TW556231B - Method for making anisotropic conductive board - Google Patents

Abstract

A method for making anisotropic conductive board is disclosed. A thick photoresist (thickness between 25-250 mum) is formed on a substrate with dense metal pins. After exposure, the substrate is pressed so that the metal pins are changed into electrodes bonding in thick photoresist. The electrodes electrically connect upper surface and lower surface of thick photoresist for electrical contact of anisotropic conduction.

Description

556231 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a method for forming a circuit substrate, and particularly relates to a method for forming an anisotropic conductive plate. [Prior art] The conventional circuit board is a printed circuit board [Printed hfeuit BQard, PCb], which is a kind of glass fiber cloth impregnated with resin, and the upper and lower surfaces are set with laser drills. Hole and then electricity

Qian method forms a metal electric key layer at the hole to achieve electrical conduction. However, the electroplating method is comprehensive, so if the metal electric key layer does not undergo an etching step, its electrical connection system cannot have a single directionality. Anisotropic Conductive Film (ACF) is a kind of adhesive film with directional electrical conduction, suitable for the connection and adhesion of electronic components, such as US Patent 6,3 4 4, 丨 5 No. 6 "ANISOTROPIC CONDUCTIVE ADHESIVE FILM" reveals an anisotropic conductive adhesive film, suitable for tape carrier package (Tape Carrier Package, TCP) or 1C chip combined with liquid crystal display panel [LCd

Pane 1], the anisotropic conductive adhesive film is an electrically insulating resin. The resin contains conductive particles. In order to achieve vertical electrical conduction, the particles of the conductive particles must be uniform and the distribution density must be uniform. At the same time, the electronic components It should have a protruding electrode to be immersed in the anisotropic conductive adhesive film. When the distance between the protruding electrode and the external circuit board is close to or smaller than the diameter of the conductive particles, an anisotropic electrical conduction can be achieved. Therefore, The conventional anisotropic conductive adhesive film is used to fix and bond electronic components and external circuit boards. 'Not suitable as a test device and device under test [Deviee Unde: r "

556231 V. Description of the invention (2)

Test, DUT] Temporary spacer [Objective and Summary of the Invention] The main object of the present invention is to provide a method for opening a substrate with dense metal pins: forming an electrical board and pressing the metal pins Make the metal pin become a thunder; ^ = form a thick photoresistor, an electrode on the lower surface for the anisotropic conductivity to conduct the thick photoresist on the substrate with the metal pin on the formation of the anisotropic conductive plate according to the present invention These metal needles are firstly provided by the dense eight series, and their distribution density is between ~ ⑽_-2. The metal set is arranged on the substrate '〇5 ~ M ,, m ,,, ^, adjacent to the rabbit needles. Interval tied

(Liyang system is opened) into a peelable layer. After that, a negative I 仏 250 "is formed on the substrate. After exposure, the substrate is pressed to the thickness of the substrate first, and its thickness ^ is densely combined with the thick light. The resistive electrode, which is a decisive cross-section, is-anisotropic conductive ... The thick photoresist is formed for the different connection. It is a conductive contact, which can be used as a temporary connection between the test equipment and the device under test. [Detailed description of the invention of anisotropic conductivity] Please refer to the attached drawings. The present invention will list the following embodiments: According to a specific embodiment of the present invention, as shown in FIG. A method for forming a conductive plate is to provide a substrate 20, such as a metal or a ceramic. A plurality of metal pins 21 are formed on one surface of the substrate 20, such as gold or the like = a ductile metal or an alloy thereof. These metal pins 2丨 It is prepared by using Micro Electro Mechanical System (MEMS), so that it is densely arranged on the substrate 20, and the adjacent space between the metal pins 2 丨 is at

Page 6 556231 V. Description of the invention (3) 0 · 5 ~ 30 // m, its distribution density is between 103 ~ 10-8__2, preferably, a peelable is formed on the bottom surface of the metal needle 21 The removable layer 22, such as a photoresist, makes the metal pins 21 easily detach from the substrate 20. In this embodiment, the metal pins 21 are conical or cylindrical. As shown in FIG. 2, on the same surface of the substrate 20 having the metal pins 21, a thick photoresist 10 is formed, such as spin coating, printlng, or spraying. The thickness is _ 2Γ-25 25 V: the thickness of the known photoresist is 0.5 ~ 10,], the thickness of the thick photoresist is 5 negative, and the photoresist contains a high-dielectric constant polymer compound [such as polyimide Laminamine, cage ^ J Baoding, Gou. Butene or its dagger] and photo-sensitive substances, MICR0 = two = a kind of thick photoresistor suitable for the present invention, its model is SU-8 2000 series, The thick photoresist 10 is formed after baking and exposure, a layer of adhesive film having an upper surface H and a lower surface 12. Then, as shown in FIG. 3 of V, the substrate 20 ′ having a thickness of 10 formed with the thick photoresist is laminated, and the thick photoresist is pressed against the substrate 20 with the -compression head 32 on the -plane stage 31. The metal pins 21 of the substrate 20 are passed through the thick photoresistor 10 and under the pressing action, the metal pins 21 are changed in shape to form a plurality of electrodes 40 ′ per electrode that are densely combined with the thick photoresistor 10. The 40 series has an end surface 41 exposed on the upper surface 11 of the thick photoresist and an end surface 42 exposed on the lower surface 12 of the thick photoresist. Therefore, the electrodes 40 are the upper surface of the vertical electrical on-resistance 10 U and the lower surface 12 are individually established, and adjacent electrodes 40 have no electrical connection. After that, the peelable layer 22 is removed, and the plate 20 is separated from the thick photoresist Π. At this time, the electrode 4 ( ) Of ^

πβ 556231 5. Description of the invention (4) An anisotropic conductive board 1 is formed [as shown in FIG. 4]. In this embodiment, the anisotropic conductive board 1 includes a thick photoresist 10 and a plurality of densely arranged and vertically conductive electrodes 40, so it has the effect of anisotropic electrical contact [ie, vertical and vertical electrical connection].

