TW554458B - Handler for TCP and method for detecting head TCP - Google Patents
Handler for TCP and method for detecting head TCP Download PDFInfo
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- TW554458B TW554458B TW091117276A TW91117276A TW554458B TW 554458 B TW554458 B TW 554458B TW 091117276 A TW091117276 A TW 091117276A TW 91117276 A TW91117276 A TW 91117276A TW 554458 B TW554458 B TW 554458B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
554458 五、發明說明d) 【發明所屬之技術領域】 承# ί ΐ明係關於一種間歇性地依序移送由複數個捲帶式554458 V. Description of the invention d) [Technical field to which the invention belongs] Cheng # 关于 Ming Department is about an intermittent sequential transfer by a plurality of tape and reel
Tcp册、、、件（TCP: Tape Carrier Package)連接成帶狀的 / U供試驗，同時按照試驗結果將各Tcp予以分類的捲 r 1二載封裝件（TCP)用處理器及前頭Tcp檢出方法。 L先刖技術】 A如周知般，TCP係使用捲帶式自動接合（TAB : Tape B〇nding)技術將K晶片安裝在薄膜上者，而在 接有複數個的捲帶形態。第3圖係該種捲帶形態 fcp t為TCP帶）之前視圖。TCP帶X，係在連接有複數個之 1的兩側設有帶狀之移送辅助部1Ac)在各Tcp 1上，於 溥膜基板1 a之周緣形成有複數個測試銲墊（t e s t 丨丨b， 同時於其中心配置有1 c晶片1 c，而各測試銲墊1 b與I C晶片 1 C上之各銲墊係藉由蝕刻形成的引線1 d來互相連接。又， 移送輔助部1A係由與上述薄膜基板la同樣的薄膜’ =了，間隔形成有用以將TCP帶X朝長度方向依序移送的鏈 輸孔1 e。 該種的TCP帶X，係邊依專用的TCP用處理考f 處理益）而朝長度方向間歇性地依序進給，而邊 =墊1b與半導體積體電路試驗裝置（通稱1C測試器 之測疋針（test Ρ1 η)依序接觸連接以進行功能試驗。又， 在上述TCP用處理器上，設有依丨試器所得之士 而將各TCP 1予以分類的分類裝置。該分類裝置j係^用Tcp volumes, TCP, and tape (TCP: Tape Carrier Package) are connected into a tape-like / U for testing. At the same time, each Tcp is sorted according to the test results. R 1 Two-load package (TCP) processor and Tcp inspection出 方法。 Out method. L-first technology] A As is well known, TCP uses a tape-and-tape (TAB: Tape Bonding) technology to mount a K wafer on a film, and a plurality of tape-and-reel forms are connected. Figure 3 is a front view of this tape and tape form (fcp t is TCP tape). The TCP belt X is provided with a belt-shaped transfer auxiliary portion 1Ac on both sides to which a plurality of 1 are connected. On each Tcp 1, a plurality of test pads (test 丨 丨) are formed on the periphery of the diaphragm substrate 1a. b, at the same time, a 1 c wafer 1 c is arranged at the center, and each test pad 1 b and each pad on the IC wafer 1 C are connected to each other by a lead 1 d formed by etching. Also, a transfer auxiliary portion 1A The same thin film as the above-mentioned thin film substrate 1a is used to form a chain feed hole 1e for sequentially transferring the TCP belt X in the length direction. The TCP belt X of this type is processed by a dedicated TCP. Test f processing benefits) and intermittently feed sequentially in the length direction, and the edge = pad 1b and the semiconductor integrated circuit test device (commonly known as the test pin (test Ρ1 η) of the 1C tester) are sequentially connected to perform functions Experiments: The TCP processor is provided with a classification device for classifying each TCP 1 according to the person obtained by the tester. This classification device j is used
