JP4089193B2 - TCP handler and leading TCP detection method - Google Patents

TCP handler and leading TCP detection method Download PDF

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Publication number
JP4089193B2
JP4089193B2 JP2001291055A JP2001291055A JP4089193B2 JP 4089193 B2 JP4089193 B2 JP 4089193B2 JP 2001291055 A JP2001291055 A JP 2001291055A JP 2001291055 A JP2001291055 A JP 2001291055A JP 4089193 B2 JP4089193 B2 JP 4089193B2
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tcp
chip
accommodation
tape
detection device
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JP2003098219A (en
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行康 高野
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Yokogawa Electric Corp
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Yokogawa Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Description

【０００１】
【発明の属する技術分野】
本発明は、複数のＴＣＰ（tape carrier package）がテープ状に連接されたＴＣＰテープを順次間欠移送して試験に供すると共に試験結果に応じて各ＴＣＰを分類するＴＣＰ用ハンドラ及び先頭ＴＣＰ検出方法に関する。
【０００２】
【従来の技術】
周知のようにＴＣＰは、ＴＡＢ（tape automated bonding）技術を用いることによりフィルム上にＩＣチップを実装したものであり、実際にプリント基板に搭載される前の搬送段階では、複数が連接されたテープ形態となっている。図３は、このようなテープ形態のＴＣＰ（以下、ＴＣＰテープという。）の正面図である。ＴＣＰテープＸは、複数連接されたＴＣＰ１の両側に帯状の移送補助部１Ａが設けられている。各ＴＣＰ１には、フィルム基板１ａの周縁に複数のテストパッド１ｂが形成されると共にその中心にＩＣチップ１ｃが配置され、各テストパッド１ｂとＩＣチップ１ｃ上の各パッドとがエッチング形成されたリード線１ｄによって相互接続されている。また、移送補助部１Ａは、上記フィルム基板１ａと同様のフィルムから構成されており、ＴＣＰテープＸを長手方向に順次移送するためのスプロケット孔１ｅが一定間隔で形成されている。
【０００３】
このようなＴＣＰテープＸは、専用のＴＣＰ用ハンドラ（ＴＡＢハンドラとも言う。）によって長手方向に順次間欠送りされつつ、各ＴＣＰ１のテストパッド１ｂが半導体集積回路試験装置（通称、ＩＣテスタ）の測定ピンに順次接触接続されて機能試験が行われる。また、上記ＴＣＰ用ハンドラには、ＩＣテスタによる試験結果に応じて各ＴＣＰ１を分類する分類装置が設けられている。この分類装置は、不良品と判定されたＴＣＰ１のみをパンチングによりＴＣＰテープＸから分離・除去するものである。
【０００４】
【発明が解決しようとする課題】
ところで、ＴＣＰテープＸ上の各ＴＣＰ１をＴＣＰ用ハンドラで移送してＩＣテスタで試験する場合、ＴＣＰテープＸ上で試験対象となる最初のＴＣＰ（先頭ＴＣＰ）を指定する必要がある。従来では、作業者が先頭ＴＣＰを決め、そのＴＣＰ１をＴＣＰ用ハンドラが指定する位置までマニアル操作にて搬送して試験を開始することによりＴＣＰ用ハンドラに先頭ＴＣＰを認識させている。
【０００５】
しかしながら、このような先頭ＴＣＰの指定方式は、作業者の操作と確認に基づいているため作業ミスにより誤った先頭ＴＣＰをＴＣＰ用ハンドラに認識させてしまう恐れがある。そして、このような事態が発生した場合、未試験、未分類のＴＣＰがＴＣＰテープＸ上に残されるという問題点がある。
【０００６】
本発明は、上述する問題点に鑑みてなされたもので、ＴＣＰ用ハンドラが自動的に先頭ＴＣＰを認識することを目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本発明では、ＴＣＰ用ハンドラに係わる第１の手段として、ＴＣＰが複数連接されたＴＣＰテープを順次間欠送りしつつ各ＴＣＰのテストパッドを半導体集積回路試験装置の測定ピンに順次接触接続させて各ＴＣＰを半導体集積回路試験装置による試験に順次供するＴＣＰ用ハンドラであって、上記接触接続に先立って、ＴＣＰテープ上で先頭に位置する先頭ＴＣＰを自動検出する先頭ＴＣＰ検出手段を具備するという手段を採用する。
