TW570947B - Radiation sensitive resin composition, its use for interlayer insulating film and microlens, interlayer insulating film and microlens - Google Patents

Radiation sensitive resin composition, its use for interlayer insulating film and microlens, interlayer insulating film and microlens Download PDF

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Publication number
TW570947B
TW570947B TW091100685A TW91100685A TW570947B TW 570947 B TW570947 B TW 570947B TW 091100685 A TW091100685 A TW 091100685A TW 91100685 A TW91100685 A TW 91100685A TW 570947 B TW570947 B TW 570947B
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TW
Taiwan
Prior art keywords
methacrylic acid
methacrylate
radiation
ester
copolymer
Prior art date
Application number
TW091100685A
Other languages
Chinese (zh)
Inventor
Isao Nishimura
Nobuhiro Takeuchi
Hideki Nishimura
Kazuaki Niwa
Original Assignee
Jsr Corp
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Publication date
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Publication of TW570947B publication Critical patent/TW570947B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

To provide a radiation sensitive resin composition having high radiation sensitivity and a sufficient margin for development, capable of easily forming a patterned thin film excellent in adhesion and suitable for forming an interlayer insulating film and microlenses, to provide a use of the composition for an interlayer insulating film and microlenses and to provide an interlayer insulating film and microlenses formed from the composition. The radiation sensitive resin composition contains [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy-containing unsaturated compound, (a3) a hydroxyl-containing unsaturated compound and (a4) another olefinically unsaturated compound and [B] a 1,2-quinonediazido compound. The interlayer insulating film and the microlenses are formed by using the composition.

Description

570947 A7 _ —_B7 五、發明説明(1 ) 技術領域 本發明係有關感放射線性樹脂組成物,詳細的說,有 關適於光蝕法製作層間絕緣膜或微透鏡的正片型感放射線 性樹脂組成物。 且’本發明係有關上述感放射線性樹脂組成物的層間 絕緣膜及微透鏡的形成方法。 又’本發明係有關上述感放射線性樹脂組成物所形成 的層間絕緣膜及微透鏡。 先行技術 一般薄膜晶體管(以下稱「T F T」。)型液晶顯示 材料或磁頭材料、集體電路、固體攝影材料等的電子零件 係於層狀配置的線路之間,爲絕緣而設置層間絕緣膜。作 爲形成層間絕緣膜的材料,得到必要的圖案形狀的層間絕 緣膜的步驟數要少,且層間絕緣膜具平坦性的特徵,因而 廣泛的使用感放射線性樹脂組成物。 T F T型液晶顯示材料係於上述層間絕緣膜上,形成 電極膜,更在其上經液晶配向膜的形成步驟製造而成。 一方面,作爲傳真機、複印機、固體攝影材料等的小 型濾色鏡的結像光學系或光纖連接器的光學系材料,使用 具3〜1 0 0 μ m程度鏡徑的微透鏡,或此等的微透鏡規 則排列的微透鏡陣列。 微透鏡或微透鏡陣列的形成,已知的有透鏡圖案形$ 後,以加熱處理使圖案溶流、就這樣利用作爲透鏡的方法 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) '~— -4 - (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 570947 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(2 ) ,或溶流後的透鏡圖案作爲罩膜,以乾式蝕刻將透鏡形狀 轉印至基材的方法。上述透鏡圖案的形成,可得到期望曲 率半徑的微透鏡爲其特徵,而廣泛的使用感放射線性樹脂 組成物。 如此的微透鏡或層間絕緣膜,於其形成時的顯影步驟 ,顯影時間僅少許大於最適時間時,因圖案與基板之間滲 透顯影液,容易產生剝落,顯影時間必要嚴密控制,製品 的收率上有問題。又,形成配線等的週邊裝置步驟時,對 配線等的形成光阻膜的剝離液的耐性不充分,基板與微透 鏡或層間絕緣膜的界面發生滲染剝離液現象,基板上產生 缺陷或剝落的問題情形。 發明欲解決的課題 本發明以上述事項爲基準,其目的爲提供具高感放射 線感度,於顯影步驟中超出最佳顯影的時間亦具形成良好 的圖案形狀的顯像優點,且,密合性優可容易形成圖案狀 薄膜,適於形成層間絕緣膜或微透鏡的感放射線性樹脂組 成物。 又,本發明的其他目的爲上述感放射線性樹脂組成物 可使用於層間絕緣膜及微透鏡的形成。 本發明的另一目的爲提供由上述感放射線性樹脂組成 物所形成的層間絕緣膜及微透鏡。 解決課題的手段 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -5- 570947 A7 B7 五、發明説明(3 ) 依本發明,本發明上述的目的及利點,第1 , 〔A〕 ( a 1 )不飽和羧酸及/或不飽和羧酸酐與( a 2 )含環氧基不飽和化合物、(a 3 )含羥基不飽和化 合物與(a 4 )其他烯烴系不飽和化合物的共聚合物,及 含 〔B〕1 ,2 -苯醌二疊氮基化合物。 〔B〕成分的含量爲每1 〇 〇重量份〔A〕成分含5 〜1 0 0重量份。爲特徵的感放射線性樹脂組成物而達成 依本發明,本發明上述的目的及利點,第2, 使用上述感放射線性樹脂組成物的層間絕緣膜及微透 鏡的形成方法而達成。 依本發明,本發明上述的目的及利點,第3, 由上述感放射線性樹脂組成物所形成的層間絕緣膜及 微透鏡而達成。 發明揭示 */ --------本-- ^·· (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局R工消費合作社印製 /—- 2 入口 所 A 。 a 聚 } o C 徵 C 在 1 物物 特物, a 成合其合中 C 組聚爲化媒 物 脂共成、溶 合 樹由所 } 於。化 性係 一^W^ 的含 線物 B a 4 造所 射成 t丨 a 製 I 放組物物彳而 A 感脂合合物合 f 的樹化化合聚物 明性基由化基合 發線氮係及由聚 本射疊 /^V } 自共 關放二 A 3 依的 有感醌 t a 下用 說的苯物彳在使 述明 I 合物存明 下發 2 聚合的發 以本,共化劑本 1•、發 及 3 弓 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -6 - 570947 A7 B7 五、發明説明(4 ) 衍生的構成單位,爲化合物(a 1 ) 、( a 2 ) 、( a 3 (請先閲讀背面之注意事項再填寫本頁) )及(a 4 )所衍生的重複單位的合計爲基準,理想爲5 〜4 0重量%,更理想爲1 0〜3 0重量%。此構成單位 不足5重量%的共聚合物,難溶於鹼性水溶液,一方面超 過4 0重量%的共聚合物則對鹼性水溶液的溶解性有過大 的傾向。化合物(a 1 )如丙烯酸、甲基丙烯酸、丁烯酸 等的單羧酸;馬來酸、富馬酸、檸嗪酸、甲基富馬酸、甲 叉丁二酸等的二羧酸;及此類的二羧酸的酐;琥珀酸單〔 2 -(甲基)丙烯醯氧乙基〕酯、對苯二甲酸單〔2 -( 甲基)丙烯醯氧乙基〕酯等的二價以上的多價羧酸的單〔 2 —(甲基)丙烯醯氧乙基〕酯類;ω -羧基聚己內酯單 (甲基)丙烯酸酯等的兩端具羧基及烴基的聚合物的單( 甲基)丙烯酸酯等。此中以共聚合反應性、對鹼性水溶液 的溶解性及容易入手的觀點而言,以使用丙烯酸、甲基丙 烯酸、無水馬來酸等爲理想。可單獨或二種以上組合使用 〇 經濟部智慧財產局員工消費合作社印製 本發明使用的共聚合物〔A〕所含化合物(a 2 )所 衍生的構成單位,爲化合物(a 1 ) 、( a 2 ) 、( a 3 )及(a 4 )所衍生的重複單位的合計爲基準,理想爲 1 0〜7 0重量%,更理想爲2 0〜6 0重量%。此構成 單位不足1 0重量%時,所得的保護膜或絕緣膜的耐熱性 、表面硬度有下降的傾向,一方面超過7 0重量%時共聚 合物的保存安定性有下降的傾向。 化合物(a 2 )如丙烯酸縮水甘油酯、甲基丙烯酸縮 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -7- 570947 A7 B7 五、發明説明(5 ) (請先閱讀背面之注意事項再填寫本頁) 水甘油酯、α -乙基丙烯酸縮水甘油酯、α - η -丁基丙 烯酸縮水甘油酯、丙烯酸- 3,4 -環氧丁酯、甲基丙烯 酸一 3,4 一環氧丁酯、丙烯酸一 6,7 -環氧丁酯、甲 基丙烯酸一 6,7 —環氧丁酯、α -乙基丙烯酸—6 ,7 -環氧丁酯、〇 -乙烯苄縮水甘油醚、m 一乙烯苄縮水甘 油醚、p —乙烯苄縮水甘油醚等。此中以共聚合反應性、 對保護膜或絕緣膜的耐熱性、提高表面硬度的觀點而言, 以使用甲基丙烯酸縮水甘油酯、甲基丙烯酸一 6,7 -環 氧丁酯、〇 -乙烯苄縮水甘油醚、m 一乙烯苄縮水甘油醚 、P -乙烯苄縮水甘油醚等爲理想。可單獨或二種以上組 合使用。 本發明使用的共聚合物〔A〕所含化合物(a 3 )所 衍生的構成單位,爲化合物(a 1 ) 、( a 2 ) 、( a 3 )及(a 4 )所衍生的重複單位的合計爲基準,理想爲2 〜5 0重量%,更理想爲5〜4 0重量%。此構成單位不 足5重量%時,密合性有下降的傾向,一方面超過5 〇重 量%時塗膜的成膜性有下降的傾向。 經濟部智慧財產局員工消費合作社印製 化合物(a 3 )如甲基丙烯酸羥甲酯、甲基丙烯酸一 2 -羥乙酯、甲基丙烯酸一 3 -羥丙酯、甲基丙烯酸一 4 -羥丁酯、單甲基丙烯酸二乙二醇酯、甲基丙烯酸2,3 -二羥丙酯、2 -甲基丙烯醯乙基配糖物、甲基丙烯酸4 一羥苯酯、5 -(2> -羥乙基)二環〔2 _ 2 · 1:)庚 —2 —烯、5,6 -二羥基二環〔2,2 . 1〕庚—2 一 烯、5,6 —二(羥乙基)二環〔2,2 , 1〕庚〜2一 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇><297公釐) -8- 570947 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(6 ) 烯、5,6 -二—羥乙基)二環〔2,2 · 1〕庚 —2 -烯、5 —羥基一 5 -甲基二環〔2,2 · 1〕庚一 2 —烯、5 —羥基—5 —乙基二環〔2,2 · 1〕庚一 2 —烯、5 —羥甲基—5 -甲基二環〔2 ,2 . 1〕庚—2 -烯等。可單獨或二種以上組合使用。 本發明使用的共聚合物〔A〕所含化合物(a 4 )所 衍生的構成單位,爲化合物(a 1 ) 、( a 2 ) 、( a 3 )及(a 4 )所衍生的重複單位的合計爲基準,理想爲 1 0〜70重量%,更理想爲1 5〜5 0重量%。此構成 單位不足1 〇重量%時,共聚合物〔A〕的保存安定性有 下降的傾向,一方面超過7 0重量%時共聚合物對鹼性水 溶液有難溶解的傾向。 化合物(a 2 )如甲基丙烯酸曱酯、甲基丙烯酸乙酯 、曱基丙烯酸正丁酯、甲基丙烯酸仲丁酯、甲基丙烯酸叔 丁酯等的甲基丙烯酸烷酯;丙烯酸甲酯、丙烯酸異丙酯等 的丙烯酸烷酯;甲基丙烯酸環己酯、甲基丙烯酸2 -甲基 環己酯、甲基丙烯酸三環〔5 · 2 . 1 . 02. 6〕癸烷一 8 -醯酯、曱基丙烯酸三環〔5 · 2 · 1 · 〇2. 6〕癸院 - 8 -醯氧乙酯、甲基丙烯酸異佛爾酮酯等的甲基丙烯酸 環烷酯;丙烯酸環己酯、丙烯酸2 -甲基環己酯、丙烯酸 三環〔5 · 2 · 1 · 02·6〕癸烷—8 -醯酯、丙烯酸三 環〔5 · 2 · 1 · 02·6〕癸烷—8 -醯氧乙酯、丙烯酸 異佛爾酮酯等的丙烯酸環烷酯;甲基丙烯酸苯酯、甲基丙 烯酸苄酯等的甲基丙烯酸芳酯;丙烯酸苯酯、丙烯酸苄酯 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁)570947 A7 _ —_B7 V. Description of the Invention (1) Technical Field The present invention relates to a radiation-sensitive resin composition. In particular, it relates to a positive-type radiation-sensitive resin composition suitable for producing an interlayer insulating film or a microlens by a photolithography method. Thing. Further, the present invention relates to a method for forming the interlayer insulating film and the microlens of the radiation-sensitive resin composition. The present invention also relates to an interlayer insulating film and a microlens formed from the radiation-sensitive resin composition. Prior art: General thin-film transistor (hereinafter referred to as "TF") liquid crystal display materials or magnetic head materials, collective circuits, solid-state imaging materials, and other electronic components are placed between layers of lines and an interlayer insulation film is provided for insulation. As a material for forming the interlayer insulating film, the number of steps for obtaining the interlayer insulating film having a necessary pattern shape is small, and the interlayer insulating film has the characteristics of flatness. Therefore, a radiation-sensitive resin composition is widely used. The T F T type liquid crystal display material is formed on the above interlayer insulating film to form an electrode film, and is further manufactured by forming a liquid crystal alignment film thereon. On the one hand, micro-lenses with a lens diameter of 3 to 100 μm, or the like, are used as the optical materials of the junction optical system or optical fiber connector of small color filters such as facsimiles, copiers, and solid photographic materials. Microlens array with regularly arranged microlenses. The formation of a microlens or microlens array is known as a lens pattern, and the pattern is melted by heat treatment. This method is used as a lens. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). ) '~ — -4-(Please read the notes on the back before filling out this page) Order printed by the Intellectual Property Bureau Employee Consumption Cooperative of the Ministry of Economic Affairs 570947 A7 B7 Printed by the Intellectual Property Bureau Employee Consumption Cooperative of the Ministry of Economic Affairs ), Or the method of transferring the lens pattern to the base material by dry etching as a cover film. The formation of the lens pattern can obtain microlenses with a desired radius of curvature as its characteristics, and a radiation-sensitive resin composition is widely used. In the development step of such a microlens or interlayer insulation film, when the development time is only slightly longer than the optimum time, the developing solution penetrates between the pattern and the substrate, which is prone to peeling. The development time must be tightly controlled. The yield of the product There is a problem. In the process of forming peripheral devices such as wiring, the resistance to the peeling solution for forming a photoresist film such as wiring is not sufficient, the bleeding and peeling phenomenon occurs at the interface between the substrate and the microlens or the interlayer insulating film, and defects or peeling occurs on the substrate. Problem situation. Problem to be Solved by the Invention The present invention is based on the above-mentioned matters, and its purpose is to provide a high-sensitivity radiation sensitivity, a development advantage of forming a good pattern shape even after the optimum development time in the development step, and adhesion It is easy to form a patterned thin film, and is suitable for forming a radiation-sensitive resin composition for an interlayer insulating film or a microlens. Another object of the present invention is that the radiation-sensitive resin composition described above can be used for the formation of an interlayer insulating film and a microlens. Another object of the present invention is to provide an interlayer insulating film and a microlens formed of the radiation-sensitive resin composition. Means to solve the problem (please read the precautions on the back before filling this page) The paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -5- 570947 A7 B7 V. Description of the invention (3) The invention, the above-mentioned objects and advantages of the present invention, the first, [A] (a 1) unsaturated carboxylic acid and / or unsaturated carboxylic anhydride and (a 2) epoxy-containing unsaturated compound, (a 3) containing Copolymers of hydroxy unsaturated compounds and (a 4) other olefinic unsaturated compounds, and compounds containing [B] 1,2-benzoquinonediazide. [B] The content of the component is 5 to 100 parts by weight per 100 parts by weight of the [A] component. Achieved by a characteristic radiation-sensitive resin composition According to the present invention, the above-mentioned objects and advantages of the present invention are achieved, and secondly, the method for forming an interlayer insulating film and a microlens using the radiation-sensitive resin composition is achieved. According to the present invention, the above-mentioned objects and advantages of the present invention, and third, are achieved by an interlayer insulating film and a microlens formed of the radiation-sensitive resin composition. Disclosure of the Invention * / -------- this-^ ... (Please read the notes on the back before filling out this page) Printed by R Industrial Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs / --- 2 Entrance Office A. a poly} o C signs C in one thing, in a combination of them, C group is aggregated into a chemical compound, lipid