31390().ptd 第4頁 554458 五、發明說明（2) '^ 衝孔方式（punching)從TCP帶X只分離及除去被判定為不 品的TCP 1者。 & 【發明所欲解決之問題】 但是，在利用TCP用處理器來移送TCP帶X上之各Tcp工 並以I C測試器來試驗的情況，就有必要指定在7(^帶χ上成 為試驗對象之最初的TCP (前頭TCP)。以往，係由作業者決 定前頭TCP ’並利用手動操作將該TCp 1送至TCP用處理器、 所指定的位置上以開始進行試驗，藉此使TCP用處理器二 別前頭TCP。 σ 然而，該種的前頭TCP之指定方式，由於係基於作業 者之操作與確認所進行者，故恐有因作業疏失而使Tcp用' 處理器識別到錯誤的前頭TCP之虞。而且，在發生該種事 態的情況，存有未試驗、未分類之TCP會殘留在TCP帶X上 的問題點。 本發明係有鑒於上述之問題點而開發完成者，其目 在於使T C P用處理器自動地識別前頭τ c p。 、 【解決問題之手段】 為了達成上述目的，本發明中關於捲帶式承載封裝 (TCP)用處理器的第一手段，係採用如下之手段，即一種 邊間歇性地依序進給連接有複數個TCp之TCP帶，而邊 TCP之測試銲墊與半導體積體電路試驗裝置之測定針依I 接觸連接，以使各TCP依序供半導體積體電路試驗裝^ 行試驗的TCP用處理器，其係具備有在進行上述接^連 作業之前’先行在TCP帶上自動檢出位於前頭之前頭Tcp31390 (). Ptd Page 4 554458 V. Description of the invention (2) '^ The punching method (punching) separates and removes only those who are judged to be defective from TCP band X. & [Problems to be Solved by the Invention] However, in the case where a TCP processor is used to transfer each Tcp worker on the TCP band X and tested with an IC tester, it is necessary to designate 7 (^ bandχ becomes The first TCP (front TCP) of the test object. In the past, the operator decided the front TCP 'and manually sent the TCp 1 to the TCP processor at a specified position to start the test. Use a processor with two TCPs in front. Σ However, because this method of specifying TCP in front is based on the operator's operation and confirmation, it is possible that Tcp's processor will recognize an error due to a mistake in the operation. There is a concern about TCP. In the case of such a situation, there is a problem that unexperimented and unclassified TCP remains on TCP band X. The present invention has been developed in view of the above problems, and The purpose is to make the processor for TCP automatically recognize the leading τ cp. [Means for solving problems] In order to achieve the above object, the first means of the present invention regarding a processor for tape and reel bearer encapsulation (TCP) adopts the following method hand That is, a type of TCP tape connected to a plurality of TCp is intermittently sequentially fed, and the test pad of the edge TCP is connected with the measuring pin of the semiconductor integrated circuit test device by I, so that each TCP is sequentially supplied to the semiconductor Integrated circuit test device TCP processor for testing, which is equipped with a TCP belt which is automatically detected in front of the TCP before the above-mentioned serial operation
313900.ptd 第5頁 554458 五、發明說明（3) 前頭TCP檢出機構。 又，關於TCP用處理器之第二手段，係在上述第一手 段中，採用如下之手段，即前頭TCP檢出機構係包含有： TCP檢出機構，在指定位置上檢出TCP帶上的TCP之存在； 以及判定機構，在將TCP帶從供給側移送至收容側的場 合，在上述TCP檢出機構中檢出TCP，則在之後，在將TCP 帶從收容側移送至供給側的場合，有指定之判定值Η次以 上連續未檢出TCP時，就將上述TCP檢出機構所檢出的TCP 判斷為前頭T C P。 關於TCP用處理器之第三手段，係在上述第一或第二 手段中，採用如下之手段，即TCP檢出機構，係為了確認 根據試驗結果而從TCP帶上除去不良TCP之分類裝置的動 作，而檢出各TCP中之1C晶片之存在的收容側1C晶片檢出 裝置。 關於TCP用處理器之第四手段，係在上述第一至第三 手段中之任一手段中，採用如下之手段，即判定值Η，係 在TCP帶上沒有欠缺TCP的情況下可存在於供給側1C晶片檢 出裝置與收容側I C晶片檢出裝置之間的TCP之個數，其中 之供給側I C晶片檢出裝置，係用以檢出供於試驗之TCP上 之I C晶片之存在，其中之收容側I C晶片檢出裝置，則係為 了確認根據試驗結果而除去不良之TCP的分類裝置之動 作，而檢出各T C P中之I C晶片之存在。 另一方面，本發明中關於前頭捲帶式承載封裝件 (TCP)檢出方法的第一手段，係採用如下之手段，即在將313900.ptd Page 5 554458 V. Description of the invention (3) The TCP detection mechanism at the front. The second means of the TCP processor is the above-mentioned first means, which adopts the following means. The preceding TCP detection mechanism includes: a TCP detection mechanism that detects a TCP band on a specified position. The existence of TCP; and the judging mechanism, when the TCP tape is transferred from the supply side to the storage side, and