【０００８】
また、ＴＣＰ用ハンドラに係わる第２の手段として、上記第１の手段において、先頭ＴＣＰ検出手段は、所定位置においてＴＣＰテープ上のＴＣＰの存在を検出するＴＣＰ検出手段と、ＴＣＰテープを供給側から収容側に移送した場合にＴＣＰ検出手段においてＴＣＰが検出されると、その後、ＴＣＰテープを収容側から供給側に移送した場合に所定の判定値Ｈ以上連続してＴＣＰが検出されないときに、ＴＣＰ検出手段によって検出されたＴＣＰを先頭ＴＣＰと判断する判定手段とから構成されるという手段を採用する。
【０００９】
ＴＣＰ用ハンドラに係わる第３の手段として、上記第１または第２の手段において、ＴＣＰ検出手段は、試験結果に基づいて不良のＴＣＰをＴＣＰテープ上から除去する分別装置の動作を確認するために、各ＴＣＰにおけるＩＣチップの存在を検出する収容側ＩＣチップ検出装置であるという手段を採用する。
【００１０】
ＴＣＰ用ハンドラに係わる第４の手段として、上記第１〜第２いずれかの手段において、判定値Ｈは、ＴＣＰテープ上にＴＣＰの欠落がないとした場合に、試験に供されるＴＣＰ上のＩＣチップの存在を検出する供給側ＩＣチップ検出装置と試験結果に基づいて不良のＴＣＰを除去する分別装置の動作を確認するために各ＴＣＰにおけるＩＣチップの存在を検出する収容側ＩＣチップ検出装置との間に存在し得るＴＣＰの個数であるという手段を採用する。
【００１１】
一方、本発明では、先頭ＴＣＰ検出方法に係わる第１の手段として、ＴＣＰテープを供給側から収容側に移送した場合にＴＣＰが検出されると、その後、ＴＣＰテープを収容側から供給側に移送した場合に所定の判定値Ｈ以上連続してＴＣＰが検出されないときに、先に検出されたＴＣＰを先頭ＴＣＰと判断するという手段を採用する。
【００１２】
また、先頭ＴＣＰ検出方法に係わる第２の手段として、上記第１の手段において、判定値Ｈは、ＴＣＰテープ上にＴＣＰの欠落がないとした場合に、試験に供されるＴＣＰ上のＩＣチップの存在を検出する供給側ＩＣチップ検出装置と試験結果に基づいて不良のＴＣＰを除去する分別装置の動作を確認するために各ＴＣＰにおけるＩＣチップの存在を検出する収容側ＩＣチップ検出装置との間に存在し得るＴＣＰの個数であるという手段を採用する。
【００１３】
【発明の実施の形態】
以下、図面を参照して、本発明に係わるＴＣＰ用ハンドラ及び先頭ＴＣＰ検出方法の一実施形態について説明する。
【００１４】
図１は、本実施形態に係わるＴＣＰ用ハンドラの要部構成図である。この図１において、符号ＸはＴＣＰテープ、２Ａは供給リール、２Ｂは収容リール、３はプッシャ、４は分類装置、５は供給側テンションガイド、６は収容側テンションガイド、７は供給側サブスプロケット、８は収容側サブスプロケット、９は供給側メインスプロケット、１０は収容側メインスプロケット、１１は供給側ＩＣチップ検出装置、１２は収容側ＩＣチップ検出装置（ＴＣＰ検出手段）、１３は演算装置（判定手段）、１４は入力装置である。これら各構成要素のうち、収容側ＩＣチップ検出装置１２及び演算装置１３は、本実施形態における先頭ＴＣＰ検出手段を構成している。
【００１５】
ＴＣＰテープＸは、図３で既に説明したＴＣＰテープＸと同一であり、複数のＴＣＰ１を連接してテープ状にしたものである。また、このＴＣＰテープＸの先端部及び後端部には、所定長さのリーダテープがそれぞれ装着されている。さらに、ＴＣＰテープＸ上にはＴＣＰ１が連続して存在する訳ではなく、前工程の試験等によって不良判定されたＴＣＰ１はパンチングにより除去されている。
【００１６】
供給リール２Ａは、ＴＣＰテープＸを巻取収納すると共に、回動することによりＴＣＰテープＸを先端から順次送り出す。収容リール２Ｂは、上記供給リール２Ａから送り出されると共に試験が終了したＴＣＰテープＸを順次巻き取る。すなわち、ＴＣＰテープＸの試験時における移送方向（試験時移送方向Ａ）は、供給リール２Ａから順時送り出されて収容リール２Ｂに巻き取られる方向、つまり供給側サブスプロケット７から収容側サブスプロケット８に向かう方向（紙面右方向）である。
【００１７】
プッシャ３は、ＴＣＰテープＸを押圧して各ＴＣＰ１のテストパッド１ｂをＩＣテスタの測定ピンに順次接触接続させる。各ＴＣＰ１は、テストパッド１ｂが測定ピンに接触接続した状態でＩＣテスタによって動作試験が行われる。分類装置４は、上記プッシャ３の後段に設けられ、試験の結果不良品と判定されたＴＣＰ１をパンチングによりＴＣＰテープＸから分離・除去する。
【００１８】
供給側テンションガイド５は、供給側ＩＣチップ検出装置１１と供給側メインスプロケット９との間に設けられ、上記プッシャ３によって押圧されるＴＣＰテープＸにバックテンションを付加する。収容側テンションガイド６は、収容側メインスプロケット１０と分類装置４との間に設けられ、上記プッシャ３によって押圧されるＴＣＰテープＸにフォワード方向のテンションを付加する。供給側サブスプロケット７は、供給リール２Ａから送り出されたＴＣＰテープＸを供給側メインスプロケット９に向けて送り出す。
【００１９】
収容側サブスプロケット８は、収容側メインスプロケット１０から送り出されたＴＣＰテープＸを収容リール２Ｂに向けて送り出す。供給側メインスプロケット９は、上記試験時移送方向Ａに対して当該ＴＣＰテープＸの供給側に設けられ、上記供給側サブスプロケット７から送り出されたＴＣＰテープＸを収容側メインスプロケット１０に向けて送り出す。収容側メインスプロケット１０は、上記試験時移送方向Ａに対して当該ＴＣＰテープＸの収容側に設けられ、上記供給側サブスプロケット７から送り出されたＴＣＰテープＸを収容側メインスプロケット１０に向けて送り出す。
【００２０】
供給側ＩＣチップ検出装置１１は、供給側サブスプロケット７と供給側テンションガイド５との間に設けられ、各ＴＣＰ１のＩＣチップ１ｃの有無を検出し、その検出結果を演算装置１３に出力する。収容側ＩＣチップ検出装置１２は、分類装置４と収容側サブスプロケット８との間に設けられ、各ＴＣＰ１のＩＣチップ１ｃの有無、つまり分類装置４によって不良なＴＣＰ１が除去された後のＴＣＰテープＸ上のＩＣチップ１ｃの有無を検出し、その検出結果を演算装置１３に出力する。
【００２１】
演算装置１３は、所定の制御プログラムに基づいて上記供給側メインスプロケット９や収容側メインスプロケット１０等の各稼働部の動作を制御する。また、この演算装置１３は、本実施形態の特徴である先頭ＴＣＰの検出処理をも行うものである。入力装置１４は、上記制御プログラムの実行に必要な各種操作情報を演算装置１３に入力するためのものである。
【００２２】
次に、このように構成された本ＴＣＰ用ハンドラの動作について、図２を参照して説明する。
【００２３】
まず最初に、試験に先立ってＴＣＰテープＸの架け回し作業が手作業によって行われる。この架け回し作業では、供給リール２Ａから引き出されたＴＣＰテープ先端のリーダテープが図１に示すような既定経路を経由して収容リール２Ｂに架け回される。リーダテープは、先端部が収容リール２Ｂに粘着固定され、さらに所定長さだけ収容リール２Ｂに巻き取られた状態とされる。
【００２４】
このような架け回し作業が完了した状態で、ＴＣＰテープＸ上の各ＴＣＰ１の動作試験がＴＣＰテープＸの間欠巻き取りと共に順次行われるが、本実施形態ではこのような試験動作の前処理として、図２に示す先頭ＴＣＰの検出処理が行われる。
【００２５】
すなわち、演算装置１３は、処理を開始すると、収容側にＩＣチップ１ｃがあるか、つまり収容側ＩＣチップ検出装置１２がＩＣチップ１ｃを検出しているか否かを判断する（ステップＳ1）。そして、この判断が「Ｙｅｓ」の場合、つまり収容側ＩＣチップ検出装置１２がＩＣチップ１ｃを検出している場合は、自らの内部に設定した連続ＩＣチップ無カウンタのカウント値をクリアして「０」に設定し（ステップＳ2）、一方、上記判断が「Ｎｏ」の場合には、ＴＣＰテープＸを収容方向に１ＴＣＰ分だけ移送させ（ステップＳ3）、さらにステップＳ1の判断処理を繰り返す。
【００２６】
演算装置１３は、ステップＳ2の処理が終了すると、ＴＣＰテープＸを供給方向に１ＴＣＰ分だけ移送させ（ステップＳ4）、さらに収容側ＩＣチップ検出装置１２がＩＣチップ１ｃを検出していないか否かを判断する（ステップＳ5）。そして、この判断が「Ｎｏ」の場合、つまり収容側ＩＣチップ検出装置１２がＩＣチップ１ｃを検出した場合は、上記ステップＳ2の処理を繰り返して、連続ＩＣチップ無カウンタのカウント値をクリアする。
【００２７】
上記ステップＳ1〜Ｓ5に係わる一連処理により、収容側ＩＣチップ検出装置１２において収容方向にＩＣチップ１ｃ（すなわちＴＣＰ１）が検出される度に、連続ＩＣチップ無カウンタのカウント値は、「０」にクリアされる。ここで、収容側ＩＣチップ検出装置１２によって検出されたＩＣチップ１ｃ（すなわちＴＣＰ１）は、先頭ＴＣＰの候補であり、以下のステップＳ6，Ｓ7に係わる処理によってこの候補を先頭ＴＣＰと認定するか否かが連続ＩＣチップ無カウンタのカウント値に基づいて決定される。
【００２８】
すなわち、演算装置１３は、ステップＳ5の判断が「Ｙｅｓ」の場合には、連続ＩＣチップ無カウンタのカウント値をカウントアップして「１」とし（ステップＳ6）、さらにこのようにカウントアップされたカウント値が予め記憶された判定値以上か否かを判断する（ステップＳ7）。そして、この判断が「Ｎｏ」の場合は、上記ステップＳ4以下の処理を繰り返すことにより、ＴＣＰテープＸを供給方向に順次移送してＴＣＰ１が連続的に検出されない個数を連続ＩＣチップ無カウンタのカウント値として計数する。
【００２９】
そして、このカウント値が判定値以上となり、ステップＳ7の判断が「Ｙｅｓ」となり、全ての処理が終了する。この場合、カウント値の基準となったＴＣＰ１が先頭ＴＣＰとして最終的に判定される。
【００３０】
なお、本実施形態では、ＴＣＰテープＸ上にＴＣＰ１の欠落がないとした場合における供給側ＩＣチップ検出装置１１と収容側ＩＣチップ検出装置１２との間に存在し得るＴＣＰ１の個数を判定値としたが、このような判定値の設定は、上記個数分ＩＣチップ１ｃがない状態は通常では起こり得ないという判断に基づくものである。
【００３１】
【発明の効果】
以上説明したように、本発明によれば、先頭ＴＣＰを自動検出する先頭ＴＣＰ検出手段を具備するので、従来のように誤った先頭ＴＣＰをＴＣＰ用ハンドラに認識させてしまう恐れがなくなり、したがって未試験、未分類のＴＣＰがＴＣＰテープＸ上に残されるという事態を解消することができる。
