TW588225B - Method of calibration of a lithographic apparatus, mask for use in calibration of lithographic apparatus, lithographic apparatus, device manufacturing method, device manufactured thereby - Google Patents

Method of calibration of a lithographic apparatus, mask for use in calibration of lithographic apparatus, lithographic apparatus, device manufacturing method, device manufactured thereby Download PDF

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Publication number
TW588225B
TW588225B TW090113719A TW90113719A TW588225B TW 588225 B TW588225 B TW 588225B TW 090113719 A TW090113719 A TW 090113719A TW 90113719 A TW90113719 A TW 90113719A TW 588225 B TW588225 B TW 588225B
Authority
TW
Taiwan
Prior art keywords
focus
dose
line
sensitive
substrate
Prior art date
Application number
TW090113719A
Other languages
English (en)
Chinese (zh)
Inventor
Johannes Jacobus Mat Baselmans
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Application granted granted Critical
Publication of TW588225B publication Critical patent/TW588225B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW090113719A 2001-05-08 2001-06-06 Method of calibration of a lithographic apparatus, mask for use in calibration of lithographic apparatus, lithographic apparatus, device manufacturing method, device manufactured thereby TW588225B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01304122A EP1256843A1 (en) 2001-05-08 2001-05-08 Method of calibrating a lithographic apparatus

Publications (1)

Publication Number Publication Date
TW588225B true TW588225B (en) 2004-05-21

Family

ID=8181953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090113719A TW588225B (en) 2001-05-08 2001-06-06 Method of calibration of a lithographic apparatus, mask for use in calibration of lithographic apparatus, lithographic apparatus, device manufacturing method, device manufactured thereby

Country Status (5)

Country Link
US (1) US6777139B2 (https=)
EP (1) EP1256843A1 (https=)
JP (1) JP4057847B2 (https=)
KR (1) KR100571373B1 (https=)
TW (1) TW588225B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
TWI227814B (en) * 2002-09-20 2005-02-11 Asml Netherlands Bv Alignment system and methods for lithographic systems using at least two wavelengths
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7268891B2 (en) 2003-01-15 2007-09-11 Asml Holding N.V. Transmission shear grating in checkerboard configuration for EUV wavefront sensor
US6867846B2 (en) 2003-01-15 2005-03-15 Asml Holding Nv Tailored reflecting diffractor for EUV lithographic system aberration measurement
US6759297B1 (en) 2003-02-28 2004-07-06 Union Semiconductor Technology Corporatin Low temperature deposition of dielectric materials in magnetoresistive random access memory devices
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
JP3848332B2 (ja) * 2003-08-29 2006-11-22 キヤノン株式会社 露光方法及びデバイス製造方法
TW200514138A (en) 2003-10-09 2005-04-16 Nippon Kogaku Kk Exposure equipment and exposure method, manufacture method of component
US7177009B2 (en) * 2004-10-01 2007-02-13 Asml Netherlands B.V. Position determination method and lithographic apparatus
US7541121B2 (en) * 2004-10-13 2009-06-02 Infineon Technologies Ag Calibration of optical line shortening measurements
US7619717B2 (en) * 2006-10-12 2009-11-17 Asml Netherlands B.V. Method for performing a focus test and a device manufacturing method
TWI383273B (zh) * 2007-11-20 2013-01-21 Asml Netherlands Bv 微影投射裝置之焦點測量方法及微影投射裝置之校準方法
DE102008015631A1 (de) * 2008-03-20 2009-09-24 Carl Zeiss Sms Gmbh Verfahren und Vorrichtung zur Vermessung von Masken für die Photolithographie
NL1036647A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv A method of measuring a lithographic projection apparatus.
EP2131245A3 (en) * 2008-06-02 2012-08-01 ASML Netherlands BV Lithographic apparatus and its focus determination method
WO2010070964A1 (ja) * 2008-12-16 2010-06-24 株式会社村田製作所 回路モジュール及びその管理方法
NL2009305A (en) * 2011-08-31 2013-03-04 Asml Netherlands Bv A method of determining focus corrections, lithographic processing cell and device manufacturing method.
JP6084227B2 (ja) * 2011-10-20 2017-02-22 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び方法
KR101983615B1 (ko) 2012-06-22 2019-05-29 에이에스엠엘 네델란즈 비.브이. 포커스를 결정하는 방법, 검사 장치, 패터닝 장치, 기판, 및 디바이스 제조 방법
KR102185757B1 (ko) * 2015-12-21 2020-12-03 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치의 포커스 성능을 측정하는 장치들 및 패터닝 디바이스들 및 방법들, 디바이스 제조 방법
CN109949366A (zh) * 2019-03-08 2019-06-28 鲁班嫡系机器人（深圳）有限公司 一种定位设备及其方法
CN111340893B (zh) * 2020-03-24 2024-12-13 奥比中光科技集团股份有限公司 一种标定板、标定方法及系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1310205C (en) 1988-03-31 1992-11-17 Roger L. Barr Quantitative lense analysis technique
EP0534720B1 (en) 1991-09-24 1998-05-27 Raphael L. Levien Register marks

Also Published As

Publication number Publication date
JP2003022968A (ja) 2003-01-24
JP4057847B2 (ja) 2008-03-05
KR100571373B1 (ko) 2006-04-14
US20020172876A1 (en) 2002-11-21
EP1256843A1 (en) 2002-11-13
KR20020085840A (ko) 2002-11-16
US6777139B2 (en) 2004-08-17

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