the TCP is detected by the TCP detection mechanism, then, when the TCP tape is transferred from the storage side to the supply side When TCP has not been detected for more than one time with the specified judgment value, the TCP detected by the aforementioned TCP detection mechanism is judged as the leading TCP. Regarding the third means of the TCP processor, in the first or second means described above, the following means is adopted. The TCP detection mechanism is a device for classifying a TCP that removes bad TCP from the TCP band based on the test results. And the receiving side 1C wafer detection device detects the presence of the 1C wafer in each TCP. Regarding the fourth means of the TCP processor, in any of the above-mentioned first to third means, the following means are adopted, that is, the determination value Η can exist in the absence of TCP on the TCP band. The number of TCPs between the supply-side 1C wafer detection device and the storage-side IC wafer detection device. The supply-side IC wafer detection device is used to detect the presence of an IC wafer on the TCP used for the test. The storage-side IC chip detection device detects the presence of the IC chip in each TCP in order to confirm the operation of the classification device that removes the defective TCP based on the test results. On the other hand, the first method of the present invention regarding the detection method of the front tape carrier package (TCP) adopts the following method, namely
313900.ptd 第6頁 554458 五、發明說明（4) TCP帶從供給側移送至收容側的場合檢出TCP，則在之後， 在將TCP帶從收容側移送至供給側的場合，有指定之判定 值Η次以上連續未檢出TCP時，就將前面所檢出的TCP判斷 為前頭T C P。 又，關於前頭TCP檢出方法之第二手段，係在上述第 一手段中，採用如下之手段，即判定值Η，係在TCP帶上沒 有欠缺TCP的情況下可存在於供給側I C晶片檢出裝置與收 容側I C晶片檢出裝置之間的TCP之個數，其中之供給側I C 晶片檢出裝置，係用以檢出供於試驗之TCP上之I C晶片之 存在，其中之收容側I C晶片檢出裝置，則係為了確認根據 試驗結果而除去不良之TCP的分類裝置之動作，而檢出各 TCP中之1C晶片之存在。 【發明之實施形態】 以下，係參照圖式，就本發明之TCP用處理器及前頭 TCP檢出方法之一實施形態加以說明。 第1圖係本實施形態之TCP用處理器的主要部分構成 圖。在該第1圖中，元件編號X係TCP帶，2A係供給捲筒 (r e e 1 )，2 B係收容捲筒，3係推進器（p u s h e r )，4係分類裝 置，5係供給側張力導件（t e n s i ο n g u i d e )，6係收容側張 力導件，7係供給側副鏈輪（s u b s p r o c k e t)，8係收容側副 鏈輪，9係供給側主鏈輪，1 0係收容側主鏈輪，1 1係供給 側1C晶片檢出裝置，12係收容側1C晶片檢出裝置（TCP檢出 機構），1 3係運算裝置（判定機構），1 4係輸入裝置。該等 各構成要素中，收容側I C晶片檢出裝置1 2及運算裝置1 3，313900.ptd Page 6 554458 V. Description of the invention (4) TCP is detected when the TCP belt is transferred from the supply side to the storage side. Then, when the TCP belt is moved from the storage side to the supply side, it is specified. When the judgment value is not detected for more than one consecutive time, the previously detected TCP is judged as the leading TCP. Also, regarding the second means of the preceding TCP detection method, in the above-mentioned first means, the following means are adopted, that is, the determination value Η can exist in the supply-side IC chip detection without the absence of TCP on the TCP band. The number of TCPs between the delivery device and the IC chip detection device on the storage side. The supply-side IC chip detection device is used to detect the existence of the IC chip on the TCP used for the test. The wafer detection device detects the presence of the 1C wafer in each TCP in order to confirm the operation of the classification device that removes