【図面の簡単な説明】
【図１】 本発明の一実施形態に係わるＴＣＰ用ハンドラの要部構成図である。
【図２】 本発明の一実施形態に係わるＴＣＰ用ハンドラの先頭ＴＣＰ検出処理を示すフローチャートである。
【図３】 本発明及び従来のＴＣＰテープの構成図である。
【符号の説明】
Ｘ……ＴＣＰテープ
１……ＴＣＰ
１ａ……フィルム基板
１ｂ……テストパッド
１ｃ……ＩＣチップ
１ｄ……リード線
１ｅ……スプロケット孔
１Ａ……移送補助部
２Ａ……供給リール
２Ｂ……収容リール
３……プッシャ
４……分類装置
５……供給側テンションガイド
６……収容側テンションガイド
７……供給側サブスプロケット
８……収容側サブスプロケット
９……供給側メインスプロケット
１０……収容側メインスプロケット
１１……供給側ＩＣチップ検出装置
１２……収容側ＩＣチップ検出装置（ＴＣＰ検出手段）
１３……演算装置（判定手段）
１４……入力装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a TCP handler and a leading TCP detection method for classifying each TCP according to a test result while intermittently transporting a TCP tape in which a plurality of TCP (tape carrier packages) are connected in a tape shape. .
[0002]
[Prior art]
As is well known, TCP is a tape in which an IC chip is mounted on a film by using a TAB (tape automated bonding) technique, and a plurality of tapes are connected in the transport stage before actually being mounted on a printed circuit board. It has a form. FIG. 3 is a front view of such a tape-shaped TCP (hereinafter referred to as a TCP tape). The TCP tape X is provided with a strip-shaped transfer auxiliary portion 1A on both sides of the TCP 1 connected in a plurality. Each TCP 1 has a plurality of test pads 1b formed on the periphery of the film substrate 1a and an IC chip 1c arranged at the center thereof, and leads in which each test pad 1b and each pad on the IC chip 1c are formed by etching. Interconnected by line 1d. Further, the transfer auxiliary portion 1A is made of the same film as the film substrate 1a, and sprocket holes 1e for sequentially transferring the TCP tape X in the longitudinal direction are formed at regular intervals.
[0003]
Such a TCP tape X is intermittently fed in the longitudinal direction by a dedicated TCP handler (also referred to as a TAB handler), while the test pad 1b of each TCP1 is measured by a semiconductor integrated circuit test apparatus (commonly known as an IC tester). A functional test is performed by sequentially contacting the pins. The TCP handler is provided with a classification device that classifies each TCP 1 according to the test result by the IC tester. This classification apparatus separates and removes only TCP 1 determined to be defective from the TCP tape X by punching.
