JP5788722B2 - Semiconductor device testing apparatus and central punch apparatus - Google Patents

Description

  The present invention relates to a semiconductor device test apparatus for discriminating whether a semiconductor integrated circuit such as a liquid crystal driver as a semiconductor device mounted on a semiconductor carrier film is a non-defective product or a defective product, and a centralized punch device used therefor About.

  In this type of conventional semiconductor device test equipment, a characteristic of the TCP (tape carrier package) device as a semiconductor carrier film is that a plurality of semiconductor devices are arranged side by side and mounted in a tape shape and cannot be separated into individual pieces. And defective products are mounted on the same tape. For this reason, it is necessary to identify whether the plurality of semiconductor devices arranged on the tape are non-defective or defective. For this reason, each company employs a method for mark punching a non-defective product (good product mark punch) or a method for punching a defective device as a quality discrimination method for a plurality of semiconductor devices.

  Patent Document 1 discloses a test method for calculating an error threshold based on a test result and determining whether to perform a continuous test or to punch a defective device as a test apparatus and test method for a semiconductor integrated circuit.

  FIG. 7 is a side view showing a configuration example of a main part of a conventional semiconductor device testing apparatus disclosed in Patent Document 1. In FIG.

  As shown in FIG. 7, a conventional semiconductor device testing apparatus 100 includes a handler apparatus 110 and a tester 120.

  The handler device 110 includes a delivery reel 111a, a take-up reel 111b, a tape carrier 112, a TCP device (semiconductor integrated circuit) 112a, a take-up portion 113 that is a tape carrier take-up means, a puncher 114, and a handler control device 115. .

  The tester 120 includes a probe card 121, a test head 122, and a tester control device 123. Between the guide rollers 116 and 117, a probe card 121, a winding unit 113, and a puncher 114 are arranged in this order. The winding unit 113 includes three guide rollers 113a, 113b, and 113c.

  The handler control device 115 controls the handler 110 as a whole. The tester control device 123 controls the entire tester 120. The handler control device 115 and the tester control device 123 are connected by an interface such as GPIB (General Purpose Interface Bus: one of bus standards), and are configured to control each other.

  With the above configuration, the tape carrier 112 set on the delivery reel 111a in the handler device 110 and having the plurality of TCP devices 112a mounted on the tape is delivered from the delivery reel 111a for each device. The TCP devices 112a on the fed tape carrier 112 are sequentially set on the probe card 121 on the test head 122 of the tester 120 one by one. When the TCP device 112a is set on the probe card 121, the handler control device 115 outputs a test start signal to the tester control device 123, and the tester 120 starts the test in response to the test start signal. The determination result is returned to the handler control device 115.

  In this case, in the handler control device 115, the error rate calculated by the error rate calculating unit is compared with the error rate threshold value read from the storage unit by the error rate comparing unit, and the comparison result by the error rate comparing unit is obtained. When the error rate calculated by the error rate calculation means exceeds the error rate threshold, the test apparatus side may be out of order such as a contact failure on the test apparatus side. A signal for stopping the punching of the integrated circuit is output to the puncher 114. For example, when a predetermined number continuously becomes defective due to poor contact on the tester side, it may not be defective when the test apparatus is stopped and the test apparatus is restarted. As a result, the device after the stop is not punched, and it is remedied that the device becomes a defective device after that, and if necessary, the semiconductor integrated circuit of the winding unit 113 is retested, and the winding unit It is also possible to rescue what was a defective device in 113.

  Next, Patent Document 2 discloses a TAB test apparatus that recognizes images of TAB before and after test measurement.

  FIG. 8 is a side view showing a configuration example of a main part of a conventional TAB test apparatus disclosed in Patent Document 2.

  As shown in FIG. 8, in the conventional TAB test apparatus 200, the supply reel 201 is mounted with a tape carrier 202, the receiving reel 203 winds up the tape carrier 202 that has been subjected to an electrical test or classification, and the pusher 204 is a tape carrier 202. By pressing the TAB, the TAB is brought into contact with the IC tester. The sprocket 205a and the sprocket 205b rotate in synchronization to transfer the tape carrier 202, and the punch unit 206 opens an identification hole in the TAB of the tape carrier 202 or punches out an IC chip according to the result of the electrical test. The imaging camera 207 captures an image of the TAB by the light emitted from the light source 208, the image processing unit 209 receives image data from the imaging camera 207 and performs image processing, and the control unit 210 receives the imaging data of the image processing unit 209. The position of the TAB at the time of measurement is controlled. The imaging camera 211 is arranged in the previous stage of the measurement of the tape carrier 202, the imaging camera 211 captures a TAB image, and outputs first image data from the imaging camera 211 to the image processing unit 209. In addition, the imaging camera 212 is disposed at the rear stage of the punch unit 206, the imaging camera 212 captures a TAB image, outputs second image data from the imaging camera 212 to the image processing unit 209, and outputs the first image data. TAB measurement availability data is stored in the control unit 210, the second image data is sent to the control unit 210, and compared with the first image data and the punching result of the punch unit 206.

  The imaging cameras 211 and 212 accurately detect the presence / absence of a TAB, the presence / absence of an IC chip, and the presence / absence of a mark hole by image recognition. Imaging data from the imaging camera 211 is stored in the control unit 210, and commands execution or non-execution of measurement at the time of TAB measurement. Data captured by the imaging camera 212 is compared with the data captured by the imaging camera 211 or compared with a punching command from the punch unit 206.

  Thus, erroneous detection can be prevented by recognizing TAB images before and after measurement by the imaging cameras 211 and 212.

JP 2007-285770 A JP 7-86355 A

  In any case, when identifying a good / defective product, there are a good product mark punch method for punching a good product and a defective device punching method for punching a defective device. In the good product mark punch method, a punch with a diameter of about 2 mm is used. Since punching is performed on a non-defective product with a mold, there is a risk of punching burrs. In particular, when the yield is good, this punching time and mark punch detection time are required. On the other hand, in the defective device punching method, since the defective device is punched for each device including the IC chip, after punching for each device, the defective device is broken and cannot be retested. Can not.

  In Patent Document 1, when the error rate exceeds a predetermined error rate threshold, the test device is stopped, and even if the predetermined number continuously becomes defective due to contact failure on the test device side, Since the number of defective devices is not increased further by stopping, the defective devices can be repaired to some extent, but the defective devices cannot be repaired more efficiently and completely.

  In the test apparatus of Patent Document 2, although the TAB is recognized before and after the measurement by the imaging cameras 211 and 212, erroneous detection is prevented. There is a possibility.

  The present invention solves the above-mentioned conventional problems, shortens the handling time during the measurement test, and can also relieve a device once determined to be defective, thereby further improving the yield. It is an object of the present invention to provide a test apparatus and a concentrated punch apparatus used therefor.

  A semiconductor device test apparatus according to the present invention is a semiconductor device test apparatus for identifying the quality of a plurality of semiconductor devices mounted on a semiconductor carrier film, and performs a predetermined measurement test on the plurality of semiconductor devices. One or more handler devices, a database in which measurement test results measured by the one or more handler devices are stored as tape map data via a network, and a defective device based on the tape map data of the database It has one or a plurality of concentrated punch devices for punching from a semiconductor carrier film, whereby the above object is achieved.

  Preferably, the concentrated punching apparatus in the semiconductor device testing apparatus of the present invention compares the relationship between the empty device position in the tape map data and the address data of the defective device, and then identifies the defective device as the semiconductor carrier. Punch from film. Preferably, the concentrated punching apparatus in the semiconductor device test apparatus of the present invention is configured to check the relationship between the empty device position in the tape map data and the address data of the defective device, and to identify the defective device as the semiconductor carrier. Punch continuously from film.

  Further, preferably, in the semiconductor device test apparatus of the present invention, the collating process between the empty device position in the tape map data and the address data of the defective device is performed by the empty device position closest to the upstream side of the address data of the defective device. Using the tape address data as a reference position, the address position of the defective device from the empty device position is collated.

  More preferably, the empty device position in the semiconductor device test apparatus of the present invention is address data punched beforehand in a “no device state” as a semiconductor carrier film defect.

  Still preferably, in a semiconductor device test apparatus according to the present invention, the handler device includes a contact of an IC tester that is in contact with a plurality of terminals of the semiconductor device sequentially mounted on the semiconductor carrier film. A measurement test is performed to determine whether each semiconductor device is good or bad.

  Further preferably, in the semiconductor device testing apparatus of the present invention, the defective device is punched out of the semiconductor carrier film by the central punching device connected to the handler device via the database in the network. .

  Further preferably, the plurality of handler apparatuses in the semiconductor device test apparatus of the present invention are configured to be able to perform a re-measurement test, and are provided with a monitoring control unit that monitors measurement test results obtained from the plurality of handler apparatuses, When a predetermined reference number of defective devices are continuously detected in the measurement test or when a defective device detection rate equal to or greater than a predetermined reference value is detected, the handler apparatus in which the defective device is detected is automatically stopped.

  Further, preferably, the defective device data in the tape map data of the database in the semiconductor device testing apparatus of the present invention is tape-synthesized and changed to non-defective device data as the result data of the remeasurement test.

  Further preferably, as a measurement test result measured by the handler device in the semiconductor device test apparatus of the present invention, a plurality of rank information is added in addition to the pass / fail identification information and stored as the tape map data in the database. .

  Further, preferably, instead of punching out a defective device in the semiconductor device test apparatus of the present invention, a semiconductor device having one rank information among the plurality of rank information is left, and a semiconductor device having other rank information is provided. The central punching device is punched on the basis of the tape map data in the database, and all or a part of the punched rank information is reorganized for each rank information.

  Further preferably, after collating the relationship between the empty device position in the tape map data and the address data of the semiconductor device other than the rank information of one of the plurality of rank information in the semiconductor device test apparatus of the present invention. Then, instead of punching the defective device, the semiconductor device other than the one rank information is punched from the semiconductor carrier film by the concentrated punching device. Preferably, while checking the relationship between the empty device position in the tape map data and the address data of the semiconductor device other than the rank information of one of the plurality of rank information in the semiconductor device test apparatus of the present invention Instead of punching the defective device, the semiconductor device other than the one rank information is continuously punched from the semiconductor carrier film by the concentrated punch device.

  Further preferably, in the semiconductor device testing apparatus according to the present invention, the collation process between the empty device position in the tape map data and the address data of the semiconductor device other than the one rank information is performed by the semiconductor device other than the one rank information. The address position of the semiconductor device other than the one rank information from the empty device position is collated with the tape address data of the empty device position immediately upstream of the address data as the reference position.

  Further preferably, the handler device in the semiconductor device test apparatus of the present invention is configured such that the contact of the IC tester is brought into contact with a plurality of terminals of the semiconductor device sequentially mounted on the semiconductor carrier film, and the inside of the semiconductor carrier film. The rank identification measurement test including the pass / fail identification of each semiconductor device is performed.

  Further preferably, in the semiconductor device testing apparatus according to the present invention, the semiconductor device other than the one rank information is transferred to the semiconductor carrier by the centralized punching device connected to the handler device via the database in the network. Concentrate and punch from the film.

  Further preferably, the plurality of handler apparatuses in the semiconductor device test apparatus of the present invention are configured to be able to perform a re-measurement test, and are provided with a monitoring control unit that monitors measurement test results obtained from the plurality of handler apparatuses, In the measurement test, when a predetermined reference number of semiconductor devices having predetermined rank information are detected or when a detection rate of predetermined rank information semiconductor devices equal to or higher than a predetermined reference value is detected, the predetermined rank information semiconductor device is The detected handler device is automatically stopped.

  Further preferably, the predetermined rank information semiconductor device data in the tape map data of the database in the semiconductor device test apparatus of the present invention is tape-map-combined with another predetermined rank information semiconductor device data as result data of the remeasurement test. To change.

  The central punch apparatus according to the present invention is a database tape map in which measurement test results measured by one or a plurality of handler apparatuses that perform a predetermined measurement test on a plurality of semiconductor devices are stored as tape map data via a network. A defective device or a predetermined rank device is punched out from the semiconductor carrier film based on the data, and the above object is achieved.

  Preferably, in the centralized punching apparatus of the present invention, after checking the relationship between the empty device position in the tape map data and the address data of the defective device or the predetermined rank device, the defective device or the predetermined rank device is Punched from the semiconductor carrier film. Preferably, in the centralized punching apparatus of the present invention, the defective device or the predetermined rank device is checked while checking the relationship between the empty device position in the tape map data and the address data of the defective device or the predetermined rank device. Continuously punched from the semiconductor carrier film.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, one or a plurality of handler apparatuses that perform a predetermined measurement test on a plurality of semiconductor devices, and a measurement test result obtained by performing the measurement test on one or a plurality of handler apparatuses are stored as tape map data via a network. And one or a plurality of central punching devices for punching out defective devices from the semiconductor carrier film based on the tape map data of the database.