the defective TCP based on the test results. [Embodiment of the Invention] Hereinafter, an embodiment of a TCP processor and a preceding TCP detection method according to the present invention will be described with reference to the drawings. Fig. 1 is a configuration diagram of the main parts of the TCP processor of this embodiment. In the first figure, the component number is X-type TCP tape, 2A-type supply reel (ree 1), 2B-type storage reel, 3-series pusher, 4-series sorting device, 5-series supply-side tension guide. (Tensi ο nguide), 6 series containment side tension guide, 7 series supply side subsprocket, 8 series containment side sprocket, 9 series supply side main sprocket, 10 series containment side sprocket , 1 1 1C wafer detection device on the supply side, 12 1C wafer detection device on the storage side (TCP detection mechanism), 1 3 computing device (judgment mechanism), 1 4 input device. Among these constituent elements, the IC chip detection device 12 on the storage side and the computing device 1 3,
313900.ptd 第7頁 554458 五、發明說明（5) --- 係構成本^實施形態之前頭Tcp檢出機構。 TCP帶X，係與第3圖中已說明的Tc 數個TCP Μ形成捲帶狀者。，接稷 後端部上，分觀有指者定長又度 γ = “有TCP丨，而是依前一步驟之試驗在等：X 判疋為不良的TCP ^利用衝孔方式（punching)除去。 以將2,A，係、用以捲取收納Tcp帶x，料藉由轉動 以將TCPf X攸丽端依序送出。收容捲筒2B，係依序捲取從 上述^供給捲筒2 A送出並完成試驗的TCP帶X。亦即，進行 TCP帶X之試驗時的移送方向（試驗時移送方向a )，係指從 供給捲筒2A依順時鐘方向送出並由收容捲筒2Β#取的方 向，亦即，從供給側副鏈輪7朝收容側副鏈輪8的方向（紙 面右方向）。 推進器3，係按壓TCP帶X以使各TCP 1之測試銲墊113與 I C測試器之測定針依序接觸連接。各TCP i，係在測試銲 塾1 b與測定針接觸連接的狀態下可依丨c測試器進行動作試 驗。分類裝置4，係設於上述推進器3之後段，利用衝孔方 式將被判定為試驗結果不良品的TCP 1從TCP帶X分離及除 去0 供給側張力導件5，係設於供給側I C晶片檢出裝置1 1 與供給側主鏈輪9之間，並在為上述推進器3所按壓的TCP 帶X上附加後退張力（b a c k t e n s i ο η)。收容側張力導件6， 係設於收容側主鏈輪1 〇與分類裝置4之間，並在為上述推 進器3所按壓的TCP帶X上附加前進方向之張力。供給側副313900.ptd Page 7 554458 V. Description of the invention (5) --- It constitutes the Tcp detection mechanism before the embodiment. The TCP strip X is a roll-shaped strip formed by a plurality of TCP M and Tc described in FIG. 3. Then, on the back end, the person who has the view points is fixed and has a length of γ = "There is TCP 丨, but the test according to the previous step is waiting: X is judged to be a bad TCP ^ using punching method (punching) Remove. To take 2, A, to take up and store the Tcp tape x, the material is rotated to send out the TCPf X end. The storage roll 2B is to take up the supply roll from above ^ 2 A sends out and completes the test of the TCP tape X. That is, the transfer direction during the test of the TCP tape X (the transfer direction a during the test) means that it is sent out from the supply reel 2A in a clockwise direction and is received by the storage reel 2B. # Take the direction, that is, the direction from the supply side sprocket 7 to the storage side sprocket 8 (right direction on the paper surface). The pusher 3 is to press the TCP belt X to make the test pad 113 of each TCP 1 and The measuring pins of the IC tester are connected in order. Each TCP i can be operated in accordance with the tester c in the state where the test welding pad 1 b is in contact with the measuring pin. The classification device 4 is provided on the above-mentioned propeller. In the third and subsequent stages, the punching method was used to separate and remove TCP 1 which was judged to be a defective product from the TCP belt X. 0 Supply-side tension The guide 5 is provided between the supply-side IC wafer detection device 1 1 and the supply-side main sprocket 9 and applies a back tension to the TCP belt X pressed by the above-mentioned pusher 3. The side tension guide 6 is provided between the storage-side main sprocket 10 and the sorting device 4 and applies a tension in the forward direction to the TCP belt X pressed by the above-mentioned thruster 3. The supply side vice
313900.ptd 第8頁 554458 五、發明說明（6) 鏈輪7，係將供給捲筒2A所送出的TCP帶X朝供給側主鏈輪9 送出。 收容側副鏈輪8，係將收容側主鏈輪1 0所送出的TCP帶 X朝收容捲筒2 B送出。供給側主鏈輪9，係相對於上述試驗 時移送方向A而設在該TCP帶X之供給側，以將上述供給側 副鏈輪7所送出的TCP帶X朝收容側主鏈輪1 0送出。收容側 主鏈輪1 0，係相對於上述試驗時移送方向A而設在該TCP帶 X之收容側，以將上述供給側主鏈輪9所送出的TCP帶X朝收 容側副鏈輪8送出。 供給側I C晶片檢出裝置11，係設於供給側副鏈輪7與 供給側張力導件5之間，以檢出各TCP 1之1C晶片lc的有 無，並將該檢出結果輸出至運算裝置1 3。收容側I C晶片檢 出裝置1 2，係設於分類裝置4與收容側副鏈輪8之間，以檢 出各TCP 1之1C晶片lc的有無，亦即檢出利用分類裝置4除 去不良的TCP 1之後的TCP帶X上之1C晶片lc的有無，並將 該檢出結果輸出至運算裝置13。 運算裝置1 3，係根據指定的控制程式而控制上述供給 側主鏈輪9或收容側主鏈輪1 0等之各運轉部的動作。又， 該運算裝置1 3，係進行作為本實施形態之特徵的前頭TCP 之檢出處理者。輸入裝置1 4，係用以將執行上述控制程式 所需要的各種操作資訊輸入至運算裝置1 3中者。 其次，參照第2圖就如此構成的本TCP用處理器之動作 加以說明。 首先最初，在進行試驗之前可先利用手動作業進行313900.ptd Page 8 554458 V. Description of the invention (6) The sprocket 7 is used to send the TCP belt X from the supply reel 2A toward the main sprocket 9 on the supply side. The storage side sprocket 8 sends the TCP tape X sent from the storage side main sprocket 10 toward the storage reel 2B. The supply-side main sprocket 9 is provided on the supply side of the TCP belt X with respect to the transfer direction A during the test, so that the TCP belt X sent from the supply-side auxiliary sprocket 7 is directed toward the storage-side main sprocket 10. Submit. The storage-side main sprocket 10 is provided on the storage side of the TCP belt X with respect to the transfer direction A during the test, so that the TCP belt X sent from the supply-side main sprocket 9 is directed toward the storage-side auxiliary sprocket 8 Submit. The supply-side IC wafer detection device 11 is provided between the supply-side auxiliary sprocket 7 and the supply-side tension guide 5 to detect the presence or absence of each 1C wafer lc of TCP 1 and output the detection result to the calculation. Device 1 3. The IC chip detection device 12 on the storage side is provided between the sorting device 4 and the sub-sprocket 8 on the storage side to detect the presence or absence of the 1C chip lc of each TCP 1, that is, the defective device is removed by the sorting device 4. The presence or absence of the 1C chip lc on the TCP band X after TCP 1 is output to the computing device 13. The computing device 1 3 controls the operation of each of the operating units such as the supply-side main sprocket 9 or the storage-side main sprocket 10 according to a designated control program. The arithmetic device 1 3 is a processor that performs the detection of the leading TCP, which is a feature of this embodiment. The input device 14 is used to input various operation information required to execute the control program into the computing device 13. Next, the operation of the present TCP processor will be described with reference to FIG. First of all, it can be done manually before testing.
313900‘ptd 第9頁 554458 五、發明說明（7) TCP帶X之搭接捲繞作業。在該搭接捲繞作業中，從供給捲 筒2A拉出的TCP帶前端之導帶（leader tape)係經由第1圖 所示之既定路徑而搭接捲繞在收容捲筒2B±。導帶的前端 部係黏接固定在收容捲筒2B上，再捲繞而成為以預定長度 捲繞在收容捲筒2 B上的狀態。 在結束如上述的搭接捲繞作業之狀態下，Tcp帶X上之 各TCP 1的動作試驗係與TCP帶X之間歇捲取作業同時依序 進行，但是本實施形態係在這樣的試驗動作之前，進行第 2圖所示之前頭TCP的檢出處理。 亦即’運算裝置13，係當開始進行處理時，會判斷收 容側是否有I C晶片1 c，亦即判斷收容側丨c晶片檢出裝置i 2 疋否仏出I C晶片1 c (步驟S 1 )。然後，在該判斷為「是」的 情況’亦即在收容側1C晶片檢出裝置12檢出IC晶片lc的情 況，就清除設定於自己内部之連續無IC晶片 值使之為「0」（步驟S2)，另一方面，在上述+^斷\< 「否」的情況，就使TCP帶X朝收容方向只移動1個TCp份 (步驟S 3 )，進而重覆步驟s 1之判斷處理。 運异裝置1 3 ’係當結束步驟S 2之處理時，使τ c P帶X朝 供給方向只移動1個TCP份（步驟S4)，進而判斷收容側1(：晶 片檢出裝置1 2是否檢出I c晶片1 C (步驟S5 )。然後，在該判 斷為「否」的情況，亦即在收容側Ic晶片檢出裝置12檢出 1C晶片lc的情況，重覆上述步驟S2之處理，清除連續無1(： 晶片計數器之計數值。 、<313900’ptd Page 9 554458 V. Description of the invention (7) Lapping and winding operation of TCP belt X. In this overlap winding operation, the leader tape of the end of the TCP tape pulled out from the supply roll 2A is overlapped and wound around the storage roll 2B ± via a predetermined path shown in FIG. 1. The leading end of the guide tape is adhered and fixed to the storage reel 2B, and is wound again to a state of being wound around the storage reel 2B with a predetermined length. In the state where the overlap winding operation is completed as described above, the operation test of each TCP 1 on the Tcp belt X and the intermittent winding operation of the TCP belt X are performed in sequence at the same time, but this embodiment is based on such a test operation Previously, the preceding TCP detection process shown in FIG. 2 was performed. That is, when the computing device 13 starts processing, it will determine whether there is an IC chip 1 c on the storage side, that is, determine whether the IC side 1 c chip detection device i 2 疋 whether the IC chip 1 c is pulled out (step S 1 ). Then, when the determination is "Yes", that is, when the IC chip lc is detected in the 1C wafer detection device 12 on the storage side, the continuous non-IC chip value set in itself is cleared to "0" ( Step S2) On the other hand, in the case of + ^ off \ " No, " the TCP band X is moved only 1 TCp portion toward the containing direction (step S3), and the judgment of step s1 is repeated. deal with. The transporting device 1 3 ′ is to move the τ c P belt X toward the supply direction by only one TCP copy when the processing of step S 2 is completed (step S4), and then determine whether the containing side 1 (: wafer detection device 12 2 is I c wafer 1 C is detected (step S5). Then, if the determination is “No”, that is, when 1 c wafer lc is detected in the Ic wafer detection device 12 on the storage side, the process of step S2 is repeated. , Clear consecutive no 1 (: chip counter's count value., ≪
利用上述步驟S1至S5之一系列處理，每次在收容側ICUsing one of the series of steps S1 to S5 described above, each time on the containing side IC
313900.ptd 第10頁 554458 五、發明說明（8) 晶片檢出裝置12中於收容方向檢出1C晶片lc(即TCP 1 ) 時，連續無I C晶片計數器之計數值，就會被清除而成為 「0」。在此，收容側I C晶片檢出裝置1 2所檢出的I C晶片 lc (即TCP 1)，係前頭TCP之候補，且藉由以下之步驟S6、 S 7的處理，根據連續無I C晶片計數器之計數值來決定是否 認定該候補為前頭T C P。 亦即，運算裝置1 3，係在步驟S5之判斷為「是」的情 況，就往上計數連續無I C晶片計數器之計數值使之為 「1」（步驟S6 )，進而判斷如此往上計數的計數值是否大 於（含等於）事先記憶之判定值（步驟S 7)。然後，在該判斷 為「否」的情況，就藉由重覆上述步驟S4以下之處理，使 TCP帶X依序朝供給方向移動並計數連續未檢出TCP 1的個 數以作為連續無I C晶片計數器之計數值。 然後，該計數值會變成大於（含等於）判定值，且步驟 S 7之判斷會變成「是」，而結束全部的處理。此時，成為 計數值之基準的TCP 1最終就會被判定為前頭TCP。 另外，在本實施形態中，當TCP帶X上沒有欠缺TCP 1 之情況，雖係將可能存在供給側I C晶片檢出裝置1 1與收容 側I C晶片檢出裝置1 2之間的TCP 1之個數當作判定值，但 是此種判定值的設定，係根據沒有上述個數份I C晶片1 c的 狀態通常不會發生之判斷者。 