[0004]
[Problems to be solved by the invention]
By the way, when each TCP1 on the TCP tape X is transferred by the TCP handler and tested by the IC tester, it is necessary to designate the first TCP (first TCP) to be tested on the TCP tape X. Conventionally, an operator decides a leading TCP, transports the TCP1 to a position designated by the TCP handler by a manual operation, and starts a test to make the TCP handler recognize the leading TCP.
[0005]
However, since such a leading TCP designation method is based on the operator's operation and confirmation, there is a risk that the TCP header will recognize the wrong leading TCP due to a work mistake. When such a situation occurs, there is a problem that untested and unclassified TCP is left on the TCP tape X.
[0006]
The present invention has been made in view of the above-described problems, and an object of the present invention is to allow a TCP handler to automatically recognize a leading TCP.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, in the present invention, as a first means related to a handler for TCP, a TCP integrated with a plurality of TCPs is sequentially intermittently fed, and each TCP test pad is measured by a semiconductor integrated circuit test apparatus. A TCP handler that sequentially contacts and connects pins to each TCP for testing by a semiconductor integrated circuit testing apparatus, and automatically detects a leading TCP positioned at the beginning on a TCP tape prior to the contact connection. Means including a detecting means is employed.
[0008]
Also, as a second means related to the TCP handler, in the first means, the leading TCP detection means includes a TCP detection means for detecting the presence of TCP on the TCP tape at a predetermined position, and a TCP tape from the supply side. When TCP is detected by the TCP detection means when transported to the accommodation side, TCP is subsequently detected when TCP is not detected continuously for a predetermined determination value H or more when the TCP tape is transported from the accommodation side to the supply side. A means is adopted that comprises a TCP detected by the detection means and a determination means for determining the TCP as the leading TCP.
[0009]
As a third means related to the TCP handler, in the first or second means, the TCP detection means is for confirming the operation of the sorting apparatus for removing defective TCP from the TCP tape based on the test result. A means of being an accommodation side IC chip detection device that detects the presence of an IC chip in each TCP is adopted.
[0010]
As a fourth means related to the TCP handler, in any of the first to second means, the determination value H is the value on the TCP used for the test when there is no TCP missing on the TCP tape. Accommodating side IC chip detecting device for detecting the presence of an IC chip in each TCP in order to confirm the operation of the supplying side IC chip detecting device for detecting the presence of the IC chip and the sorting device for removing defective TCP based on the test result The number of TCPs that can exist between the two is adopted.
[0011]
On the other hand, in the present invention, as a first means related to the leading TCP detection method, when TCP is detected when the TCP tape is transferred from the supply side to the storage side, the TCP tape is then transferred from the storage side to the supply side. In such a case, when TCP is not detected continuously for a predetermined determination value H or more, a means is adopted in which the previously detected TCP is determined as the leading TCP.
[0012]
Further, as a second means related to the leading TCP detection method, in the first means, the determination value H is an IC chip on the TCP used for the test when there is no TCP missing on the TCP tape. A supply-side IC chip detection device that detects the presence of a chip and a receiving-side IC chip detection device that detects the presence of an IC chip in each TCP in order to confirm the operation of a sorting device that removes defective TCP based on the test result A means that the number of TCPs that can exist between them is adopted.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a TCP handler and a leading TCP detection method according to the present invention will be described with reference to the drawings.
[0014]
FIG. 1 is a configuration diagram of a main part of a TCP handler according to the present embodiment. In FIG. 1, X is a TCP tape, 2A is a supply reel, 2B is a storage reel, 3 is a pusher, 4 is a sorting device, 5 is a supply side tension guide, 6 is a storage side tension guide, and 7 is a supply side sub-sprocket. , 8 is an accommodation side sub-sprocket, 9 is a supply side main sprocket, 10 is an accommodation side main sprocket, 11 is a supply side IC chip detection device, 12 is an accommodation side IC chip detection device (TCP detection means), and 13 is an arithmetic unit ( (Determination means) 14 is an input device. Among these components, the accommodation-side IC chip detection device 12 and the arithmetic device 13 constitute the leading TCP detection means in this embodiment.
[0015]
The TCP tape X is the same as the TCP tape X already described in FIG. 3, and a plurality of TCPs 1 are connected to form a tape. In addition, leader tapes of a predetermined length are respectively attached to the front end portion and the rear end portion of the TCP tape X. Further, TCP1 does not continuously exist on the TCP tape X, and TCP1 determined to be defective by a test or the like in the previous process is removed by punching.
[0016]
The supply reel 2A winds and stores the TCP tape X, and sequentially feeds the TCP tape X from the tip by rotating. The accommodation reel 2B sequentially takes up the TCP tape X that has been sent out from the supply reel 2A and has been tested. That is, the direction of transport of the TCP tape X during the test (the transport direction A during the test) is the direction in which the tape is fed out from the supply reel 2A and wound around the storage reel 2B, that is, from the supply side sub sprocket 7 to the storage side sub sprocket 8 Direction (right direction on the page).
