-19 2002-03-19 半導体集積回路のシールド構造

Publications (2)

Publication Number Publication Date
TW200305257A TW200305257A (en) 2003-10-16
TWI222713B true TWI222713B (en) 2004-10-21

Family

ID=27800367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104408A TWI222713B (en) 2002-03-19 2003-03-03 Semiconductor integrated circuit

Country Status (6)

Country Link
US (1) US7411277B2 (enExample)
EP (1) EP1349212A3 (enExample)
JP (1) JP2003273231A (enExample)
KR (2) KR100880506B1 (enExample)
CN (1) CN1240124C (enExample)
TW (1) TWI222713B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100704584B1 (ko) * 2005-08-22 2007-04-06 후지쯔 가부시끼가이샤 다중 배선층과 방습링을 갖는 반도체 장치
JP5065606B2 (ja) 2006-03-03 2012-11-07 ルネサスエレクトロニクス株式会社 半導体装置
JP5061520B2 (ja) * 2006-07-18 2012-10-31 富士通セミコンダクター株式会社 半導体装置及び半導体ウェーハ
JP2022182020A (ja) * 2021-05-27 2022-12-08 株式会社東芝 ヘッドアクチュエータおよびディスク装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5050238A (en) * 1988-07-12 1991-09-17 Sanyo Electric Co., Ltd. Shielded front end receiver circuit with IF amplifier on an IC
JPH0750779B2 (ja) 1988-08-12 1995-05-31 三洋電機株式会社 半導体集積回路
JP2864576B2 (ja) * 1988-11-22 1999-03-03 セイコーエプソン株式会社 半導体装置
US5428242A (en) * 1988-11-22 1995-06-27 Seiko Epson Corporation Semiconductor devices with shielding for resistance elements
US5185650A (en) * 1989-02-28 1993-02-09 Kabushiki Kaisha Toshiba High-speed signal transmission line path structure for semiconductor integrated circuit devices
JP2724193B2 (ja) * 1989-02-28 1998-03-09 株式会社東芝 半導体装置
JP3351803B2 (ja) 1991-01-11 2002-12-03 富士通株式会社 半導体集積回路装置の製造方法
JPH06318597A (ja) * 1993-05-07 1994-11-15 Nec Kyushu Ltd 半導体装置
JP2905736B2 (ja) * 1995-12-18 1999-06-14 株式会社エイ・ティ・アール光電波通信研究所 半導体装置
JPH09232435A (ja) * 1996-02-22 1997-09-05 Oki Electric Ind Co Ltd 半導体集積回路
JP2833568B2 (ja) 1996-02-28 1998-12-09 日本電気株式会社 半導体集積回路
US6166403A (en) * 1997-11-12 2000-12-26 Lsi Logic Corporation Integrated circuit having embedded memory with electromagnetic shield
JP2003037178A (ja) * 2001-07-25 2003-02-07 Nec Corp 半導体集積回路装置

Also Published As

Publication number Publication date
KR100880506B1 (ko) 2009-01-28
US7411277B2 (en) 2008-08-12
TW200305257A (en) 2003-10-16
CN1240124C (zh) 2006-02-01
KR20030076327A (ko) 2003-09-26
EP1349212A2 (en) 2003-10-01
CN1445837A (zh) 2003-10-01
KR20080097981A (ko) 2008-11-06
US20030178706A1 (en) 2003-09-25
JP2003273231A (ja) 2003-09-26
EP1349212A3 (en) 2004-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees