TW527394B - Radiation sensitive resin composition used in interlaminar insulation film and microlens, manufacture method for interlaminar insulation film and microlens, and interlaminar insulation film and microlens - Google Patents

Radiation sensitive resin composition used in interlaminar insulation film and microlens, manufacture method for interlaminar insulation film and microlens, and interlaminar insulation film and microlens Download PDF

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TW527394B
TW527394B TW090112109A TW90112109A TW527394B TW 527394 B TW527394 B TW 527394B TW 090112109 A TW090112109 A TW 090112109A TW 90112109 A TW90112109 A TW 90112109A TW 527394 B TW527394 B TW 527394B
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weight
resin composition
insulation film
film
patent application
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TW090112109A
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Chinese (zh)
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Nobuhiro Takeuchi
Kazuaki Niwa
Masayuki Endo
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Jsr Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02Monomers containing only one unsaturated aliphatic radical
    • C08F212/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06Hydrocarbons
    • C08F212/08Styrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36Amides or imides
    • C08F222/40Imides, e.g. cyclic imides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

To provide a radiation-sensitive resin composition having high radiation sensitivity and easily forming a patterned thin film of excellent heat-resistance and solvent resistance and to provide an interlaminar insulation film and microlens made of the composition. The radiation-sensitive resin composition contains [A], a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound containing epoxy group, (a3) a maleimide monomer and (a4) other olefinic unsaturated compound, and [B], a 1,2-quinonediazide compound, in which the amount of [B] is 5 to 100 weight part of 100 weight part of [A].

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527394 A7 __ B7 五、發明説明(i) 發明所屬的技術領域 本發明係有關感應放射線性樹脂組成物,詳細而言, 係有關適於利用微影法之層間絕緣膜或顯微頭的製作之正 片型感應放射線性樹脂組成物。 再者,本發明係有關利用上述感應放射線性組成物之 層間絕緣膜及顯影鏡頭之製造方法。 再者,本發明係有關由上述感應放射線性組成物所形 成的層間絕緣膜及顯微鏡頭。 習知技術 通常,於薄膜電晶體(以下記作「T F T」型液晶顯 示元件或磁頭元件,積體電路元件,固體攝影元件等電子 元件內,爲使經予配置成層狀的配線之間絕緣設有層間絕 緣膜。至於形成層間絕緣膜之材料,以具有可得爲得必需 的圖案形狀之層間絕緣膜而採的步驟數小且有足夠的平坦 性之層間絕緣膜之特徵的感應放射線性樹脂組成物可被廣 泛的使用著。 T F T型液晶顯示元件,係於上述的層間絕緣膜之上 ,形成透明電極模,再者於其上經由形成液晶定向膜可予 製造。 該時際,於形成透明電極膜之步驟及形成定向膜之步 驟由於經予加熱,層間絕緣膜之耐熱性並不足的情形,於 透明電極膜中混入來自絕緣膜之蒸散物,提高透明電極模 之電阻並使導通降低,或層間絕緣膜本身著色並使透明性 本纸張尺度適用中國國家標準(CNS ) A4規格(2丨〇'〆297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧时447¾工消費合泎社印製 -4- 527394 A7 B7 五、發明説明(2 ) 降低的問題會生成。 (請先閲讀背面之注意事項再填寫本頁) 又,於絕緣膜爲耐溶劑性較低者之情形,在形成絕緣 膜後之形成電極步驟’藉由與供電極之圖案化而用的蝕刻 液,光阻剝離液等的有機溶劑接觸,使各該絕緣膜膨潤, 變形,有生成由基板剝離等的障礙之情形。 另一方面,至於傳真機、電子影印機、固體攝影元件 等在晶片上的濾色片chip color filter)之攝影光學系 或光纖連結器之光學系材料,以將具有3〜1 0 0 # m之 鏡頭直徑之影微鏡頭予以規則性的排列的顯微鏡頭陣列係 被使用著。 於形成顯微鏡頭或顯微鏡頭陣列時,形成鏡頭圖案後 ,藉由加熱處理使圖案熔融流動,保持該狀態下利用作鏡 頭之方法,或使熔融流動的鏡頭圖案作成光罩並利用乾蝕 刻使轉印鏡頭形狀至基底上的方法等係爲人所知的,於形 成前述鏡頭圖案時,具有所謂可得具所期待的曲率半徑之 顯微鏡頭之特徵的感應放射線性樹脂組成物係被廣泛使用 者。 經濟部智慧財4^員工消費合作社印製 此種顯微鏡頭,於其形成步驟,或佈線等之周邊裝置 的形成步驟,可進行在高溫的加熱處理。此時,顯微鏡頭 用材料之耐熱性並不足夠時,顯微鏡頭會著色,又鏡頭形 狀變形等,有未能達成用作顯微鏡頭之功能的情形。 又有於形成顯微鏡頭後,進行電極,佈線形成步驟之 情形,於顯微鏡頭材料之耐溶劑性並不足夠的情形,有生 成所謂由蝕刻液或光阻剝離液等的有機溶劑引起之顯微鏡 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -5- 527394 A7 _—_ B7 五、發明説明(3 ) 頭之變形,剝離的問題。 (請先閲讀背面之注意事項再填寫本頁) 發明欲解決的課顆 本發明係基於上述情形而完成者,其目的係具有較高 的,感應放射線性’而且可谷易形成耐熱性,耐溶劑性優越 的圖案狀薄膜之適於形成層間絕緣膜或顯微鏡頭之感應放 射線性樹脂組成物。 又本發明之另外目的’係提供已採用上述感應放射線 性樹脂組成物之層間絕緣膜及顯微鏡頭之製造方法。 本發明之再另一目的,係提供由上述感應放射線性樹 脂組成物所形成的層間絕緣膜及顯微鏡頭。 解決問題而採的手段 涇齊郎.¾°¾吋—工肖費合汴吐,印製 本發明之上述目的及優點,係若依本發明,第一形態 ,由含有〔A〕 (a 1)不飽和羧酸及/或不飽和羧酸酐 ’(a 2 )含有環氧基之不飽和化合物,(a 3 )順丁烯 二醯亞胺單體及(a 4 )其他烯烴系不飽和化合物之共聚 物,及 〔B〕1 ,2 -醌二疊氮化合物,〔B〕成分之含有 量對〔A〕成分1 〇 〇重量分爲5〜1 0 0重量分爲特徵 之感應放射線性樹脂組成物可予達成的。 本發明之目的及優點,係第2形態,由已採用上述的 感應放射線性組成物之層間絕緣膜及顯微鏡頭之製造方法 可予達成。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -6 - 527394 A7 — ___B7_ 五、發明説明(4 ) 本發明之目的及優點,係第三形態,由上述的感應放 射線性組成物所形成的層間絕緣膜及顯微.鏡頭可予達成的 〇 (請先閲讀背面之注意事項再填寫本頁) 以下詳細說明本發明之感應放射線性樹脂組成物。 本發明之感應放射線性樹脂組成物,係以由共聚物〔 A〕及1,2 —醌二疊氮化合物〔B〕而成爲特徵。 共聚物「Α Ί 共聚物〔A〕係在溶劑中,在聚合引發劑之存在下藉 由對化合物(a 1 ),化合物(a 2 ),化合物(a 3 ) 及化合物(a 4)進行自由基聚合可予製造。 本發明所用的共聚物〔A〕,係基於由化合物(a 1 ),(a 2 ) , ( a 3 )及(a 4 )衍生的重複單位之合 經濟部智慧財產^員工消費合作社印製 計,宜爲含有由化合物(a 1 )衍生的構成單位5〜4 0 重量%,尤宜爲1 0〜3 0重量%。此構成單位未滿5重 量%之共聚物,係較難溶解於鹼水溶液內,另一方面超過 4 0重量%之共聚物對鹼水溶液之溶解性有過於變大的傾 向。至於化合物(a 1),可舉出例如:丙嫌酸、甲基丙 烯酸、巴豆酸等單羧酸;順丁烯二酸、反丁烯二酸、伊康 酸、順式甲基丁烯二酸、甲基反丁烯二酸等二羧酸;及此 等二羧酸酐;琥珀酸單〔2 -(甲基)丙烯醯氧基乙基〕 酯、苯二甲酸單〔2 -(甲基)丙烯醯氧基乙基〕酯等二 價以上之多元羧酸之單〔(甲基)丙嫌醯氧基院基〕酯類 本纸張尺度適用中國國家標準(CNS ) A4規格(21〇&gt;&lt;297公釐) 527394 A7 B7 五、發明説明(5) (請先閱讀背面之注意事項再填寫本頁) 單(甲基)丙烯酸6; 一羧基聚己內酯酯等之兩終端上 具有羧基及羥基之聚合物之單(甲基)丙烯酸酯類等。此 等之中,丙烯酸、甲基丙烯酸、順丁烯二酸等,由共聚合 反應性對鹼水溶液之溶解性及可容易到手的點係宜爲採用 的。此等可單獨使用或組合使用。 本發明所用的共聚物〔A〕,係基於由化合物(a 1 ),(a 2 ) , ( a 3 )及(a 4 )衍生的重複單位之合 計,宜爲含有由化合物(a 2 )衍生的構成單位1 0〜 7 0重量%,尤宜爲2 0〜6 0重量%。此構成單位未滿 1 0重量%時所得的保護膜或絕緣膜之耐熱性,表面硬度 有降低的傾向,另一方面超過7 0重量%時,共聚物之保 存安定性有降低的傾向。 ¾齊邹皆迭吋4苟8工消費合汴r.£.印Μ 至於化合物(a 2 ),例如可舉出:丙烯酸縮水甘油 基酯,甲基丙烯酸縮水甘油基酯’ ^ -乙基丙烯酸縮水甘 油基酯、2 -正-丙基丙烯酸縮水甘油基酯、^ -正丁基 丙烯酸縮水甘油基酯、丙烯酸- 6 ’ 7 -環氧基庚酯、甲 基丙烯酸一 6,7 -環氧基庚酯、^ 一乙基丙烯酸一 6, 7 -環氧基庚酯、鄰-乙烯基苄基縮水甘油基醚、間-乙 烯基苄基縮水甘油基醚、對一乙烯基苄基縮水甘油基醚等 ,係由共聚合反應性及提高所得的保護膜或絕緣膜之耐熱 性、表靣硬度之點,係較宜採用的’此等可單獨使用或組 合使用。 本發明所用的共聚物〔A〕,係基於由化合物(a 1 ),(a2) ,(a3)及(a4)衍生的重複單位之合 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 527394 A7 B7 五、發明説明(6) 計,宜爲由含有由化合物(a 3 )衍生的構成單位2〜 (請先閲讀背面之注意事項再填寫本頁) 5 0重量%,尤宜爲5〜4 0重量%。此構成單位未滿2 重量%時,有耐熱性、耐藥品性、表面硬度降低的傾向, 另一方面超過5 0重量%時’塗膜之成膜性有降低的傾向 〇 至於順丁烯二醯亞胺系單體(a 3 ) ’可舉出有:苯 基順丁嫌二醯亞胺、環己基順丁烯二酸亞胺、卡基順丁儲 二醯亞胺、N -琥珀醯亞胺基一 3 -順丁烯二醯亞胺基苯 甲酸酯、N —琥珀醯亞胺基一 4 一順丁烯二醯亞胺丁酯、 N —琥珀醯亞胺基—6 -順丁烯二醯亞胺己酸酯、N -琥 珀醯亞胺基—3 -順丁烯二醯胺丙酸酯、N— (9 -吖啶 基)順丁烯二醯亞胺。此等係可單獨使用或組合二種以上 使用。 本發明所用的共聚物〔A〕,係基於由化合物(a 1 ),(a 2 ) ,(a3)及(a4)衍生的重複單位之合 經濟部^¾时4^員工消費^泎注印製 計,宜爲由含有由化合物(a 4)衍生的構成單位1〜5 0重量%,更宜爲1〜2 0重量%,尤宜爲3〜1 0重量 %。此構成單位未滿1重量%時,有共聚物〔A〕之保有 安定性降低的傾向,另一方面超過5 0重量%時,有共聚 物〔A〕較難溶解於鹼水溶液之傾向。 至於化合物(a 4 ),例如可舉出:甲基丙烯酸甲酯 、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸第二 丁基酯、甲基丙烯酸正丁基酯、甲基丙烯酸第二丁基酯、 甲基丙烯酸第三丁基酯等的甲基丙烯酸烷基酯;甲基丙烯 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) &quot; -9- 527394 Α7 Β7 五、發明説明(7 ) (請先閱讀背面之注意事項再填寫本頁) 酸酯、異丙基丙烯酸酯等的丙烯酸烷基酯;甲基丙烯酸環 己酯、甲基丙烯酸2 -甲基環己基酯、甲基丙烯酸三環〔 5.2.1.02 6〕院—8 -基酯(在各該技術領域, 慣用名稱係被稱作甲基丙烯酸二環戊烯基酯)、甲基丙烯 酸二環戊烯基氧基乙酯、甲基丙烯酸異佛爾酮基酯等甲基 丙烯酸環狀烷基酯;丙烯酸環己基酯、丙烯酸2 -甲基環 己基酯、丙烯酸三環〔5 ·2 · 1 · 02’6〕癸烷—8 — 基酯(在各該技術領域,慣用各稱係被稱作丙烯酸二環戊 烯基酯)、丙烯酸二環戊烯氧基乙基酯、丙烯酸異佛爾酮 基酯等丙烯酸環狀烷基酯;甲基丙烯酸苯基酯、甲基丙烯 酸苄基酯等的甲基丙烯酸芳香基酯;丙烯酸苯基酯、丙烯 酸苄基酯等的丙烯酸芳香基酯;順丁烯二酸二乙酯、反丁 烯二酸二乙酯,伊康酸二乙酯等的不飽和二羧酸二酯;甲 基丙烯酸2 -羥乙基酯、甲基丙烯酸2 -羥丙基酯等羥烷 基酯; 雙環〔2.2.1〕庚基一2—烯, 5 -甲基雙環〔2 · 2 · 1〕庚基一 2—烯, 經濟邹tl时產¾資工消費合itfi印製 5-乙基雙環〔2·2·1〕庚基一2—烯, 5-羥基雙環〔2·2·1〕庚基一2—烯, 5 -羧基雙環〔2 · 2 · 1〕庚基一2 —烯, 5 —羥基甲基雙環〔2 · 2 · 1〕庚基一 2 —烯, 5 — (2 / —羥基乙基)雙環〔2 · 2 · 1〕庚基一 2 一稀, 5 —甲氧基雙環〔2 · 2 · 1〕庚基一 2 —烯, 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -10- 527394 A7 B7 五、發明説明(8 ) 5 —乙氧基雙環〔2 · 2 · 1〕庚基一 2 —烯, 5,6 —二羥基雙環〔2 · 2 .1〕庚基一 2 —烯, (請先閱讀背面之注意事項再填寫本頁) 5,6 —二羧基雙環〔2 · 2 · 1〕庚基一 2 —烯, 5 ,6 —二(羥基甲基)雙環〔2 · 2 · 1〕庚基一 2 —烯, 5 ,6—二(2&gt; —羥基乙基)雙環〔2 · 2 · 1〕 庚基一 2 —烯, 5 ,6 —二甲氧基雙環〔2 · 2 · 1〕庚基一 2 —烯 5 ,6 —二乙氧基雙環〔2 · 2 · 1〕庚基一 2 —烯 5 —羥基—5 —甲基雙環〔2 · 2 · 1〕庚基一 2 — 稀, 5 —羥基—5 -乙基雙環〔2 · 2 · 1〕庚基一 2 — 烯, 5 —羧基一 5 —甲基雙環〔2 · 2 · 1〕庚基一 2 — 烯, 5 —羧基—5 —乙基雙環〔2 · 2 · 1〕庚基一 2 — 烯, 5 —羥基甲基—5 —甲基雙環〔2 · 2 · 1〕庚基一 2 —烯, 5 -殘基一 6 —甲基雙環〔2 · 2 · 1〕庚基一 2 — 嫌, 5 —羧基—6—乙基雙環〔2 · 2 . 1〕庚基一 2 — 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 527394 A7 B7 五、發明説明(9 ) 嫌, (請先閱讀背面之注意事項再填寫本頁) 5,6 —二羧基雙環〔2 · 2 .1〕庚基一 2 —烯酐 (Hymic酸酐) 5 —第三丁氧基羰基雙環〔2 · 2 · 1〕庚基一 2 — 嫌, 5-環己基氧基羰基雙環〔2·2·1〕庚基一2— 烯, 5 -苯氧基羰基雙環〔2.· 2 · 1〕庚基一 2 —烯, 5 ,6 -二(第三丁氧基羰基)雙環〔2 . 2 · 1〕 庚基一 2 —烯, 5,6 -二(環己基氧基羰基)雙環〔2 · 2 · 1〕 庚基一 2 —烯等的雙環不飽和化合物類;及苯乙烯、鄰-甲基苯乙烯、間一甲基苯乙烯、對甲基苯乙烯、乙烯基甲 苯、對甲氧基苯乙烯、丙烯腈、甲基丙烯腈、氯乙烯、偏 二氯乙烯、丙烯醯胺、甲基丙烯醯胺、醋酸乙烯酯、1, 3 - 丁二烯、異戊二烯、2,3 —二甲基一 1 ,3 — 丁二 烯等。 經濟邹皙逄財4笱員工消費^汴社印製 此等之中,以苯乙烯、甲基丙烯酸第三丁基酯、甲基 丙烯酸二環戊烯基酯、對甲氧基苯乙烯、丙烯酸2 -甲基 環己基酯、1 ,3 - 丁二烯、雙環〔2 · 2 · 1〕庚基一 2 —烯等,由共聚合反應性及對鹼水溶液之溶解性的點係 較宜的。此等係可單獨使用或組合使用。 本發明所用的共聚物〔A〕,以聚苯乙嫌換算重量平 均分子量(以下稱作「Mw」),通常在2X103〜lx 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -12- 527394 A7 B7 五、發明説明(10) (請先閱讀背面之注意事項再填寫本頁) 1 Ο5,宜爲5X1 ο3〜5xl 04較佳。Mw若未滿2χ 1 0 3時,則所得的被膜在顯影性,殘膜率等會降低’又圖 案形狀,耐熱性等低劣’另一方面若超過1 x1 〇 5時’則 靈敏度會降低,又有圖案形狀低劣的情形。 如上述般,本發明所用的共聚物〔a〕 ’係具有羧基 及/或羧酸酐基及環氧基’對鹼水溶液具有適當的溶解性 ,同時即使在不合倂使用特別的硬化劑下,亦可藉由加熱 可使容易硬化。 含有上述共聚物〔A〕之感應放射線性樹脂組成物, 在顯影之際,在不生成顯影殘存下,又無被膜滑動下,可 容易的形成指定圖案形狀。 經濟部智慧財產¾員工消費合作社印製 至於製造共聚物〔A〕時所用的溶劑,具體而言例如 可舉出:甲醇、乙醇等醇類;四氫呋喃等醚類;乙二醇單 甲醚、乙二醇單乙醚等甘醇醚類;甲氧基乙醇乙酯、乙氧 基乙醇乙醋等乙二醇烷基醚乙酯類;二乙二醇單甲醚、二 乙二醇單乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙 二醇乙甲基醚等二乙二醇類;丙二醇丙醚、丙二醇丁醚等 的丙二醇單烷基醚類;丙二醇甲醚乙酯、丙二醇乙醚乙酯 、丙二醇丙醚乙酯、丙二醇丁醚乙酯等的丙二醇烷基醚乙 酯類;丙二醇甲醚丙酯、丙二醇乙醚丙酯、丙二醇丙醚丙 酯、丙二醇丁醚丙酯等的丙二醇烷基醚乙酯類;甲苯、二 甲苯等芳香族烴類; 甲乙基醚、環己酮、4_羥基一 4 一甲基一 2 —戊酮 等酮類;及醋酸甲酯、醋酸乙酯、醋酸丙酯、醋酸丁酯、 本紙張尺度適用中國國家標準^CNS ) A4規格(210X297公釐) &quot; -13- 527394 A7 •___ B7 五、發明説明(1彳) (請先閱讀背面之注意事項再填寫本頁) 2 —羥基丙酸乙酯、2 —羥基一 2 —甲基丙酸甲酯、2 -羥基一 2 -甲基丙酸乙酯、羥基醋酸甲酯、羥基醋酸乙酯 、羥基醋酸丁酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸 丁.酯、3 —羥基丙酸甲酯、3 -羥基丙酸乙酯、3 -羥基 丙酸丙酯、3 -羥基丙酸丁酯、3 —羥基—3 -甲基丁酸 甲酯、甲氧基醋酸甲酯、甲氧基醋酸乙酯、甲氧基醋酸丙 酯、甲氧基醋酸丁酯、乙氧基醋酸甲酯、乙氧基醋酸乙酯 、乙氧基醋酸乙酯、乙氧基醋酸丙酯、乙氧基醋酸丁酯、 丙氧基醋酸甲酯、丙氧基醋酸乙酯、丙氧基醋酸丙酯、丙 氧基醋酸丁酯、丁氧基醋酸甲酯、丁氧基醋酸乙酯、丁氧 基醋酸丙酯、丁氧基醋酸丁酯、2 -甲氧基丙酸甲酯、2 一甲氧基丙酸乙酯、2 -甲氧基丙酸丙酯、2 —甲氧基丙 酸丁酯、2 —乙氧基丙酸甲酯、2 —乙氧基丙酸乙酯、2 -乙氧基丙酸丙酯、2 -乙氧基丙酸丁酯、2 —丁氧基丙 酸甲酯、2 —丁氧基丙酸乙酯、2 —丁氧基丙酸甲酯、3 一甲氧基丙酸乙酯、3 —甲氧基丙酸丙酯、3 —甲氧基丙 酸丁酯、3 —乙氧基丙酸甲酯、3 —乙氧基丙酸乙酯、3 -乙氧基丙酸丙酯、3 —乙氧基丙酸乙酯、3 —乙氧基丙 酸丙酯、3 -乙氧基丙酸丁酯、3 —丙氧基丙酸甲酯、3 -丙氧基丙酸乙酯、3 -丙氧基丙酸丙酯、3 —丙氧基丙 酸丁酯、3 -丁氧基丙酸甲酯、3 -丁氧基丙酸丙酯、3 -丁氧基丙酸丁酯等的酯類。 至於製造共聚物〔A〕所用的聚合引發劑,通常可使 用已知被用作自由基聚合引發劑者,例如可舉出:2, 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14- 527394 A7 B7 五、發明説明(12) (請先閲讀背面之注意事項再填寫本頁) 2 -偶氮雙異丁腈、2,2,一偶氮雙—(2,4 —二 甲基戊腈)、2 ,—偶氮雙一(4 一甲氧基_2 ,4 —'甲基戊臆)寺的偶氣化合物;過氧化苯甲釀基、過氧 化月桂醯基、雙戊酸第三丁基過氧基酯、1,1,一雙一 (.第三丁基過氧基)環己烷等的有機過氧化物;及過氧化 氫,於使用過氧化物作爲自由基聚合引發劑之情形,與還 原劑同時採用過氧化物,作爲還原氧化型引發劑亦可。 1,2 -醌二疊氮化合物〔B〕 至於本發明所用的1 ,2 —醌二疊氮化合物〔B〕, 例如可舉出:1 ,2 —苯並醌二疊氮磺酸酯、1 ,2 -萘 醌二疊氮磺酸酯、1 ,2 -苯並醌二疊氮磺酸醯胺及1 , 2 -萘醌二疊氮磺酸醯胺等。 至於此等的具體例,可舉出·· 2,3,4 一三羥基二 苯酮一 1 ,2 -萘醌二疊氮—4_磺酸酯、2,3 ,4 — 三羥基二苯酮一 1 ,2 —萘醌二疊氮一 5 -磺酸酯、2, 經濟部智慧时產-%8工消費合作社印製 4,6 -三羥基二苯酮—1,2 —萘醌二疊氮一 4 一磺酸 酯、2 ,4,6 —三羥基二苯酮—1 ,2 —萘醌二疊氮— 5 -磺酸酯等的三羥基二苯酮之1,2 -萘醌二疊氮磺酸 酯類;2,,4,4&lt; —四羥基二苯酮—1 ,2 -萘 醌二疊氮—4 —磺酸酯、2,,4,4 — 一四羥基二 苯酮一 1 ,2 —萘醌二疊氮—5 —磺酸酯、2,3 ,4, 3 / —四羥基二苯酮一 1 ,2 -萘醌二疊氮一 4 一磺酸酯 、2 ,3,4,3 / _四羥基二苯酮一1 ,2 —萘醌二疊 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -15- 527394 A7 B7 五、發明説明(13) (請先閲讀背面之注意事項再填寫本頁) 氮—5 —磺酸酯、2 ,3 ,4,4 / —四羥基二苯酮—1 ,2—萘醌二疊氮一4 —磺酸酯、2 ,3 ,4,4&gt; —四 羥基二苯酮一 1 ,2 -萘醌二疊氮一 5 -磺酸酯、2,3 ,4,2 &gt; —四羥基—4 / 一甲基二苯酮一1 ,2 —萘醌 二疊氮—4 —磺酸酯、2,3 ,4,2^—四羥基—4/ 一甲基二苯酮一 1 ,2 —萘醌二疊氮一 5 —磺酸酯、2 , 3 ,4 ,4 / 一四羥基—3^ —甲氧基二苯酮一1 ,2- 萘醌二疊氮—4 一磺酸酯、2 ,3 ,4,4 / 一四羥基一 3 &gt; —甲氧基二苯酮一 1 ,2 —萘醌二疊氮一 5 —磺酸酯 等的四羥基二苯銅之1 ,2 —萘醌二疊氮磺酸酯;2 ,3 ,4,,6 / —五羥基二苯酮一 1 ,2 —萘醌二疊氮 —4 —磺酸酯、2,3,4,2 &gt;,6 / —五羥基二苯酮 —1 ,2 -萘醌二疊氮一 5 -磺酸酯等五羥基二苯酮之1 ,2 —萘醌二疊氮磺酸酯;2,4,6,3 &gt; ,4 —, 5 &gt; —六羥基二苯酮一 1 ,2 —萘醌二疊氮一 4 一磺酸酯 、2,4,6,3 / ,4,,5,一六羥基二苯酮一 1 , 2 —萘醌二疊氮—5 —磺酸酯、3 ,4,5 ,3 / , 經濟部智慧財4%員工消費合汴ti印製 ,5 / -六羥基二苯酮—1 ,2 —萘醌二疊氮—4 一磺酸 酯、3,4,5 ,3 / ,4 &gt; ,5 / —六羥基二苯酮—1 ,2 -萘醌二疊氮一 5 -磺酸酯等之羥基二苯酮之1 ,2 一萘醌二疊氮磺酸酯;雙(2,4 —二羥基苯基)甲烷一 1 ,2 -萘醌二疊氮—4 一磺酸酯、雙(2 ,4 —二羥基 苯基)甲烷一 1 ,2 —萘醌二疊氮一 5 —磺酸酯、雙(對 羥基苯基)甲烷一 1 ,2 -萘醌二疊氮一 4 一磺酸酯、雙 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -16- 527394 A7 B7 五、發明説明(14) (對羥基苯基)甲烷一 1 ,2 —萘醌二疊氮一 5 —磺酸酯 、三(對羥基苯基)甲烷一 1 ,2 —萘醌二疊氮一 4 一磺 (請先閲讀背面之注意事項再填寫本頁) 酸酯、三(對羥基苯基)甲烷一 1 ,2 —萘醌二疊氮一 5 —磺酸酯、1 ,1 ,1 —三(對羥基苯基)乙烷一 1 ,2 —萘醌二疊氮—4 一磺酸酯、1 ,1 ,1 一三(對羥基苯 基)乙烷一 1 ,2 —萘醌二疊氮一 5 —磺酸酯、雙(2, 3 ,4 一三羥基苯基)甲烷—1 ,2 —萘醌二疊氮一 4 — 磺酸酯、雙(2 ,3 ,4 —三羥基苯基)甲烷—1 ,2’ 一 萘醌二疊氮一 5 —磺酸酯、2 ,2 -雙(2 ,3 ,4 —三 羥基苯基)丙烷一 1 ,2 -萘醌二疊氮一 4 一磺酸酯、2 ,2 —雙(2,3,4 —三羥基苯基)丙烷一 1 ,2 —萘 醌二疊氮一 5 —磺酸酯、1 ,1 ,3 —叁(2 ,5 —二甲 基一 4 —羥基苯基)—3 -苯基丙烷—1 ,2 -萘醌二疊 氮一 4 —擴酸酯、1 ,1 ,3— _(2 ,5— 二甲基—4 一羥基苯基)一 3 -苯基丙烷一 1 ,2 —萘醌二疊氮—5 —磺酸酯、4,4&gt; —〔1—〔4 —〔1—〔4 —羥基苯 基〕一 1 一甲基乙基〕苯基〕亞乙基〕雙酚一 1 ,2 —萘 經濟部智慧財產局8工消費合作钍印製 醌二疊氮一 4 —磺酸酯、4,4&gt;一〔1—〔4 —〔1 — 〔4 一羥基苯基〕一 1 一甲基乙基〕苯基〕亞乙基〕雙酸 一 1 ,2 -萘醌二疊氮—5-磺酸酯、雙〔2 ,5 —二甲 基一 4 一羥基苯基〕—2 —羥基苯基甲烷一 1 ,2 —萘醒 二疊氮—4 —磺酸酯、雙〔2 ,5 —二甲基一 4 一羥基苯 基〕一 2 —羥基苯基甲烷—1 ,2 —萘醌二疊氮一 5 —磺 酸酯、3 ,3 ,3,,3,一四甲基一1 ,1 一一亞螺基 本紙張尺度適用中國國家標隼(CNS ) A4規格(210X297公釐) -17- 527394 A7 B7 五、發明説明(15) (請先閲讀背面之注意事項再填寫本頁) —5,6 ,7,/ 一 己醇一工,2 一萘醒 二疊氮一4 —磺酸酯、3 , 3 , 3 / ,3,一四甲基—1 ,1一—亞螺基—5,6,7,5^,6^,7/一己醇 一 1 , 2 —萘醌二疊氮一 5 —磺酸酯、2 ,2 , 4 —三甲 基〜7,2 ^ ,4 ^ —三羥基黃烷一 1 ,2 —萘醌二疊氮 一 4 —磺酸酯、2 ,2 ,4 —三甲基一 7,,4&gt; — 三羥基黃烷一 1 ,2 —萘醌二疊氮一 5 -磺酸酯等的(聚 羥基苯基)烷之1,2 -萘醌二疊氮磺酸酯。 又將上述例示的1 , 2 -萘醌二疊氮磺酸酯類之酯鍵 結變更成醯胺鍵結之1,2 -萘醌二疊氮磺酸_胺類,例 如2 ,3 ,4 一三經基二苯酮一1 ,2 一萘酉比一覺氣 4 -磺酸醯胺等亦較宜使用的。 此等的1 ,2 -醌二疊氮化合物係可單獨或組合一種 以上使用。 〔B〕成分之使用比率,對〔A〕成分1 00重量份 ,通常爲5〜1 0 0重量分,宜爲1 〇〜5 0重量分。 於此比率未滿5重量分時,利用放射線之照射而生成 的酸量較少,故對成爲放射線之照射部分及未照射部分之 顯影液之鹼水溶液的溶解度之差較小,欲予圖案化即成困 難。又與環氧基之反應有關的酸之量變少,故未能得足夠 的耐熱性及耐溶劑性。另一方面,此比率若超過1 〇 〇重 量分時’在短時間之放射線之照射,由於未反應之〔B〕 成分大量殘存的,故對前述鹼水溶液之不溶化效果過高, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -18- 527394 A7 _______B7____ 五、發明説明(16) 即成爲較難顯影。 (請先閲讀背面之注意事項再填寫本頁) 〈其他成分〉 於本發明之感應放射線性樹脂組成物,除上述之〔A 〕成分及〔B〕成分外,視必要時,可使含有〔C〕感熱 性酸生成化合物、〔D〕具有至少一個之乙烯性不飽和雙 鍵鍵結之聚合性化合物、〔E〕環氧樹脂、〔F〕附著助 劑及界面活性劑。 上述〔C〕感熱性酸生成化合物係可供爲使耐熱性或 硬度提高而用。至於其具體例,可舉出氟化銻類,至於市 售品,則有 San Aid SI— L80,San Aid SI - L110,San Aid SI — L150 (以上均爲三新化學工業(股)製造)等。 〔C〕成分之使用比率爲對共聚物〔A〕 1〇〇重量 分,宜爲2 0重量分以下,較宜爲5重量分以下。 此比率在超過2 0重量分時,會發生析出物,有圖案 化成爲困難的情形。 經濟部智慧財產局工消費合作社印製 〔D〕至於具有至少1個乙烯性不飽和雙鍵鍵結之聚 合性化合物可較合適採用例如單官能(甲基)丙嫌酸酯、 二官能(甲基)丙烯酸酯或三官能(甲基)丙烯酸酯。 至於上述單官能(甲基)丙烯酸酯,例如可舉出··( 甲基)丙烯酸2—羥乙酯、(甲基)丙烯酸卡必醇酯、( 甲基)丙烯酸異原冰片基酯、(甲基)丙烯酸3 —甲氧基 丁基酯、2 -(甲基)丙烯醯氧基乙基一 2 -羥基丙基苯 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -19- 527394 A7 ____B7_ 五、發明説明(17) 二甲酸酯等。 至於此等市售品,例如可舉出:Allonix Μ - 1 0 1, M— 111,Μ - 114(東亞合成(股)製)、 KAYARAD T C - 1 1 〇 S,TC— 120S (日本化藥 (股)製造)、Biscoat 1 5 8,2 3 1 1 (大阪有機化學 工業(股)製造)等。 至於上述二官能(甲基)丙烯酸酯,例如可舉出:( 甲基)丙烯酸乙二醇酯、二(甲基)丙烯酸1 ,6 —己二 醇酯、二(甲基)丙烯酸1 ,9 一壬二醇酯二(甲基)丙 烯酸聚丙二醇酯、二(甲基)丙烯酸聚丙二醇酯、二(甲 基)丙烯酸四乙二醇酯、二丙燃酸雙苯氧基乙醇莽醇。二 丙烯酸雙苯氧基乙醇莽酯等。 至於此等的市售品,例如可舉出:Allonix Μ - 2 1 0 ,Μ— 240,Μ— 6200 (東亞合成(股)製造)、 KAYARAD HDDA,HX— 220,R— 604 (曰本化 藥(股)製造)、Biscoat 260,312,335HP( 大阪有機化學工業(股)製造)等。 至於上述三官能以上的(甲基)丙烯酸酯,例如可舉 出:三(甲基)丙烯酸三羥甲基丙烷酯、三(甲基)丙烯 酸季戊四醇酯、磷酸三((甲基)丙烯醯氧基乙基)酯、 四(甲基)丙烯酸季戊四醇酯、五(甲基)丙烯酸二季戊 四醇酯、六(甲基)丙烯酸二季戊四醇酯等,至於其市售 品,例如可舉出 Allonix M— 309,M— 400,Μ — 40 5,Μ - 450,Μ - 7100,Μ— 8030,Μ 本纸張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 -20- 527394 A7 B7 五、發明説明(18) (請先閲讀背面之注意事項再填寫本頁} —8060 (東亞合成(股)製)、KAYARAD TMPTA, DPHA, DPCA- 2 0,DPCA— 3 0,DPCA— 6 0,DPCA —120(曰本化藥(股)製造)、Biscoat 2 9 5, 300 ,36〇 ’ GPT,3PA,400 (大阪有機化 學工業(股)製造)等。 此等的單官能、二官能或三官能以上之(甲基)丙烯 酸酯,係可單獨使用或組合使用。 〔D〕成分之使用比率,對共聚物〔A〕1 〇 〇重量 分,宜爲5 0重量分以下,較宜爲3 0重量分以下。 藉由以此種比率使含有〔D〕成分,可使用本發明之 感應放射線性樹脂組成物而得的保護膜或絕緣膜之耐熱性 及表面硬度等提高。此比率超過5 0重量分時,有對共聚 .物〔A〕之鹼可溶性樹脂之相溶性成爲不足,塗布時生成 塗膜粗糙的情形。 經濟部智慧时4.^:® (工消費合作社印製 至於上述〔E〕環氧樹脂,祗要對相溶性不影響,並 未予限定者,惟宜爲雙酚A型環氧樹脂、酚酚醛淸漆型環 氧樹脂、甲酚酚醛淸漆型環氧樹脂、環狀脂肪族環氧樹脂 、縮水甘油基酯型環氧樹脂、縮水甘油基胺型環氧樹脂、 雜環式環氧樹脂、已(共)聚合甲基丙烯酸縮水甘油基酯 之樹脂等。 此等之中,宜爲雙酚A型環氧樹脂、甲酚型酚醛淸漆 環氧樹脂、縮水甘油基酯型環氧樹脂等。 〔E〕成分之使用比率,對共聚物〔A〕l 0 0重量 分,宜爲30重量分以下。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) '' -21 - 527394 A7 B7 五、發明説明(19) (請先閲讀背面之注意事項再填寫本頁) 藉由以此種比率使含有〔E〕成分,可使由本發明之 感應放射線性樹脂組成物而得的保護膜或絕緣膜之耐熱性 及表面硬度等提高。 此比率超過3 0重量分時,有對共聚物〔A〕之鹼可 溶性樹脂之相溶性成爲不足’有未能獲得足夠的塗膜形成 能力。 且,共聚物〔A〕亦稱作「環氧樹脂」,惟在具有鹼 可溶性之點,被要求較高的分子量之點上,〔E〕成分係 不同的。 經濟部智慧財4局g(工消費合作社印製 爲使塗布性提高,可使用〔F〕界面活性劑。至於其 市售品,例如可舉出:BM - 1〇〇〇,BM— 1 100 (BM CHEMIE 公司)製造)、Megafac F 1 4 2 D,F172,F173,F183 (大日本油墨化學工 業(股)製造)、Flowlard FC— 135,FC — 170c,FC — 430,FC — 431 (住友 3M (股 )製造),Surflon S — 112,S— 113,S — 131,S-141,S — 145,S-382,SC-101,SC— 102,SC - 103,SC - 104, SC— 105 .SC - 106(旭玻璃(股)製造), EFTOPEF 301 ,3 0 3,3 5 2 (新秋田化成(股) 製造),SH— 28PA,SH— 190,SH— 193 ,SZ - 6032,SF - 8428,DC - 57,DC 一 1 9 0 (東麗3丨以〇1^(股)製造)等氟系及矽氧系界面 活性劑。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -22- 527394 A7 B7 五、發明説明(20) (請先閲讀背面之注意事項再填寫本頁) 其他亦有「F」成分,可使用聚環氧乙烷月桂基醚、 聚環氧乙烷硬脂基醚、聚環氧乙烷油基醚等聚環氧乙烷烷 基醚類;聚環氧乙烷辛基苯基醚、聚環氧乙烷壬基苯基醚 等聚環氧乙烷芳香基醚類;聚環氧乙烷二月桂酯、聚環氧 乙院二硬脂酯等聚環氧乙烷二烷基酯類等非離子性系界面 活性劑;有機矽氧烷聚合物K P 3 4 1 (信越化學工業( 股)製造)、(甲基)丙烯酸系共聚物1)〇以仏〜^.57, 9 5 (共榮公司油脂化學工業(股)製造)等。 此等的界面活性劑,對共聚物〔A〕1 〇 〇重量分, 宜爲採用5重量分以下較宜爲2重量分以下。界面活性劑 之量超過5重量分時,有塗布時容易生成塗膜粗糙的情形 〇 又爲使與基體之接著性提高,亦可使用〔G〕接著助 劑。至於此種接著助劑,官能性矽烷偶合劑係較宜爲使用 ,例如可舉出:具有羧基、甲基丙烯醯基、異氰酸酯基、 環氧基等之反應性取代基之矽烷偶合劑,具體而言可舉出 三甲氧基甲矽基安息香酸、r 一甲基丙烯氧基丙基三甲氧 基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、 7 -異氰酸酯丙基三乙氧基矽烷、7 -縮水丙氧基丙基三 甲氧基矽烷、/3 — (3 ,4 一環氧基環己基)乙基三甲氧 基矽烷等。 此種接著助劑,對共聚物〔A〕1 〇 〇重量分,宜爲 採用2 0重量分,較宜爲1 0重量分以下之量。接著助劑 之量超過2 0重量分時,有顯影殘存容易生成的情形。 本紙張尺度適用中關家標準(CNS ) A4規格(21GX297公董) 一 -23- 527394 A7 B7 五、發明説明(21) (請先閱讀背面之注意事項再填寫本頁) 本發明之感應放射線性樹脂組成物,係藉由均勻的混 合上述的共聚物〔A〕及1 ,2 —醌二疊氮化合物〔B〕 與如上述般任意添加的其他配合劑可予製備。通常’本發 明之感應放射線性樹脂組成物,係予溶解於適當的溶劑並 以-溶液狀態採用著。例如藉由以指定的比率混合共聚物〔 A〕、1 ,2 -醌二疊氮〔B〕及任意添加的其他配合劑 ,可製備溶液狀態之感應放射線性樹脂組成物。 至於製備本發明之感應放射線性樹脂組成物所用的溶 劑,採用均勻的溶解共聚物〔A〕、1 ,2 —醌二疊氮化 合物〔B〕及經予任意配合的其他配合劑之各成分的不與 各成分反應者。 具體而言,例如可舉出:甲醇、乙醇等醇類;四氫呋 喃等醚類;乙二醇單甲醚、乙二醇單乙醚等甘醇醚類;甲 氧基乙醇乙酯、乙氧基乙醇乙酯等乙二醇烷基醚乙酯類; 二乙二醇二乙醚、二乙二醇乙甲基醚等二乙二醇類;丙二 醇丙醚、丙二醇丁醚等的丙二醇單烷基醚類;丙二醇甲醚 乙酯、丙二醇乙醚乙酯、丙二醇丙醚乙酯、丙二醇丁醚乙 酯等的丙二醇烷基醚乙酯類;丙二醇甲醚丙酯、丙二醇乙 醚丙酯、丙二醇丙醚丙酯、丙二醇丁醚丙酯等的丙二醇烷 基醚乙酯類;甲苯、二甲苯等芳香族烴類; 甲乙基酮、環己酮、4 一羥基一 4 一甲基一 2 —戊酮 酮類;及醋酸甲酯、醋酸乙酯、醋酸丙酯、醋酸丁酯、2 一羥基丙酸乙酯、2 —羥基—2 —甲基丙酸甲酯、2 —羥 基- 2 -甲基丙酸乙酯、羥基醋酸甲酯、羥基醋酸乙酯、 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -24- 527394 A7 B7 五、發明説明(22) (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財4^78工消費合作Ti印製 經基醋酸丁酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁 廟、3 —羥基丙酸甲酯、3 -羥基丙酸乙酯、3 -羥基丙 酸两酯、3 -羥基丙酸丁酯' 2 -羥基—3 —甲基丁酸甲 酯、甲氧基醋酸甲酯、甲氧基醋酸乙酯、甲氧基醋酸丙酯 、甲氧基醋酸丁酯、乙氧基醋酸甲酯、乙氧基醋酸乙酯、 乙氧基醋酸乙酯、乙氧基醋酸丙酯、乙氧基醋酸丁酯、丙 氧基醋酸甲酯、丙氧基醋酸乙酯、丙氧基醋酸丙酯、丙氧 基醋酸丁酯、丁氧基醋酸甲酯、丁氧基醋酸乙酯、丁氧基 醋酸丙酯、丁氧基醋酸丁酯、2 —曱氧基丙酸甲酯、2 -甲氧基丙酸乙酯、2 —甲氧基丙酸丙酯、2 —甲氧基丙酸 丁酯、2 —乙氧基丙酸甲酯、2 —乙氧基丙酸乙酯、2 — 乙氧基丙酸丙酯、2 -乙氧基丙酸丁酯、2 -丁氧基丙酸 甲酯、2 — 丁氧基丙酸乙酯、2 —丁氧基丙酸甲酯、3 — 甲氧基丙酸乙酯、3~甲氧基丙酸酯、3 —甲氧基丙酸丁 酸、3 —乙氧基丙酸甲酯、3 —乙氧基丙酸乙酯、3 —乙 氧基丙酸丙酯、3 -乙氧基丙酸乙酯、3 —乙氧基丙酸丙 酯、3 -乙氧基丙酸丁酯、3 —丙氧基丙酸甲酯、3 —丙 氧基丙酸乙酯、3 -丙氧基丙酸丙酯、3 -丙氧基丙酸丁 酯、3 — 丁氧基丙酸甲酯、3 —丁氧基丙酸丙酯、3 -丁 氧基丙酸丁酯等的酯類。 此等溶劑之中,由溶解性,與各成分之反應性及塗膜 之形成容易性,較宜採用甘醇醚類、乙二醇烷基醚乙酯類 、酯類及二乙二醇類。 再者,與前述溶劑同時亦可合倂使用高沸點溶劑。至 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -25- 527394 A7 __ B7 五、發明説明(23) (請先閱讀背面之注意事項再填寫本頁) 於可合倂使用的高沸點溶劑,例如可舉出:N -甲基甲醯 胺、N,N —二甲基甲醯胺、N —甲基醯苯胺、N —甲基 乙醯胺、N,N —二甲基乙醯胺、N —甲基吡咯烷酮、二 甲基亞硕、苄基乙醚、二己醚、乙醯基丙酮、異佛爾酮、 己酸、庚酸、1—辛醇、1—壬醇、苄醇、醋酸苄酯、安 息香酸乙酯 '草酸二乙酯、順丁烯二酸二乙酯、r 一丁內 酯、碳酸乙烯酯、碳酸丙烯酯、乙苯基乙醇乙酯等。 又,如上述的予以製備的組成物溶液係採用孔徑〇 · 2 # m程度之毫米過濾膜等過濾後,亦可供使用。 圖案狀薄膜之形成 其次採用本發明之感應放射線性樹脂組成物,說明形 成本發明之層間絕緣膜、顯微鏡頭之方法。 本發明之層間絕緣膜及顯微鏡頭係依下述步驟予以製 造。 (1 )於基板上形成感應放射線性樹脂組成物之塗膜 經濟部智慧財4笱員工消費合作社印製 (2 )將放射線照射於經予形成的塗膜之至少一部分 上之後,進行顯影處理之步驟。 (3 )視必要時,再照射放射線後,進行後烘烤步驟 〇 於上述(1 )之步驟,至於形成感應放射線性樹脂組 成物之塗膜的方法,可使用適當的方法,惟例如將感應放 射線性樹脂組成物之溶液塗布於基板表面,藉由進行預烘 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -26- 527394 A7 B7 五、發明説明(24) (請先閲讀背面之注意事項再填寫本頁) 烤’可由去除溶劑之方法而成。至於組成物溶液之塗布方 法,並未予特別限定,例如可採用噴布法、輥塗法、旋塗 $、棒塗法等各種方法。 至於預烘烤之條件,雖然依各成分之種類,使用比率 而異,惟通常在60〜1 10 °C 30秒〜1 5鐘程度。 至於上述(2 )之步驟所用的放射線,例如可舉出g 射線(波長4 3 6 n m ) i射線(波長3 6 5 n m )等的 紫外線,K r F激發體雷射等的遠紫外線,同步加速器放 射線等的X射線、電子線等的荷電粒子線,此等之中可舉 出g射線及i射線係較宜者。 於將放射線照射至塗膜之至少一部分之際,視必要時 介經指定的圖案光罩可予進行。又於顯影處理,採用下述 的顯影液藉由去除放射線之照射部分,可形成所期待的圖 案。 經濟部智慧时4-^s工消費合作钍印製 至於顯影處理所用的顯影液,可採用氫氧化鈉、氫氧 化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨、乙胺、正丙胺、 二乙胺、二乙基胺基乙醇、二正丙基胺、三乙基胺、甲基 一乙基胺、一甲基乙醇胺、三乙醇胺、氫氧化四甲基錢、 氣氧化四乙基氣、吼略、/、氨哦卩定、1 ’ 8 ——氮雑雙環 〔5 · 4 · 0〕— 7 —十一嫌 1 ,5 -二氮雜雙環〔4 · 3 · 0〕一 5 -壬院等驗類水溶液。 又於上述的鹼類水溶液內可使用已適當添加甲醇、乙 醇等的水溶性有機溶劑或界面活性劑之水溶液或溶解本發 明之組成物的各種有機溶劑作爲顯影液。 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -27- 527394 A7 B7 經濟部智慧时4^7員工消費合作钍印t 五、發明説明(25) 再者,至少顯影方法,可利用滿液法、浸漬法、搖動 浸漬法等。 (3 )再者’視必要於顯影處理後,對經予圖案化的 薄膜,例如進行利用流水淸洗之淸洗處理,再者藉由全面 照射利用高壓水銀燈等的放射線,進行各該薄膜中殘存的 1 ,2 —醌二疊氮化合物之分解處理後,利用熱板、烘箱 等加熱裝置煅燒此薄膜,進行各該薄膜之硬化處理。 於此硬化處理之煅燒處理溫度,例如1 5 0〜2 5 0 °C,煅燒時間例如爲5〜9 0分鐘(在熱板上進行煅燒時 爲5〜3 0分鐘,在烘箱進行煅燒時爲3 0〜9 0分鐘) 0 如此進行,於基板之表面上可形成對應於目的之層間 絕緣膜,或顯微鏡頭之優越的圖案狀薄膜(硬化膜)。 上述經予形成的層間絕緣膜或顯微鏡頭,係具有高透 明性者,可將膜厚設爲1 . Ο μ m時之波長領域4 0 0〜 8 0 0 nm之光線之最低透過率設爲8 0以上,再者設成 8 5%以上,尤其亦可設成9 0%以上。 上述經予形成的層間絕緣膜、顯微鏡頭,由後述的實 施例可顯而得知,除透明性之外,在耐熱性、耐溶劑性等 方面係優越者。 實施例 以下表示出合成例、實施例,雖可再具體的說明本發 明’惟本發明並非受以下的實施例所限定者。 (請先閱讀背面之注意事項再填寫本頁) i# 訂 -AW·. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X29*7公釐) -28- 527394 A7 B7 五、發明説明(26) (請先閲讀背面之注意事項再填寫本頁) 實施例 合成例1 於具有冷凝管、攪拌機之燒瓶內、饋入2,2 &gt; -偶 氮雙(2 ,4 —二甲基戊腈7 8重量分、二乙二醇乙基甲 基醚2 2 0重量分。接著饋入苯乙烯2 0重量分、甲基丙 烯酸2 0重量分、甲基丙烯酸縮水甘油基酯4 0重量分及 苯基順丁烯二醯亞胺2 0重量分,經氮氣取代後,徐徐開 始攪拌。使溶液之溫度上升至7 0 °C,保持此溫度5小時 而得含有共聚物〔A - 1〕之聚合物溶液。所得的聚合物 溶液之固形分濃度爲3 0 · 6重量%。 合成例2 經濟部智慧財4%員工消費合汴钍印^ 於具有冷凝管、攪拌機之燒瓶內,饋入2,2 &gt; -偶 氮雙(2 ,4 一二甲基戊腈)8重量分、二乙二醇乙基甲 基醚2 2 0重量分。接著饋入苯乙烯1 0重量分,甲基丙. 烯酸2 0重量分,甲基丙烯酸縮水甘油基酯4 0重量分, 甲基丙烯酸二環戊烯基酯2 0重量分及苯基順丁烯二醯亞 胺重量分,經氮氣取代後,徐徐開始攪拌。使溶液之溫度 上升至7 0 °C,保持此溫度5小時而得含有共聚物〔A 一 2〕之聚合物溶液。所得的聚合物溶液之固形分濃度爲3 1 . 0重量%。 合成例3 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -29- 527394 A7 B7 五、發明説明(27) (請先閱讀背面之注意事項再填寫本頁) 於具有冷凝管、攪拌機之燒瓶內,饋入2,2 &gt; -偶 氮雙(2,4 一二甲基戊腈)8重量分、及二乙二醇乙基 甲基醚2 2 0重量分。接著饋入苯乙烯1 〇重量分,甲基 丙烯酸2 0重量分,甲基丙烯酸縮水甘油基酯3 0重量分 ,-對乙烯基苄基縮水甘油基醚1 5重量分,甲基丙烯酸二 環戊烯基酯1 5重量分及苯基順丁烯二醯亞胺1 〇重量分 ,經氮氣取代後,徐徐開始攪拌。使溶液之溫度上升至 7 0 °C,保持此溫度5小時而得含有共聚物〔A - 1〕之 聚合物溶液。所得的聚合物溶液之固形分濃度爲3 1 . 0 重量%。 合成例4 ¾.齊郎皆达材€ 9a(工力費合汴社印製 於具有冷凝管、攪拌機之燒瓶內,饋入2,2 &gt; -偶 氮雙(2,4 一二甲基戊腈)8重量分及二乙二醇乙基甲 基醚2 2 0重量分。接著饋入苯乙烯1 〇重量分,甲基丙 烯酸2 0重量分,甲基丙烯酸縮水甘油基酯4 0重量分, 甲基丙烯酸二環戊烯基酯15重量分及苯基順丁烯二醯亞 胺1 0重量分,經氮氣取代後,徐徐開始攪拌。使溶液之 溫度上升至7 0 °C,保持此溫度5小時而得含有共聚物〔 A - 1〕之聚合物溶液。所得的聚合物溶液之固形分濃度 爲3 1 · 2重量%。 實施例1 〔感應放射線性樹脂組成物之製備〕 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -30- 527394 A7 B7 五、發明説明(28) 混合以合成例1而得的聚合物溶液(相當於共聚物〔 A — 1〕100重量分)及成分〔B〕之2,3,4,4 /一四羥基二苯酮一 1 ,2 -萘醌二疊氮一 4 一磺酸酯 3 〇重量分,使溶解於乙二醇乙基甲基醚至固形分濃度成 3 〇重量%後,以孔徑0 · 2 // m之毫米孔隙過濾膜過濾 並製備感應放射線性樹脂組成物之溶液(S - 1 )。 〔感應放射線性樹脂組成物之評估〕 對上述組成物(S - 1 )進行感應放射線性之評估, 再者對由(S - 1 )所形成的圖案狀薄膜,進行耐溶劑、 耐熱性、透明性、耐熱變色性之評估。 〔感應放射線性之評估〕 於矽基板上採用旋塗器,塗布上述組成物(S - 1 ) 後’在9 0 °C於熱板上預烘烤2分鐘並形成膜厚3 · 0 之塗膜。於所得的塗膜上介經具有寬度3 之圖案 的圖案光罩利用水銀燈照射指定量之紫外線。其次採用由 氫氧化四甲基銨〇 · 4重量%水溶液而成的顯影液在2 5 °C進行顯影處理9 0秒鐘後,以超純水進行流水淸洗1分 鐘。 此時’測定爲使寬度3 // m之圖案完全溶解於顯影液 內所需的最小紫外線照射量(以下,稱作「形成圖案最小 曝光量」)。其結果示於表1。