[0017]
The pusher 3 presses the TCP tape X to sequentially contact and connect the test pads 1b of each TCP1 to the measurement pins of the IC tester. Each TCP 1 is subjected to an operation test by an IC tester in a state where the test pad 1b is in contact with the measurement pin. The classification device 4 is provided at the subsequent stage of the pusher 3 and separates and removes the TCP 1 determined as a defective product as a result of the test from the TCP tape X by punching.
[0018]
The supply-side tension guide 5 is provided between the supply-side IC chip detection device 11 and the supply-side main sprocket 9 and applies a back tension to the TCP tape X pressed by the pusher 3. The accommodation-side tension guide 6 is provided between the accommodation-side main sprocket 10 and the classification device 4, and applies a forward tension to the TCP tape X pressed by the pusher 3. The supply-side sub-sprocket 7 sends the TCP tape X sent out from the supply reel 2 </ b> A toward the supply-side main sprocket 9.
[0019]
The storage-side sub-sprocket 8 sends the TCP tape X sent out from the storage-side main sprocket 10 toward the storage reel 2B. The supply-side main sprocket 9 is provided on the supply side of the TCP tape X in the transfer direction A during the test, and sends the TCP tape X sent out from the supply-side sub-sprocket 7 toward the accommodation-side main sprocket 10. . The accommodation-side main sprocket 10 is provided on the accommodation side of the TCP tape X with respect to the transfer direction A during the test, and sends out the TCP tape X delivered from the supply-side sub-sprocket 7 toward the accommodation-side main sprocket 10. .
[0020]
The supply-side IC chip detection device 11 is provided between the supply-side sub-sprocket 7 and the supply-side tension guide 5, detects the presence / absence of the IC chip 1 c of each TCP 1, and outputs the detection result to the arithmetic device 13. The accommodation-side IC chip detection device 12 is provided between the classification device 4 and the accommodation-side sub-sprocket 8, and the presence or absence of the IC chip 1c of each TCP1, that is, the TCP tape after the defective TCP1 is removed by the classification device 4 The presence or absence of the IC chip 1c on X is detected, and the detection result is output to the arithmetic unit 13.
[0021]
The arithmetic device 13 controls the operation of each operating unit such as the supply side main sprocket 9 and the accommodation side main sprocket 10 based on a predetermined control program. The arithmetic device 13 also performs the leading TCP detection process, which is a feature of the present embodiment. The input device 14 is used to input various operation information necessary for executing the control program to the arithmetic device 13.
[0022]
Next, the operation of the TCP handler configured as described above will be described with reference to FIG.
[0023]
First, prior to the test, the work of wrapping the TCP tape X is performed manually. In this routing operation, the leader tape at the leading end of the TCP tape drawn out from the supply reel 2A is routed around the receiving reel 2B via a predetermined path as shown in FIG. The leading end of the leader tape is adhesively fixed to the receiving reel 2B, and is wound around the receiving reel 2B by a predetermined length.
[0024]
In such a state where the wrapping work is completed, the operation test of each TCP1 on the TCP tape X is sequentially performed together with the intermittent winding of the TCP tape X. In this embodiment, as a pre-process of such a test operation, The leading TCP detection process shown in FIG. 2 is performed.
[0025]
That is, when the processing is started, the arithmetic device 13 determines whether there is an IC chip 1c on the accommodation side, that is, whether the accommodation-side IC chip detection device 12 detects the IC chip 1c (step S1). If this determination is “Yes”, that is, if the accommodation-side IC chip detection device 12 detects the IC chip 1c, the count value of the continuous IC chip non-counter set in itself is cleared and “ On the other hand, when the above determination is “No”, the TCP tape X is transferred by 1 TCP in the accommodation direction (step S3), and the determination process of step S1 is repeated.
[0026]
When the processing of step S2 is completed, the arithmetic unit 13 moves the TCP tape X by 1 TCP in the supply direction (step S4), and further whether or not the accommodation-side IC chip detection device 12 has detected the IC chip 1c. Is determined (step S5). If this determination is “No”, that is, if the accommodation-side IC chip detection device 12 detects the IC chip 1c, the process of step S2 is repeated to clear the count value of the counter without continuous IC chip.
[0027]
When the IC chip 1c (that is, TCP1) is detected in the accommodation direction in the accommodation-side IC chip detection device 12 by the series of processes related to the above steps S1 to S5, the count value of the continuous IC chip no counter is set to “0”. Cleared. Here, the IC chip 1c (that is, TCP1) detected by the accommodation-side IC chip detection device 12 is a leading TCP candidate, and whether or not this candidate is recognized as the leading TCP by the processes related to steps S6 and S7 below. Is determined based on the count value of the continuous IC chip non-counter.