co-formation, and fusion tree. The chemical system is a ^ W ^ -containing thread B a 4 which is shot to form t 丨 a. I is a chemical compound. A is a lipophilic compound. The tree-forming compound of f is composed of chemical groups. The hairline nitrogen system and the photoinjection / ^ V} self-contained two A 3 depending on the quinone ta benzene compounds used to make the description of the compound I issued 2 polymerized hair Copies, Co-agents 1 •, Hair and 3 Bows The paper size is applicable to the Chinese National Standard (CNS) A4 (210X 297 mm) -6-570947 A7 B7 V. Description of the invention (4) Derived constituent units are Compounds (a 1), (a 2), (a 3 (please read the precautions on the back before filling out this page)) and (a 4) are derived from the total number of repeating units, ideally 5 to 40 weight %, More preferably 10 to 30% by weight. Copolymers containing less than 5% by weight of these constituent units are difficult to dissolve in an alkaline aqueous solution. On the other hand, copolymers exceeding 40% by weight tend to have an excessively high solubility in alkaline aqueous solutions. Compound (a 1) such as monocarboxylic acid of acrylic acid, methacrylic acid, butenoic acid, etc .; dicarboxylic acid of maleic acid, fumaric acid, citrazine acid, methyl fumaric acid, mesuccinic acid, etc .; And the anhydrides of such dicarboxylic acids; di [2-(meth) acryloxyethyl] succinate, di [2-(meth) acryloxyethyl] terephthalate, and the like Mono- [2- (meth) acrylic acid oxyethyl] esters of polyvalent carboxylic acids of more than valence; polymers with carboxyl groups and hydrocarbon groups at both ends, such as ω-carboxy polycaprolactone mono (meth) acrylate Of mono (meth) acrylates. Among these, acrylic acid, methacrylic acid, anhydrous maleic acid, etc. are preferably used from the viewpoints of copolymerization reactivity, solubility in an alkaline aqueous solution, and easy availability. It can be used alone or in combination of two or more. The consumer unit of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a constituent unit derived from the compound (a 2) contained in the copolymer (A) used in the present invention, which is the compound (a 1), ( The total of the repeating units derived from a 2), (a 3), and (a 4) is used as a reference, and is preferably 10 to 70% by weight, and more preferably 20 to 60% by weight. When the constituent unit is less than 10% by weight, the heat resistance and surface hardness of the obtained protective film or insulating film tend to decrease. On the other hand, when it exceeds 70% by weight, the storage stability of the copolymer tends to decrease. Compounds (a 2) such as glycidyl acrylate and methacrylic acid paper are sized according to Chinese National Standard (CNS) A4 (210X297 mm) -7- 570947 A7 B7 V. Description of the invention (5) (Please read the back first Please fill in this page before filling in this page) Hydroglyceride, α-Ethyl Glycidyl Acrylate, α-η-Butyl Glycidyl Acrylate, Acrylic-3,4-Epoxybutyl Ester, Methacrylic Acid 3,4 Monobutylene oxide, acrylic acid 6,7-butylene oxide, methyl methacrylate-6,7-butylene oxide, α-ethyl acrylic acid-6,7-butylene oxide, 0-vinyl benzyl shrink Glyceryl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, and the like. Among them, from the viewpoints of copolymerization reactivity, heat resistance to a protective film or an insulating film, and improvement of surface hardness, glycidyl methacrylate, 6,7-epoxybutyl methacrylate, 〇- Ethylene benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, P-vinyl benzyl glycidyl ether and the like are preferable. It can be used alone or in combination of two or more. The constituent unit derived from the compound (a 3) contained in the copolymer [A] used in the present invention is a repeating unit derived from the compounds (a 1), (a 2), (a 3), and (a 4). The total amount is based on 2 to 50% by weight, and more preferably 5 to 40% by weight. When the constituent unit is less than 5% by weight, the adhesion tends to decrease. On the other hand, when it exceeds 50% by weight, the film-forming property of the coating film tends to decrease. Compounds (a 3) printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, such as methyl methacrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxy methacrylate Butyl ester, diethylene glycol monomethacrylate, 2,3-dihydroxypropyl methacrylate, 2-methacryl ethyl glycoside, 4-hydroxyphenyl methacrylate, 5-(2 > -Hydroxyethyl) bicyclo [2 _ 2 · 1: :) hept-2-ene, 5,6-dihydroxybicyclo [2,2. 1] hept-2-ene, 5,6-di (hydroxy Ethyl) bicyclo [2,2,1] hept ~ 2 One paper size applies Chinese National Standard (CNS) A4 specification (21〇 > < 297 mm) -8- 570947 Employees ’Intellectual Property Bureau of the Ministry of Economic Affairs employee consumption Printed by the cooperative A7 B7 V. Description of the invention (6) ene, 5,6-di-hydroxyethyl) bicyclo [2,2 · 1] hept-2-ene, 5-hydroxy-5-methylbicyclo [ 2,2 · 1] hepta-2-ene, 5-hydroxy-5 -ethylbicyclo [2,2 · 1] hepta-2-ene, 5-hydroxymethyl-5 -methylbicyclo [2, 2.1] hept-2-ene and the like. They can be used alone or in combination of two or more. The constituent unit derived from the compound (a 4) contained in the copolymer [A] used in the present invention is a repeating unit derived from the compounds (a 1), (a 2), (a 3), and (a 4) The total is used as a reference, preferably 10 to 70% by weight, and more preferably 15 to 50% by weight. When the constituent unit is less than 10% by weight, the storage stability of the copolymer [A] tends to decrease. On the other hand, when it exceeds 70% by weight, the copolymer tends to be difficult to dissolve in an alkaline aqueous solution. Compound (a 2) such as alkyl methacrylate, ethyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, etc .; methyl acrylate, Alkyl acrylates such as isopropyl acrylate; cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclic methacrylate [5 · 2.. 1. 02. 6] decane 8-醯Esters, tricyclic methacrylic acid [5 · 2 · 1 · 〇2. 6] decane-8-methoxyethyl, isophorone methacrylate and other cycloalkyl methacrylates; cyclohexyl acrylate , 2-methylcyclohexyl acrylate, tricycloacrylic acid [5 · 2 · 1 · 02 · 6] decane-8-fluorenyl ester, acrylic acid tricyclo [5 · 2 · 1 · 02 · 6] decane-8 -Naphthyl acrylate, isophorone acrylate, etc. Naphthenate acrylate, aryl methacrylate, phenyl methacrylate, benzyl methacrylate, etc .; phenyl acrylate, benzyl acrylate This paper is applicable to China National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page)

-9 - 570947 A7 B7 五、發明説明(7 ) (請先閲讀背面之注意事項再填寫本頁) 等的丙烯酸芳酯;馬來酸二乙酯、富馬酸二乙酷、甲叉丁 二酸二乙酯等的不飽和羧酸二乙酯;甲基丙烯酸2 一經乙 酯、甲基丙烯酸2 -羥丙酯等的甲基丙烯酸羥烷酯;二環 〔2,2 · 1〕庚—2 —烯、5 —甲基二環〔2,2 .工 〕庚一 2 —烯、5 —乙基二環〔2,2 · 1〕庚—2 —烯 、5 —羥基—壤〔2 ’ 2 · 1〕庚一 2 —烯、5 —竣基一 環〔2,2 · 1〕庚—2 —烯、5 —羥甲基二環〔2,2 _ 1〕庚—2 —烯、5 —甲氧基二環〔2,2 .丄彳庚― 2 -烯、5,6 —二羧基二環〔2,2 . 1〕庚一 2 —烯 、5,6 - 二甲氧基二環〔2,2 · 1〕庚—2 —烯、5 ,6_二乙氧基二環〔2,2 _ 1〕庚—2 —烯、5 —殘 基一 5 —甲基二環〔2,2 . 1〕庚—2 —條、5 -殘基 一 6 —甲基二環〔2,2 · 1〕庚一 2 —烯、5 一竣基— 6 -乙基二環〔2,2 · 1〕庚-2 -烯、5,6 —二竣 經濟部智慧財產局員工消費合作社印製 基二環〔2,2 · 1〕庚一 2 —烯酐、5 -叔—丁氧羰基 二環〔2,2 · 1〕庚—2-烯、5 —環己氧羰基二環〔 2,2 . 1〕庚—2 —烯、5 -苯氧羰基二環〔2,2 · 1〕庚—2 -烯、5,6 -二(叔丁氧羰基)二環〔2, 2 · 1〕庚一 2 -烯、5,6 -二(環己氧羰基)二環〔 2,2 · 1〕庚一 2 -烯等的二環不飽和化合物類; 苯基馬來醯亞胺、環己基馬來醯亞胺、苄基馬來醯亞 胺、N -琥珀醯酵醯一 3 -馬來醯亞胺苯甲酸酯、N -琥 珀醯酵醯- 4 -馬來醯亞胺丁酸酯、N -琥珀醯酵醯一 6 -馬來醯亞胺己酸酯、N -琥珀醯酵醯- 3 -馬來醯亞胺 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X 297公釐) -10- 570947 A7 ______ B7 五、發明説明(8 ) (請先閲讀背面之注意事項再填寫本頁) 苯丙酸酯、N -(丙烯酸醯)馬來醯亞胺等的馬來醯亞胺 化合物類;及苯乙烯、α -甲基苯乙烯、間一甲基苯乙烯 、對一甲基苯乙烯、乙烯甲苯、對甲氧基苯乙烯、丙烯腈 、甲基丙烯腈、氯乙烯、偏氯乙烯、丙烯胺、甲基丙烯胺 、醋酸乙烯' 1 ,3 — 丁二烯、異丙烯、2,3 —二甲基 一 1 ,3 — 丁二烯等。 此中以共聚合反應性、對鹼性水溶液的溶解性的觀點 而言,以使用苯乙烯、甲基丙烯酸-叔一丁酯、甲基丙烯 酸二環戊酯、對一甲基基苯、丙烯酸一 2 -曱基環己酯、 1,3 — 丁二烯、二環〔2 . 2 · 1〕庚一 2 -烯等爲理 想。可單獨或二種以上組合使用。 本發明使用的共聚合物〔A〕的具體例,可列舉如苯 乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基丙烯酸 2-羥乙酯/甲基丙烯酸三環〔5.2·1·〇2·6〕癸 烷一8-醯酯共聚合物、 苯乙烯/曱基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 —羥乙酯/甲基丙烯酸三環〔5 . 2 · 1 . 經濟部智慧財產局員工消費合作社印製 〇2 · 6〕癸烷一 8 -醯酯/甲基丙烯酸一叔一丁酯共聚合 物、 苯乙烯/曱基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 -羥乙酯/甲基丙烯酸三環〔5 · 2 · 1 · 〇2·6〕癸烷一 8 —醯酯/對一甲氧苯乙烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 -羥乙酯/甲基丙烯酸三環〔5 · 2 · 1 · 0 2 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 570947 A7 B7 五、發明説明(9 ) •6〕癸烷一 8 -醯酯/甲基丙烯酸2 -甲基環己酯共聚 合物、 (請先閱讀背面之注意事項再填寫本頁) 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 -羥乙酯/甲基丙烯酸三環〔5 . 2 · 1 · 〇2·6〕癸烷一 8 -醯酯/1,3 丁二烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 —羥乙酯/甲基丙烯酸三環〔5 . 2 · 1 · 0 2 〕癸院一 8 - S盡醋/ 一^環〔2 . 2 · 1〕庚一 2 —燃 共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/曱基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 · 2 .1 • 02·6〕癸烷一 8 —醯酯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 . 2 · 1 .0 2 · 6〕癸烷一 8 -醯酯/甲基丙烯酸一叔一丁酯共聚 合物、 經濟部智慧財產局R工消費合作社印製 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 . 2 . 1 • 02·6〕癸烷一 8 -醯酯/對一甲氧苯乙烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 . 2 . 1 • 02·6〕癸烷一 8 —醯酯/甲基丙烯酸2 —甲基環己酯 共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -12- 570947 A7 B7 五、發明説明(1〇) 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 _ 2 . 1 • 02·6〕癸烷一 8 -醯酯/1 ,3 丁二烯共聚合物、 (請先閱讀背面之注意事項再填寫本頁) 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5 · 2 · 1 • 〇2·6〕癸烷—8 —醯酯/二環〔2 · 2 · 1〕庚—2 -烯共聚合物 本發明使用的共聚合物〔A〕聚苯乙烯換算重量平均 分子量(以下以「Mw」稱之),通常爲2x1 03〜1 X 1 〇5,理想爲 5x 1 03 〜5x 1 04,MW 不足 2x 1 ο 3時,顯像優點惡化,所得被覆膜的殘膜率等降低, 又’圖案形狀、耐熱性等劣化,一方面超過1 X 1 0 5時 ,感度降低圖案形狀惡化。 含上述共聚合物〔A〕的感放射線性樹脂組成物,顯 像時不產生殘留顯像,又,不產生膜緣,容易形成設定之 圖案形狀。 經濟部智慧財產局員工消費合作社印製 用於共聚合物〔A〕的溶媒,具體的可列舉如甲醇、 乙醇等的醇類;四氫呋喃等的醚類;乙二醇單甲基醚、乙 二醇單乙基醚等的乙二醇單烷基醚類;醋酸甲基乙二醇乙 醚酯、醋酸乙基乙二醇乙醚酯等的醋酸烷基乙二醇乙醚酯 類;二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二 甲基醚、二乙二醇單乙基醚、二乙二醇乙甲基醚等的二乙 二醇類;丙二醇甲基醚、丙二醇乙基醚、丙二醇丙基醚、 丙二醇丁基醚等的丙二醇烷基醚類;醋酸丙二醇甲基醚酯 '醋酸丙二醇乙基醚酯、醋酸丙二醇丙基醚酯 '醋酸丙二 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -13- 570947 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(11) 醇丁基醚酯等的醋酸丙二醇烷基醚酯;丙酸丙二醇甲基醚 酯、丙酸丙二醇乙基醚酯、丙酸丙二醇丙基醚酯、丙酸丙 二醇丁基醚酯等的丙酸丙二醇烷基醚酯;甲苯、二甲苯等 的芳香族烴類;甲乙基酮、環己酮、4 一羥基一四甲基2 -戊酮等的酮類;及醋酸甲酯、醋酸乙酯、醋酸丙酯、醋 酸丁酯、2 —羥基一丙酸乙酯、2 -羥基一 2 —甲基丙酸 甲酯、2 —羥基一 2 —甲基丙酸乙酯、羥基醋酸甲酯、經 基醋酸乙酯、羥基醋酸丁酯、乳酸甲酯、乳酸乙酯、乳酸 丙酯、乳酸丁酯、3 -羥基丙酸甲酯、3 -羥基丙酸酯、 3 —羥基丙酸丙酯、3 -羥基丙酸酯、2 -羥基一 3 -曱 基丁酸甲酯、甲氧基醋酸甲酯、甲氧基醋酸乙酯、甲氧基 醋酸丙酯、曱氧基醋酸丁酯、氧基醋酸曱酯、乙氧基醋酸 乙酯、乙氧基醋酸丙酯、乙氧基醋酸丁酯、丙氧基醋酸甲 酯、丙氧基醋酸乙酯、丙氧基醋酸丙酯、丙氧基醋酸丁酯 、丁氧基醋酸甲酯、丁氧基醋酸乙酯、丁氧基醋酸丙酯、 丁氧基醋酸丁酯、2 -曱氧基丙酸甲酯、2 -甲氧基丙酸 乙酯、2 —甲氧基丙酸丙酯、2 -甲氧基丙酸丁酯、2 — 乙氧基丙酸甲酯、2 -乙氧基丙酸乙酯、2 -乙氧基丙酸 丙酯、2 —乙氧基丙酸丁酯、2 -丁氧基丙酸甲酯、2 -氧基丙酸乙酯、2 -丁氧基丙酸丙酯' 2 - 丁氧基丙酸丁 酯、3 —甲氧基丙酸甲酯、3 —甲氧基丙酸乙酯、3 —甲 氧基丙酸丙酯、3 -甲氧基丙酸丁酯、3 -乙氧基丙酸甲 酯、3 -乙氧基丙酸乙酯、3 -乙氧基丙酸丙酯、3 -乙 氧基丙酸丁酯、3 -丙氧基丙酸甲酯、3 -丙氧基丙酸乙 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14 - 570947 A7 B7 五、發明説明(12) 酯、3 -丙氧基丙酸丙酯、3 -丙氧基丙酸丁酯、、3 -丁氧基丙酸甲酯、3 -丁氧基丙酸乙酯、3 -丁氧基丙酸 丙酯、3 - 丁氧基丙酸丁酯等的酯類。 有關共聚合物〔A〕製造用的聚合引發劑,一般所知 的自由基聚合引發劑均可使用,例如2,2 " —偶氮二異 丁腈、2,-偶氮二一(2,4 一二甲基戊腈)、2 ,2 / -偶氮一(四羥基一 2,4 一二甲基戊腈)等的偶 氮化合物;過氧化苯醯、過氧化月桂醯、特戊酸一叔一過 氧化丁基酯、1 ,1 /一雙—(過氧化一叔—丁基)環己 烷等的過氧化物;及過氧化氫。以過氧化物作聚合引發劑 時,可同時使用過氧化物及還元劑的氧化還元型聚合引發 劑。 1 ,2 -醌酮二疊氮基化合物 本發明所用的1 ,2 -醌酮二疊氮基化合物,可列舉 如1,2 -對苯驅二疊氮基碌酸酯、1 ,2 -萘艦二疊氮 基磺酸酯、1,2 -對苯醌二疊氮基磺酸胺、1 ,2 -萘 醌二疊氮基磺酸胺等。 