形成圖案最小曝光量未滿 80mj/crri時係被評估成優良,8〇〜i〇〇mJ/ 本纸張尺度適 家標举(CNS) A4規格(21〇&gt;&lt;297公¥1 ^ -31 - (請先閱讀背面之注意事項再填寫本頁) 訂 争· 527394 A7 B7 五、發明説明(29) c m2則感應放射線性被評估成良好,在超過1 〇 〇 m j / c rri時,則感應放射線性係予以評估成不良。 (請先閱讀背面之注意事項再填寫本頁) 〔耐溶劑性之評估〕 .於矽基板上採用旋塗器,塗布上述組成物(S - 1 ) 後,在9 0°C於熱板上預烘2分鐘並形成膜厚3 . 〇//m 之塗膜。於所得的塗膜上利用水銀燈照射紫外線至積算照 射量成爲3 0 0 m J / c m2,接著,藉由在淸淨烘箱內於 2 2 0 °C煅燒此矽基板1小時,進行塗膜之硬化處理,測 定所得的硬化膜之膜厚(T 1 )時,爲2 · 5 # m。因此 ,使此硬化膜經予形成的矽基板浸漬入溫度經予控制於 7 0 °C之二甲基亞碾中之後,測定各該硬化膜之膜厚( t 1 ),算出由浸漬引起的膜厚變化率{(tl 一丁 1) / T 1 } X 1 0 0 [ % ]。 此値之絕對値未滿5 %時,耐溶劑性可說是優良,於 5〜1 0 %時,耐溶劑性可說是良好,超過1 〇 %時,耐 溶劑性可說是不良,結果示於表1。 〔耐熱性之評估〕 與上述的耐溶劑性之評估同法形成硬化膜,測定所得 的硬化膜之膜厚(T2)時,爲2 · 5//m,接著,將此 硬化膜基板在淸淨烘箱內於2 4 0 °C追加1小時烘烤後, 測定各該硬化膜之膜厚(t 2 ),算出由追加烘烤引起的 膜厚變化率丨(t2 — 丁 2)/T2}xl00〔%〕。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -32- 527394 A7 _B7__ 五、發明説明(30) 此値之絕對値未滿5 %時,耐熱性可說是優良,於5〜 (請先閱讀背面之注意事項再填寫本頁) 1 0 %時,熱熱性可說是良好,超過1 0 %時,耐熱性可 說是不良。結果不於表1。 〔透明性之評估〕 使用玻璃基板「Corning 7059 ( Corning公司)製造」 及預烘烤後的塗膜之膜厚爲1 · 2 //m外,餘與上述的耐 溶劑性之評估同法,於玻璃基板上形成膜厚1 · 0 m之 硬化膜。採用分光光度計「1 5 0 — 2 0型double beam ( 日立製作所製造)」在4 0 0〜8 0 0 nm之範圍之波長 測定具有此硬化膜之玻璃基板之光線透過率。此時,參考 側之小室係與使用作基板者安裝同種的玻璃^ Corning 7059 」。此時之最低透過率在9 0 %以上時,透明性可說係極 優良,在8 5%以上至未滿9 0%時,透明性可說是優良 ,8 0 %以上未滿8 5 %時,透明性可說是良好,未滿8 0 %時,透明性可說是不良。結果示於表1。 經濟部智慧財產^資工消費合作社印製 〔耐熱變色性之評估〕 與上述的透明性之評估同法於玻璃基板上形成硬化膜 。接著將此硬化膜基板再於淸淨烘箱內在2 4 0 °C追加烘 烤1小時。採用分光光度計「1 5 0 — 2 0型double beam (日立製作所製造)」在400〜800nm之範圍之波 長測定具有此硬化膜之玻璃基板在追加烘烤後之光線透過 率。此時,參考側之小室係與使用作基板者安裝同種的玻 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -33- 527394 A7 B7 五、發明説明(31) (請先閱讀背面之注意事項再填寫本頁) 璃「Corning 7059」。此時之最低透過率在90%以上時, 耐熱變色性可說是極優良在8 5以上至未滿9 〇%時,_ 熱變性可說是優良,在8 0以上未滿8 5 %時,耐熱變色 性可說是不良。結果示於表1。 實施例2 除使用含有共聚物〔A - 2〕之聚合物溶液取代含有* 共聚物〔A — 1〕之共聚物溶液外,餘以與實施例1同法 而製備組成物溶液,並予評估。其結果示於表1。 實施例3 除使用含有共聚物〔A - 3〕之聚合物溶液取代實施 例1之含有共聚物〔A - 1〕之聚合物溶液外,餘以與實 施例1同法製備組成物溶液(S - 3 )並予評估。結果示 於表1。 實施例4 經濟部智慧时產%員工消費合作社印製 除使用含有共聚物〔A - 4〕之聚合物溶液取代實施 例1之含有共聚物〔A - 1〕之聚合物溶液外,餘以與實 施例1同法製備組成物溶液(S - 4 )並予評估。結果示 於表1。 實施例5 除使用實施例4之成分〔B〕之1 ,;[ , 3 一叁(2 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -34- 527394 A7 B7 五、發明説明(32) ,5 -二甲基—4 一羥基苯基一 3 -苯基)丙烷(1莫耳 )及1 ,2 -奈醌一豐氮一 5 -磺酸氯化物(1 · g莫耳 (請先閱讀背面之注意事項再填寫本頁) )間之縮合物(1 ’ 1 ’ 3— _(2 ,5 —二甲基—4 — 經基苯基)一 3 -苯基丙烷—1 ,2-萘醌二疊氮一 4 一 石黃酸酯)3 0重量分外’餘以與實施例4同法製備組成物 溶液(S - 5 )並予評估。其結果示於表1。 【表1】 感應放射線性 耐溶劑性 耐熱性 透明性 耐熱變色性 形成圖案最小 曝光量 (mJ/cm2) 膜厚變化率 (%) 膜厚變化率 (%) 400-800nm 之 最低透過率 (%) 400-800nm 之 最低透過率 (%) 實施例1 100 +2.5 -2.0 94 91 實施例2 90 +3.0 -3.0 93 90 實施例3 60 +3.5 -3.5 89 87 實施例4 50 +4.5 -4.0 88 86 實施例5 75 +4.0 -3.5 92 90 經濟部智慧財產笱員工消費合作社印製 發明的功效 本發明之感應放射性樹脂組成物,係可得高感應放射 線性,可容易形成耐溶劑性、透明性及耐熱性優越的圖案 狀薄膜。 又,本發明之層間絕緣膜係較適合用作設於T F T型 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -35- 527394 A7 B7 五、發明説明(33) 液晶顯示元件或積體電路元件之層間絕緣膜。 再者,本發明之顯微鏡頭係較合適用作晶片上濾色片 之結影光學系或光纖連結晶之光學系材料。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智逄时4^資工消費合作社印糾 义度適用中國國家標準(CNS ) A4規格(210X297公釐) -36-527394 A7 __ B7 V. Description of the invention (i) The technical field to which the invention belongs The present invention relates to an induction radiation resin composition, in particular, to the manufacture of an interlayer insulating film or a micro head suitable for lithography. Positive type induction radiation resin composition. Furthermore, the present invention relates to a method for manufacturing an interlayer insulating film and a developing lens using the above-mentioned induction radiation composition. Furthermore, the present invention relates to an interlayer insulating film and a microscope lens formed of the above-mentioned induction radiation composition. Conventional technology is generally used in thin-film transistors (hereinafter referred to as "TFT" type liquid crystal display elements or magnetic head elements, integrated circuit elements, solid-state imaging elements, and other electronic components to insulate wirings that have been arranged in layers. An interlayer insulating film is provided. As for the material for forming the interlayer insulating film, the characteristic of the interlayer insulating film having a small number of steps and sufficient flatness to obtain the necessary pattern shape is the induction radiation characteristic of the interlayer insulating film. Resin compositions can be widely used. TFT-type liquid crystal display elements are formed on the interlayer insulating film described above to form a transparent electrode mold, and can be manufactured by forming a liquid crystal alignment film thereon. At this time, in The steps of forming a transparent electrode film and the step of forming an alignment film may cause insufficient heat resistance of the interlayer insulating film due to pre-heating. The transparent electrode film is mixed with evapotranspiration from the insulating film to increase the resistance of the transparent electrode mold and make it conductive Reduce or color the interlayer insulation film itself and make it transparent. This paper is sized to the Chinese National Standard (CNS) A4 specification (2 丨 〇'〆29 7 mm) (Please read the notes on the back before filling this page) Ordered by the Ministry of Economic Affairs, 447¾ Printed by Industrial and Consumer Corporation -4- 527394 A7 B7 V. Description of the invention (2) Reduced problems will occur. ( (Please read the precautions on the back before filling in this page.) Also, in the case where the insulating film is less solvent resistant, the electrode formation step after forming the insulating film is an etching solution used for patterning with the electrode. When the organic solvent such as a photoresist stripping solution comes into contact with each other, the insulating film may swell and deform, which may cause obstacles such as peeling from the substrate. On the other hand, as for a facsimile machine, an electronic photocopier, a solid-state imaging device, etc. (Chip color filter) is used for photographic optics or optical connector material of optical system, and the micro lens array with regular arrangement of shadow micro lenses with a lens diameter of 3 ~ 100 mm is used. With. When forming a microscope head or an array of microscope heads, after forming a lens pattern, the pattern is melted and flowed by heat treatment, and the method is used as a lens while maintaining the state, or the melted and flowed lens pattern is made into a mask, and the dry etching is used to make the lens The method of printing the shape of a lens onto a substrate is well known. When forming the aforementioned lens pattern, an induction radiation resin composition having the characteristics of a so-called microscope lens having a desired curvature radius is widely used by users. . This kind of microscope head is printed by the employee ’s consumer cooperative of the Ministry of Economic Affairs. In the formation step, or the peripheral device formation steps such as wiring, it can be heated at high temperature. At this time, if the heat resistance of the material for the microscope lens is not sufficient, the microscope lens may be colored, and the shape of the lens may be deformed, and the function as a microscope lens may not be achieved. In addition, after forming the microscope lens, the electrode and wiring forming steps are performed. When the solvent resistance of the microscope lens material is not sufficient, there is a possibility that the microscope may be caused by an organic solvent such as an etching solution or a photoresist stripping solution. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -5- 527394 A7 _-_ B7 V. Description of the invention (3) Deformation and peeling of the head. (Please read the precautions on the back before filling this page) The lesson to be solved by the invention The present invention was completed based on the above situation, and its purpose is to have high, inductive radiation ', and can easily form heat resistance, resistance Inductive radiation resin composition suitable for forming an interlayer insulating film or a microscope lens with a patterned thin film having excellent solvent properties. Still another object of the present invention is to provide a method for manufacturing an interlayer insulating film and a microscope head using the above-mentioned induction radiation resin composition. Still another object of the present invention is to provide an interlayer insulating film and a microscope lens formed of the above-mentioned induction radiation resin composition. The method adopted to solve the problem is Qilang. ¾ ° ¾ inch—the above-mentioned objects and advantages of the present invention are printed. If the first form of the present invention is adopted, it contains [A] (a 1 ) Unsaturated carboxylic acids and / or unsaturated carboxylic anhydrides' (a 2) unsaturated compounds containing epoxy groups, (a 3) maleimide monomers and (a 4) other olefinic unsaturated compounds Copolymer, and [B] 1,2-quinonediazide compound, the content of the [B] component to the [A] component 100 weight divided into 5 to 100 weight sensitive radiation resin The composition can be achieved. The object and advantages of the present invention are the second aspect, which can be achieved by a method for manufacturing an interlayer insulating film and a microscope head which have adopted the above-mentioned induction radiation composition. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -6-527394 A7 — ___B7_ V. Description of the invention (4) The purpose and advantages of the present invention are the third form and consist of the above-mentioned inductive radiation The interlayer insulating film and microscope formed by the object can be achieved. (Please read the precautions on the back before filling in this page) The following explains the inductive radiation resin composition of the present invention in detail. The induction radiation resin composition of the present invention is characterized by a copolymer [A] and a 1,2-quinonediazide compound [B]. Copolymer "A Ί Copolymer [A] is a compound in which a compound (a 1), a compound (a 2), a compound (a 3), and a compound (a 4) are freely contained in a solvent in the presence of a polymerization initiator. The polymer [A] used in the present invention is based on the intellectual property of the Ministry of Economic Affairs based on the repeating units derived from the compounds (a 1), (a 2), (a 3), and (a 4) ^ Printed by the employee consumer cooperative, it should be 5 to 40% by weight, especially 10 to 30% by weight, which is a constituent unit derived from compound (a 1). This copolymer is a copolymer with less than 5% by weight, It is difficult to dissolve in an alkaline aqueous solution, and on the other hand, the solubility of the copolymer exceeding 40% by weight in the alkaline aqueous solution tends to be too large. As for the compound (a 1), for example, propionic acid, formazan Monocarboxylic acids such as acrylic acid, crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, itaconic