[0028]
That is, when the determination in step S5 is “Yes”, the arithmetic unit 13 increments the count value of the counter without continuous IC chip to “1” (step S6), and further counts up in this way. It is determined whether or not the count value is greater than or equal to a determination value stored in advance (step S7). If this determination is “No”, the process from step S4 onward is repeated, so that the TCP tape X is sequentially transferred in the supply direction and the number of TCP1s not continuously detected is counted by the counter without a continuous IC chip. Count as a value.
[0029]
Then, the count value becomes equal to or greater than the determination value, the determination in step S7 becomes “Yes”, and all the processes are completed. In this case, TCP1 that is the reference of the count value is finally determined as the leading TCP.
[0030]
In the present embodiment, the number of TCP1s that can exist between the supply-side IC chip detection device 11 and the accommodation-side IC chip detection device 12 when there is no missing TCP1 on the TCP tape X is used as the determination value. However, the setting of such a determination value is based on the determination that a state in which there are no IC chips 1c corresponding to the number of pieces cannot normally occur.
[0031]
【The invention's effect】
As described above, according to the present invention, since the leading TCP detection means for automatically detecting the leading TCP is provided, there is no possibility of causing the TCP handler to recognize the wrong leading TCP as in the prior art. The situation where the test and unclassified TCP is left on the TCP tape X can be solved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a main part of a handler for TCP according to an embodiment of the present invention.
FIG. 2 is a flowchart showing a leading TCP detection process of a TCP handler according to an embodiment of the present invention.
FIG. 3 is a configuration diagram of the present invention and a conventional TCP tape.
[Explanation of symbols]
X …… TCP tape 1 …… TCP
DESCRIPTION OF SYMBOLS 1a ... Film substrate 1b ... Test pad 1c ... IC chip 1d ... Lead wire 1e ... Sprocket hole 1A ... Transfer auxiliary part 2A ... Supply reel 2B ... Housing reel 3 ... Pusher 4 ... Sorting device 5 ... Supply side tension guide 6 ... Accommodation side tension guide 7 ... Supply side sub sprocket 8 ... Accommodation side sub sprocket 9 ... Supply side main sprocket 10 ... Accommodation side main sprocket 11 ... Supply side IC chip detection Device 12 ... Accommodating IC chip detection device (TCP detection means)
13: Arithmetic unit (determination means)
14 …… Input device

Claims (4)

ＴＣＰ（１）が複数連接されたＴＣＰテープ（Ｘ）を順次間欠送りしつつ各ＴＣＰ（１）のテストパッド（１ｂ）を半導体集積回路試験装置の測定ピンに順次接触接続させて各ＴＣＰ（１）を半導体集積回路試験装置による試験に順次供するＴＣＰ用ハンドラであって、
ＴＣＰテープ（Ｘ）の供給側に設けられ、ＴＣＰ（１）上のＩＣチップ（１ｃ）の存在を検出する供給側ＩＣチップ検出装置（１１）と、
ＴＣＰテープ（Ｘ）の収容側に設けられ、ＴＣＰ（１）上のＩＣチップ（１ｃ）の存在を検出する収容側ＩＣチップ検出装置（１２）と、
ＴＣＰテープ（Ｘ）を供給側から収容側に移送した場合に前記収容側ＩＣチップ検出装置（１２）でＩＣチップ（１ｃ）が検出されると、ＴＣＰテープ（Ｘ）を収容側から供給側に移送し、この際に所定の判定値Ｈ以上連続してＩＣチップ（１ｃ）が前記収容側ＩＣチップ検出装置（１２）で検出されないときに、前記収容側ＩＣチップ検出装置（１２）で検出されたＩＣチップ（１ｃ）のＴＣＰ（１）をＴＣＰテープ（Ｘ）上で先頭に位置する先頭ＴＣＰと判断する判定手段（１３）とから構成され、前記接触接続に先立って、先頭ＴＣＰを自動検出する先頭ＴＣＰ検出手段を具備し、
前記判定値Ｈは、ＴＣＰテープ（Ｘ）上にＴＣＰ（１）の欠落がないとした場合に前記供給側ＩＣチップ検出装置（１１）と前記収容側ＩＣチップ検出装置（１２）との間に存在し得るＴＣＰ（１）の個数であることを特徴とするＴＣＰ用ハンドラ。While the TCP tape (X) having a plurality of TCPs (1) connected thereto is successively intermittently fed, the test pads (1b) of the TCPs (1) are sequentially contacted and connected to the measurement pins of the semiconductor integrated circuit test apparatus. ) Is a TCP handler that is sequentially provided for testing by a semiconductor integrated circuit testing device,
A supply-side IC chip detection device (11) that is provided on the supply side of the TCP tape (X) and detects the presence of the IC chip (1c) on the TCP (1);