其具體例有2,3,4 一三羥對苯醌一 1 ,2 -萘S昆 二疊氮基一 4 一磺酸酯、2,3,4 一三羥對苯醌一 1, 2 -萘醌二疊氮基—5 —磺酸酯、2,4,6 —三羥對苯 醌一 1,2 _萘醌二疊氮基一 4 —磺酸酯、2,4,6 -三羥對苯醌一 1,2 -萘醌二疊氮基一 5 -磺酸酯等的三 羥對苯醌一 1 ,2 —萘醌的二疊氮基磺酸酯類;2,2 / 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) " ~ ^ -15 - (請先閱讀背面之注意事項再填寫本頁) 衣· 訂 經濟部智慧財產局員工消費合作社印製 570947 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(13 ) 一 4,4 / 一四羥對苯醌一 1 ,2 -萘醌二疊氮基一 4 一 磺酸酯、2,2 / — 4,4 / 一四羥對苯醌一 1 ,2 —萘 醌二疊氮基一 5 —磺酸酯、2,3 - 4,3 > -四羥對苯 醌一 1,2 -萘醌二疊氮基一 4 —磺酸酯、2,3 — 4, 3 > -四羥對苯醌一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯 、2,3 — 4,4 ——四羥對苯醌—1 ,2 -萘醌二疊氮 基一 4 —磺酸酯、2,3 — 4,4 / —四羥對苯醌—1 , 2 -萘醌二疊氮基一 5 -磺酸酯、2,3 - 4,2 / —四 羥一 4 > 一甲基對苯醌一 1 ,2 一萘醌二疊氮基一 4 一磺 酸酯、2,3 — 4,2 / —四羥一 4 / 一甲基對苯醌—1 ,2 -萘醌二疊氮基一 5 —磺酸酯、2,3 - 4,4 / 一 四羥一 3 > -甲基對苯醌一 1 ,2 —萘醌二疊氮基一 4 一 磺酸酯' 2,3 — 4,4 > —四羥—3 / —甲基對苯醌一 1 ,2 —萘醌二疊氮基- 5 -磺酸酯等的四羥一甲基對苯 醌的1,2 —萘醌二疊氮基磺酸酯;2,3,4,2 —, 6 — -五羥一 1 ,2 -萘醌二疊氮基一 4 一磺酸酯、2, 3,4,,6 > -五羥—1 ,2 —萘醌二疊氮基一 5 -磺酸酯的五羥基萘醌的二疊氮基磺酸酯;2,4,6, 3 >,4 — 5 > -六羥對苯醌一 1,2 -萘醌二疊氮基— 4 一磺酸酯、2,4,6,3 / ,4 / 5 — -六羥對苯醌 —1 ,2 -萘醌二疊氮基一 5 —磺酸酯、3,4,5 , 3 /,4 — 5 ——六羥對苯醌一 1 ,2 -萘醌二疊氮基— 4 一磺酸酯、3,4,5 ,3 / ,4 / 5 / -六羥對苯醌 - 1 ,2 -萘醌二疊氮基一 5 -磺酸酯等的六羥對苯醌萘 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -16- 570947 A7 B7 五、發明説明(14) (請先閱讀背面之注意事項再填寫本頁) 醌二疊氮基磺酸酯;雙(2,4 一二羥苯基)甲烷一對苯 醌一 1,2 -萘醌二疊氮基一 4 一磺酸酯、雙(2,4 一 二羥苯基)甲烷一對苯醌一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯、雙(對一羥苯基)甲烷一對苯醌一 1 ,2 -萘醌 二疊氮基一 4 一磺酸酯、雙(對-羥苯基)甲烷一對苯醌 一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯、三(對一羥苯基 )曱烷一對苯醌一 1 ,2 -萘醌二疊氮基一 4 一磺酸酯、 三(對一羥苯基)甲烷一對苯醌一 1 ,2 -萘醌二疊氮基 一 5 —磺酸酯、1 ,1 ,1 一三(對一羥苯基)乙烷一對 苯醌一 1 ,2 -萘醌二疊氮基—4 一磺酸酯、1 ,1 ,1 一三(對一羥苯基)乙烷一對苯醌一 1 ,2 -萘醌二疊氮 經濟部智慧財產局員工消費合作社印製 基一 5 -磺酸酯、雙(2,3,4 —羥苯基)甲烷一 1 , 2 -萘醌二疊氮基—4 —磺酸酯、雙(2,3,4 —羥苯 基)甲烷一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯、2 ,2 一雙(2,3,4 一羥苯基)丙烷—1 ,2 -萘醌二疊氮 基一 4 一磺酸酯、2,2 -雙(2,3,4 一羥苯基)丙 烷一 1 ,2 -萘醌二疊氮基一 5 —磺酸酯、1 ,1 ,3 — 三(2,5 -二甲基—4 一羥基苯)-3 —苯基丙烷一 1 ,2 -萘醌二疊氮基一 4 一磺酸酯、1 ,1 ,3 —三(2 ,5 -二甲基一 4 一羥基苯)-3 -苯基丙烷一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯、4,4 > 一〔 1 一〔 4 一〔 1—〔4—羥苯基〕—1—甲乙基〕苯基〕乙叉〕雙酚― 1 ,2 -萘醌二疊氮基—4 —磺酸酯、4,4 > 一〔 1 一 〔4 一〔 1 一〔4 一經苯基〕一 1 一甲乙基〕苯基〕乙叉 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -17- 570947 Α7 Β7 五、發明説明(15) (請先閱讀背面之注意事項再填寫本頁) 〕-3 -雙酚一 1 ,2 -萘醌二疊氮基一 5 -磺酸酯、雙 (2,5 -二甲基一 4 一羥苯基)-2 -羥苯基甲烷一 1 ,2 -萘醌二疊氮基一 4 一磺酸酯、雙(2,5 —二甲基 一 4 一羥苯基)-2 -羥苯基甲烷一 1 ,2 -萘醌二疊氮 基一 5 -磺酸酯、3 ,3 ,3^ ,3 一―四曱基—1 , 1 > —螺二印—5 ,δ ,7,5 一 ,6 > ,7 己醇— 1 ,2 —萘醌二疊氮基一 4 —磺酸酯、3,3,3 —, 3一一四甲基一1 ,1一一螺二印一5 ,6 ,7 ,5', 6 >,7 ——己醇—1 ,2 -萘醌二疊氮基一 5 -磺酸酯 、2,2,4 —三甲基—7,22,,4,—三羥黃烷— 1 ,2 —萘醌二疊氮基—4 一磺酸酯、2,2,4 —三甲 基一 7,22 /,4 > 一三羥黃烷—1 ,2 -萘醌二疊氮 基一 5 -磺酸酯等的(聚羥苯基)烷的1 ,2 -萘醌二疊 氮基磺酸酯。 又,上述所例示的1 ,2 -萘醌二疊氮基磺酸酯類的 酯結合改變爲1 ,2 -萘醌二疊氮基磺酸胺類,如2,3 ,4 一三羥苯醌一 1 ,2 —萘醌二疊氮基一 4 —磺酸胺等 亦適合使用。 經濟部智慧財產局員工消費合作社印製 此中亦以使用2,3,4 —三羥對苯醞一 1 ,2 -萘 醞二疊氮基一 4 一磺酸酯、2,3 — 4,4 / 一四羥對苯 醌一 1,2 -萘醌二疊氮基一 4 一磺酸酯、雙(2,4 一 二羥苯基)甲烷一對苯醌—1 ,2 -萘醌二疊氮基一 4 一 磺酸酯、4,4 > 一〔 1 —〔 4 —〔 1 —〔 4 —羥苯基〕 一 1 一甲乙基〕苯基〕乙叉〕雙酚一 1 ,2 -萘醌二疊氮 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) -18- 570947 A7 B7 五、發明説明(16) 基—4 —磺酸酯、1 ,1 ,3 —三(2,5 —二甲基—4 一經基苯)-3 -苯基丙院一 1 ,2 -萘醒二疊氮基—4 一磺酸酯等爲理想,其中2,3,4 一三羥對苯醌一 1, 2 —萘醌二疊氮基一 4 —磺酸酯、2,3 — 4,4,一四 羥對苯醌一 1 ,2 -萘醌二疊氮基一 4 —磺酸酯、4, 4> —〔1—〔4 —〔1一〔4 —羥苯基〕一1—曱乙基 〕苯基〕乙叉〕雙酚一 1,2 -萘醌二疊氮基一 4 一磺酸 酯、1 ,1 ,3 —三(2,5 —二甲基—4 —羥基苯)- 3 -苯基丙烷一 1 ,2 -萘醌二疊氮基一 4 一磺酸酯特別 理想。 此等的1,2 -萘醌二疊氮基化合物可單獨或二種以 上組合使用。 〔B〕成分的使用量爲每1 0 0重量份〔A〕成分用 5〜1 〇 〇重量份,較理想爲1 0〜5 0重量份。此比例 不足5重量份時,以放射線照射而生成的酸量較少,故放 射線照射的部份與未照射部份對顯影液的鹼性水溶液的溶 解度差距小,圖案成形有困難。又,環氧基的反應有關的 酸量少不能得到充分的耐熱性及耐溶劑性。一方面,此比 例超過1 0 0量份時,短時間的放射線照射,未反應的成 分〔B〕多量殘留,對上述鹼性水溶液的不溶化效果過高 ,顯影困難。 <其他的成分> 有關本發明的感放射線性樹脂組成物,除了上述的[ 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閱讀背面之注意事項再填寫本頁)-9-570947 A7 B7 V. Description of the Invention (7) (Please read the precautions on the back before filling this page) and other aryl acrylates; diethyl maleate, diethyl fumarate, and methylidene Unsaturated dicarboxylic acid such as diethyl acid; methacrylic acid 2; hydroxyalkyl methacrylate such as ethyl ester, 2-hydroxypropyl methacrylate; etc .; bicyclo [2,2 · 1] heptane— 2-ene, 5-methylbicyclo [2,2.g] hepta-2-ene, 5-ethylbicyclo [2,2 · 1] hept-2-ene, 5-hydroxy-soil [2 ' 2 · 1] Hepta-2-ene, 5-Hexyl monocycle [2,2 · 1] Hept-2-ene, 5-Hydroxymethylbicyclo [2,2 -1] Hept-2-ene, 5 — Methoxybicyclo [2,2.Hepta-2-ene, 5,6-dicarboxybicyclo [2,2.1]] hepta-2-ene, 5,6-dimethoxybicyclo [ 2,2 · 1] heptan-2-ene, 5,6-diethoxybicyclo [2,2 — 1] heptan-2-ene, 5 -residue 5-methylbicyclo [2,2 1] Hepta-2- stripe, 5-residue-6-methylbicyclo [2,2 · 1] Hepta-2-ene, 5one condensed-6-ethylbicyclo [2 , 2 · 1] Hepta-2-ene, 5,6 —Second printed by the consumer property cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [2,2 · 1] Hepta-2-ene anhydride, 5 -tert-butoxy Carbonyl bicyclo [2,2 · 1] heptan-2-ene, 5-cyclohexyloxycarbonyl bicyclo [2,2. 1] heptan-2-ene, 5-phenoxycarbonyl bicyclo [2,2 · 1 ] Hept-2-ene, 5,6-bis (tert-butoxycarbonyl) bicyclo [2, 2 · 1] Hepta-2-ene, 5,6-bis (cyclohexyloxycarbonyl) bicyclo [2,2 · 1] Bicyclic unsaturated compounds such as hept-2-ene; phenylmaleimide, cyclohexylmaleimide, benzylmaleimide, N-succinylpyridine-3- Maleimide imine benzoate, N-succinyl fermentate- 4 -maleimide imidate butyrate, N-succinyl fermentate-6-maleimide iminohexanoate, N-amber Enzyme-3-maleimide imine This paper is in accordance with the Chinese National Standard (CNS) A4 specification (21〇X 297 mm) -10- 570947 A7 ______ B7 V. Description of the invention (8) (Please read the back Note: Please fill in this page again) Malays such as phenylpropionate, N- (acrylic acid) maleimide, imine, etc. Imine compounds; and styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride , Vinylidene chloride, acrylamine, methacrylamine, vinyl acetate '1,3-butadiene, isopropylene, 2,3-dimethyl-1,3-butadiene, and the like. Among these, from the viewpoints of copolymerization reactivity and solubility in an alkaline aqueous solution, styrene, t-butyl methacrylate, dicyclopentyl methacrylate, p-methylbenzene, and acrylic acid are used. Mono-2-fluorenyl cyclohexyl ester, 1,3-butadiene, bicyclo [2.2 · 1] hepta-2-ene, etc. are preferable. They can be used alone or in combination of two or more. Specific examples of the copolymer [A] used in the present invention include styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylate [5.2 · 1 · 〇2 · 6] decane-8-methyl ester copolymer, styrene / methyl acrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [5.2.1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 02] 6] Decane-8-fluorenyl ester / mono-t-butyl methacrylate copolymer, styrene / fluorenyl acrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylate [5 · 2 · 1 · 〇2 · 6] decane-8-methyl ester / p-methoxystyrene copolymer, styrene / methacrylic acid / Glycidyl methacrylate / 2-Hydroxyethyl methacrylate / Tricyclic methacrylate [5 · 2 · 1 · 0 2 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -11 -570947 A7 B7 V. Description of the invention (9) • 6] Decane-8-fluorenyl ester / 2-methylcyclohexyl methacrylate copolymer (Please read the precautions on the back before filling this page) Styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [5.2 · 1 · 〇2 · 6] decane-8-methyl ester / 1,3 butadiene copolymer, styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [ 5.2 · 1 · 0 2] Guiyuan one 8-S exhaust vinegar / one ring [2. 2 · 1] heptyl 2-flammable copolymer, styrene / methacrylic acid / glycidyl methacrylate / Trimethylacrylic acid 2,3 -dihydroxypropyl ester / methacrylic acid tricyclic [5 · 2. .1 · 02 · 6] decane-8-methyl ester copolymer, styrene / methacrylic acid / methacrylic acid Glycidyl ester / 2,3-dihydroxypropyl methacrylate / tricyclic methacrylate [5. 2 · 1. 0 2 · 6] decane-8-fluorenyl ester / mono-tert-butyl methacrylate Printed by the Polymer and Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy and the Ministry of Economic Affairs, printed by styrene / methacrylic acid / glycidyl methacrylate / methacrylic acid 2,3-dihydroxypropyl ester / tricyclic methacrylic acid [5 2. 1 • 02 · 6] decane-8-methyl ester / p-methoxystyrene copolymer, styrene / methacrylic acid / glycidyl methacrylate / methacrylic acid 2,3-dihydroxy Propyl ester / triacrylic acid [5.2.1 • 02 · 6] decane-8-methyl ester / methacrylic acid 2-methylcyclohexyl copolymer, styrene / methacrylic acid / methyl Glycidyl acrylate / methyl This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm) -12- 570947 A7 B7 V. Description of the invention (10) 2,3-Dihydroxypropyl acrylate / methacrylic acid Tricyclic [5 _ 2.. 1 • 02 · 6] decane-8-fluorenyl ester / 1,3 butadiene copolymer, (Please read the precautions on the back before filling this page) Styrene / methacrylic acid / Glycidyl methacrylate / 2,3-dihydroxypropyl methacrylate / tricyclic methacrylate [5 · 2 · 1 • 〇2 · 6] decane-8-fluorenyl ester / bicyclo [2 · 2 · 1] hept-2-ene copolymer The copolymer [A] polystyrene-equivalent weight average molecular weight (hereinafter referred to as "Mw") used in the present invention is usually 2x1 03 to 1 X 1 5, ideally 5x 1 03 to 5x 1 04, MW less than 2x 1 ο 3, the development advantages deteriorate, the residual film rate of the resulting coating film is reduced, and the pattern shape, heat resistance and other deterioration, on the one hand, it exceeds 1 When X 1 0 5, the sensitivity decreases and the shape of the pattern deteriorates. The radiation-sensitive resin composition containing the above-mentioned copolymer [A] does not cause residual development during development, and does not generate a film edge, and easily forms a set pattern shape. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints solvents for copolymers [A]. Specific examples include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; ethylene glycol monomethyl ether and ethylene diethylene glycol. Ethylene glycol monoalkyl ethers such as alcohol monoethyl ether; Ethyl glycol monoethyl ether ethers such as methyl ethylene glycol ethyl ether acetate, ethyl glycol ether ethyl acetate; etc. Diethylene glycols such as methyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol ethyl methyl ether; propylene glycol methyl Propylene glycol alkyl ethers such as ether, propylene glycol ethyl ether, propylene glycol propyl ether, propylene glycol butyl ether; propylene glycol methyl ether acetate 'propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate' propylene acetate paper Standards apply to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) -13- 570947 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (11) Propyl glycol glycol acetates such as butyl ether ether esters Ether ether; propylene glycol propionate methyl ether ester, propylene glycol propionate ethyl Ether esters, propylene glycol propionate propyl ether ester, propylene glycol butyl ether propionate, and other propylene glycol alkyl ether esters; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ketone, cyclohexanone, 4-monohydroxy Ketones such as tetramethyl 2-pentanone; and methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxy-monopropionate, 2-methyl 2-methylpropionate Esters, 2-hydroxy-2-methyl propionate, methyl hydroxyacetate, ethyl ethyl acetate, butyl hydroxy acetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxy Methyl propionate, 3-hydroxypropionate, propyl 3-hydroxypropionate, 3-hydroxypropionate, 2-hydroxy-3-methylmethyl butyrate, methyl methoxyacetate, methoxy Ethyl acetate, propyl methoxyacetate, butyl methoxyacetate, butyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate Esters, ethyl propoxy acetate, propyl propoxy acetate, butyl propoxy acetate, methyl butoxy acetate, ethyl butoxy acetate, butoxy vinegar Propyl ester, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate , 2-methyl ethoxypropionate, 2-ethyl ethoxypropionate, 2-propyl ethoxypropionate, 2-butyl ethoxypropionate, 2-butoxypropionate , Ethyl 2-methoxypropionate, propyl 2-butoxypropionate '2-butyl butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, Propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, Butyl 3-propoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate (please read the notes on the back before filling out this page) This paper size applies to Chinese national standards (CNS ) A4 specification (210X297mm) -14-570947 A7 B7 V. Description of the invention (12) Esters, 3-propoxypropionate propyl, 3-propoxypropionate butyl, 3-butoxypropionate Esters such as methyl ester, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, and butyl 3-butoxypropionate. Regarding the polymerization initiator used in the production of the copolymer [A], generally known free-radical polymerization initiators can be used, such as 2, 2-azobisisobutyronitrile, 2,-azobisone (2 , 