  As a result, the handling time during the measurement test can be shortened, and the device once determined to be defective can be remedied, and the yield can be further improved.

  As described above, according to the present invention, the handling time during the measurement test can be shortened, and a device that has been determined to be defective can be relieved. In this way, the handling time during the measurement test can be shortened, and the rank classification data and defective devices can be relieved by adding the rank classification data to the map data.

It is a side view which shows typically the example of a principal part structure of the test device of the semiconductor device in Embodiment 1 of this invention. It is a top view which shows a part of TCP of FIG. (A) is a figure which shows a mode that the several handler apparatus which performs a measurement and a punch is arrange | positioned separately in the conventional case, (b) performs a punch with the several handler apparatus which performs the measurement of FIG. It is a figure which shows a mode that the central punch apparatus was connected with the network via the database. It is a data diagram for demonstrating the collation process of the TCP device data in a database, and tape map data in the case of punching out TCP collectively with the central punch apparatus of FIG. It is a figure explaining the case where the tape carrying the device for every rank data to which rank information is added is created. It is a figure which shows the tape map data after synthesize | combining the tape map data before and after the re-measurement test, the tape map data which shows the result of the re-measurement test of only the defective product of the tape map data before the re-measurement test. It is a side view which shows the principal part structural example of the testing apparatus of the conventional semiconductor device currently disclosed by patent document 1. FIG. It is a side view which shows the principal part structural example of the conventional TAB test apparatus currently disclosed by patent document 2. FIG.

  Embodiment 1 of a semiconductor device test apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a side view schematically showing a configuration example of a main part of a semiconductor device test apparatus according to Embodiment 1 of the present invention. FIG. 2 is a plan view showing a part of the TCP of FIG.

  1 and 2, in the test apparatus 1 for the semiconductor device 41 of the first embodiment, one or a plurality of handler apparatuses including an IC tester 51 as a measurement unit that performs a predetermined measurement test on the plurality of semiconductor devices 41. 5, a database 6 in which test results measured by one or a plurality of handler devices 5 are stored as tape map data via a network, and a defective device is identified as a semiconductor carrier film (COF (COF) based on the tape map data in the database 6. (This is referred to as TCP 4), and one or a plurality of central punching devices 7 for punching from TCP 4), and the defective devices are punched to identify the quality of the plurality of semiconductor devices mounted on TCP 4. be able to.

  In TCP4 (tape carrier package), a plurality of semiconductor devices 41, which are semiconductor integrated circuits (ICs) such as liquid crystal drivers, are mounted side by side on a tape, and a plurality of semiconductor devices 41 are respectively connected via a plurality of wirings. The terminals 42 are respectively arranged around the terminals 42. At the time of the measurement test, a plurality of probes from the probe card of the IC tester 51 serving as a measurement unit are brought into contact with each predetermined terminal 42 of each semiconductor device 41 to apply a predetermined voltage to each terminal 42 of the TCP 4. According to the measurement test result whether or not the expected value output in the predetermined range is obtained, if the expected value output in the predetermined range is not obtained, it is determined as a defective product, and the measurement results are recorded in the database 6 in the order of the measurement test addresses. Then, from the TPC device data in the database 6, tape map data including the relationship with the empty device position of the TCP defective “no device” is created. Note that the TCP defective empty device position in this case is unique for each lot. TCP4 is a device in which a semiconductor chip of a semiconductor device 41 is mounted on a pad 43 by wire bonding or the like to a plurality of terminals 42 to which wiring is connected. Defects such as chipping of the pad 43, the wiring and the terminal 42, and other damages are punched in advance as TCP defective empty device positions so that the semiconductor chip is not mounted. That is, the empty device position is address data punched out in a “no device state” as a TCP failure. For example, several percent of the plurality of semiconductor devices 41 of the TCP 4 have empty device positions with a TCP defect, and this is used to reinforce the positioning of the measurement address.