acid, maleic acid, methyl fumaric acid; and the like Dicarboxylic anhydride; succinic acid mono- [2- (meth) acryloxyethyl] ester, phthalic acid mono- [2- ) Mono-((methyl) propanthoxyloxy-based) esters of polyvalent carboxylic acids with more than two valences such as propylene ethoxyethyl] esters This paper applies Chinese National Standard (CNS) A4 specifications (21〇 &gt; &lt; 297 mm) 527394 A7 B7 V. Description of the invention (5) (Please read the notes on the back before filling this page) Mono (meth) acrylic acid 6; Monocarboxy polycaprolactone etc. Mono (meth) acrylates of carboxyl and hydroxy polymers. Among these, acrylic acid, methacrylic acid, maleic acid, and the like are preferably used because of their solubility in alkali aqueous solutions and their easy accessibility. These can be used alone or in combination. The copolymer [A] used in the present invention is preferably based on the total of repeating units derived from compounds (a 1), (a 2), (a 3), and (a 4), and preferably contains a derivative derived from compound (a 2). The constituent unit is 10 to 70% by weight, and more preferably 20 to 60% by weight. When the constituent unit is less than 10% by weight, the heat resistance and surface hardness of the protective film or insulating film obtained tends to decrease, and when it exceeds 70% by weight, the storage stability of the copolymer tends to decrease. The compound (a 2) includes, for example, glycidyl acrylate, glycidyl methacrylate, and ^ -ethyl acrylic acid. Glycidyl ester, 2-n-propyl glycidyl acrylate, ^ -n-butyl glycidyl acrylate, 6 '7-epoxyheptyl acrylate, methacrylic acid 6,7-epoxy Heptyl, ^ -ethylheptyl monoethyl acrylate, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether The ethers and the like are based on the copolymerization reactivity and improving the heat resistance and surface hardness of the protective film or insulating film obtained, and are more suitable for use. These can be used alone or in combination. The copolymer [A] used in the present invention is based on the combined paper size of repeating units derived from compounds (a 1), (a2), (a3), and (a4). The Chinese paper standard (CNS) A4 specification ( 210X297 mm) 527394 A7 B7 5. In the description of invention (6), it should be composed of the constituent units derived from compound (a 3) 2 ~ (Please read the notes on the back before filling this page) 50% by weight, It is particularly preferably 5 to 40% by weight. When the constituent unit is less than 2% by weight, heat resistance, chemical resistance, and surface hardness tend to decrease. On the other hand, when it exceeds 50% by weight, the film-forming property of the coating film tends to decrease. Examples of the fluorene imine-based monomer (a 3) include phenylmaleimide, cycloimide maleimide, carbamide maleimide, and N-succinimide Imino-3 -cis-butenediamidoiminobenzoate, N -succinimidinoimino-4 -cisbutenediamidoiminobutyl, N -succinimidino-6-cis Butene difluorene iminohexanoate, N-succinimide imino-3-maleic acid diammonium propionate, N- (9-acridyl) maleimide diimide. These systems can be used alone or in combination of two or more. The copolymer [A] used in the present invention is based on the Ministry of Economic Affairs of the Ministry of Economic Affairs based on repeating units derived from compounds (a 1), (a 2), (a3), and (a4). It is preferable that the amount is from 1 to 50% by weight, more preferably from 1 to 20% by weight, and even more preferably from 3 to 10% by weight. When the constituent unit is less than 1% by weight, the stability of the copolymer [A] tends to decrease. On the other hand, when it exceeds 50% by weight, the copolymer [A] tends to be difficult to dissolve in an alkaline aqueous solution. Examples of the compound (a 4) include methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, second butyl methacrylate, n-butyl methacrylate, methyl Alkyl methacrylates such as second butyl acrylate, third butyl methacrylate, etc .; methacrylic paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) &quot; -9- 527394 Α7 Β7 V. Description of the invention (7) (Please read the notes on the back before filling this page) Alkyl acrylates such as acid esters, isopropyl acrylates; cyclohexyl methacrylate, 2-methyl methacrylate Cyclohexyl ester, tricyclic methacrylate [5.2.1.02 6] Y-8-yl ester (in each technical field, the common name is called dicyclopentenyl methacrylate), dimethacrylate Cyclopentenyloxyethyl, isophorone methacrylate and other cyclic alkyl methacrylates; cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclic acrylate [5 · 2 · 1 · 02'6] decane-8-yl ester (in each technical field Cyclic alkyl esters such as dicyclopentenyl acrylate, dicyclopentenyl ethyl acrylate, isophorone acrylate, etc. are commonly used; phenyl methacrylate, Aromatic methacrylates such as benzyl methacrylate; aryl acrylates such as phenyl acrylate and benzyl acrylate; diethyl maleate, diethyl fumarate, Iran Unsaturated dicarboxylic acid diesters such as diethyl taurate; hydroxyalkyl esters such as 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate; bicyclic [2.2.1] heptyl-2 —Ene, 5-methylbicyclo [2 · 2 · 1] heptyl-1, 2-ene, economically produced per hour, ¾ labor and consumption, itfi printing 5-ethylbicyclo [2 · 2 · 1] heptyl-1 2-ene, 5-hydroxybicyclo [2 · 2 · 1] heptyl-2-ene, 5-carboxybicyclo [2 · 2 · 1] heptyl-2-ene, 5-hydroxymethylbicyclo [2 · 2 · 1] heptyl-2-ene, 5- (2-/-hydroxyethyl) bicyclic [2 · 2 · 1] heptyl-2 dilute, 5-methoxybicyclo [2 · 2 · 1] heptyl One 2-ene, the paper size Use Chinese National Standard (CNS) A4 specification (210 × 297 mm) -10- 527394 A7 B7 V. Description of the invention (8) 5-ethoxybicyclo [2 · 2 · 1] heptyl-2-ene, 5, 6 —Dihydroxybicyclo [2.2.1.1] heptyl-2-ene, (Please read the precautions on the back before filling out this page) 5,6-Dicarboxybicyclo [2 · 2 · 1] heptyl-1— Ene, 5,6-bis (hydroxymethyl) bicyclo [2 · 2 · 1] heptyl-2-ene, 5,6-bis (2 &gt; -hydroxyethyl) bicyclo [2 · 2 · 1] heptyl Mono-2-ene, 5, 6-dimethoxybicyclo [2 · 2 · 1] heptyl-2-ene-5, 6-diethoxybicyclo [2 · 2 · 1] heptyl-2-ene-5 —Hydroxy-5 —methylbicyclo [2 · 2 · 1] heptyl — 2 —dilute, 5 —Hydroxy-5 —ethylbicyclo [2 · 2 · 1] heptyl — 2 —ene, 5 —carboxyl 5 —Methylbicyclo [2 · 2 · 1] heptyl-2-ene, 5-carboxy-5—ethylbicyclo [2 · 2 · 1] heptyl-2-ene, 5-hydroxymethyl-5-methyl Dicyclo [2 · 2 · 1] heptyl-2-ene, 5 -residue 6 —Methylbicyclo [2 · 2 · 1] heptyl-2—Catalyst, 5—Carboxy-6-ethylbicyclo [2 · 2.1.1] Heptyl-1—This paper size applies to Chinese National Standard (CNS) A4 Specifications (210X297 mm) -11-527394 A7 B7 V. Description of the invention (9), (Please read the precautions on the back before filling this page) 5,6-Dicarboxybicyclo [2 · 2. .1] heptyl -2-ene anhydride (Hymic acid anhydride) 5-third butoxycarbonyl bicyclic [2 · 2 · 1] heptyl-2-hexyl, 5-cyclohexyloxycarbonyl bicyclic [2 · 2 · 1] heptyl- 2-ene, 5-phenoxycarbonyl bicyclic [2. · 2 · 1] heptyl-2-ene, 5, 6-bis (third butoxycarbonyl) bicyclic [2.2 2 · 1] heptyl-1 2-ene, 5,6-bis (cyclohexyloxycarbonyl) bicyclo [2 · 2 · 1] heptyl-2-ene and other bicyclic unsaturated compounds; and styrene, o-methylstyrene, m- Monomethylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, acetic acid B Enols, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, and the like. Economy Zou Xicai 4 Employees' Printing ^ Among these, styrene, third butyl methacrylate, dicyclopentenyl methacrylate, p-methoxystyrene, acrylic acid 2-methylcyclohexyl ester, 1,3-butadiene, bicyclo [2 · 2 · 1] heptyl-2-ene, etc. are more suitable from the point of copolymerization reactivity and solubility in alkali aqueous solution. . These systems can be used alone or in combination. The copolymer [A] used in the present invention is a polystyrene-equivalent weight average molecular weight (hereinafter referred to as "Mw"), which is usually in the range of 2X103 ~ lx. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). ) -12- 527394 A7 B7 V. Description of the invention (10) (Please read the notes on the back before filling in this page) 1 〇5, preferably 5X1 ο 3 ~ 5xl 04 is better. If the Mw is less than 2 × 103, the developability and residual film rate of the obtained film will be reduced, and the pattern shape and heat resistance will be inferior. On the other hand, if it exceeds 1 x 105, the sensitivity will decrease. There are also cases where the pattern shape is inferior. As described above, the copolymer [a] used in the present invention 'has a carboxyl group and / or a carboxylic anhydride group and an epoxy group' and has an appropriate solubility in an alkaline aqueous solution, and even when a special hardener is not used, It can be easily hardened by heating. The inductive radiation resin composition containing the above-mentioned copolymer [A] can be easily formed into a predetermined pattern shape during development without the development residue and without film slip. Intellectual property of the Ministry of Economy ¾ Solvents used by employees' consumer cooperatives to produce copolymers [A]. Specific examples include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; ethylene glycol monomethyl ether, ethyl acetate Glycol ethers such as glycol monoethyl ether; ethylene glycol alkyl ether ethyls such as methoxyethanol ethyl ester, ethoxyethanol ethyl acetate; diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, two Diethylene glycols such as ethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether; propylene glycol monoalkyl ethers such as propylene glycol propyl ether and propylene glycol butyl ether; propylene glycol methyl ether ethyl ester Propylene glycol alkyl ether ethyls such as propylene glycol ethyl ether, propylene glycol propyl ether ethyl, propylene glycol butyl ether ethyl; propylene glycol methyl ether propyl, propylene glycol ether propyl, propylene glycol propyl ether propyl, propylene glycol butyl ether propyl, etc. Propylene glycol alkyl ether ethyls; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ether, cyclohexanone, 4-hydroxy-4 4-methyl-2 2-pentanone and other ketones; and methyl acetate, acetic acid Ethyl acetate, propyl acetate, butyl acetate, this paper is suitable for China National Standard ^ CNS) A4 specification (210X297 mm) &quot; -13- 527394 A7 • ___ B7 V. Description of the invention (1 彳) (Please read the notes on the back before filling this page) 2 —Ethyl hydroxypropionate , 2-hydroxy- 2-methyl propionate, 2-hydroxy- 2- methyl propionate, methyl glycolate, ethyl glycolate, butyl glycolate, methyl lactate, ethyl lactate, Propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, 3-hydroxy-3 -methyl butyl Methyl ester, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, ethoxyacetate Ethyl acetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, ethyl propoxyacetate, propyl propoxyacetate, butyl propoxyacetate, methyl butoxyacetate Esters, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2- Propoxypropionate, 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, 2-ethoxypropionate, 2-ethyl Butyl oxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, methyl 2-butoxypropionate, ethyl 3-methoxypropionate, 3-methyl Propyl oxypropionate, Butyl 3-methoxypropionate, Methyl 3-ethoxypropionate, Ethyl 3-ethoxypropionate, Propyl 3-ethoxypropionate, 3-Ethyl Ethoxy propionate, 3-ethoxy propionate, butyl 3-ethoxy propionate, methyl 3- propoxy propionate, ethyl 3- propoxy propionate, 3- propane Esters such as propyloxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, propyl 3-butoxypropionate, butyl 3-butoxypropionate, etc. . As for the polymerization initiator used in the production of the copolymer [A], those known to be used as radical polymerization initiators can be generally used, for example: 2. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297) (Mm) -14- 527394 A7 B7 V. Description of the invention (12) (Please read the notes on the back before filling out this page) 2 -Azobisisobutyronitrile, 2,2,1azobisbis— (2, 4-dimethylvaleronitrile), 2, azobis (4-monomethoxy_2,4-'methylvalerium) temple; benzoyl peroxide, lauryl peroxide Organic peroxides, such as tributyl valerate, tert-butyl pervalerate, 1,1,1-bis ((tertiary butyl peroxy)) cyclohexane; and hydrogen peroxide, in the use of peroxide When a substance is used as a radical polymerization initiator, a peroxide may be used together with a reducing agent, and it may also be used as a reducing oxidation type initiator. 1,2-quinonediazide compound [B] As for the 1,2-quinonediazide compound [B] used in the present invention, for example, 1,2-benzoquinonediazide sulfonate, 1 2,2-naphthoquinonediazidesulfonate, 1,2-benzoquinonediazidesulfonamide, and 1,2-naphthoquinonediazidesulfonamide. As for these specific examples, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonate, 2,3,4-trihydroxydiphenyl Ketone-1,2-naphthoquinonediazide-5-sulfonate, 2, Wisdom by the Ministry of Economic Affairs-% 8 printed by Industrial Cooperative Cooperative, 4,6-trihydroxybenzophenone-1,2-naphthoquinonedione 1,2-naphthoquinone of trihydroxybenzophenone, such as azide-4 monosulfonate, 2,4,6-trihydroxybenzophenone-1,2, naphthoquinonediazide-5-sulfonate, etc. Diazide sulfonates; 2, 4, 4, 4 &lt; —tetrahydroxybenzophenone — 1, 2-naphthoquinonediazide — 4 —sulfonate, 2, 4, 4, 4-tetrahydroxybenzophenone — 1, 2 —naphthoquinonediazide — 5 —Sulfonate, 2,3,4, 3 / —tetrahydroxybenzophenone-1,2-naphthoquinonediazide-4 monosulfonate, 2,3,4,3 / _tetrahydroxybenzophenone 1,2—The paper size of naphthoquinone dipyramid is applicable to Chinese National Standard (CNS) A4 (210X297 mm) -15- 527394 A7 B7 V. Description of the invention (13) (Please read the precautions on the back before filling in this Page) Nitrogen-5 —sulfonate, 2,3,4,4 / —tetrahydroxybenzophenone — 1, 2-naphthoquinonediazide — 4-sulfonate, 2,3,4,4> — Tetrahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonate, 2,3,4,2 &gt; -tetrahydroxy-4 / monomethylbenzophenone-1,2-naphthoquinone Diazide-4-sulfonate, 2,3,4,2 ^ -tetrahydroxy-4 / monomethylbenzophenone-1,2-naphthoquinonediazide-5-sulfonate, 2, 3 , 4, 4 / one tetrahydroxy-3 ^ -methoxybenzophenone-1, 2-naphthoquinonediazide-4 monosulfonate, 2,3, 4,4 / one tetrahydroxyl-3 &gt; -methoxybenzophenone-1,2 -naphthoquinonediazide-5 -sulfonate, etc. Azasulfonate; 2,3,4,, 6 / -pentahydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonate, 2,3,4,2 &gt;, 6 /- Pentahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonate 1,1,2-naphthoquinonediazide sulfonate; 2,4,6,3 &gt; , 4 —, 5 &gt; —hexahydroxybenzophenone-1,2 —naphthoquinonediazide-4 monosulfonate, 2,4,6,3 /, 4,5,6-hexahydroxybenzophenone 1,1,2-naphthoquinonediazide-5 sulfonate, 3,4,5,3 /, 4% of employees of the Ministry of Economic Affairs ’s intellectual property printing, 5 / -hexahydroxybenzophenone-1 , 2 -naphthoquinonediazide-4 monosulfonate, 3,4,5,3 /, 4 &gt;, 5 / -hexahydroxybenzophenone-1, 2-naphthoquinonediazide-5 -sulfonate 1,2,4-naphthoquinonediazide sulfonate; bis (2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-4 monosulfonic acid Bis (2,4-dihydroxyphenyl) methane-1,2-naphthoquinonediazide-5-sulfonate, bis (p-hydroxyphenyl) methane-1,2-naphthoquinonediazide-4 Monosulfonic acid esters, double paper sizes are applicable to Chinese National Standards (CNS) A4 specifications (210X297 mm) -16- 527394 A7 B7 V. Description of the invention (14) (P-hydroxyphenyl) methane-1,2-naphthoquinone Diazide-5—sulfonate, tris (p-hydroxyphenyl) methane-1, 2-naphthoquinonediazide-4—sulfonic acid (please read the precautions on the back before filling this page) P-hydroxyphenyl) methane-1,2-naphthoquinonediazide-5-sulfonate, 1,1,1-tris (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide-4 Monosulfonate, 1,1,1, tris (p-hydroxyphenyl) ethane-1,2-naphthoquinonediazide-5-sulfonate, bis (2,3,4-trihydroxyphenyl) Methane-1,2-naphthoquinonediazide-4-sulfonate, bis (2,3,4-trihydroxyphenyl) methane-1,2'-naphthoquinonediazide-5-sulfonate, 2, 2-double (2, 3, 4 — Hydroxyphenyl) propane-1,2-naphthoquinonediazide-4 monosulfonate, 2,2-bis (2,3,4-trihydroxyphenyl) propane-1,2-naphthoquinonediazide A 5-sulfonic acid ester, 1, 1, 3-tris (2, 5-dimethyl-1, 4-hydroxyphenyl), 3-phenylpropane-1, 2-naphthoquinonediazide, 4-propanoic acid Esters, 1,1,3 -— (2,5-dimethyl-4 monohydroxyphenyl) -3-phenylpropane-1,2-naphthoquinonediazide-5—sulfonate, 4,4 &gt; [1— [4 — [1- [4-hydroxyphenyl]-1-methylethyl] phenyl] ethylene] bisphenol-1, 2-naphthalene, Intellectual Property Bureau of the Ministry of Economic Affairs, 8th Industrial Cooperation Printed quinonediazide 4-sulfonate, 4,4>-[1- [4- — [1 — [4-monohydroxyphenyl] -1 monomethylethyl] phenyl] ethylene] Bisacid-1,2-naphthoquinonediazide-5-sulfonate, bis [2,5-dimethyl-1,4-hydroxyphenyl] -2-hydroxyphenylmethane-1,2-naphthalene Azid-4-sulfonate, bis [2,5-Dimethyl-4 monohydroxyphenyl] -2-hydroxyphenylmethyl —1,2 —naphthoquinonediazide-5 —sulfonate, 3,3,3,, 3, tetramethyl-1,1,1 —Spiral basic paper size is applicable to Chinese National Standard (CNS) A4 Specifications (210X297 mm) -17- 527394 A7 B7 V. Description of the invention (15) (Please read the notes on the back before filling in this page) —5,6,7, 1-hexanol, 2-naphthalene Azide 4-sulfonate, 3, 3, 3 /, 3, tetramethyl-1, 1-spiroline-5, 6, 7, 5 ^, 6 ^, 7 / -hexanol-1 , 2-naphthoquinonediazide-5-sulfonate, 2,2,4-trimethyl ~ 7,2 ^, 4 ^ -trihydroxyflavan-1,2-naphthoquinonediazide-4— (Polyhydroxyphenyl) alkanes such as sulfonate, 2,2,4-trimethyl-1,7,4> -trihydroxyflavane-1,2-naphthoquinonediazide-5-sulfonate 1,2-naphthoquinonediazidesulfonate. In addition, the above-exemplified 1,2-naphthoquinonediazidesulfonate esters are changed to amido-bonded 1,2-naphthoquinonediazidesulfonic acid_amines, such as 2, 3, 4 Triphenyl benzophenone-1,2 naphthylpyrene is more suitable than ketamine 4-sulfonyl sulfonamide. These 1,2-quinonediazide compounds can be used alone or in combination of one or more. The use ratio of the [B] component is usually 100 to 50 parts by weight, preferably 100 to 50 parts by weight, based on 100 parts by weight of the [A] component. When the ratio is less than 5 weight points, the amount of acid generated by irradiation with radiation is small, so the difference in solubility of the aqueous alkali solution of the developing solution that becomes the irradiated portion and the unirradiated portion is small, and patterning is desired. Serve difficulties. In addition, the amount of the acid related to the reaction of the epoxy group becomes small, so that sufficient heat resistance and solvent resistance cannot be obtained. On the other hand, if this ratio exceeds 1000 weight-hours, the radiation in a short period of time, because the unreacted [B] component remains in a large amount, the insolubilization effect on the aforementioned alkaline aqueous solution is too high, and this paper scale is applicable China National Standard (CNS) A4 specification (210X297 mm) -18- 527394 A7 _______B7____ 5. Description of the invention (16) becomes difficult to develop. (Please read the precautions on the back before filling this page) <Other ingredients> In addition to the above-mentioned [A] component and [B] component, the induction radiation resin composition of the present invention may contain [ C] Thermosensitive acid generating compound, [D] Polymerizable compound having at least one ethylenically unsaturated double bond, [E] Epoxy resin, [F] Adhesion aid and Surfactant. The above-mentioned [C] thermosensitive acid generating compound is used for improving heat resistance or hardness. As specific examples, antimony fluorides can be cited. As for the commercially available products, there are San Aid SI—L80, San Aid SI—L110, and San Aid SI—L150 (the above are all manufactured by Sanxin Chemical Industry Co., Ltd.) Wait. The use ratio of the component [C] is 100 parts by weight to the copolymer [A], preferably 20 parts by weight or less, and more preferably 5 parts by weight or less. When the ratio exceeds 20% by weight, precipitates may occur, and patterning may become difficult. Printed by the Industrial and Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [D] As for the polymerizable compound having at least one ethylenically unsaturated double bond, for example, monofunctional (meth) propionic acid, difunctional (formaldehyde) Based) acrylate or trifunctional (meth) acrylate. As the monofunctional (meth) acrylate, for example, 2-hydroxyethyl (meth) acrylate, carbitol (meth) acrylate, isobornyl (meth) acrylate, ( Methacrylic acid 3-methoxybutyl ester, 2- (meth) acryloxyethyl-2-hydroxypropylbenzene Paper size applicable to Chinese National Standard (CNS) A4 specification (210X297 mm)- 19- 527394 A7 ____B7_ 5. Description of the invention (17) Diformate and so on. As for these commercially available products, for example, Allonix M-101, M-111, M-114 (manufactured by Toa Kosei Co., Ltd.), KAYARAD TC-1 110S, TC-120S (Japanese Chemicals) (Manufacturing), Biscoat 1 5 8, 2, 3 1 1 (manufactured by Osaka Organic Chemical Industry (manufacturing)), etc. As for the above-mentioned difunctional (meth) acrylate, for example, ethylene glycol (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and 1,9 di (meth) acrylate are mentioned. Monononyl dipropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, diphenoxyethanol manganese alcohol. Diphenoxyethanol bismuth acrylate and the like. As for these commercially available products, for example, Allonix M-2110, M-240, M-6200 (manufactured by Toa Kosei Co., Ltd.), KAYARAD HDDA, HX-220, R-604 (Japanese