TWD195587S - 半導體元件用構件 - Google Patents

半導體元件用構件

Info

Publication number
TWD195587S
TWD195587S TW107301729D02F TW107301729D02F TWD195587S TW D195587 S TWD195587 S TW D195587S TW 107301729D02 F TW107301729D02 F TW 107301729D02F TW 107301729D02 F TW107301729D02 F TW 107301729D02F TW D195587 S TWD195587 S TW D195587S
Authority
TW
Taiwan
Prior art keywords
case
designed
design
showing
wafer
Prior art date
Application number
TW107301729D02F
Other languages
English (en)
Chinese (zh)
Inventor
坂本剛志
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TWD195587S publication Critical patent/TWD195587S/zh

Links

TW107301729D02F 2017-09-27 2018-03-27 半導體元件用構件 TWD195587S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-021147 2017-09-27
JPD2017-21147F JP1604003S (enrdf_load_stackoverflow) 2017-09-27 2017-09-27

Publications (1)

Publication Number Publication Date
TWD195587S true TWD195587S (zh) 2019-01-21

Family

ID=62104980

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107301729D02F TWD195587S (zh) 2017-09-27 2018-03-27 半導體元件用構件

Country Status (3)

Country Link
US (1) USD865690S1 (enrdf_load_stackoverflow)
JP (1) JP1604003S (enrdf_load_stackoverflow)
TW (1) TWD195587S (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1664282S (enrdf_load_stackoverflow) * 2019-07-24 2020-07-27
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

Citations (16)

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Publication number Priority date Publication date Assignee Title
TW404562U (en) 1999-05-06 2000-09-01 Advanced Semiconductor Eng Semiconductor glue film application platform with positioning structure
TW443580U (en) 1999-11-25 2001-06-23 Chipmos Technologies Inc Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW446183U (en) 1999-11-25 2001-07-11 Chipmos Technologies Inc Wafer surface structure
TW452191U (en) 1999-05-06 2001-08-21 Advanced Semiconductor Eng Semiconductor adhesive-film adhering platen with a positioning structure
TW461582U (en) 2000-11-07 2001-10-21 Chipmos Technologies Inc Laser repair and real-time detection device
TW491359U (en) 1999-11-25 2002-06-11 Chipmos Technologies Inc Connection distribution structure for etching pad mesh set of wafer
TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
TW510503U (en) 1999-11-25 2002-11-11 Chipmos Technolgies Inc Distributing structure of wafer's testing pad and burning pad
TW529771U (en) 2001-11-28 2003-04-21 Advanced Semiconductor Eng Flip chip semiconductor device with solder balls
TW556957U (en) 2002-08-13 2003-10-01 Advanced Semiconductor Eng Semiconductor wafer and semiconductor device
TWM293525U (en) 2004-06-29 2006-07-01 Sino American Silicon Products Silicon wafer structure for power electronic device
TWM352128U (en) 2008-10-08 2009-03-01 Int Semiconductor Tech Ltd Semiconductor structure having silver bump
TWM379066U (en) 2009-12-18 2010-04-21 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe card
TWM386593U (en) 2010-03-29 2010-08-11 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe
TWM478909U (zh) 2012-11-20 2014-05-21 Kun-Chieh Chang 發光二極體晶片之複合陣列微透鏡
TWM482158U (zh) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd 黏著半導體晶片之裝置

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Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW404562U (en) 1999-05-06 2000-09-01 Advanced Semiconductor Eng Semiconductor glue film application platform with positioning structure
TW452191U (en) 1999-05-06 2001-08-21 Advanced Semiconductor Eng Semiconductor adhesive-film adhering platen with a positioning structure
TW443580U (en) 1999-11-25 2001-06-23 Chipmos Technologies Inc Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW446183U (en) 1999-11-25 2001-07-11 Chipmos Technologies Inc Wafer surface structure
TW491359U (en) 1999-11-25 2002-06-11 Chipmos Technologies Inc Connection distribution structure for etching pad mesh set of wafer
TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
TW510503U (en) 1999-11-25 2002-11-11 Chipmos Technolgies Inc Distributing structure of wafer's testing pad and burning pad
TW461582U (en) 2000-11-07 2001-10-21 Chipmos Technologies Inc Laser repair and real-time detection device
TW529771U (en) 2001-11-28 2003-04-21 Advanced Semiconductor Eng Flip chip semiconductor device with solder balls
TW556957U (en) 2002-08-13 2003-10-01 Advanced Semiconductor Eng Semiconductor wafer and semiconductor device
TWM293525U (en) 2004-06-29 2006-07-01 Sino American Silicon Products Silicon wafer structure for power electronic device
TWM352128U (en) 2008-10-08 2009-03-01 Int Semiconductor Tech Ltd Semiconductor structure having silver bump
TWM379066U (en) 2009-12-18 2010-04-21 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe card
TWM386593U (en) 2010-03-29 2010-08-11 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe
TWM478909U (zh) 2012-11-20 2014-05-21 Kun-Chieh Chang 發光二極體晶片之複合陣列微透鏡
TWM482158U (zh) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd 黏著半導體晶片之裝置

Also Published As

Publication number Publication date
USD865690S1 (en) 2019-11-05
JP1604003S (enrdf_load_stackoverflow) 2018-05-14

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