  The handler device 5 performs a predetermined measurement test on the semiconductor device 41 of the TCP 4 supplied from the supply reel 2 and then collects the TCP 4 on the recovery reel 3 for recovery. A test test is performed by connecting a contact such as a probe of the IC tester 51 to a plurality of terminals 42 of the semiconductor device 41 and applying a predetermined voltage to the terminal 42 to determine whether the output current or output voltage is within a predetermined range. By doing so, the pass / fail judgment test of each semiconductor device 41 in the TCP 4 is sequentially performed.

  The IC tester 51 is configured such that when the semiconductor device 41 is an IC device such as a liquid crystal driver, a predetermined voltage can be applied to a predetermined terminal 42 of each semiconductor device 41 via a contact at a predetermined timing. An output current or voltage is output to a predetermined other terminal 42 of each semiconductor device 41 via a contact. It is determined whether or not the output current or voltage input from the predetermined separate terminal 42 via the contact is within a predetermined range, and when this is out of the predetermined range, it is determined that the device is defective.

  In addition, when the semiconductor device 41 is an LED element, the IC tester 51 is configured so that a predetermined voltage can be applied to a predetermined terminal 42 of each semiconductor device 41 through a contact at a predetermined timing. A light emission amount measuring means including an image sensor for detecting the light emission amount of the semiconductor device 41 is provided, and if the light emission amount obtained from the light emission amount measuring means does not reach a predetermined reference light emission amount, this is detected to be a defective device. judge. These pass / fail judgment results (measurement test results) are recorded and controlled in the database 6 by a predetermined recording control unit in the IC tester 51 via the network. In addition, this measurement test can also be comprised so that it may determine in multiple rank divisions other than quality determination.

  In the database 6, measurement test results obtained by performing a pass / fail judgment test with one or a plurality of handler devices 5 are recorded as tape map data via a network. This tape map data can correspond to the relationship between the address data at the empty device position and the tape address data in TCP4.

  Based on the tape map data in the database 6, the central punching device 7 collates the relationship between the “no device” empty device position and the tape address data in the measurement order in this tape map data, The punching process is performed by using a punch unit 71 composed of a punch die. In this way, information on the empty device position (tape failure and no device) is added to the tape map data in addition to the non-defective and defective product information, and the empty device position is unique for each tape lot. Always collates as ID information.

  Conventionally, a predetermined voltage is applied to a plurality of terminals 42 of the TCP 4 to perform a measurement test as to whether an expected value output within a predetermined range is obtained, and an expected value output within a predetermined range is obtained according to the measurement test result. However, in the first embodiment, during the measurement test by the handler device 5, for example due to a contact failure on the test device 1 side. Since defective devices may occur continuously in succession, defective devices are punched in a concentrated manner after the measurement test using the position of the measurement test result data without performing the punching of defective devices during the measurement test. In this case, in order not to make a mistake in the position of the TCP defective device, the empty device position in which the TCP defect is empty is collated with the pass / fail position of the measurement result data, and the defective device is punched accurately.

  In short, in the first embodiment, instead of the non-defective product / defective product punching method used as a good product identification in the TCP product, punching is performed using a centralized punch device 7 which is a separate device connected to the handler device 5 via a network. To do. Since this central punching method has a possibility of tape map shift, it is possible to prevent tape map shift by checking the empty device position (the position where the TCP defect is empty) with the determination result of the measurement address. it can.

  Hereinafter, an example of the semiconductor integrated circuit test apparatus 1 according to the first embodiment will be described more specifically.

  FIG. 3A is a diagram showing a state in which a plurality of handler devices for performing a measurement test and punching are individually arranged in the conventional case, and FIG. 3B is a diagram of the semiconductor integrated circuit according to the first embodiment. FIG. 2 is a diagram showing a state in which a plurality of handler devices 5 that perform the measurement test of FIG. 1 and a central punch device 7 that performs punching are connected via a database 6 in the test apparatus 1 via a network.

  As shown in FIG. 3 (a), in the conventional case, a plurality of handler devices for performing a measurement test and punching are individually arranged, and as a result of the measurement test, defective devices including IC chips are punched for each device. The

  On the other hand, as shown in FIG. 3B, in the semiconductor device testing apparatus 1 of the first embodiment, a plurality of handler apparatuses 5 for performing the measurement test of FIG. Therefore, only a measurement test is performed by a plurality of handler devices 5, and even if defective devices due to contact failure on the test device 1 side continuously occur, these are automatically detected. Then, the handler device 5 may be stopped, or the handler device 5 may be manually paused, and the defective device can be easily retested to rescue the defective device. . Thereafter, the TCP device including the IC chip 41 of the defective device can be accurately punched together by the central punch device 7.