An accommodation-side IC chip detection device (12) that is provided on the accommodation side of the TCP tape (X) and detects the presence of the IC chip (1c) on the TCP (1);
When the IC chip (1c) is detected by the accommodation-side IC chip detection device (12) when the TCP tape (X) is transferred from the supply side to the accommodation side, the TCP tape (X) is moved from the accommodation side to the supply side. When the IC chip (1c) is not detected by the accommodation-side IC chip detection device (12) continuously for a predetermined determination value H or more at this time, it is detected by the accommodation-side IC chip detection device (12). And a determination means (13) for determining the TCP (1) of the IC chip (1c) as the leading TCP positioned at the head on the TCP tape (X), and automatically detecting the leading TCP prior to the contact connection. Including a leading TCP detection means,
The determination value H is between the supply-side IC chip detection device (11) and the accommodation-side IC chip detection device (12) when there is no missing TCP (1) on the TCP tape (X). A TCP handler characterized by the number of TCP (1) that can exist. 供給側ＩＣチップ検出装置（１１）は、試験に供されるＴＣＰ（１）上のＩＣチップ（１ｃ）の存在を検出するためにＴＣＰテープ（Ｘ）の供給側に設けられたものであり、収容側ＩＣチップ検出装置（１２）は、試験結果に基づいて不良のＴＣＰ（１）を除去する分類装置（４）の動作を確認するためにＴＣＰテープ（Ｘ）の収容側に設けられたものであることを特徴とする請求項１記載のＴＣＰ用ハンドラ。The supply side IC chip detection device (11) is provided on the supply side of the TCP tape (X) in order to detect the presence of the IC chip (1c) on the TCP (1) to be tested. The accommodation-side IC chip detection device (12) is provided on the accommodation side of the TCP tape (X) in order to confirm the operation of the classification device (4) that removes the defective TCP (1) based on the test result. The TCP handler according to claim 1, wherein: ＴＣＰ（１）が複数連接されたＴＣＰテープ（Ｘ）を順次間欠送りしつつ各ＴＣＰ（１）のテストパッド（１ｂ）を半導体集積回路試験装置の測定ピンに順次接触接続させて各ＴＣＰ（１）を半導体集積回路試験装置による試験に順次供するＴＣＰ用ハンドラにおける先頭ＴＣＰの検出方法であって、
ＴＣＰテープ（Ｘ）を供給側から収容側に移送した場合に、収容側に設けられた収容側ＩＣチップ検出装置（１２）でＴＣＰ（１）上のＩＣチップ（１ｃ）が検出されると、ＴＣＰテープ（Ｘ）を収容側から供給側に移送し、この際にＴＣＰテープ（Ｘ）上にＴＣＰ（１）の欠落がないとして供給側に設けられた供給側ＩＣチップ検出装置（１１）と前記収容側ＩＣチップ検出装置（１２）との間に存在し得るＴＣＰ（１）の個数以上連続してＩＣチップ（１ｃ）が検出されないときに、先に検出されたＩＣチップ（１ｃ）のＴＣＰ（１）を先頭ＴＣＰと判断することを特徴とする先頭ＴＣＰ検出方法。 While the TCP tape (X) having a plurality of TCPs (1) connected thereto is successively intermittently fed, the test pads (1b) of the TCPs (1) are sequentially contacted and connected to the measurement pins of the semiconductor integrated circuit test apparatus. ) Is a method for detecting a leading TCP in a TCP handler that is sequentially subjected to a test by a semiconductor integrated circuit testing device,
When the TCP tape (X) is transferred from the supply side to the storage side, when the IC chip (1c) on the TCP (1) is detected by the storage-side IC chip detection device (12) provided on the storage side, A supply-side IC chip detection device (11) provided on the supply side for transporting the TCP tape (X) from the accommodation side to the supply side, assuming that there is no missing TCP (1) on the TCP tape (X). When the IC chip (1c) is not detected continuously more than the number of TCP (1) that can exist between the receiving-side IC chip detection device (12), the TCP of the IC chip (1c) detected first. A method for detecting a leading TCP, wherein (1) is determined to be a leading TCP. 供給側ＩＣチップ検出装置（１１）として、ＴＣＰ（１）上のＩＣチップ（１ｃ）の存在を検出するために供給側に設けられたものを用い、収容側ＩＣチップ検出装置（１２）として、不良のＴＣＰ（１）を除去する分類装置（４）の動作を確認するために収容側に設けられたものを用いることを特徴とする請求項３記載の先頭ＴＣＰ検出方法。As the supply-side IC chip detection device (11), a device provided on the supply side for detecting the presence of the IC chip (1c) on the TCP (1) is used, and as the accommodation-side IC chip detection device (12), 4. The method for detecting a leading TCP according to claim 3, wherein a device provided on the accommodation side is used for confirming the operation of the classification device (4) for removing the defective TCP (1).
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