4-Dimethylvaleronitrile), 2, 2 / -Azo- (tetrahydroxy-2,4-Dimethylvaleronitrile), and other azo compounds; phenylhydrazone, lauryl peroxide, and pentamidine Acid mono-tert-butyl peroxide, 1, 1 / -bis- (per-tert-butyl) cyclohexane, and peroxides; and hydrogen peroxide. When a peroxide is used as a polymerization initiator, an oxidation-reduction type polymerization initiator of a peroxide and a reduction agent may be used at the same time. 1,2-quinone ketone diazide compound The 1,2-quinone ketone diazide compound used in the present invention can be exemplified by 1,2-p-phenylene diazide ester, 1,2-naphthalene Diazide sulfonate, 1,2-p-benzoquinonediazide sulfonate, 1,2-naphthoquinonediazide sulfonate and the like. Specific examples thereof are 2,3,4-trihydroxy-p-benzoquinone-1,2-naphthalene S-quindiazide-4-sulfonic acid ester, 2,3,4-trihydroxy-p-benzoquinone-1,2,- Naphthoquinonediazide-5-sulfonate, 2,4,6-trihydroxyp-benzoquinone-1,2-naphthoquinonediazide-4-sulfonate, 2,4,6-trihydroxy Trihydroxy-p-benzoquinone-1,2-naphthoquinonediazide sulfonates such as p-benzoquinone-1,2-naphthoquinonediazide-5-sulfonate; 2,2 / this paper Standards are applicable to China National Standard (CNS) A4 specifications (210X 297 mm) " ~ ^ -15-(Please read the precautions on the back before filling this page) Clothing · Order Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 570947 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention (13)-4,4 / -tetrahydroxyparabenzoquinone-1, 2-naphthoquinonediazide-4 -sulfonate, 2, 2 /-4,4 / -tetrahydroxyp-benzoquinone-1, 2, -naphthoquinonediazide-5-sulfonate, 2,3-4,3 > -tetrahydroxyp-benzoquinone -1,2 -Naphthoquinonediazide- 4-sulfonate, 2,3-4, 3 > -tetrahydroxy-p-benzoquinone 1,2-naphthoquinonediazide-5-sulfonate, 2,3--4,4 ——tetrahydroxyp-benzoquinone-1,2-naphthoquinonediazide-4-sulfonate, 2 , 3,4,4 / -tetrahydroxyp-benzoquinone-1, 2 -naphthoquinonediazide-5-sulfonate, 2,3-4,2 / -tetrahydroxy-1 -4 > monomethyl para Benzoquinone-1,2naphthoquinonediazide-4 monosulfonate, 2,3-4,2 / 2-tetrahydroxy-4 / monomethylp-benzoquinone-1,2-naphthoquinonediazide 5-sulfonate, 2,3-4,4 / 1 -tetrahydroxyl 3 >-methyl p-benzoquinone-1, 2-naphthoquinonediazide-4 monosulfonate '2, 3 — 4,4 > —Tetrahydroxy-3 / —methyl-p-benzoquinone-1,2 —naphthoquinonediazide-5 -sulfonic acid esters, such as tetrahydroxymonomethyl-p-benzoquinone 1,2 — Naphthoquinonediazidesulfonate; 2,3,4,2 —, 6 — -pentahydroxy-1,2-naphthoquinonediazide-4 monosulfonate, 2, 3,4,6 > -pentahydroxy-1,2-naphthoquinonediazide-5-sulfonate pentahydroxynaphthoquinonediazidesulfonate; 2,4,6,3 >, 4 -5 > -Hexahydroxy-p-benzoquinone-1,2-naphthoquinonediazide — 4 monosulfonate, 2,4,6,3 /, 4/5 — -hexahydroxyp-benzoquinone — 1, 2-naphthoquinonediazide — 5-sulfonate, 3,4,5, 3 /, 4-5-hexahydroxyp-benzoquinone-1,2-naphthoquinonediazide-4 monosulfonate, 3,4,5, 3 /, 4/5 / -hexahydroxyp-benzoquinone -1,2-naphthoquinonediazide-5-sulfonate and other hexahydroxyparabenzoquinone naphthalene (please read the precautions on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) -16- 570947 A7 B7 V. Description of the invention (14) (Please read the notes on the back before filling in this page) Quinonediazide sulfonate; bis (2,4-dihydroxyphenyl) ) Methane parabenzoquinone-1,2-naphthoquinonediazide-4 monosulfonate, bis (2,4-dihydroxyphenyl) methane parabenzoquinone-1,2-naphthoquinonediazide -5-sulfonate, bis (p-hydroxyphenyl) methane benzoquinone-1, 2-naphthoquinone diazide-4-sulfonate, bis (p-hydroxyphenyl) methane Benzoquinone-1,2-naphthoquinonediazide-5-sulfonate, tris (p-hydroxyphenyl) pinene, 1-benzene 1,1,2-naphthoquinonediazide-4 monosulfonate, tris (p-hydroxyphenyl) methane parabenzoquinone 1,1,2-naphthoquinonediazide-5-sulfonate, 1 , 1,1, tris (p-hydroxyphenyl) ethane-benzobenzoquinone-1,2-naphthoquinonediazide-4 monosulfonate, 1,1,1, tris (p-hydroxyphenyl) ) Ethyl benzobenzoquinone-1,2-naphthoquinonediazide Intellectual Property Bureau of the Ministry of Economic Affairs Employees Cooperatives Printed bases 5-Sulfonate, bis (2,3,4-hydroxyphenyl) methane-1 , 2-naphthoquinonediazide-4-sulfonate, bis (2,3,4-hydroxyphenyl) methane-1,2-naphthoquinonediazide-5-sulfonate, 2,2 One bis (2,3,4 monohydroxyphenyl) propane-1, 2-naphthoquinonediazide-4 monosulfonate, 2,2-bis (2,3,4 monohydroxyphenyl) propane-1 1,2-naphthoquinonediazide-5-sulfonate, 1,1,3-tris (2,5-dimethyl-4 monohydroxybenzene) -3-phenylpropane-1,2-naphthalene Quinonediazide-4 monosulfonate, 1,1,3-tris (2,5-dimethyl-4-hydroxybenzene) -3 -phenylpropane-1,2- Quinonediazide-5-sulfonate, 4,4 > mono- [1- [4-[1- [4-hydroxyphenyl] -1-methyl ethyl] phenyl] ethylidene] bisphenol-1 , 2-naphthoquinonediazide-4-sulfonate, 4,4 > 1 [1 1 [4 1 [1 1 [4 1 phenyl] 1 1 methyl ethyl] phenyl] ethylidene paper The scale is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -17- 570947 Α7 Β7 V. Description of the invention (15) (Please read the precautions on the back before filling this page)] -3 -Bisphenol-1 2,2-naphthoquinonediazide- 5-sulfonate, bis (2,5-dimethyl-1 4-hydroxyphenyl) -2 -hydroxyphenylmethane-1,2-naphthoquinonediazide One 4-monosulfonate, bis (2,5-dimethyl-1 4-hydroxyphenyl) -2 -hydroxyphenylmethane-1,2-naphthoquinonediazide-5-sulfonate, 3, 3,3 ^, 3 1-tetrafluorenyl-1, 1 > --spirobiin-5, δ, 7,5 one, 6 >, 7 hexanol-1, 2 --naphthoquinonediazide-1 4-sulfonic acid ester, 3,3,3 —, 3-tetramethyl-1, 1, 1-spiro diimide 5, 6, 7, 5 ', 6 >, 7 —Hexanol—1,2-naphthoquinonediazide-5—sulfonate, 2,2,4-trimethyl-7,22,4, —trihydroxyflavane—1,2, naphthoquinone Diazide-4 monosulfonate, 2,2,4-trimethyl-7,22 /, 4 > Trihydroxyflavan-1, 2-naphthoquinonediazide-5-sulfonic acid (Polyhydroxyphenyl) alkane 1,2-naphthoquinonediazidesulfonate. In addition, the ester combination of the 1,2-naphthoquinonediazidesulfonic acid esters exemplified above is changed to 1,2-naphthoquinonediazidesulfonic acid amines, such as 2,3,4-trihydroxybenzene Quinone-1,2-naphthoquinonediazide-4-sulfonic acid amine is also suitable for use. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. It also uses 2,3,4-trihydroxy-p-benzene-1,2-naphthalene-1, diazido-4, sulfonate, 2,3-4, 4 / Tetrahydroxyp-benzoquinone-1,2-naphthoquinonediazide-4 monosulfonate, bis (2,4-dihydroxyphenyl) methane parabenzoquinone-1, 2-naphthoquinone di Azido-4 monosulfonate, 4,4 > mono- [1-[4 — [1-[4-hydroxyphenyl]-1 -methylethyl] phenyl] ethylidene] bisphenol -1,2 -Naphthoquinonediazide This paper is in accordance with Chinese National Standard (CNS) A4 specification (210 × 297 mm) -18- 570947 A7 B7 V. Description of the invention (16) Base-4 —sulfonic acid esters, 1, 1, 3 —Tris (2,5—dimethyl-4, triphenylene) -3—phenylpropanone—1,2, naphthyldiazide—4 monosulfonate, etc. are preferred, of which 2,3,4 Trishydroxyquinone-1,2-naphthoquinonediazide-1, 4-sulfonate, 2,3-4,4,4-tetrahydroxyparabenzoquinone-1,2-naphthoquinonediazide-1 4 —sulfonic acid ester, 4, 4> — [1— [4 — [1— [4-hydroxyphenyl] —1—fluorene] ] Phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-4 monosulfonate, 1,1,3-tris (2,5-dimethyl-4-hydroxybenzene) -3 -Phenylpropane-1,2-naphthoquinonediazide-4 monosulfonate is particularly desirable. These 1,2-naphthoquinonediazide compounds can be used alone or in combination of two or more. [B] The component is used in an amount of 5 to 100 parts by weight per 100 parts by weight of the [A] component, and more preferably 10 to 50 parts by weight. When the proportion is less than 5 parts by weight, the amount of acid generated by radiation irradiation is small, so the difference in solubility between the irradiated portion and the unirradiated portion in the alkaline aqueous solution of the developer is small, and pattern formation is difficult. In addition, the amount of the acid related to the reaction of the epoxy group is small, and sufficient heat resistance and solvent resistance cannot be obtained. On the one hand, when the ratio exceeds 100 parts by weight, a short period of radiation is irradiated, and a large amount of unreacted component [B] remains. The insolubilizing effect on the above-mentioned alkaline aqueous solution is too high, and development is difficult. < Other ingredients > Regarding the radiation-sensitive resin composition of the present invention, in addition to the above-mentioned [This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)] (Please read the precautions on the back before filling (This page)

、1T 經濟部智慧財產局員工消費合作社印製 570947 A7 B7 五、發明説明(17) (請先閱讀背面之注意事項再填寫本頁) A〕成分及〔B〕成分以外,依必要可含〔C〕感熱性酸 生成化合物、〔D〕至少具1個乙烯性不飽和雙鍵聚合1生 化合物、〔E〕環氧樹脂、〔F〕密合助劑、及〔G〕界 面活性劑。 上述〔C〕感熱性酸生成化合物,用以提高耐熱性及 硬度。其具體例如氟化銨類、市售品如甘y工< K (賽恩 得)S I — L 8 0、寸 > 工彳卜、(賽恩得)S I — L 1 1 〇、寸 > 工彳卜、(賽恩得)S I - L 1 5 0 (曰本三新化 學工業(株)製)等。 〔C〕成分的使用比例,以1 〇 〇重量份共聚合物〔 A〕理想爲2 0重量份以下,更理想爲5重量份以下。 作爲〔D〕至少具1個乙烯性不飽和雙鍵聚合性化合 物、適合使用如單官能(甲基)丙烯酸酯、二官能(甲基 )丙烯酸酯、及三官能(甲基)丙烯酸酯。 經濟部智慧財產局員工消費合作社印製 上述官能(甲基)丙烯酸酯、如2 -羥乙基(甲基) 丙烯酸酯、卡必醇(甲基)丙烯酸酯、異富爾酮基(甲基 )丙烯酸酯、3 -甲氧丁基(甲基)丙烯酸酯、對苯二酸 一 2 —(甲基)丙烯醯氧乙基一 2 -羥丙酯等。 此類的市售品有7 口二夕只(阿洛尼)Μ — 1 〇 1 、 同Μ— 111、同Μ— 114 (日本東亞合成(株)製) ,KAYARAD TC - ll〇S、同 TC — 120 S (日本化藥(株)製)匕、7〕一卜(比斯可)1 5 8、 同23 11 (日本大阪有機化學工業(株)製)。 上述二官能(甲基)丙烯酸酯,可列舉如乙二醇(甲 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) — 570947 A7 ____B7_ 五、發明説明(18 ) (請先閲讀背面之注意事項再填寫本頁) 基)丙細酸酯、1 ’ 6 -己院二醇二(甲基)丙烯酸酯、 1 ,9 一壬烷二醇二(甲基)丙烯酸酯、聚丙二醇二(甲 基)丙烯酸酯、四乙二醇(甲基)丙烯酸酯、雙酣氧甲醇 芴二丙烯酸酯。 的巾售品有7 口二夕只(阿洛尼)Μ — 2 1 Q 、同μ —240、同M— 6200 (日本東亞合成(株)製)、 KAYARAD HDDA、同 HX — 220 、同 R — 604 (日本大阪有機化學工業(株)製)等。1.1T printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 570947 A7 B7 V. Description of the invention (17) (Please read the precautions on the back before filling this page) A] ingredients and [B] ingredients, if necessary, may contain [ C] Thermosensitive acid generating compound, [D] At least one ethylenically unsaturated double bond polymerization primary compound, [E] epoxy resin, [F] adhesion promoter, and [G] surfactant. The above-mentioned [C] thermosensitive acid-forming compound is used to improve heat resistance and hardness. Specific examples thereof are ammonium fluorides, and commercially available products such as Gan Kung < K (Saind) SI — L 8 0, inch > Gongbu, (Saind) SI — L 1 1 0, inch & gt Gongbubu, (Siende) SI-L 1 50 (by Ben Sanxin Chemical Industry Co., Ltd.) and so on. [C] The use ratio of the component is preferably 100 parts by weight or less of the copolymer [A], and more preferably 5 parts by weight or less. [D] As the polymerizable compound having at least one ethylenically unsaturated double bond, monofunctional (meth) acrylate, difunctional (meth) acrylate, and trifunctional (meth) acrylate are suitably used. The above-mentioned functional (meth) acrylates, such as 2-hydroxyethyl (meth) acrylate, carbitol (meth) acrylate, isophorone-based (methyl) ) Acrylate, 3-methoxybutyl (meth) acrylate, terephthalic acid 2- (meth) acrylic acid ethyl 2-hydroxypropyl ester, and the like. Commercial products of this type include 7 mouthpieces (Alone) M — 〇1, the same M — 111, the same M — 114 (manufactured by Japan Toa Synthetic Co., Ltd.), KAYARAD TC-110, the same TC — 120 S (manufactured by Nippon Kayaku Co., Ltd.), 7] bu (bisco) 1 5 8 and 23 11 (manufactured by Osaka Organic Chemical Industry Co., Ltd.). The above-mentioned difunctional (meth) acrylates can be exemplified by ethylene glycol (the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) — 570947 A7 ____B7_ V. Description of the invention (18) (Please read first Note on the back, please fill in this page again) Base) Propionate, 1 '6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, polypropylene glycol Di (meth) acrylate, tetraethylene glycol (meth) acrylate, bis (oxy) methanol, and diacrylate. There are 7 mouthpieces of Erika (Alone) M — 2 1 Q, same μ — 240, same M — 6200 (manufactured by Japan Toa Synthetic Co., Ltd.), KAYARAD HDDA, same HX — 220, and R — 604 (manufactured by Osaka Organic Chemical Industry Co., Ltd.), etc.

