TWD198372S - 電氣特性測定用探針之部分 - Google Patents

電氣特性測定用探針之部分

Info

Publication number
TWD198372S
TWD198372S TW107306751F TW107306751F TWD198372S TW D198372 S TWD198372 S TW D198372S TW 107306751 F TW107306751 F TW 107306751F TW 107306751 F TW107306751 F TW 107306751F TW D198372 S TWD198372 S TW D198372S
Authority
TW
Taiwan
Prior art keywords
design
component
probe
semiconductor
measuring probe
Prior art date
Application number
TW107306751F
Other languages
English (en)
Inventor
Michio Kaida
Huei Che Yu
Original Assignee
美亞科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美亞科技股份有限公司 filed Critical 美亞科技股份有限公司
Publication of TWD198372S publication Critical patent/TWD198372S/zh

Links

Abstract

【物品用途】;本設計是一種探針，可用於檢驗例如半導體基板、半導體晶片、半導體封裝、半導體元件等，並測量如電路板上的配線是否導通或其電阻值等電氣特性。;【設計說明】;圖式所示之虛線部分為本案不主張設計之部分。;為示明本設計實施狀態，茲以使用狀態參考圖輔助說明，其中，元件10為包含本設計之探針的檢驗儀器，元件11為本設計之探針，元件12為檢驗夾具，元件13為待檢驗物品，元件14為檢驗臺。
TW107306751F 2018-05-16 2018-11-16 電氣特性測定用探針之部分 TWD198372S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-10760F JP1624757S (zh) 2018-05-16 2018-05-16

Publications (1)

Publication Number Publication Date
TWD198372S true TWD198372S (zh) 2019-07-01

Family

ID=65359084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107306751F TWD198372S (zh) 2018-05-16 2018-11-16 電氣特性測定用探針之部分

Country Status (3)

Country Link
US (1) USD894025S1 (zh)
JP (1) JP1624757S (zh)
TW (1) TWD198372S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1024815S1 (en) 2021-11-15 2024-04-30 Okins Electronics Co., Ltd. Probe for measuring electrical characteristics

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD983681S1 (en) * 2020-12-03 2023-04-18 Mpi Corporation Probe for testing device under test
TWD226028S (zh) * 2022-04-29 2023-06-21 南韓商普因特工程有限公司 半導體檢測針

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD510043S1 (en) * 2003-06-11 2005-09-27 K&S Interconnect, Inc. Continuously profiled probe beam
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
JP6475238B2 (ja) * 2013-07-09 2019-02-27 フォームファクター， インコーポレイテッド 導電性ガイド板を通る信号経路及び導電性ガイド板の間の２次経路を備えるマルチパス電気プローブ並びにプローブ・アセンブリ
JP1529607S (zh) * 2014-12-15 2015-07-27
JP1529608S (zh) * 2014-12-15 2015-07-27
JP1529605S (zh) * 2014-12-15 2015-07-27
JP1529612S (zh) * 2014-12-19 2015-07-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1024815S1 (en) 2021-11-15 2024-04-30 Okins Electronics Co., Ltd. Probe for measuring electrical characteristics

Also Published As

Publication number Publication date
JP1624757S (zh) 2019-02-18
USD894025S1 (en) 2020-08-25

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