  In short, the plurality of handler devices 5 are configured to be able to perform a re-measurement test, and a monitoring control unit (not shown) for monitoring measurement test results (tape map data) obtained from the plurality of handler devices 5 is provided for measurement. When a predetermined reference number of defective devices are continuously detected in the test or when a defective device detection rate equal to or higher than a predetermined reference value is detected, the handler device 5 in which the defective device is detected is automatically stopped. The re-measurement test is easily performed on the defective device.

  FIG. 4 is a data diagram for explaining a collation process between the TCP device data in the database and the tape map data when TCP is punched together by the central punching device 7 of FIG.

  As shown in FIG. 4, the data collation process when the central punching device 7 collectively punches out the TCP is performed in the TCP device data stored in the database 6 and the tape map data in which the pass / fail judgment result is stored. , By always collating the tape address of the empty device position of “no device” (the position where the TCP defective device is empty) and the address position of the defective device, it is possible to prevent erroneous punching. Even if erroneous punching occurs, only the section from the empty device position to the next empty device position is targeted, and damage is suppressed to a minimum.

  In this case, the matching process between the empty device position in the tape map data and the address data of the defective device is performed by using the tape address data of the empty device position closest to the upstream side of the address data of the defective device as a reference position. This is performed by associating addresses from the empty device position of the address position. For the address from the empty device position of the defective device address position, the difference between the empty device positions closest to the upstream side may be obtained from the address data of the defective device.

  Next, as a measurement test result, not only pass / fail judgment but also rank information can be added to partially relieve defective devices. This will be described with reference to FIG.

  FIG. 5 is a diagram for explaining a case where a tape on which a device for each rank data to which rank information is added is mounted is created.

  In FIG. 5, the leftmost TCP device data includes, as a measurement test result measured by the handler device 5, as rank information, for example, non-defective product A rank, non-defective product B rank, defective product A rank, and defective product. Rank B is added and stored in the database 6 as tape map data.

  With respect to the tape map data in which rank information is given to the leftmost TCP device data, in the next non-defective A rank lot data from the left, only the non-defective A rank is left as rank information, and other rank information TCP devices ( A plurality of terminals 42) are punched out via the IC device 41 and wiring. This non-defective A rank product is shipped as a standard product in a tape state including a punched portion.

  The third non-defective B rank lot data and the right most defective A rank lot data from the left are individually tape-knitted. The non-defective product B rank product and the defective product A rank product are each shipped in a tape state as different standard products. That is, each of the non-defective product B rank product and the defective product A rank product is shipped again (re-ASSY) on the tape as shown in FIG.

  The defective product A rank may be used according to the intended use as long as the IC device 41 is a liquid crystal driver, for example, even if there is a problem with the current consumption value at the quadruple speed and there is no problem at the normal speed. it can. Further, when the IC device 41 is, for example, an LED element, the IC device 41 is ranked according to the light emission intensity, and the LED elements having the respective light emission intensities are used in combination.

  The semiconductor device of the rank information (here, good product B rank, defective product A rank and defective product B rank) other than the rank information (here, good product A rank) is left out of a plurality of rank information. The central punch device 7 is punched based on the tape map data in the database 6, and all or a part of the punched rank information (here, good product B rank and defective product A rank) is the rank of the semiconductor device. Each information is re-mounted on the tape and reorganized.

  Next, data superposition after the tape map data re-measurement test will be described.

  FIG. 6 shows the tape map data before the re-measurement test, the tape map data showing the result of the re-measurement test of only defective tape map data, and the tape map data after the tape map data before and after the re-measurement test are synthesized. FIG.

  At the time of the measurement test, since a defective device is not punched out, a retest can be easily performed. For example, when defective devices are continuously generated due to poor contact on the test apparatus 1 side, as shown in FIG. 6, a re-measurement test of the defective device in the tape map data before the re-measurement test is performed. In the case of a non-defective product judgment, the corresponding tape map data before the re-measurement test is used as the re-measurement test result while matching the address data of the non-defective product with the address position of “no device”. change.