Therefore, the method for forming the anisotropic conductive plate provided by the present invention can efficiently manufacture the anisotropic conductive plate. The method of pressing the metal pin 21 to the thick photoresistor 10 can ensure that the formed electrodes 40 are individually established, and They will not be connected to each other to achieve anisotropic conductivity for temporary electrical connection in a fixed direction. As shown in Figure 5, the anisotropic conductive plate 1 is placed between a probe card of a test device and a semiconductor wafer 60 to be tested to avoid contamination of the probe card. When conducting electrical test, burn-in test or burn-in & electrical parallel test,

The probe 50 of the probe card is in contact with the anisotropic conductive plate 1 and is electrically connected to the electrode 61 (such as a bump or a pad) of the wafer 60 through the electrode 40 of the anisotropic conductive plate 1 to eliminate The contamination is caused by the probe 50 directly contacting the electrode 6 of the wafer 60. Since the electrodes 40 are densely and individually combined with the thick photoresistor 10, any placement can be To achieve the anisotropic conductive electrical contact, there is no need to go through the alignment operation. As shown in Figure 6a, when one of the electrodes 61 of the wafer 60 is electrically connected to the test device 2 through the plurality of electrodes 40a Even if the movement or expansion and contraction of the anisotropic conductive plate! Occurs, as shown in the figure, the other electrodes 40b can still be electrically connected with an electrical short circuit or an electrical contact failure problem.

556231 V. Description of the invention (5) Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application. Any person skilled in the art will make any changes and modifications without departing from the spirit and scope of the present invention. Modifications belong to the protection scope of the present invention.

Page 9 556231 Brief description of the drawing 1 Figure: The method of forming an anisotropic conductive plate according to the present invention, the cross section of the substrate provided is βΐ, Figure 2 • The figure of the anisotropic conductive plate according to the present invention Forming method J Cross-sectional view of a substrate with a thick photoresist. Figure 3 • Cross-sectional view of a substrate in a laminated state according to the method of forming an anisotropic conductive plate according to the present invention, FIG. 4 Forming method of the conductive conductive plate 5 Sectional schematic diagram of the anisotropic conductive plate formed, FIG. 5 • Method of forming the anisotropic conductive plate according to the present invention 5 The formed anisotropic conductive plate is placed on a semiconductor test δ Partial cross-sectional schematic diagrams and Figures 6a to 6b are prepared ... According to Zhao # η, the method of forming the anisotropic conductive plate of the present invention Schematic diagram of the corresponding positions of the electrodes of the anisotropic conductive plate and the electrodes of the wafer under test under different placement conditions. [Illustration of the drawing number] 1 Anisotropic conductive plate 10 Thick photoresist 11 Upper surface 12 Lower surface 20 Substrate 21 Metal needle 22 peelable layer 31 stage 32 compression head 40 electrode 40 a electrode 40 b electrode 41 upper end face 42 lower end face 50 probe 60 semiconductor wafer 61 electrode j iktl

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Claims (1)

556231, patent application scope [application patent scope] 1. A method for forming anisotropic conductive board, comprising: providing a substrate with a plurality of metal pins formed on one surface thereof; forming a thick photoresist On the substrate, wherein the thickness of the thick photoresist is 25-250 β \ 250; ^ 91 Pressing the far substrate so that the metal pins are bonded to the thick photoresist and electrically conducting the upper and lower surfaces of the thick photoresist to become electrodes of the thick photoresist; and removing the substrate so that the A thick photoresist with conducting electrodes constitutes an anisotropic conductive plate. 2. The method for forming an anisotropic conductive plate as described in item 1 of the scope of patent application, wherein in the step of forming a thick photoresist, the thick photoresist is a negative photoresist. '3. The method of forming the anisotropic conductive plate as described in item 2 of the scope of the patent application, wherein after the thick photoresist is formed, the thick photoresist is exposed. 4. The method for forming an anisotropic conductive plate as described in item 1 of the scope of patent application, wherein in the step of providing the substrate, a peelable layer is formed between the metal pins and the substrate. 5. The method for forming the anisotropic conductive plate as described in item 丨 of the scope of the patent application, wherein in the step of providing the substrate, the distribution density of the metal pins is between 10 3 and 108 mm-2. 6. The method for forming the anisotropic conductive plate as described in item 1 of the scope of the patent application, wherein the adjacent interval between the metal pins is from 0.5 to 30 from m. Scope of patent application A method for forming an anisotropic conductive board, comprising: providing a substrate having a plurality of metal pins formed on one surface thereof; forming at least one photoresist layer on the substrate; and pressing the substrate such that the substrate These metal pins are bonded to the photoresist layer, and electrically connect the upper and lower surfaces of the photoresist layer to become the electrodes of the photoresist layer; and S removes the substrate to make the photoresist with the conducting electrode The layers constitute an anisotropic conductive plate. The method for forming an anisotropic conductive plate as described in item 7 of the scope of patent application, wherein in the step of forming the photoresist layer, the photoresist layer is a negative photoresist. '', Such as the 7th scope of the patent application The second step is where the photoresist layer is exposed after the photoresist layer is formed. 10. The method for forming an anisotropic conductive plate according to item 7 in the scope of the patent application, wherein in the step of providing the substrate, a peelable layer is formed between the metal pins and the substrate.