Pharmaceutical (stock) manufacturing), Biscoat 260, 312, 335HP (Osaka Organic Chemical Industry (stock) manufacturing), etc. Examples of the trifunctional or higher (meth) acrylates include, for example, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, and tri ((meth) acrylic acid) phosphate. Ethyl), pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc. As the commercially available products, for example, Allonix M-309 , M—400, M—40 5, M—450, M—7100, M—8030, M This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before Fill in this page) Order -20- 527394 A7 B7 V. Description of the invention (18) (Please read the notes on the back before filling out this page} —8060 (East Asia Synthetic), KAYARAD TMPTA, DPHA, DPCA- 2 0, DPCA — 3 0, DPCA — 6 0, DPCA — 120 (manufactured by Benwa Chemical Co., Ltd.), Biscoat 2 9 5, 300, 3600 'GPT, 3PA, 400 (manufactured by Osaka Organic Chemical Industry Co., Ltd.) ), Etc. These monofunctional, difunctional or trifunctional The (meth) acrylic acid ester can be used alone or in combination. [D] The ratio of the component to the copolymer [A] is 100 parts by weight, preferably 50 parts by weight or less, and more preferably 30 parts by weight. The following points are obtained. By adding the [D] component at such a ratio, the heat resistance and surface hardness of a protective film or an insulating film obtained by using the inductive radiation resin composition of the present invention can be improved. This ratio exceeds 50 weight In the case of time sharing, the compatibility of the alkali-soluble resin of the copolymer [A] becomes insufficient, and the coating film may be rough during the coating. When the Ministry of Economic Affairs is smart 4. ^: ® (printed by the Industrial and Commercial Cooperatives as above [E] Epoxy resin does not affect compatibility, and it is not limited, but it is preferably bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, ring Aliphatic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin, heterocyclic epoxy resin, resin of (co) polymerized glycidyl methacrylate, etc. Medium, preferably bisphenol A epoxy resin, Phenol-type phenolic lacquer epoxy resin, glycidyl ester-type epoxy resin, etc. The ratio of the component [E] to the copolymer [A] 100 weight points, preferably 30 weight points or less. This paper size applies China National Standard (CNS) A4 specification (210X297 mm) '' -21-527394 A7 B7 V. Description of invention (19) (Please read the notes on the back before filling this page) By including at this rate [ E] The component can improve the heat resistance and surface hardness of a protective film or an insulating film obtained from the inductive radiation resin composition of the present invention. When the ratio exceeds 30% by weight, there is insufficient compatibility with the alkali-soluble resin of the copolymer [A], and sufficient coating film forming ability cannot be obtained. In addition, the copolymer [A] is also called "epoxy resin", but the [E] component is different from the point that it has alkali solubility and the point that a higher molecular weight is required. [F] Surfactant can be used to improve the coating property by the 4th Bureau of the Ministry of Economic Affairs ’Smart Assets (printed by the Industrial and Consumer Cooperatives). As for the commercially available products, for example, BM-100, BM-1 100 (Manufactured by BM CHEMIE), Megafac F 1 4 2 D, F172, F173, F183 (manufactured by Dainippon Ink Chemical Industry Co., Ltd.), Flowlard FC— 135, FC — 170c, FC — 430, FC — 431 (Sumitomo 3M (stock), Surflon S—112, S—113, S—131, S-141, S—145, S-382, SC-101, SC—102, SC-103, SC-104, SC— 105.SC-106 (manufactured by Asahi Glass Co., Ltd.), EFTOPEF 301, 3 0 3, 3 5 2 (manufactured by Shin Akita Chemical Co., Ltd.), SH-28PA, SH-190, SH-193, SZ-6032, SF-8428, DC-57, DC-190 (manufactured by TORAY 3 丨 made by 〇1 ^ (share)) and other fluorine-based and silicone-based surfactants. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -22- 527394 A7 B7 V. Description of invention (20) (Please read the notes on the back before filling this page) Others also have "F" component , Can use polyethylene oxide lauryl ether, polyethylene oxide stearyl ether, polyethylene oxide oleyl ether and other polyethylene oxide alkyl ethers; polyethylene oxide octylphenyl Ethers, polyethylene oxide nonylphenyl ethers, and other polyethylene oxide aryl ethers; polyethylene oxide dilauryl, polyethylene oxide distearate, and other polyethylene oxide dialkyls Non-ionic surfactants such as esters; organosiloxane polymer KP 3 4 1 (manufactured by Shin-Etsu Chemical Co., Ltd.), (meth) acrylic copolymers 1) 〇 ~ ^ .57, 9 5 (manufactured by Gongrong Co., Ltd. Grease Chemical Industry (stock)). These surfactants are preferably used in an amount of 5 parts by weight or less, and more preferably 2 parts by weight or less, with respect to the copolymer [A] at 100 parts by weight. When the amount of the surfactant exceeds 5 parts by weight, a rough coating film may be easily generated during coating. [G] A bonding agent may also be used to improve the adhesion to the substrate. As for such an adjuvant, a functional silane coupling agent is preferably used, and examples thereof include a silane coupling agent having a reactive substituent such as a carboxyl group, a methacryl group, an isocyanate group, and an epoxy group. Specifically, Examples include trimethoxysilylbenzoic acid, r-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, 7-isocyanatepropyltrimethoxysilane Ethoxysilane, 7-glycidoxypropyltrimethoxysilane, / 3- (3,4-monoepoxycyclohexyl) ethyltrimethoxysilane, etc. Such an adjuvant is preferably used in an amount of 100 parts by weight to the copolymer [A], and more preferably 10 parts by weight or less. When the amount of the adjuvant is more than 20% by weight, there may be a case where the development residue is liable to be generated. This paper size applies the Zhongguanjia Standard (CNS) A4 specification (21GX297 public director) -23- 527394 A7 B7 V. Description of the invention (21) (Please read the precautions on the back before filling this page) Induction radiation of the present invention The resin composition can be prepared by uniformly mixing the copolymer [A] and the 1,2-quinonediazide compound [B] with other compounding agents arbitrarily added as described above. The induction radiation resin composition of the present invention is usually dissolved in an appropriate solvent and used in a solution state. For example, by mixing the copolymer [A], 1,2-quinonediazide [B], and other compounding agents arbitrarily added at a specified ratio, an inductive radiation resin composition in a solution state can be prepared. As for the solvent used for preparing the inductive radiation resin composition of the present invention, uniformly dissolving each component of the copolymer [A], 1, 2-quinonediazide compound [B], and other compounding agents that are arbitrarily mixed are used. Those who do not react with each ingredient. Specific examples include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methoxyethanol ethyl ester and ethoxy ethanol Ethyl glycol alkyl ether ethyl esters, etc .; Diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, and other diethylene glycols; propylene glycol propyl ether, propylene glycol butyl ether, and other propylene glycol monoalkyl ethers. ; Propylene glycol methyl ether ethyl ester, propylene glycol ethyl ether ethyl ester, propylene glycol propyl ether ethyl ester, propylene glycol butyl ether ethyl ester and other propylene glycol alkyl ether ethyl esters; propylene glycol methyl ether propyl ester, propylene glycol ether propyl ester, propylene glycol propyl ether propyl ester, Propylene glycol alkyl ether ethyls such as propylene glycol butyl ether propyl; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ketone, cyclohexanone, 4-hydroxyl-4 4-methyl-2 2-pentanone; and Methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-monohydroxypropionate, 2-hydroxy-2-methylpropionate, 2-hydroxy-2-methylpropionate, Methyl Glycolate, Ethyl Glycolate, This paper size applies to Chinese National Standard (CNS) A4 Grid (210X 297mm) -24- 527394 A7 B7 V. Description of the invention (22) (Please read the notes on the back before filling this page) Ministry of Economic Affairs, Intellectual Property, 4 ^ 78 Industrial and Consumer Cooperation, Ti Printing Esters, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, diester 3-hydroxypropionate, butyl 3-hydroxypropionate ' 2-hydroxy-3-methyl methyl butanoate, methyl methoxy acetate, ethyl methoxy acetate, propyl methoxy acetate, butyl methoxy acetate, methyl ethoxy acetate, ethoxy Ethyl acetate, ethyl ethoxy acetate, propyl ethoxy acetate, butyl ethoxy acetate, methyl propoxy acetate, ethyl propoxy acetate, propyl propoxy acetate, propoxy Butyl acetate, methyl butoxy acetate, ethyl butoxy acetate, propyl butoxy acetate, butyl butoxy acetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate Esters, Propyl 2-methoxypropionate, Butyl 2-methoxypropionate, Methyl 2-ethoxypropionate, Ethyl 2-ethoxypropionate, Propyl 2-ethoxypropionate ester, 2-butyl ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, methyl 2-butoxypropionate, ethyl 3-methoxypropionate, 3 ~ methoxypropionate, 3-methoxypropionic acid butyric acid, 3-ethoxypropionic acid methyl ester, 3-ethoxypropionic acid ethyl ester, 3-ethoxypropionic acid propyl ester, 3 -Ethyl ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3 -Propyl propoxy propionate, butyl 3-propoxy propionate, methyl 3-butoxy propionate, propyl 3-butoxy propionate, butyl 3-propoxy propionate, etc. Esters. Among these solvents, it is more suitable to use glycol ethers, glycol alkyl ether ethyl esters, esters, and diethylene glycols because of solubility, reactivity with each component, and ease of coating film formation. . In addition, a high boiling point solvent may be used in combination with the solvent. To this paper size, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied. -25- 527394 A7 __ B7 V. Description of the invention (23) (Please read the precautions on the back before filling this page) Can be used in combination Examples of the high boiling point solvents include: N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylformamide Acetylamine, N-methylpyrrolidone, dimethylasco, benzyl ether, dihexyl ether, acetoacetone, isophorone, hexanoic acid, heptanoic acid, 1-octanol, 1-nonanol , Benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, r-butyrolactone, ethylene carbonate, propylene carbonate, ethyl ethyl ethoxide, and the like. In addition, the composition solution prepared as described above can also be used after filtration using a millimeter filter membrane having a pore size of