上述三官能(甲基)丙烯酸酯、可列舉如三羥甲基丙 烷三(甲基)丙烯酸酯、五丁四醇三(甲基)丙烯酸酯、 三((甲基)丙烯醯氧乙基)膦酸酯、五丁四醇四(甲基 )丙烯酸酯、二·五丁四醇五(甲基)丙烯酸酯、二·五 丁四醇六(曱基)丙烯酸酯等,其市售品有7 口二夕只( 阿洛凡)M— 309、同Μ — 400、同M— 40 5 、同 Μ — 450 、同 Μ— 7100、同 Μ— 8030 、同 Μ-8060 (日本東亞合成(株)製)、KAYARADTMPTA 經濟部智慧財產局員工消費合作社印製 、同 DPHA、同 DPCA — 20、同 DPCA— 30 、 同—DPCA — 60、同 DPCA— 120 (日本化藥( 株)製)、匕、只〕一卜(比斯可)295 、同300 、同 360 、同GPT、同3ΡΑ、同40〇(曰本大阪有機 化學工業(株)製)等。此單官能、二官能及三官能以上 的(甲基)丙烯酸酯可單獨或組合使用。 〔D〕成分的使用比例,對1 0 0重量份共聚合物〔 A〕以5 0重量份以下爲理想,更理想爲3 0重量份以下 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -21 - 570947 Μ Β7 五、發明説明(19) 〇 由含此比例〔D〕成分的本發明的感放射線性樹脂組 成物所得的保護膜及絕緣膜,可提高其耐熱性及表面硬度 。此比例超過5 0重量份時,共聚合物〔A〕對鹼性可溶 性樹脂的相溶性不充分,塗覆時膜會產生皺紋。 上述〔E〕環氧樹脂在不影響相溶性下,雖無限制’ 但以雙酚A型環氧樹脂、酚淸漆型環氧樹脂、甲酚淸漆型 環氧樹脂、環狀脂肪族環氧樹脂、縮水甘油酯型環氧樹脂 、縮水甘油胺型環氧樹脂、複素環式環氧樹脂、縮水甘油 甲基丙烯酸酯等(共)聚合的樹脂。 其中以雙酚A型環氧樹脂、甲酚淸漆型環氧樹脂、縮 水甘油酯型環氧樹脂等爲理想。 〔E〕成分的使用比例,對1 0 0重量份共聚合物〔 A〕以3 0重量份以下爲理想。 由含此比例〔D〕成分的本發明的感放射線性樹脂組 成物所得的保護膜及絕緣膜,可提高其耐熱性及表面硬度 〇 此比例超過5 0重量份時,共聚合物〔A〕對鹼性可 溶性樹脂的相溶性不充分,不能得到很充分的塗膜形成能 〇 共聚合物〔A〕亦稱爲「環氧樹脂」,具鹼可溶性, 此與〔E〕成分不同。 爲提高塗覆性可使用〔E〕界面活性劑。市售品有Μ —1〇〇〇、ΒΜ— 1100 (BMCHEMI 公司製) 本紙張尺度適用中國國家標準(CNS ) A4規格(21 ox 297公釐) (請先閲讀背面之注意事項再填寫本頁) 水. 經濟部智慧財產局員工消費合作社印製 22- 570947 Α7 Β7 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁)Examples of the trifunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, pentabutanol tri (meth) acrylate, and tri ((meth) acrylic acid oxyethyl). Phosphonates, penta-tetraol tetra (meth) acrylate, di · pentaerythritol penta (meth) acrylate, di · pentaerythritol hexa (fluorenyl) acrylate, and the like are commercially available. 7 mouths only (Alofan) M-309, same M-400, same M-40 5, same M-450, same M-7100, same M-8030, same M-8060 (Japan East Asia Synthesis (strain ), KAYARADTMPTA Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the same as DPHA, the same as DPCA-20, the same as DPCA-30, the same as DPCA-60, the same as DPCA120 (made by Nippon Kayaku Co., Ltd.), and , Only] Yibu (Bisco) 295, same 300, same 360, same GPT, same 3PA, same as 40 (made by Osaka Organic Chemical Industry Co., Ltd.), etc. These monofunctional, difunctional, and trifunctional (meth) acrylates may be used alone or in combination. [D] The proportion of the component used is 100 parts by weight of the copolymer [A] It is preferably 50 parts by weight or less, more preferably 30 parts by weight or less. This paper applies the Chinese National Standard (CNS) A4 specification ( 210X 297 mm) -21-570947 Μ B7 V. Description of the invention (19) 〇 The protective film and the insulating film obtained from the radiation-sensitive resin composition of the present invention containing the component (D) in this proportion can improve its heat resistance And surface hardness. When the proportion exceeds 50 parts by weight, the compatibility of the copolymer [A] with the alkali-soluble resin is insufficient, and the film may be wrinkled during coating. The above [E] epoxy resins are not limited without affecting compatibility, but bisphenol A type epoxy resin, phenol lacquer type epoxy resin, cresol lacquer type epoxy resin, and cyclic aliphatic ring (Co) polymerized resins such as oxygen resins, glycidyl ester epoxy resins, glycidylamine epoxy resins, compound epoxy resins, glycidyl methacrylate, and the like. Among them, bisphenol A type epoxy resin, cresol lacquer type epoxy resin, glycidyl ester type epoxy resin and the like are preferable. [E] The use ratio of the component is preferably 30 parts by weight or less with respect to 100 parts by weight of the copolymer [A]. The protective film and the insulating film obtained from the radiation-sensitive resin composition of the present invention containing the component [D] in this proportion can improve its heat resistance and surface hardness. When the proportion exceeds 50 parts by weight, the copolymer [A] The compatibility with alkaline soluble resins is insufficient, and a sufficient coating film forming energy cannot be obtained. The copolymer [A] is also called "epoxy resin" and has alkali solubility, which is different from the component [E]. [E] surfactant can be used to improve coating properties. The commercially available products are M—1000, BM—1100 (made by BMCHEMI). The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 ox 297 mm). (Please read the precautions on the back before filling in this page. ) Water. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 22- 570947 Α7 Β7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling out this page)

五、發明説明(2〇) > if 7 7 シ 夕 ( 美 可 普 ) F 1 7 3 Λ 同 F 1 8 3 ( 臼 工 業 ( 株 ) 製 ) 口 一 同 F C — 1 7 〇 C Λ 同 F C 曰 本 工 厶 ( 3 Μ ) ( 株 ) S — 1 1 2 Λ S — 1 1 3 Λ 同 S — 1 4 5 、 同 S — 3 S C — 1 〇 2 同 S C — 1 S C — 1 〇 5 Λ 同 S C — 1 5 工 卜 シ 7° ( 耶 普 脫 ) E F 3 5 2 ( 曰 本 新 秋 田 ( 株 — 1 9 0 S Η — 1 9 3 Λ 8 4 2 8 D C — 5 7 Λ D > ( 東 麗 矽 橡 膠 ) ( 株 ) 製 其 他 的 C F ] 成分 可使 氧 乙 烷 硬 脂 酸 酯 % 聚 ΤΜ. 壞 氧 乙 類 j 聚 m 氧 乙 院 辛 基 苯 醚 氧 乙 院 芳 基 醚 類 • y 聚 丫 tm ϊ哀 氧 乙 硬 脂 酸 酯 等 的 聚 X® 壞 氧 乙 院 二 類 y 才 IV 力、 V V 牛 Κ Ρ 3 4 1 ( 曰 本 信 越 化 學 烯 酸 系 共 聚 合 物 丨J 口 — 曰 本 共 榮 社 化 學 ( 株 ) 製 ) 此界面活性劑的使用比 F142D、同 F172、同 本大日本彳y牛(油墨)化學 卜'、(普拉多)F C — 1 3 5、 —430、同 FC — 431 ( )製),寸一7 口 y (賽幅隆 、S— 131、同 S — 141 82、同 SC— 1〇1 、同 03、同 SC— 1〇4、同 0 6 (日本旭硝子(株)製)V. Description of the invention (2〇) > if 7 7 xixi (Meikepu) F 1 7 3 Λ together with F 1 8 3 (made by Usu Kogyo Co., Ltd.) FC — 1 7 〇C Λ Same as FC The main work (3M) S. S. 1 1 2 Λ S — 1 1 3 Λ Same as S — 1 4 5, same as S — 3 SC — 1 〇2 Same as SC — 1 SC — 1 〇5 Λ Same as SC — 1 5 Gong Bu Shi 7 ° (Yeput) EF 3 5 2 (Yoshimoto Shin Akita (strain — 1 0 0 S Η — 1 9 3 Λ 8 4 2 8 DC — 5 7 Λ D > (Toray Other CF made by Silicone Rubber Co., Ltd.] component can make oxyethane stearate% poly-T. Bad oxygen j j poly m oxy ethyl octyl phenyl ether oxy ethyl aryl aryl ethers • y poly y tm Polyoxoethylene stearate, etc. Poly X® Badoxoin Class II Class IV Power, VV Bovine κ Ρ 3 4 1 (Said this Shin-Etsu chemical olefinic copolymer 丨 J 口 — 本本 共(Used by Sakae Chemical Co., Ltd.) The usage of this surfactant is higher than F142D, same as F172, and same as Dainippon yak (ink) chemistry. , (Prado) FC — 1 3 5, —430, same FC — 431 ()), inch 1 7 y (Sai Long, S — 131, same as S — 141 82, same as SC — 1101, same as 03. Same as SC—104, same as 0 6 (made by Japan Asahi Glass Co., Ltd.)