  As described above, in the first embodiment, first, the measurement test result is stored as the tape map data in the database 6 without punching out a defective device at the time of the measurement test, and the whole or a part of the tape map data is monitored. Then, it may be automatically determined whether a re-measurement test is necessary, or the number of defective devices may be a predetermined reference defect rate (which may be the whole or between empty device positions. If a predetermined number of defective devices are detected continuously in the measurement test, the measurement test by the handler device 5 is automatically stopped, and only the defective device is separately stored in the tape map data. Based on the address position of the defective device, the remeasurement test may be performed while collating with the address position of “no device”.

  Next, as shown in FIG. 6, the pass / fail judgment is made here. However, when the re-measurement test of the device corresponding to the defective device in the tape map data before the re-measurement test is performed and the non-defective product is judged, Corresponding tape map data before the re-measurement test is changed while collating the address data determined as “no device” with the address position.

  Thereafter, based on the changed tape map data, after collating with the address position of “no device”, the defective device is punched out by the central punching device 7.

  As described above, since punching is performed using the centralized punching device 7 which is a separate device connected to the handler device 5 via the network, only the tape map data storing the measurement test result by the handler device 5 is obtained and the handler device 5 performs punching. Do not do. For this reason, since the handling time during the measurement test can be shortened and the map data result can be overlaid and the data can be updated, the remeasurement test can be easily performed. Can be relieved, and the yield can be improved. In this case, since the punching process is performed by a separate device, the drilling time (punching time) and the tick time during the measurement test can be eliminated, and the operating rate of the IC tester 51 can be improved. Using tape map data, it is possible to perform a remeasurement test for defective devices or specific item failures. In addition, a re-measurement test with another device is possible. In this re-measurement test, the tape map data is superimposed.

  In the conventional display method, only good / defective products were identified, but by adding rank classification information to good and defective tape map information, it can be relieved as a non-defective product after punching and re-assy. It becomes. In short, in addition to non-defective product and defective product processing using tape map data, ranking data is added to the tape map data by adding ranking data, for example, ranking of non-defective devices, for example, repair of defective devices. (Rank fall goods) becomes possible.

  In addition, address information for empty devices (tape failure and no devices) is also added to the tape map data, and address matching is also performed on the relationship between the address position to be punched out and the address information for the empty device to prevent erroneous device punching. be able to. Even if erroneous punching occurs, the section from the empty device to the next empty device is targeted, and the occurrence of a minimum loss can be suppressed. Further, since the central punching device 7 performs the punching collectively, the punch unit 71 which is a punching die possessed by each handler device 5 can be dispensed with, and the punch in the handler device as in the conventional case can be eliminated. It is possible to prevent dust generated sometimes, and to suppress the number of punching dies, thereby reducing the number of punching dies to be managed.

  In the first embodiment, a plurality of rank information is added to the database 6 as tape map data in addition to the pass / fail identification information as a measurement test result measured by the handler device 5. In this case, instead of punching out the defective device, the semiconductor device having one rank information among the plurality of rank information is left, and the semiconductor device having the other rank information is transferred to the tape map of the database 6 by the centralized punch device 7. The case where all or a part of the punched rank information is punched based on the data and the tape is reorganized for each rank information has been described. In addition to this, the first embodiment particularly Although not explained, it can be performed as follows.

  After collating the relationship between the empty device position in the tape map data and the address data of the semiconductor device other than the rank information of one of the plurality of rank information, instead of punching out the defective device by the concentrated punch device 7, Semiconductor devices other than one rank information can be punched from TCP.

  The matching process between the empty device position in the tape map data and the address data of the semiconductor device other than the one rank information is performed by using the tape address data of the empty device position closest to the upstream side of the address data of the semiconductor device other than the one rank information. As the reference position, the address position of the semiconductor device other than one rank information from the empty device position can be collated.

  The handler device 5 conducts a rank identification measurement test including pass / fail identification of each semiconductor device in the TCP 4 by bringing a contact of an IC tester into contact with a plurality of terminals of the semiconductor devices sequentially mounted on the TCP 4. Can do.

  A central punch device 7 connected to the handler device 5 via a database 6 in the network can also be used to concentrate and punch out semiconductor devices other than one rank information from the TCP 4.

