TWD207359S - 半導體模組 - Google Patents

半導體模組 Download PDF

Info

Publication number
TWD207359S
TWD207359S TW108305976F TW108305976F TWD207359S TW D207359 S TWD207359 S TW D207359S TW 108305976 F TW108305976 F TW 108305976F TW 108305976 F TW108305976 F TW 108305976F TW D207359 S TWD207359 S TW D207359S
Authority
TW
Taiwan
Prior art keywords
semiconductor module
resin box
terminals
terminal
article
Prior art date
Application number
TW108305976F
Other languages
English (en)
Inventor
前田昭平
牧本陽一
Original Assignee
日商三社電機製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三社電機製作所股份有限公司 filed Critical 日商三社電機製作所股份有限公司
Publication of TWD207359S publication Critical patent/TWD207359S/zh

Links

Images

Abstract

【物品用途】;本物品係一種於樹脂製盒內收納半導體晶片零件或基板之半導體模組。;【設計說明】;於樹脂製盒之上部形成有3個端子，於該等端子間形成有沿垂直方向立設之第1、第2肋。於樹脂製盒之上部，在前述端子之周圍形成有槽。於第1肋之中央部形成有與端子對向之突起部。

Description

半導體模組
本物品係一種於樹脂製盒內收納半導體晶片零件或基板之半導體模組。
於樹脂製盒之上部形成有3個端子，於該等端子間形成有沿垂直方向立設之第1、第2肋。於樹脂製盒之上部，在前述端子之周圍形成有槽。於第1肋之中央部形成有與端子對向之突起部。
TW108305976F 2019-05-28 2019-09-27 半導體模組 TWD207359S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-011582 2019-01-25
JPD2019-11582F JP1642469S (zh) 2019-05-28 2019-05-28

Publications (1)

Publication Number Publication Date
TWD207359S true TWD207359S (zh) 2020-09-21

Family

ID=68052314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108305976F TWD207359S (zh) 2019-05-28 2019-09-27 半導體模組

Country Status (2)

Country Link
JP (1) JP1642469S (zh)
TW (1) TWD207359S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212158S (zh) 2020-12-02 2021-06-11 日商三社電機製作所股份有限公司 半導體元件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194386S (zh) 2017-12-28 2018-12-01 日商Ｓｕｍｃｏ股份有限公司 用於晶圓容器的襯墊

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194386S (zh) 2017-12-28 2018-12-01 日商Ｓｕｍｃｏ股份有限公司 用於晶圓容器的襯墊

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212158S (zh) 2020-12-02 2021-06-11 日商三社電機製作所股份有限公司 半導體元件

Also Published As

Publication number Publication date
JP1642469S (zh) 2019-09-30

Similar Documents

Publication Publication Date Title
USD947800S1 (en) Integrated module
SG10201805946SA (en) Semiconductor package
TWD205539S (zh) 智能音箱
TWD211363S (zh) 基板載具
FR2893764B1 (fr) Boitier semi-conducteur empilable et procede pour sa fabrication
SG152986A1 (en) Integrated circuit package system with shield
TW200802789A (en) Stackable molded packages and methods of making the same
TW200742035A (en) Low profile semiconductor package-on-package
USD887400S1 (en) Crossover for RFID IC terminals
SG10201803467SA (en) Semiconductor device
TWD220260S (zh) 功率半導體封裝
TWD205582S (zh) 終端機之部分
TWD207359S (zh) 半導體模組
TWD205286S (zh) 飲料瓶之蓋體
SG170803A1 (en) Integrated circuit package system including die having relieved active region
USD822629S1 (en) Semiconductor package
SG10201804909VA (en) Chip structure including heating element
EP3495318A3 (en) Semiconductor package with air cavity
TW200713397A (en) Intergrated circuit chip and manufacturing process thereof
TWD205959S (zh) 連接器端子
WO2019059690A3 (ko) 발광소자 패키지
EP3522232A3 (en) Semiconductor chip and manufacturing method thereof
TWD222577S (zh) 端子料帶
USD918150S1 (en) Electric contact
CN206533539U (zh) 一种一体式低压注塑成型的音箱结构