TWD223708S - 用於測試積體電路的合規接地塊 - Google Patents

用於測試積體電路的合規接地塊 Download PDF

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Publication number
TWD223708S
TWD223708S TW111303419F TW111303419F TWD223708S TW D223708 S TWD223708 S TW D223708S TW 111303419 F TW111303419 F TW 111303419F TW 111303419 F TW111303419 F TW 111303419F TW D223708 S TWD223708 S TW D223708S
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TW
Taiwan
Prior art keywords
integrated circuits
testing integrated
ground block
design
compliant ground
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TW111303419F
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English (en)
Inventor
特賴伯格 瓦爾茨
喬亞爾 帕特
弗利格曼 萊斯利
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美商瓊斯科技國際公司
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Application filed by 美商瓊斯科技國際公司 filed Critical 美商瓊斯科技國際公司
Publication of TWD223708S publication Critical patent/TWD223708S/zh

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Abstract

【物品用途】;本設計是一種用於測試積體電路的合規接地塊。;【設計說明】;本設計是一種積體電路測試針板陣列的兩板對，相互鄰接的板的內表面不是主張保護的部分。

Description

用於測試積體電路的合規接地塊
本設計是一種用於測試積體電路的合規接地塊。
本設計是一種積體電路測試針板陣列的兩板對，相互鄰接的板的內表面不是主張保護的部分。
TW111303419F 2021-01-19 2021-07-19 用於測試積體電路的合規接地塊 TWD223708S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202129766911 2021-01-19
US29/766,911 2021-01-19

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TWD223708S true TWD223708S (zh) 2023-02-11

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ID=88878936

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TW111303418F TWD224736S (zh) 2021-01-19 2021-07-19 用於測試積體電路的合規接地塊
TW111303419F TWD223708S (zh) 2021-01-19 2021-07-19 用於測試積體電路的合規接地塊
TW110303723F TWD223374S (zh) 2021-01-19 2021-07-19 用于測試積體電路的合規接地塊

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TW111303418F TWD224736S (zh) 2021-01-19 2021-07-19 用於測試積體電路的合規接地塊

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TW110303723F TWD223374S (zh) 2021-01-19 2021-07-19 用于測試積體電路的合規接地塊

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TW (3) TWD224736S (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD205153S (zh) 2019-08-14 2020-06-11 浩暘工業股份有限公司 連接器端子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD205153S (zh) 2019-08-14 2020-06-11 浩暘工業股份有限公司 連接器端子

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Publication number Publication date
TWD224736S (zh) 2023-04-11
TWD223374S (zh) 2023-02-01

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