F301 、同 F3 — 3 、同 )製),SH- 28A、SH SZ — 6032、SF-C—190(日本東レシリπ )等氟系及矽系界面活性劑。 用聚環氧乙烷月桂酸酯、聚環 烷油酸酯等的聚環氧乙烷烷酯 聚環氧乙烷壬基苯醚等的聚環 烷二月桂酸酯、聚環氧乙烷二 烷酯類的非離子系界面活性劑 v (有機聚矽氧烷聚合物) 工業(株)製),(甲基)丙 (聚氟)Νο·57、95( 等。 例,對1 0 0重量份共聚合物 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -23- 570947 A7 B7 五、發明説明(21) 〔A〕以5重量份以下爲理想,更理想爲2重量份以下。 界面活性劑的量超過5重量份時,塗覆時膜會產生皺紋。 (請先閱讀背面之注意事項再填寫本頁) 又,爲提高與基板的接合性,可使用〔G〕接合助劑 。此類接合助劑以官能性自由基偶合劑爲理想,例如具錢 基、甲基丙烯醯基、異氰酸基、環氧基等反應性置換基等 的矽烷偶合劑。具體的例有三甲氧基甲矽烷基苯甲酸、γ -甲基丙烯氧基丙基三甲氧基矽烷、乙烯三甲氧基矽烷、 r -異氰酸-丙烯三乙基矽烷、r -環氧丙氧基丙基三甲 氧基矽烷、/3 -(3,4 一環氧環己基)乙基三甲基矽等 〇 此接合助劑的使用比例,對1 0 0重量份共聚合物〔 A〕以2 0重量份以下爲理想,更理想爲1 〇重量份以下 。接合助劑的量超過2 0重量份時,會產生殘留顯影。 本發明的感放射線樹脂合物係由上述共聚合物〔A〕 及1 ,2 -醌二疊氮基化合物與任意添加的上述其他配合 經濟部智慧財產局員工消費合作社印製 劑’均勻混合調製而成。通常,本發明的感放射線樹脂合 物係以適當的溶媒溶解成溶液使用。例如共聚合物〔A〕 及1,2 -醌二疊氮基化合物與任意添加的其他配合劑, 以所定的比例混合,調製成溶液狀態的感放射線樹脂合物 〇 本發明的感放射線樹脂合物調製用的溶媒係使用能溶 解共聚合物〔A〕及1,2 -醌二疊氮基化合物與任意添 加的其他配合劑各成分,而不與各成分反應的溶媒。 具體的有甲醇、乙醇等醇類;四氫呋喃等的醚類;乙 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 24- 570947 A7 B7 五、發明説明(22 ) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 二醇單甲基醚、乙二醇單乙基醚等的乙二醇醚類;甲基溶 纖素醋酸酯、基溶纖素醋酸酯的乙二醇烷基醚醋酸酯;二 乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二甲醚、 二乙二醇曱乙基醚等的二乙二醇類;丙二醇甲基醚、丙二 醇乙基醚、丙二醇丙基醚、丙二醇丁基醚等的丙二醇單院 基醚類;丙二醇甲基醚醋酸酯、丙二醇乙基醚醋酸酯、丙 二醇丙基醚醋酸酯、丙二醇丁基醚醋酸酯等的丙二醇單院 基醚醋酸酯類;丙二醇甲基醚丙酸酯、丙二醇乙基醚丙醋 酸酯、丙二醇丙基醚丙酸酯、丙二醇丁基醚丙酸酯等的丙 二醇單烷基醚丙酸酯類;甲苯、二甲苯等的芳香族烴類; 甲乙基酮、環己酮、4 一羥—4 一甲基一 2 —戊酮等的酮 類;及醋酸甲酯、醋酸乙酯、醋酸丙酯、醋酸丁酯、2 -羥基丙酸乙酯、2 —羥基一 2 -甲基丙酸甲酯、2 -羥基 - 2 —甲基丙酸乙酯、羥基丙酸曱酯、羥基丙酸乙酯、羥 基丙酸丁酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁酯 、3 -羥基丙酸甲酯、3 -羥基丙酸乙酯、3 -羥基丙酸 丙酯、3 -羥基丙酸丁酯、2 -羥基一 3 -甲基丁酸甲酯 、2-羥基一 3 -甲基丁酸乙酯、2 -羥基-3 —甲基丁 酸丙酯、2 —羥基一 3 -甲基丁酸丁酯、甲氧基醋酸甲酯 、甲氧基醋酸乙酯、甲氧基醋酸丙酯、甲氧基醋酸丁酯、 乙氧基醋酸甲酯、乙氧基醋酸乙酯、乙氧基醋酸丙酯、乙 氧基醋酸丁酯、丙氧基醋酸甲酯、丙氧基醋酸乙酯、丙氧 基醋酸丙酯、丙氧基醋酸丁酯、丁氧基醋酸甲酯、丁氧基 醋酸乙酯、丁氧基醋酸丙酯、丁氧基醋酸丁酯、2 -甲氧 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -25- 570947 A7 _B7 五、發明説明(23 ) (請先閱讀背面之注意事項再填寫本頁) 基丙酸甲酯、2 -甲氧基丙酸乙酯、2 -甲氧基丙酸丙酯 、2 —甲氧基丙酸丁酯、2 -乙氧基丙酸甲酯、2 -乙氧 基丙酸乙酯、2 -乙氧基丙酸丙酯、2 -乙氧基丙酸丁酯 、2 —丙氧基丙酸甲酯、2 -丙氧基丙酸乙酯、2 -丙氧 基丙酸丙酯、2 -甲氧基丙酸丁酯、2 -丁氧基丙酸甲酯 、2 -丁氧基丙酸乙酯、2 -丁氧基丙酸丙酯、2 -丁氧 基丙酸丁酯、3 -曱氧基丙酸甲酯、3 -甲氧基丙酸乙酯 、3 —甲氧基丙酸丙酯、3 -甲氧基丙酸丁酯、3 -乙氧 基丙酸甲酯、3 -乙氧基丙酸乙酯、3 -乙氧基丙酸丙酯 、3 -乙氧基丙酸丁酯、3 -丙氧基丙酸甲酯、3 —丙氧 基丙酸乙酯、3 -丙氧基丙酸丙酯、3 -甲氧基丙酸丁酯 、3 -丁氧基丙酸曱酯、3 -丁氧基丙酸乙酯、3 -丁氧 基丙酸丙酯、3 - 丁氧基丙酸丁酯等的酯類。 此類溶劑中依溶解性、依其對各成分的反應性及塗膜 的容易形成性,以乙二醇醚類的乙二醇烷基醚醋酸酯,酯 類及二乙二醇類爲理想。 經濟部智慧財產局員工消費合作社印製 且上述溶媒可與高沸點溶媒倂用。可倂用的高沸點溶 媒如N —甲基甲醯胺、N,N —二甲基甲醯胺、N —甲基 甲醯替苯胺、N -甲基乙醯胺、N,N —二甲基乙醯胺、 N -甲基吡咯烷酮、二甲亞碼、苄乙基醚、二己基醚、丙 醇基丙酮、異富爾酮、己酸、癸酸、1 一辛醇、1 一壬醇 、苄基醇、醋酸苄酯、苯甲酸乙酯、酸二乙酯、馬來酸二 乙酯、r -丁內酯、碳酸乙烯酯、碳酸丙烯酯、苯基溶纖 素醋酸酯等。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -26- 570947 A7 B7 五、發明説明(24 ) 上述調製的組成物溶液,以孔徑0 . 2 // m的細微過 濾器過濾後提供使用。 (請先閱讀背面之注意事項再填寫本頁) 微透鏡、層間絕緣膜的形成 其次述說使用本發明的感放射線性組成物形成本發明 的層間絕緣膜、微透鏡的方法。 本發明的層間絕緣膜及微透鏡的形成方法,至少含以 下步驟。 ① 於基板上形成感放射線性樹脂組成物的塗膜的步驟 〇 ② 上述塗膜至少一部份爲放射線照射的步驟。 ③ 顯影步驟。 ④ 後培步驟。 以下就上述各步驟以說明。 ①於基板上形成感放射線忤樹脂組成物的塗膜的步鮮。 經濟部智慧財產局員工消費合作社印製 有關上述①的步驟,係將本發明的組成物塗覆於基板 表面後’以預焙將溶劑除去,形成感放射線性樹脂組成物 的塗膜。有關組成物溶液的塗覆方法,無特別的限制,可 採用噴霧法、輥輪塗覆法、回轉塗覆法、括刀覆法等的各 種方法。 預焙的條件,依各成分的種類、使用比例等而異,通 常爲60〜110 °C,30秒鐘〜15分鐘。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -27 - 570947 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明(25) ② 上.述塗膜至-少二_部份霞i射線照射的击释。 有關上述②步驟’係將所定的圖案罩膜介入已形成的 塗覆膜上,經放射線照射後,使用顯影液作顯影處理將照 射部份除去,進行圖案化。此時所用的放射線如g線(波 長4 3 6 n m )、i線(波長3 6 5 n m )等的紫外線, K r F激元雷射等的遠紫外線,同步加速器放射線等的χ 光線’電子光線等的帶電粒子光線,此中,以g線及i線 爲理想。 ③ 顯影步驟。 顯影處理所用的顯影液,可使用氫氧化鈉、氫氧化鉀 、碳酸鈉、矽酸鈉、 甲基矽酸鈉、氨、乙胺' η -丙胺 '二乙胺、二乙胺 基乙醇、二—η —丙胺、三乙胺、甲基二乙胺、二甲基乙 醇胺、三乙醇胺、氧化四甲基銨、氧化四乙基銨、吡咯、 派啶、1 ,8 —二氮雜環〔5,4,0〕- 7 -十一烷、 1 ,5 —二氮雜環〔4,3,0〕- 5 -壬烷等的鹼類的 水溶液。 又,上述的鹼類的水溶液添加適量甲醇、乙醇等的水 溶性有機媒或界面活性劑的水溶液,或能溶解本發明的組 成物的各種有機溶媒作爲顯影液使用。 此時的顯影時間,依組成物的組成而異,通常爲3〇 〜1 2 0秒。又,向來所知的層間絕緣膜、微透鏡用的組 成物其顯影界限(對最適當顯影時間可容許的超過時間) (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -28- 570947 A7 ___ B7 五、發明説明(26 ) 不足1 5秒,本發明的組成物的顯影界限理想爲1 5秒以 上,更理想爲3 0秒以上。 (請先閱讀背面之注意事項再填寫本頁) ④後焙步驟。 如上述實施顯影處理後,圖案化的薄膜通常以流水式 洗淨水方進行淸洗,更理想爲使用高壓水銀燈等的放射光 線進行全面照射,將薄膜中殘留的1 ,2 -醌酮二疊氮化 合物進行分解處理後,此薄膜以熱板、烘箱等的加熱裝置 焙燒,進行該薄膜的硬化處理。 此硬化處理的焙燒溫度爲1 5 0〜2 5 0 °C,焙燒時 間爲5〜9 0分鐘(於熱板上進行焙燒爲5〜3 0分鐘, 烘箱中進行焙燒爲3 0〜9 0分鐘)。 依此可將目的之層間絕緣膜、微透鏡,以優圖案狀薄 膜形成於對應的基板表面。 如上述所形成的層間絕緣膜、微透鏡,可由下述的實 施例了解其優異的密合性、耐熱性、耐溶劑性、及透明性 等。 經濟部智慧財產局員工消費合作社印製 實施例 以下以合成例、實施例所示具體說明本發明,本發明 不限制於此實施例而已。 合成例1 於具備冷卻管、攪拌器的燒瓶中’投入8重量部2, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -29- 570947 A7 B7 經濟部智慧財產局g(工消費合作社印製 五、發明説明(27) 2 / —偶氮2,4 一二甲基戊腈、2 2 0重量份二乙二醇 乙甲基醚。再投入2 0重量份苯乙烯、2 0重量份甲基丙 烯酸、4 0重量份甲基丙烯酸縮水甘油酯及2 0重量份2 -羥乙基甲基丙烯酸酯,以氮氣排換後開始緩慢的攪拌。 將液溫昇至7 0 °C,保持此溫度5小時,得到含共聚合物 〔A - 1〕的聚合物溶液。所得的聚合物溶液的固體含量 爲3 0 . 6重量%。 合成例2 以2 0重量份2,3 -二經丙基甲基丙烯酸酯代替實 施例1之2 0重量份2 -羥乙基甲基丙烯酸酯外進行同樣 的操作,得到含共聚合物〔A - 2〕的聚合物溶液。所得 的聚合物溶液的固體含量爲3 1 . 0重量%。 合成例3 於具備冷卻管、攪拌器的燒瓶中,投入8重量部2, 2 — -偶氮2,4 一二甲基戊腈、2 2 0重量份二乙二醇 乙甲基醚。再投入2 0重量份甲基丙烯酸、4 0重量份甲 基丙烯酸縮水甘油酯、2 0重量份三環〔5 . 2 . 1 . 〇2·6〕癸一 8 —烯甲基丙烯酸酯及20重量份2 ,3 -二羥丙基甲基丙烯酸酯,以氮氣排換後開始緩慢的攪拌。 將液溫昇至7 0 °C,保持此溫度5小時,得到含共聚合物 〔A - 3〕的聚合物溶液。所得的聚合物溶液的固體含量 爲31.0重量%。 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -30 - 570947 A7 B7 五、發明説明(28 ) 實施例1 (請先閱讀背面之注意事項再填寫本頁) 〔感放射線性樹脂組成物的調製] 合成例1所得的聚合物溶液(相當於1 〇 〇重量份共 聚合物〔A - 1〕)與30重量份作爲成分〔b〕的2, 3 ’ 4 ’ 4 —四羥苯醌(1 m 〇 1 )及1 ,2 -萘醌疊 氮基—5 —氯化擴酸(2m〇 1)的縮合物(2,3,4 ,4 / —四羥苯醌一 1 ,2 —萘醌疊氮基一 5 —磺酸酯) 混合,以二乙二醇乙甲基醚溶解爲3 0重量%固體的濃度 ,以孔徑0 · 2 // m的細微過濾器過濾,調製成感放射線 性樹脂組成物溶液〔S - 1〕。 〔感放射線性樹脂組成物的評價〕 上述組成物(S - 1 )進行下述感放射線性的評價, 更進一步評價由(S - 1 )形成的圖案狀薄膜的耐溶劑性 、耐熱性、透明性。 經濟部智慧財產局員工消費合作社印製 〔感放射線性的評價〕 使用回旋器將上述組成物(S - 1 )塗覆於矽基板上 後,於熱板上以9 0 °C預焙5分鐘形3 · 〇 V m厚的薄膜 ,所得的塗膜介入具幅3 . 0 // m圖案的罩膜’以水銀燈 照射預設定量的紫外線。其次以0 · 3重量%氧化四甲基 銨水溶液之顯影液在2 5 °C進行9 0秒的顯影處理後’以 超純水進行1分鐘的流水洗淨。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -31 - 570947 A7 B7 五、發明説明(29 ) 此時’測定幅3 . 〇 # 1Ί1圖案被顯影液完全溶解所需 的最小紫外線照射量(以下稱爲「圖案形成最小曝光量」 )°其結果如表1所示。圖案形成最小曝光量低於8〇 m J / c m 2時爲優良感放射線性,8 〇〜1 〇 〇 m J / cm2時爲良好,超過1 〇 時評價爲感放 射線性不良。 〔顯影界限的評價〕 使用回旋器將上述組成物(s 一 1 )塗覆於矽基板上 後,於熱板上以9 0 °C預焙2分鐘形3 . 0 // m厚的薄膜 ,所得的塗膜介入具幅3 · 〇 ;/ m圖案的罩膜,以水銀燈 照射8 0 m J / c m 2的紫外線。其次以〇 · 3重量%氧 化四甲基銨水溶液之顯影液在2 5 °C進行9 0秒的顯影處 理後,以超純水進行1分鐘的流水洗淨。 此時,測定最佳顯影時間,由最佳顯影時間繼續顯影 至幅3 · 0 // m圖案剝落的時間(顯影界限)。其結果如 表1所示。評價依剝落所需時間在3 0秒以上時爲顯影界 限優良,1 5秒以上3 0秒以下時爲顯影界限良好,低於 1 5秒時爲顯影界限不良。 〔耐溶劑性的評價〕 使用回旋器將上述組成物(S - 1 )塗覆於矽基板上 後,於熱板上以9 0 °C預焙2分鐘形3 · 0 // m厚的薄膜 ,所得的塗膜介入具幅3 · 0 # m圖案的罩膜,以水銀燈 本紙張尺度適用中國國家標準(cns ) A4規格(2丨〇><297公釐) (請先閲讀背面之注意事項再填寫本頁) 衣· 訂 經濟部智慧財產局員工消費合作社印製 570947 A7 B7 五、發明説明(3〇 ) (請先閱讀背面之注意事項再填寫本頁) 照射3 0 0 m J / c m 2的紫外線。其次此矽基板於 1 0 0 °C烘箱內焙燒1小時,進行塗膜硬化處理,得到的 硬化膜測定其膜厚(T 1 ),然後將此形成硬化膜的矽基 板浸漬於溫度控制在7 0 °C的二甲亞硕中2 0分鐘後,測 定該硬化膜的膜厚(t 1 ),算出由浸漬的膜厚變化率{ (tl— Tl)/Tl}xl〇〇〔%〕。 此値的絕對値低於5 %時爲耐溶劑性優良,5〜1 Ο %時爲耐溶劑性良好,超過1 0 %時爲耐溶劑性不良。結 果如表1所示。 〔耐熱性的評價〕 與上述耐溶劑性的評價同樣形成硬化膜,測定所得的 硬化膜的膜厚(Τ 2 )。其次該硬化膜基板於2 4 0 °C淸 淨烘箱內進行1小時追加焙燒後,測定該硬化膜的膜厚( t 2 ),算出由浸漬的膜厚變化率丨(t 2 - T 2 ) / T 2 } X 1 0 0〔 %〕。此値的絕對値低於5 %時爲耐熱 經濟部智慧財產局員工消費合作社印製 性優良,5〜1 0 %時爲耐熱性良好,超過1 〇 %時爲耐 熱性不良。結果如表1所示。 〔透明性的評價〕 上述的耐溶劑性的評價,以玻璃基板〔Π —二y / ( 可寧)7 0 5 9 ( π —二y夕、、(可寧)社製)〕代替矽基 板外,以同樣方法於玻璃基板上形成硬化膜。以分光光度 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -33- 570947 A7 B7 五、發明説明(31 ) 計「1 5 0 — 2 0型雙光朿(日本日立製作所(株)製) 」於波長4 0 〇〜8 0 〇 n m的範圍測定具此硬化膜的玻 璃基板光線透射率。此時最低透射率在9 0 %以上時爲透 明性優良,8 5 %以上9 0 %以下爲透明性良好,低於 8 5 %爲透明性不良。其結果如表1所示。 實施例2 貫施例1 ’以含共聚合物〔A - 2〕的聚合物溶液代 替含共聚合物〔A- 1〕的聚合物溶液外,與實施例1同 樣調製成組成物溶液(S - 2 )加以評價。其結果如表丄 所示。 實施例3 實施例1 ,以含共聚合物〔A 一 3〕的聚合物溶液代 替含共聚合物〔A - 1〕的聚合物溶液外,與實施例1巧 樣調製成組成物溶液(S 一 3 )加以評價。宜結果如 所示。 、’裘1 (請先閲讀背面之注意事項再填寫本頁} 經濟部智慧財產局員工消費合作社印製 實施例4 實施例1 ,改用3 0重量份作爲成分〔B ,3 —二(2 ,5 -二甲基—4一羥苯基一3 院(1 m 〇 1 )及1 ,2 _萘醌疊氮基一 5〜 1 · 9 m〇1 )的縮合物(1 ,1 ,3 —三〔 甲基 4 一羥苯基一 3 —苯基)丙烷—1, 〕的 1,1 一苯基)丙 氯化磺酸( 2 ? 5 -- 一萘醌疊氮 本紙張尺度適用中國國家標準(CNS )八4規格(21〇><297公釐) -34 570947 A7 B7 五、發明説明(32 ) 基- 5 -磺酸酯)外,與實施例1同樣調製成組成物溶液 (S - 4 )加以評價。其結果如表1所示。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -35- 570947 A7 B7 五、發明説明(33 ) 表1 感放射線 顯影界限 耐溶 耐熱 透明性 性 劑性 性 圖案形成 最佳顯 顯影 膜厚變 膜厚變 400 〜800 最小曝光量 影時間 界限 化率 化率 nm的最低透 (mJ / cm2) (秒) (秒) (%) (%) 射_%) 實 施 例1 70 80 35 + 3.0 -3.5 90 實 施 例2 65 75 30 + 3.0 -3.0 90 實 施 例3 75 85 40 + 2.5 -3.0 92 實 施 例4 70 80 35 + 3.0 -3.5 90 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 商業上之利用領域 本發明的感放射線性樹脂組成物,具感放射線性、容 易形成優密合性、耐溶劑性、透明性及耐熱性的.微透鏡、 層間絕緣膜。 又’本發明的層間絕緣膜適合設置於T F T型液晶顯 示材料或集體電路之層間絕緣膜。 系 學 光 像 結 的 鏡 濾 色 彩 於 合 適 鏡 透 。 微料 的材 明系 發學 本光 , 的 且結 更聯 纖 或 本紙張尺度適用中關家標準(CNS) M規格(210>< 297公慶) -36-F301, the same as F3-3, the same)), SH-28A, SH SZ-6032, SF-C-190 (Japan's Toshihisa) and other fluorine-based and silicon-based surfactants. Use polyethylene oxide laurate, polycycloalkane oleate, etc., polyethylene oxide alkyl ester, polyethylene oxide nonyl phenyl ether, etc. polycycloalkane dilaurate, polyethylene oxide di Alkyl ester-based non-ionic surfactants v (organic polysiloxane polymer) manufactured by Industrial Co., Ltd.), (meth) propyl (polyfluoro) NO 57 · 95, etc. For example, for 1 0 0 Copolymers in parts by weight This paper applies Chinese National Standard (CNS) A4 specifications (210X297 mm) -23- 570947 A7 B7 V. Description of the invention (21) [A] It is ideal if the weight is less than 5 parts by weight, more preferably 2 Part by weight or less. When the amount of the surfactant exceeds 5 parts by weight, the film may be wrinkled during coating. (Please read the precautions on the back before filling this page.) In order to improve the adhesion with the substrate, [G ] Bonding aid. Such a bonding aid is preferably a functional radical coupling agent, for example, a silane coupling agent having a reactive substitution group such as a fluorenyl group, a methacryl group, an isocyanate group, or an epoxy group. Specific examples are trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, Enetrimethoxysilane, r-isocyanate-propylenetriethylsilane, r-glycidoxypropyltrimethoxysilane, / 3- (3,4-epoxycyclohexyl) ethyltrimethyl Silicon, etc. The proportion of the bonding aid used is preferably 100 parts by weight or less of the copolymer [A], and more preferably 100 parts by weight or less. The amount of the bonding aid exceeds 20 parts by weight. The residual radiation-developing resin composition of the present invention is composed of the above-mentioned copolymer [A] and the 1,2-quinonediazide-based compound and any of the other additions mentioned above, which are consumed by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. Cooperative printed preparations are prepared by uniformly mixing. Generally, the radiation-sensitive resin composition of the present invention is dissolved in a suitable solvent to be used as a solution. For example, the copolymer [A] and the 1,2-quinonediazide compound and any The other compounding agents added are mixed in a predetermined ratio to prepare a radiation-sensitive resin composition in a solution state. The solvent system for preparing the radiation-sensitive resin composition of the present invention uses a solvent capable of dissolving the copolymer [A] and 1,2- Quinonediazide Other additives that are added intentionally, but do not react with each component. Specific examples include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; and the size of the paper is applicable to China National Standard (CNS) A4 (210X297) (%) 24- 570947 A7 B7 V. Description of Invention (22) (Please read the notes on the back before filling out this page) Printed glycol monomethyl ether and glycol monoethyl ether by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Glycol ethers such as ethers; Methyl lysin acetate, Glycol alkyl ether acetate glycol ether; Diethylene glycol monomethyl ether, Diethylene glycol monoethyl ether Diethylene glycols such as dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl ether; propylene glycol monoethers such as propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, and propylene glycol butyl ether Ethers; Propylene glycol monoether ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol butyl ether acetate; propylene glycol methyl ether propionate, propylene glycol Ethyl ether propyl acetate, propylene glycol propylene Propylene glycol monoalkyl ether propionates such as ether propionate, propylene glycol butyl ether propionate; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ketone, cyclohexanone, 4 monohydroxy-4 monomethyl ether Ketones such as 2-pentanone; and methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, 2-hydroxy-2-methyl propionate, 2 -Hydroxy-2-ethyl methylpropionate, ethyl hydroxypropionate, ethyl hydroxypropionate, butyl hydroxypropionate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxypropyl Methyl ester, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutyrate, 2-hydroxy-3-methylbutyrate Ethyl Acetate, 2-Hydroxy-3-methylbutanoate, 2-Hydroxy-3-methylbutyrate, Methyl Methoxyacetate, Methyl Methoxyacetate, Methyl Methoxypropyl Acetate , Butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, ethyl propoxyacetate, Propoxy Acid propyl ester, butyl propoxy acetate, methyl butoxy acetate, ethyl butoxy acetate, propyl butoxy acetate, butyl butoxy acetate, 2-methoxy This paper standard is applicable to Chinese national standards (CNS) A4 specification (210X297 mm) -25- 570947 A7 _B7 V. Description of the invention (23) (Please read the precautions on the back before filling this page) Methyl propionate, 2-methoxypropionate Esters, Propyl 2-methoxypropionate, Butyl 2-methoxypropionate, Methyl 2-ethoxypropionate, Ethyl 2-ethoxypropionate, Propyl 2-ethoxypropionate Esters, 2-ethoxypropionate, methyl 2-propoxypropionate, ethyl 2-propoxypropionate, propyl 2-propoxypropionate, butyl 2-methoxypropionate Esters, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-propoxypropionate Esters, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate Ester, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, 3 Ethyl propoxypropionate, propyl 3-propoxypropionate, butyl 3-methoxypropionate, ethyl 3-butoxypropionate, ethyl 3-butoxypropionate, 3- Esters such as propyl butoxy propionate and butyl 3-butoxy propionate. Glycol ether ether glycol alkyl ether acetates, esters, and diethylene glycols are preferred in these solvents depending on the solubility, their reactivity to each component, and the ease of formation of the coating film. . Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the above solvents can be used with high boiling point solvents. Available high boiling point solvents such as N-methylformamide, N, N-dimethylformamide, N-methylformamide, N-methylacetamide, N, N-dimethylformamide Acetylamine, N-methylpyrrolidone, dimethylene code, benzyl ethyl ether, dihexyl ether, propanol acetone, isofulrone, hexanoic acid, capric acid, 1-octanol, 1-nonanol , Benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl acid, diethyl maleate, r-butyrolactone, vinyl carbonate, propylene carbonate, phenylcellosolve acetate, and the like. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -26- 570947 A7 B7 V. Description of the invention (24) The composition solution prepared above is a fine filter with a pore size of 0.2 // m Filtered for use. (Please read the precautions on the back before filling this page.) Formation of Microlenses and Interlayer Insulating Films Next, the method for forming the interlayer insulating films and microlenses of the present invention using the radiation-sensitive composition of the present invention will be described. The method for forming an interlayer insulating film and a microlens of the present invention includes at least the following steps. ① A step of forming a coating film of a radiation-sensitive resin composition on a substrate ② ② At least a part of the above coating film is a step of radiation irradiation. ③ Development step. ④ Post-cultivation steps. The above steps are described below. ① Steps of forming a coating film of a radiation-sensitive resin composition on a substrate. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The above-mentioned step ① is to apply the composition of the present invention to the surface of a substrate 'to remove the solvent by pre-baking to form a coating film of a radiation-sensitive resin composition. The coating method of the composition solution is not particularly limited, and various methods such as a spray method, a roll coating method, a rotary coating method, and a knife coating method can be used. The pre-baking conditions vary depending on the type of each component, the proportion of use, etc., usually 60 to 110 ° C, 30 seconds to 15 minutes. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -27-570947 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (25) ② Above. B. Partial release of Xia i-ray irradiation. Regarding the above step ②, the predetermined pattern cover film is interposed on the formed coating film, and after irradiation with radiation, a developing solution is used as a developing treatment to remove the irradiated portion and perform patterning. The radiation used at this time is ultraviolet rays such as g-line (wavelength 4 3 6 nm), i-rays (wavelength 3 65 nm), far-ultraviolet rays such as K r F excimer laser, x-rays such as synchrotron radiation, and electrons. The charged particle rays such as rays are preferably g-line and i-line. ③ Development step. As a developing solution used for the development process, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium methylsilicate, ammonia, ethylamine'η-propylamine'diethylamine, diethylaminoethanol, diamine —Η —propylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium oxide, tetraethylammonium oxide, pyrrole, pyridine, 1, 8 —diazacyclo [5 , 4,0] -7-undecane, 1,5-diaza heterocyclic ring [4,3,0] -5 -nonane and other alkali aqueous solutions. In addition, the above-mentioned alkaline aqueous solution is used as a developing solution by adding an appropriate amount of an aqueous solution of a water-soluble organic medium such as methanol, ethanol, or a surfactant, or various organic solvents capable of dissolving the composition of the present invention. The development time at this time varies depending on the composition of the composition, and is usually 30 to 120 seconds. Also, conventionally known compositions for interlayer insulating films and microlenses have a development limit (exceedable time for the most appropriate development time) (please read the precautions on the back before filling this page) This paper is applicable to China Standard (CNS) A4 specification (210X297 mm) -28- 570947 A7 ___ B7 V. Description of the invention (26) Less than 15 seconds, the development limit of the composition of the present invention is preferably 15 seconds or more, more preferably 30 More than seconds. (Please read the precautions on the back before filling this page) ④ Post-baking steps. After the development process is performed as described above, the patterned film is usually rinsed with running water, and more preferably, it is irradiated with radiation from a high-pressure mercury lamp, etc., and the 1,2-quinones remaining in the film are stacked. After the nitrogen compound is decomposed, the film is baked in a heating device such as a hot plate or an oven, and the film is hardened. The firing temperature of this hardening process is 150 ~ 250 ° C, the firing time is 5 ~ 90 minutes (firing on a hot plate is 5 ~ 30 minutes, and the firing in an oven is 30 ~ 90 minutes. ). According to this, the target interlayer insulating film and microlens can be formed on the corresponding substrate surface in an excellent pattern thin film. The interlayer insulating film and microlens formed as described above can be understood from the following examples for their excellent adhesion, heat resistance, solvent resistance, and transparency. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Example The following specifically describes the present invention with synthetic examples and examples. The present invention is not limited to this example. Synthesis Example 1 Put 8 weight parts 2 into a flask equipped with a cooling tube and a stirrer. This paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) -29- 570947 A7 B7 Intellectual Property Bureau of the Ministry of Economic Affairsg (Printed by the Industrial and Consumer Cooperatives. 5. Description of the invention (27) 2 / -Azo 2,4 dimethylvaleronitrile, 2 20 parts by weight of diethylene glycol ethyl methyl ether. Another 20 parts by weight of styrene is added. , 20 parts by weight of methacrylic acid, 40 parts by weight of glycidyl methacrylate, and 20 parts by weight of 2-hydroxyethyl methacrylate, and after stirring with nitrogen, begin to stir slowly. Raise the liquid temperature to 7 At 0 ° C, the temperature was maintained for 5 hours to obtain a polymer solution containing a copolymer [A-1]. The obtained polymer solution had a solid content of 30.6% by weight. Synthesis Example 2 2 20 parts by weight 2 The same operation was carried out with 3-dipropyl methacrylate instead of 20 parts by weight of 2-hydroxyethyl methacrylate in Example 1, to obtain a polymer solution containing a copolymer [A-2]. The solid content of the obtained polymer solution was 31.0% by weight. Synthesis Example 3 Into the flask of the device, put 8 parts by weight of 2, 2--azo 2,4-dimethylvaleronitrile, 20 parts by weight of diethylene glycol ethyl methyl ether, and then add 20 parts by weight of methacrylic acid, 40 parts by weight of glycidyl methacrylate, 20 parts by weight of tricyclic [5.2.1.2.06] deca-8-enmethacrylate and 20 parts by weight of 2,3-dihydroxypropyl After the methacrylate was replaced with nitrogen, the stirring was started slowly. The liquid temperature was raised to 70 ° C and kept at this temperature for 5 hours to obtain a polymer solution containing a copolymer [A-3]. The obtained polymer The solid content of the solution is 31.0% by weight. (Please read the precautions on the back before filling in this page.) This paper size applies to China National Standard (CNS) A4 (210X297 mm) -30-570947 A7 B7 V. Description of the invention ( 28) Example 1 (Please read the precautions on the back before filling in this page) [Preparation of radiation-sensitive resin composition] Polymer solution obtained in Synthesis Example 1 (equivalent to 1,000 parts by weight of copolymer [A- 1]) and 30 parts by weight of 2, 3 '4' 4-tetrahydroxybenzoquinone (1 m 〇1) as the component [b] Condensate of 1,2-naphthoquinone azido-5 —chlorinated acid (2m01) (2,3,4,4 / —tetrahydroxybenzoquinone — 1, 2 —naphthoquinone azide — 5 — Sulfonate) mixed, dissolved in diethylene glycol ethyl methyl ether to a concentration of 30% by weight of solids, filtered through a fine filter with a pore size of 0 · 2 // m to prepare a radiation-sensitive resin composition solution [ S-1]. [Evaluation of Radiation Sensitive Resin Composition] The above composition (S-1) was subjected to the following radiation sensitivity evaluation to further evaluate the solvent resistance, heat resistance, and transparency of the patterned film formed from (S-1) Sex. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Evaluation of Radiation Sensitivity] The above composition (S-1) was coated on a silicon substrate using a gyrator, and prebaked on a hot plate at 90 ° C for 5 minutes. A thin film with a thickness of 3.0 mm was formed, and the obtained coating film was interposed with a cover film with a pattern of 3.00 m. A predetermined amount of ultraviolet rays were irradiated with a mercury lamp. Next, a developing solution of a tetramethylammonium oxide aqueous solution of 0.3% by weight was subjected to a development treatment at 25 ° C for 90 seconds' and washed with running water for 1 minute with ultrapure water. This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -31-570947 A7 B7 V. Description of the invention (29) At this time, the 'measurement width 3. 〇 # 1Ί1 pattern is completely dissolved by the developer The minimum ultraviolet irradiation amount (hereinafter referred to as "the minimum exposure amount for pattern formation") is shown in Table 1. When the minimum exposure amount for pattern formation is less than 80 m J / cm 2, the radiation is excellent, and when it is 800 to 100 m J / cm 2, it is good. When it exceeds 10, the radiation is poor. [Evaluation of the development limit] After the above composition (s-1) was coated on a silicon substrate using a gyrator, it was prebaked on a hot plate at 90 ° C for 2 minutes to form a 3.0-m thick film. The obtained coating film was interposed into a cover film having a pattern of 3.0 mm / m, and ultraviolet rays of 80 mJ / cm2 were irradiated with a mercury lamp. Next, a developing solution of a 0.3% by weight aqueous solution of tetramethylammonium oxide was developed at 25 ° C for 90 seconds, followed by washing with ultrapure water for 1 minute. At this time, the optimal development time is measured, and the development time from the optimal development time to the width of 3 · 0 // m pattern peeling (development limit). The results are shown in Table 1. According to the evaluation, the development limit was excellent when the peeling time was 30 seconds or more, the development limit was good when it was 15 seconds or more and 30 seconds or less, and the development limit was less than 15 seconds. [Evaluation of Solvent Resistance] After the above composition (S-1) was coated on a silicon substrate using a gyrator, it was pre-baked on a hot plate at 90 ° C for 2 minutes to form a 3 · 0 // m-thick film. The obtained coating film has a cover film with a pattern of 3 · 0 # m. The paper size of the mercury lamp applies the Chinese National Standard (cns) A4 specification (2 丨 〇 > < 297 mm) (Please read the back Note: Please fill in this page again.) Clothing · Order Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 570947 A7 B7 V. Invention Description (30) (Please read the precautions on the back before filling this page) Irradiation 3 0 0 m J / cm 2 of ultraviolet light. Next, the silicon substrate was fired in an oven at 100 ° C for 1 hour, and the coating film was hardened. The resulting cured film was measured for film thickness (T 1), and the silicon substrate forming the cured film was immersed in a temperature controlled at 7 After 20 minutes at 0 ° C in Dimethoate, the film thickness (t 1) of the cured film was measured, and