【發明之效果】 如以上說明，若依據本發明，則由於其具備有自動檢 出前頭TCP的前頭TCP檢出機構，所以可消除如以往會使313900.ptd Page 10 554458 V. Description of the invention (8) When the 1C chip lc (ie TCP 1) is detected in the storage direction in the wafer detection device 12, the count value of the continuous IC-free chip counter will be cleared and become "0". Here, the IC chip lc (that is, TCP 1) detected by the IC chip detection device 12 on the storage side is a candidate for the preceding TCP, and is processed by the following steps S6 and S7 according to the continuous IC chip counter. The count value to determine whether the candidate is deemed to be the leading TCP. That is, the arithmetic device 1 3 is the case where the determination in step S5 is "YES", and counts up the continuous non-IC chip counter value to "1" (step S6), and then judges that it counts up Whether the count value of is greater than (including equal to) the judgment value memorized in advance (step S 7). Then, when the determination is "No", the TCP belt X is sequentially moved toward the supply direction by repeating the processing of steps S4 and below, and the number of consecutive undetected TCP 1 is counted as a continuous non-IC Wafer counter count value. Then, the count value becomes greater than (including equal to) the judgment value, and the judgment of step S 7 becomes "YES", and all the processing is ended. At this time, TCP 1 which is the reference of the count value is finally determined as the leading TCP. In addition, in the present embodiment, when there is no lack of TCP 1 on the TCP band X, it is possible that there is a TCP 1 between the supply-side IC wafer detection device 11 and the storage-side IC wafer detection device 12 The number is used as a judgment value, but the setting of such a judgment value is based on a judge who does not normally occur in a state in which the number of IC chips 1 c does not exist. [Effects of the Invention] As described above, according to the present invention, since it has a front TCP detection mechanism for automatically detecting the front TCP, it can eliminate
313900.ptd 第11頁 554458313900.ptd Page 11 554458
313900.ptd 第12頁 554458 圖式簡單說明 【圖式之簡單說明】 第1圖係本發明之一實施形態之TCP用處理器的主要部 分構成圖。 第2圖係顯示本發明之一實施形態之TCP用處理器之前 頭TCP檢出處理的流程圖。 第3圖係本發明及以往之TCP帶的構成圖。 【元件編號之說明】313900.ptd Page 12 554458 Brief description of the drawing [Simplified description of the drawing] Fig. 1 is a structural diagram of a main part of a TCP processor according to an embodiment of the present invention. Fig. 2 is a flowchart showing a TCP detection process before a TCP processor according to an embodiment of the present invention. Fig. 3 is a configuration diagram of the present invention and a conventional TCP band. [Description of component number]
la 1 c 1 e 2A 11 12 13 供給側主鏈輪 供給側I C晶片檢出裝置 收容側1C晶片檢出裝置（TCP檢出機構） 運算裝置（判定機構） 1 4 輸入裝置 lb Id ΙΑ 2Β 4 10 TCP帶 薄膜基板 I C晶片 鏈輪孔 供給捲筒 推進器 供給側張力導件 供給側副鏈輪la 1 c 1 e 2A 11 12 13 Supply-side main sprocket Supply-side IC wafer detection device Storage side 1C wafer detection device (TCP detection mechanism) Computing device (judgment mechanism) 1 4 Input device lb Id ΙΑ 2B 4 10 TCP with film substrate IC wafer sprocket hole supply reel thruster supply side tension guide supply side auxiliary sprocket
TCP 測試銲墊 引線 移送輔助器 收容捲筒 分類裝置 收容側張力導件 收容側副鏈輪 收容側主鏈輪TCP test pad lead transfer aid storage reel classification device storage side tension guide storage side sprocket storage side main sprocket
313900.ptd 第13頁313900.ptd Page 13
Claims (1)
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