about 0.2 m. Formation of patterned thin film Next, the method of forming an interlayer insulating film and a microscope lens of the present invention will be described using the inductive radiation resin composition of the present invention. The interlayer insulating film and the microscope lens of the present invention are manufactured by the following steps. (1) A coating film for forming an inductive radiation resin composition on a substrate is printed by the Ministry of Economic Affairs, Intellectual Property, and printed by an employee consumer cooperative. (2) Radiation is irradiated onto at least a part of the formed coating film, followed by development processing. step. (3) If necessary, after the radiation is irradiated, the post-baking step is performed. In the above step (1), as for the method of forming the coating film of the induction radiation resin composition, an appropriate method can be used, but for example, the induction The solution of the radiation resin composition is coated on the surface of the substrate. The paper size is pre-baking. The Chinese standard (CNS) A4 specification (210X297 mm) is applied. -26- 527394 A7 B7 V. Description of the invention (24) (please first (Please read the notes on the back and fill in this page) Bake 'can be made by removing the solvent. The coating method of the composition solution is not particularly limited, and various methods such as a spray method, a roll coating method, a spin coating method, and a bar coating method can be used. As for the pre-baking conditions, although the use ratio varies depending on the type of each component, it is usually about 60 to 1 10 ° C for 30 seconds to 15 minutes. As for the radiation used in the above step (2), for example, ultraviolet rays such as g-rays (wavelength 4 3 6 nm) and i-rays (wavelength 3 65 nm), and far-ultraviolet rays such as K r F excimer lasers are synchronized. X-rays such as accelerator radiation and electron beams such as electron beams, among which g-rays and i-rays are preferred. When the radiation is irradiated to at least a part of the coating film, it may be performed through a designated pattern mask if necessary. In the development process, a desired pattern can be formed by removing the irradiated portion by using a developer as described below. The Ministry of Economic Affairs ’s smart cooperation with 4- ^ s industry is to print the developer used in the development process. Sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, and Propylamine, diethylamine, diethylaminoethanol, di-n-propylamine, triethylamine, methylmonoethylamine, monomethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethyl aerobic oxidation Base gas, rogue, /, ammonia, hydrazine, 1 '8 —— azepine bicyclic [5 · 4 · 0] — 7 — eleven, 1, 5-diazabicyclo [4 · 3 · 0] a 5-Ren Yuan et al. In the above-mentioned alkaline aqueous solution, an aqueous solution in which a water-soluble organic solvent such as methanol or ethanol or a surfactant is appropriately added or various organic solvents in which the composition of the present invention is dissolved can be used as a developing solution. This paper size applies to China National Standard (CNS) A4 (210X297 mm) -27- 527394 A7 B7 Ministry of Economic Affairs 4 ^ 7 employee consumption cooperation seals V. Description of invention (25) Furthermore, at least the development method , Can use the full liquid method, dipping method, shaking dipping method and so on. (3) Furthermore, if necessary, after the development process, the pre-patterned film is subjected to, for example, a rinsing treatment using flowing water rinsing, and then each of the films is subjected to full irradiation with radiation such as a high-pressure mercury lamp. After the decomposition treatment of the remaining 1,2-quinonediazide compound, the film is calcined by a heating device such as a hot plate or an oven, and a curing treatment is performed for each of the films. The calcination temperature at this hardening process is, for example, 150 to 250 ° C, and the calcination time is, for example, 5 to 90 minutes (for calcination on a hot plate, for 5 to 30 minutes, and for oven calcination) 3 0 ~ 9 0 minutes) 0 In this way, an interlayer insulating film or a good patterned thin film (hardened film) of the microscope lens can be formed on the surface of the substrate. The pre-formed interlayer insulating film or microscope lens has high transparency, and the minimum transmittance of light in the wavelength range of 400 to 800 nm at a wavelength of 1.0 μm can be set to Above 80, more than 85%, especially above 90%. The above-mentioned formed interlayer insulating film and microscope lens will be apparent from the examples described later. In addition to transparency, they are superior in terms of heat resistance and solvent resistance. Examples Synthesis examples and examples are shown below. Although the present invention can be described more specifically, the present invention is not limited to the following examples. (Please read the precautions on the back before filling this page) i # Order-AW ·. This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X29 * 7 mm) -28- 527394 A7 B7 V. Description of the invention ( 26) (Please read the precautions on the back before filling this page) Example Synthesis Example 1 In a flask with a condenser and a stirrer, feed 2, 2 &gt; -Azobis (2,4 -dimethylpentyl) Nitrile 7 8 parts by weight, diethylene glycol ethyl methyl ether 2 20 parts by weight. Then 20 parts by weight of styrene, 20 parts by weight of methacrylic acid, and 40 parts by weight of glycidyl methacrylate are fed. And 20% by weight of phenylcis-butenedifluorene imide. After being replaced with nitrogen, stirring was started slowly. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 5 hours to obtain a copolymer containing [A-1] Polymer solution. The solid content concentration of the obtained polymer solution was 30.6% by weight. Synthesis Example 2 4% of the employees of the Ministry of Economic Affairs ’s consumer consumption seal ^ In a flask with a condenser and a stirrer, feed it 2,2 &gt;-8 parts by weight of azobis (2,4-dimethylvaleronitrile), diethylene glycol ethylmethyl 2 2 0 parts by weight. Next, 10 parts by weight of styrene, methyl propylene. 20 parts by weight of enoic acid, 40 parts by weight of glycidyl methacrylate, and 20 parts of dicyclopentenyl methacrylate. After being replaced by nitrogen, the weight fraction and the weight fraction of phenylcis butylene diimide were gradually stirred. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 5 hours to obtain a copolymer containing [A-2] Polymer solution. The solid content concentration of the obtained polymer solution was 3 1.0% by weight. Synthesis Example 3 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -29- 527394 A7 B7 V. Description of the invention (27) (Please read the precautions on the back before filling this page) In a flask with a condenser and a stirrer, feed 2,2 &gt; -Azobis (2,4-dimethylvaleronitrile) 8 weight points, and diethylene glycol ethyl methyl ether 220 weight points. Next, 10 weight points of styrene, 20 weight points of methacrylic acid, and 30 weight points of glycidyl methacrylate were fed. -15 parts by weight of vinyl benzyl glycidyl ether, 15 parts by weight of dicyclopentenyl methacrylate The amount and 10% by weight of phenylcis butylene diimide were replaced by nitrogen, and then slowly stirred. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 5 hours to obtain a copolymer containing [A- 1] polymer solution. The solid content concentration of the obtained polymer solution was 3 1.0% by weight. Synthesis Example 4 ¾. Qilang Jieda materials € 9a (printed by labor union, with a condenser, The flask of the blender was fed with 2,2 &gt;-azobis (2,4-dimethylvaleronitrile) 8 parts by weight and diethylene glycol ethyl methyl ether 2 20 parts by weight. Then, 10 wt% of styrene, 20 wt% of methacrylic acid, 40 wt% of glycidyl methacrylate, 15 wt% of dicyclopentenyl methacrylate, and phenyl maleic acid were fed. The imine was 10 parts by weight. After being replaced with nitrogen, stirring was started slowly. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer [A-1]. The solid content concentration of the obtained polymer solution was 3 1 · 2% by weight. Example 1 [Preparation of Inductive Radiation Resin Composition] The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -30- 527394 A7 B7 V. Description of the invention (28) Mixing with Synthesis Example 1 The obtained polymer solution (equivalent to 100 parts by weight of the copolymer [A-1]) and the component [B] of 2,3,4,4 / -tetrahydroxybenzophenone-1,2-naphthoquinonediazide-1 4 monosulfonic acid ester 30% by weight, dissolved in ethylene glycol ethyl methyl ether to a solid content concentration of 30% by weight, and then filtered through a pore filter membrane having a pore size of 0 · 2 // m to prepare induction radiation Solution (S-1) of the resin composition. [Evaluation of Inductive Radiation Resin Composition] The above composition (S-1) was evaluated for inductive radiation, and the patterned film formed by (S-1) was solvent-resistant, heat-resistant, and transparent. Evaluation of heat resistance and heat discoloration. [Evaluation of Inductive Radiation] Using a spin coater on a silicon substrate, apply the above composition (S-1) and pre-bake it on a hot plate at 90 ° C for 2 minutes to form a coating with a film thickness of 3.0 membrane. A specified amount of ultraviolet light was irradiated with a mercury lamp through a patterned mask having a pattern having a width of 3 on the obtained coating film. Next, a developing solution composed of a tetramethylammonium hydroxide 0.4% by weight aqueous solution was subjected to a development treatment at 25 ° C for 90 seconds, and then rinsed with ultrapure water for 1 minute. At this time, '' is determined as the minimum amount of ultraviolet radiation required to completely dissolve a pattern with a width of 3 // m in the developing solution (hereinafter referred to as "the minimum exposure amount for forming a pattern"). The results are shown in Table 1. When the minimum exposure amount for pattern formation is less than 80mj / crri, the system is evaluated as excellent, 80 ~ 100mJ / this paper size is suitable for the standard (CNS) A4 specification (21〇 &gt; &lt; 297g ¥ 1 ^ -31-(Please read the precautions on the back before filling in this page) Contract · 527394 A7 B7 V. Description of the invention (29) c m2, the induced radiation linearity is evaluated as good, at more than 1 〇〇mj / crri, the induction radiation system was evaluated as poor. (Please read the precautions on the back before filling in this page) [Evaluation of Solvent Resistance]. Apply the above composition (S-1) on a silicon substrate using a spin coater, and then apply it to a hot plate at 90 ° C. Pre-bake for 2 minutes and form a coating film with a film thickness of 3.0 // m. The resulting coating film was irradiated with ultraviolet rays by a mercury lamp until the total exposure amount was 300 m J / c m2. Then, the silicon substrate was calcined in a clean oven at 220 ° C for 1 hour to perform coating film formation. When the film thickness (T 1) of the obtained cured film was measured for curing treatment, it was 2 · 5 # m. Therefore, the preformed silicon substrate was immersed in a dimethyl sulfite millet whose temperature was controlled at 70 ° C, and then the film thickness (t1) of each of the cured films was measured to calculate the cause of the impregnation. The change rate of film thickness is {(tl- 一 丁 1) / T 1} X 1 0 0 [%]. When the absolute value is less than 5%, the solvent resistance is excellent. When it is 5 to 10%, the solvent resistance is good. When it exceeds 10%, the solvent resistance is poor. Shown in Table 1. [Evaluation of Heat Resistance] A cured film was formed in the same manner as the above-mentioned evaluation of the solvent resistance. When the film thickness (T2) of the obtained cured film was measured, it was 2 · 5 // m. After an additional 1 hour baking in a clean oven at 240 ° C, the film thickness (t 2) of each cured film was measured to calculate the film thickness change rate caused by the additional baking 丨 (t2 — ding2) / T2} xl00 [%]. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -32- 527394 A7 _B7__ V. Description of the invention (30) When the absolute value of this is less than 5%, the heat resistance can be said to be excellent. ~ (Please read the precautions on the back before filling in this page) When 10%, the heat resistance is good, and when it exceeds 10%, the heat resistance is poor. The results are not in Table 1. [Evaluation of transparency] Using a glass substrate "Corning 7059 (Corning)" and the thickness of the coating film after pre-baking is 1 · 2 // m, the rest is the same as the above-mentioned evaluation of solvent resistance, A hardened film with a film thickness of 1.0 m was formed on the glass substrate. The light transmittance of the glass substrate having this cured film was measured using a spectrophotometer "type 150-200 double beam (manufactured by Hitachi)" in a wavelength range of 400 to 800 nm. At this time, the cell on the reference side is the same type of glass as that used as the substrate ^ Corning 7059 ". At this time, the minimum transmittance is more than 90%, the transparency can be said to be excellent, and when the minimum transmittance is more than 85% to less than 90%, the transparency can be said to be excellent, more than 80% and less than 85%. In this case, the transparency is considered to be good, and when it is less than 80%, the transparency is considered to be poor. The results are shown in Table 1. Printed by the Intellectual Property of the Ministry of Economic Affairs ^ Consumer Cooperatives [Evaluation of heat resistance and discoloration resistance] The same method as the above evaluation of transparency is used to form a hardened film on a glass substrate. Next, the cured film substrate was baked in a decanter oven for an additional hour at 240 ° C. The light transmittance of the glass substrate with this cured film after additional baking was measured using a spectrophotometer "150-200 double beam (manufactured by Hitachi)" in a wavelength range of 400 to 800 nm. At this time, the reference side of the cell is the same type of glass paper size used by the user who installs it as the substrate. The Chinese national standard (CNS) A4 specification (210X297 mm) -33- 527394 A7 B7 V. Description of the invention (31) (Please (Please read the notes on the back before filling out this page) Glass "Corning 7059". When the minimum transmittance at this time is 90% or more, the heat discoloration resistance can be said to be excellent. When it is 8 5 or more and less than 90%, the heat resistance can be said to be excellent, when 80 or more is less than 85%. The heat discoloration can be said to be poor. The results are shown in Table 1. Example 2 A polymer solution containing the copolymer [A-2] was used in place of the copolymer solution containing the * copolymer [A-1], and a composition solution was prepared in the same manner as in Example 1 and evaluated. . The results are shown in Table 1. Example 3 A polymer solution containing the copolymer [A-3] was used instead of the polymer solution containing the copolymer [A-1] in Example 1, and a composition solution (S -3) and evaluate. The results are shown in Table 1. Example 4 Printed by the Ministry of Economic Affairs,% of smart hourly production, consumed by a consumer cooperative, except that the polymer solution containing the copolymer [A-1] was used instead of the polymer solution containing the copolymer [A-1] in Example 1, In Example 1, a composition solution (S-4) was prepared and evaluated in the same manner. The results are shown in Table 1. Example 5 In addition to the use of component [B] -1 of Example 4, [, 3 one three (2 this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -34- 527394 A7 B7 V. Description of the Invention (32), 5-Dimethyl-4 monohydroxyphenyl-3-phenyl) propane (1 mole) and 1,2-naphthoquinone-nitrogen-5-sulfonic acid chloride (1 · g Mol (please read the notes on the back before filling this page)) condensate (1 '1' 3— _ (2,5 —dimethyl-4 — phenylphenyl)-3 -phenylpropane -1, 2-naphthoquinonediazide-4 mono-Luteronate) 30% by weight. The composition solution (S-5) was prepared and evaluated in the same manner as in Example 4. The results are shown in Table 1. [Table 1] Induced radiation, solvent resistance, heat resistance, transparency, heat discoloration resistance, minimum pattern exposure (mJ / cm2), film thickness change rate (%), film thickness change rate (%), minimum transmittance of 400-800nm (% ) 400-800nm minimum transmittance (%) Example 1 100 +2.5 -2.0 94 91 Example 2 90 +3.0 -3.0 93 90 Example 3 60 +3.5 -3.5 89 87 Example 4 50 +4.5 -4.0 88 86 Example 5 75 +4.0 -3.5 92 90 Efficacy of the invention printed by the Intellectual Property of the Ministry of Economic Affairs / Employee Consumer Cooperatives The induction radioactive resin composition of the present invention can obtain high induction radiation and can easily form solvent resistance and transparency And pattern film with excellent heat resistance. In addition, the interlayer insulating film of the present invention is more suitable for use in a TFT type. This paper is sized for the Chinese National Standard (CNS) A4 (210X297 mm) -35- 527394 A7 B7. 5. Description of the invention (33) Liquid crystal display element Or interlayer insulation film of integrated circuit components. Furthermore, the microscope lens of the present invention is more suitable for use as an optical material for a concatenation optical system or an optical fiber connected crystal of a color filter on a wafer. (Please read the precautions on the back before filling out this page) The Ministry of Economic Affairs, the Ministry of Economic Affairs, 4 ^ Industrial and Industrial Consumer Cooperatives, the correctness of the seal applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -36-

Claims (1)

527394527394 A8 B8 C8 D8 六、申請專利範圍 1 . 一種用於層間絕緣膜及顯微鏡頭之感應放射線性 樹脂組成物,其特徵在於含有〔a〕 ( a 1 )不飽和羧酸 (請先閲讀背面之注意事項再填寫本頁) 及/或不飽和羧酸酐’ (a 2)含有環氧基之不飽和化合 物,(a 3 )順丁烯二醯亞胺系單體及(a 4 )其他烯烴 系不飽和化合物之共聚物,與 〔B〕1 ,2 -醌二疊氮化合物,〔B〕成分之含有量對 〔A〕成分1 0 0重量分爲5〜1 0 0重量分。 2 .如申請專利範圍第1項之感應放射線性樹脂組成 物,係於共聚物〔A〕中含有由〔a 3〕成分衍生的構成 單位2〜5 0重量%。 3 . —種層間絕緣膜之製造方法,其特徵在於含有下 述步驟: (1 )於基板上形成申請專利範圍第1項或第2項之組成 物的塗膜之步驟, (2 )於經予形成的塗膜之至少一部分上照射放射線,接 著進行顯影處理之步驟。 4 . 一種顯微鏡頭之製造方法,其特徵在於含有下述 步驟: (1 )於基板上形成申請專利範圍第1項或第2項之組成 物的塗膜之步驟, (2 )於經予形成的塗膜之至少一部分上照射放射線,接 著進行顯影處理之步驟。 5 . —種層間絕緣膜,係由申請專利範圍第1項或第 2項之感應放射線性樹脂組成物所形成的。 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) 527394 A8 B8 C8 D8 7T、申請專利乾圍 6 .如申請專利範圍第5項之層間絕緣膜,係波長領 域4 0 0〜8 0 0 n m之光線的最低透過率在8 0 %以上 〇 7 . —種顯微鏡頭,係由申請專利範圍第1項或第2 項之感應放射線性樹脂組成物所形成的。. f (請先閱讀背面之注意事項再填寫本頁) 訂 f 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -38-A8 B8 C8 D8 6. Scope of patent application 1. An inductive radiation resin composition for interlayer insulation film and microscope lens, which is characterized by containing [a] (a 1) unsaturated carboxylic acid (please read the note on the back first) Please fill in this page again) and / or unsaturated carboxylic anhydrides' (a 2) unsaturated compounds containing epoxy groups, (a 3) maleimide monomers and (a 4) other olefinic compounds The content of the copolymer of a saturated compound with [B] 1,2-quinonediazide compound, and the content of the component [B] is 5 to 100 parts by weight based on 100 parts of the component [A]. 2. The inductive radiation resin composition according to item 1 of the scope of patent application, wherein the copolymer [A] contains a constituent unit derived from the component [a 3] of 2 to 50% by weight. 3. — A method for manufacturing an interlayer insulating film, which is characterized by containing the following steps: (1) a step of forming a coating film of a composition for which the scope of patent application item 1 or 2 is applied on a substrate, (2) At least a part of the pre-formed coating film is irradiated with radiation, followed by a step of developing treatment. 4. A method for manufacturing a microscope head, characterized by comprising the following steps: (1) a step of forming a coating film of the composition of the scope of the first or second patent application on a substrate, (2) forming At least a part of the coating film is irradiated with radiation, followed by a step of developing treatment. 5. — A kind of interlayer insulation film is formed by the induction radiation resin composition of the first or second patent application scope. This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm) 527394 A8 B8 C8 D8 7T, applied for patent application 6. If the interlayer insulation film of item 5 of the patent application is applied, it is in the wavelength field 4 0 0 The minimum transmittance of light to ~ 800 nm is more than 80%. 07. A microscope head is formed by the inductive radiation resin composition of the first or second patent application. f (Please read the precautions on the back before filling out this page) Order f This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -38-
TW090112109A 2000-06-12 2001-05-21 Radiation sensitive resin composition used in interlaminar insulation film and microlens, manufacture method for interlaminar insulation film and microlens, and interlaminar insulation film and microlens TW527394B (en)

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