the film thickness change rate {(tl—Tl) / Tl} × 100 (%) from the immersion was calculated. When the absolute value of this is less than 5%, the solvent resistance is excellent, when 5 to 10%, the solvent resistance is good, and when it exceeds 10%, the solvent resistance is poor. The results are shown in Table 1. [Evaluation of heat resistance] A cured film was formed in the same manner as the above-mentioned evaluation of the solvent resistance, and the film thickness (T 2) of the obtained cured film was measured. Next, the cured film substrate was subjected to additional baking in a clean oven at 240 ° C for 1 hour, and then the film thickness (t 2) of the cured film was measured to calculate the film thickness change rate from immersion (t 2-T 2) / T 2} X 1 0 0 [%]. When the absolute value is less than 5%, it is heat-resistant. The employee cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has excellent printability. When it is 5 to 10%, it has good heat resistance. When it exceeds 10%, it has poor heat resistance. The results are shown in Table 1. [Evaluation of Transparency] The above-mentioned evaluation of the solvent resistance was replaced with a silicon substrate by a glass substrate [Π — 二 y / (可 宁) 7 0 5 9 (π — 二 y 夕, manufactured by (Corning))]. In addition, a cured film was formed on a glass substrate in the same manner. Spectrophotometric This paper scale applies Chinese National Standard (CNS) A4 (210X297 mm) -33- 570947 A7 B7 V. Description of the invention (31) Calculated as "1 50-2 0 type double light beam (Hitachi, Japan ( Co., Ltd.) "The light transmittance of the glass substrate having this cured film was measured in a wavelength range of 400 to 800 nm. At this time, when the minimum transmittance is 90% or more, the transparency is excellent; when the minimum transmittance is 85% or more and 90% or less, the transparency is good; when it is less than 85%, the transparency is poor. The results are shown in Table 1. Example 2 In Example 1, a polymer solution containing the copolymer [A-2] was used instead of the polymer solution containing the copolymer [A-1], and a composition solution was prepared in the same manner as in Example 1. (S -2) to be evaluated. The results are shown in Table 丄. Example 3 In Example 1, a polymer solution containing the copolymer [A-3] was used instead of the polymer solution containing the copolymer [A-1], and a composition solution was prepared as in Example 1 (S A 3) to be evaluated. The results should be as shown. "Qiu 1 (please read the precautions on the back before filling this page) Example 4 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, Example 1, using 30 parts by weight as the component [B, 3-2 (2 Condensate of 1,5-Dimethyl-4-hydroxyphenyl-3 (1 m 〇1) and 1,2-naphthoquinone azide-5 ~ 1.99 m01) (1, 1, 3 —Tris [methyl4, hydroxyphenyl, 3-phenyl) propane-1,], 1,1phenyl) propane chloride sulfonic acid (2-5—mononaphthoquinone azide) This paper is applicable to China National Standard (CNS) 8.4 Specification (21〇 < 297 mm) -34 570947 A7 B7 V. Explanation of the Invention (32) -5 -sulfonic acid ester) The same composition as in Example 1 was prepared into a composition The solution (S-4) was evaluated. The results are shown in Table 1. (Please read the precautions on the back before filling out this page) The paper printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economy applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -35- 570947 A7 B7 V. Invention Explanation (33) Table 1 Radiation-sensitive development limit Solvent-resistant heat-resistant transparent agent property pattern formation Optimal development and film thickness change Film thickness change 400 to 800 Minimum exposure amount Shadow time limit rate Conversion rate nm Minimum transmission (mJ / cm2) (seconds) (seconds) (%) (%) shot_%) Example 1 70 80 35 + 3.0 -3.5 90 Example 2 65 75 30 + 3.0 -3.0 90 Example 3 75 85 40 + 2.5 -3.0 92 Example 4 70 80 35 + 3.0 -3.5 90 (Please read the notes on the back before filling out this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in the field of commercial use. The radiation-sensitive resin composition of the present invention, Radiation sensitive, easy to form excellent adhesion, solvent resistance, transparency and heat resistance. Micro lens, interlayer insulation film. The interlayer insulating film of the present invention is suitable for an interlayer insulating film provided in a TFT liquid crystal display material or a collective circuit. The color filter of the optical light knot is suitable for proper lens penetration. The material of the micro-materials is from the Ming Department. It is a light fiber, and it is more connected to the fiber.

Claims (1)

570947 i έ Η正 公 本 A8 B8 C8 D8 5.2.1.02· 經濟部智慧財產局員工消費合作社卬製 利範圍 1 附件3 第9 1 1 0 0 6 8 5號專利申§靑案 中文申請專利範圍修正本 民國92年4月23日修卫 1. 一種感放射線性樹脂組成物,其特徵爲含〔A〕( a 1 )不飽和羧酸及/或不飽和羧酸酐、(a 2)含環氧 基不飽和化合物、(a 3)含羥基不飽和化合物與(a 4 )其他烯烴系不飽和化合物的共聚合物,及含 〔B〕1,2-苯醌二疊氮基化合物,其中, 〔B〕成分的含量對每100重量份〔A〕成分爲含5 〜1 0 0重量份。 2. 如申請專利範圍第1項之感放射線性樹脂組成物, 其中〔A〕成分係苯乙烯/甲基丙烯酸/甲基丙烯酸縮水 甘油酯/曱基丙烯酸2 -羥乙酯/甲基丙烯酸三環〔 癸烷- 8 -醯酯共聚合物 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 —羥乙酯/甲某丙燸酸三環〔5.2.1.02·6 ]癸烷一 S 醯酯/甲基丙烯酸-叔- 丁酯共聚合物 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 —羥乙酯/甲基丙烯酸三環〔5.2.1.02·6〕癸烷—8 一醯酯/對-甲氧苯乙烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 -羥乙酯/甲基丙烯酸三環〔5.2.1.02 6〕·癸烷一 8 -醯酯/甲基丙烯酸2 -甲基環己酯共聚合物、 本紙張尺度適用中國國家標準(CNS ) A4規袼(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 570947 A8 B8 C8 D8 六、申請專利範圍 2 (請先閲讀背面之注意事項再填寫本頁) 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 —羥乙酯/甲基丙烯酸三環〔5.2.1 ·0 2 6〕癸烷一 8 一醯酯/ 1,3 丁二烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2 -羥乙酯/甲基丙烯酸三環〔5.2.1 ·02·6〕癸烷一 8 一醯酯/二環〔2.2.1〕庚一 2 -烯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3-二羥丙酯/甲基丙烯酸三環〔5.2.1.02·6〕癸 烷- 8 -醯酯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3-二羥丙酯/甲基丙烯酸三環〔5.2.1.02·6〕癸 烷- 8 -醯酯/甲基丙烯酸-叔-丁酯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3-二羥丙酯/甲基丙烯酸三環〔5.2.1.02·6〕癸 烷一 8 -醯酯/對-甲氧苯乙烯共聚合物、 經濟部智慧財產局員工消費合作社卬製 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 -二羥丙酯/甲基丙烯酸三環〔5.2.1.02·6〕癸. 烷一 8 -醯酯/甲基丙烯酸2 -甲基環己酯共聚合物、 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3 —二羥丙酯/甲基丙烯酸.三環〔5.2:1.02·6〕癸 烷一 8 -醯酯/ 1,3 丁二烯共聚合物、及 苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油酯/甲基 丙烯酸2,3-二羥丙酯/甲基丙烯酸三環〔5.2. I/O2·6〕癸 烷一 8-醯酯/二環〔2.2.1〕庚一 2-烯共聚合物中至少 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -2 - 570947 A8 B8 C8 D8 六、申請專利範圍 3 選取一種。 3.如申請專利範圍第1或第2項之感放射線性樹脂組 (請先閱讀背面之注意事項再填寫本頁) 成物’其中感放射線性樹脂組成物係用於形成層間絕緣膜 〇 4 · 一種層間絕緣膜的形成方法,其特徵爲至少含下述 步驟 a於基板上形成申請專利範圍第3項之感放射線性樹 脂組成物的塗膜的步驟, b使上述塗膜至少一部份照射放射線的步驟, c顯影步驟, d後燒焙步驟。 5 · —種層間絕緣膜’其特徵係由申請專利範圍第3項 之感放射線性樹脂組成物所形成。 6. 如申請專利範圍第1或第2項之感放射線性樹脂組 成物’其中感放射線性樹脂組成物係用於形成微透鏡。 7. —種微透鏡的形成方法,其特徵爲至少含下述步驟 a於基板上形成申請專利範圍第6項之感放射線性樹 經濟部智慧財產局員工消費合作址印製 脂組成物的塗膜的步驟, b使上述塗膜至少一部份照射放射線的步驟, c顯影步驟, d後燒焙步驟。 8. —種微透鏡,其特徵係申請專利範圍第6項之感放 射線性樹脂組成物所形成。 · 本紙張尺度適用中國國家標準(CNS ) Μ規格(210X297公釐) -3-570947 i 公 Official copy of A8 B8 C8 D8 5.2.1.02 · The scope of profit of the consumer cooperative of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 Attachment 3 No. 9 1 1 0 0 6 8 5 Patent § 申 Chinese patent application scope amendment Revised on April 23, 1992 1. A radiation-sensitive resin composition characterized by containing [A] (a 1) unsaturated carboxylic acid and / or unsaturated carboxylic anhydride, (a 2) containing epoxy Copolymers of (a 3) hydroxyl-containing unsaturated compounds and (a 4) other olefin-based unsaturated compounds, and [B] 1,2-benzoquinonediazide-based compounds, of which [ B] The content of the component is 5 to 100 parts by weight per 100 parts by weight of the component [A]. 2. The radiation-sensitive resin composition according to item 1 of the scope of patent application, wherein the component [A] is styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl acrylate / trimethyl acrylate Cyclo [decane-8-fluorenyl ester copolymer styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / trimethylmalonic acid tricyclo [5.2.1.02 · 6] decane Alkyl-S-methyl ester / methacrylic acid-tert-butyl copolymer styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [5.2.1.02 · 6] decane-8 monomethyl ester / p-methoxystyrene copolymer, styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [5.2 .1.02 6] · decane-8-methyl ester / methacrylic acid 2-methylcyclohexyl copolymer, this paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (please first Read the precautions on the back and fill in this page) Order 570947 A8 B8 C8 D8 VI. Patent Application Scope 2 (Please read the back first Please fill in this page again) Styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylic acid [5.2.1 · 0 2 6] decane 8 8 Ethyl ester / 1,3 butadiene copolymer, styrene / methacrylic acid / glycidyl methacrylate / 2-hydroxyethyl methacrylate / tricyclic methacrylate [5.2.1 · 02 · 6] Decane-8 monomethyl ester / bicyclo [2.2.1] hepta-2-ene copolymer, styrene / methacrylic acid / glycidyl methacrylate / 2,3-dihydroxypropyl methacrylate / Tricyclic methacrylate [5.2.1.02 · 6] decane-8-fluorene ester copolymer, styrene / methacrylic acid / glycidyl methacrylate / methacrylic acid 2,3-dihydroxypropyl ester / formaldehyde Tricyclic acrylic [5.2.1.02 · 6] decane-8-fluorenyl ester / methacrylic acid-tert-butyl ester copolymer, styrene / methacrylic acid / glycidyl methacrylate / methacrylic acid 2, 3-Dihydroxypropyl ester / tricyclic methacrylic acid [5.2.1.02 · 6] decane-8-fluorenyl ester / p-methoxystyrene copolymer, manufactured by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Styrene / methacrylic acid / glycidyl methacrylate / 2,3-dihydroxypropyl methacrylate / tricyclic methacrylic acid [5.2.1.02 · 6] decane. 8-fluorenyl ester / methacrylic acid 2-methylcyclohexyl copolymer, styrene / methacrylic acid / glycidyl methacrylate / methacrylic acid 2,3-dihydroxypropyl ester / methacrylic acid. Tricyclic [5.2: 1.02 · 6] Decane 8-fluorenyl ester / 1,3 butadiene copolymer, and styrene / methacrylic acid / glycidyl methacrylate / 2,3-dihydroxypropyl methacrylate / tricyclic methacrylate [5.2. I / O2 · 6] decane-8-fluorenyl ester / bicyclo [2.2.1] At least this paper size in the hept-2-ene copolymer is subject to the Chinese National Standard (CNS) A4 specification (210X297 mm) ) -2-570947 A8 B8 C8 D8 VI. Application scope 3 Choose one. 3. If the radiation-sensitive resin group of item 1 or 2 of the scope of patent application (please read the precautions on the back before filling in this page), the product 'wherein the radiation-sensitive resin composition is used to form an interlayer insulation film. 4 A method for forming an interlayer insulating film, which is characterized by including at least the following steps a. Forming a coating film of a radiation-sensitive resin composition of the scope of patent application No. 3 on a substrate, b. Making at least a part of the above coating film A step of irradiating radiation, a step of developing, and a step of post-baking. 5 · —Special Interlayer Insulation Film 'is characterized in that it is formed of a radiation-sensitive resin composition according to item 3 of the patent application. 6. The radiation-sensitive resin composition according to item 1 or 2 of the scope of the patent application, wherein the radiation-sensitive resin composition is used to form a microlens. 7. A method for forming a microlens, characterized in that it comprises at least the following steps a: forming a coating on a substrate to apply the patented item No. 6 of the sensible radiation tree in the Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperation site, and printing the grease composition; A film step, b a step of irradiating at least a part of the coating film with radiation, c a developing step, and d a post-baking step. 8. A microlens, characterized by being formed by a radiation-sensitive resin composition according to item 6 of the patent application. · This paper size is applicable to Chinese National Standard (CNS) M specifications (210X297 mm) -3-
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JP2000347397A (en) * 1999-06-04 2000-12-15 Jsr Corp Radiation sensitive resin composition and its use for interlayer dielectric
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TWI386714B (en) * 2004-05-06 2013-02-21 Dongjin Semichem Co Ltd An interlayer organic insulating film for tft-lcd, acrylic copolymer resin used for an interlayer organic insulating film for tft-lcd and the preparation method thereof
TWI394000B (en) * 2005-01-21 2013-04-21 Jsr Corp Radiation sensitive resin composition, radiation sensitive dry film, interlayer dielectric film and a forming method thereof, and microlens and a forming method thereof
TWI410667B (en) * 2005-10-03 2013-10-01 Jsr Corp Sensing linear resin composition, interlayer insulating film and method for forming the same, microlens and method for forming the same

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