  The plurality of handler devices 5 are configured to be able to perform re-measurement tests, and are provided with a monitoring control unit for monitoring measurement test results obtained from the plurality of handler devices 5, and predetermined rank information of a predetermined reference number continuously in the measurement tests. When the detection rate of a predetermined rank information semiconductor device equal to or higher than a predetermined reference value is detected, the handler device 5 in which the predetermined rank information semiconductor device is detected is automatically stopped. You can also

  The predetermined rank information semiconductor device data in the tape map data of the database 6 can be changed by tape map synthesis to another predetermined rank information semiconductor device data as result data of the remeasurement test.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1 of this invention, this invention should not be limited and limited to this Embodiment 1. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of the specific preferred embodiment 1 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to a semiconductor integrated circuit test apparatus for identifying whether a semiconductor integrated circuit such as a liquid crystal driver mounted on a TCP (tape carrier package) is a non-defective product or a defective product, and a concentrated punching device used therefor In the field, it is possible to shorten the handling time at the time of the measurement test, and also to relieve a device once determined to be defective, thereby improving the yield.

DESCRIPTION OF SYMBOLS 1 Semiconductor integrated circuit test equipment 2 Supply reel 4 TCP (tape carrier package)
41 IC device 42 Terminal 43 Pad 3 Collection reel 5 Handler device 51 IC tester 6 Database 7 Central punch device 71 Punch unit

Claims (12)

A semiconductor device test apparatus for identifying the quality of a plurality of semiconductor devices mounted on a semiconductor carrier film,
One or a plurality of handler devices including a measurement unit that performs a predetermined measurement test on the plurality of semiconductor devices, and the measurement test results measured by the one or a plurality of handler devices are stored as tape map data via a network. a database that is, the defective devices based on the tape map data of the database have a and one or more centralized punch apparatus for punching from the semiconductor carrier film,
The concentrated punching apparatus is a semiconductor device testing apparatus in which the defective device is punched from the semiconductor carrier film after collating the relationship between the empty device position in the tape map data and the address data of the defective device. The collation process between the empty device position in the tape map data and the address data of the defective device is based on the tape address data of the empty device position closest to the upstream side of the address data of the defective device as a reference position. The semiconductor device testing apparatus according to claim 1 , wherein the address position of the defective device is collated. The semiconductor device test apparatus according to claim 1 , wherein the empty device position is address data punched in advance in a “no device state” as a semiconductor carrier film defect.   The semiconductor device testing apparatus according to claim 1, wherein the defective device is punched out of the semiconductor carrier film in a concentrated manner by the concentrated punching apparatus connected to the handler apparatus via the database in the network. The plurality of handler devices are configured to be able to perform a re-measurement test, and a monitoring control unit that monitors measurement test results obtained from the plurality of handler devices is provided, and a predetermined reference number of defective devices continuously in the measurement test. Is detected, or when a defective device detection rate equal to or higher than a predetermined reference value is detected, the handler device in which the defective device is detected is automatically stopped.
2. The semiconductor device testing apparatus according to claim 1, wherein defective device data in the tape map data of the database is changed by tape map synthesis to non-defective device data as result data of a remeasurement test.   As a measurement test result measured by the handler device, a plurality of rank information is added in addition to the pass / fail identification information and stored as the tape map data in the database. In the rank information, the semiconductor device having the rank information other than the rank information is punched out based on the tape map data of the database by the central punching apparatus, and the punched rank information is obtained. The semiconductor device testing apparatus according to claim 1, wherein all or some of the semiconductor devices are reorganized for each rank information. After checking the relationship between the empty device position in the tape map data and the address data of the semiconductor device other than the rank information of one of the plurality of rank information, the defective punch device is punched by the concentrated punching device. Instead, the semiconductor device testing apparatus according to claim 6 , wherein semiconductor devices other than the one rank information are punched from the semiconductor carrier film. The matching process between the empty device position in the tape map data and the address data of the semiconductor device other than the one rank information is performed by the tape at the empty device position closest to the upstream side of the address data of the semiconductor device other than the one rank information. The semiconductor device test apparatus according to claim 7 , wherein the address position of the semiconductor device other than the one rank information from the empty device position is collated using the address data as a reference position. Measurement of rank identification including the pass / fail identification of each semiconductor device in the semiconductor carrier film by making the contact of the IC tester contact the plurality of terminals of the semiconductor devices sequentially mounted on the semiconductor carrier film. The semiconductor device test apparatus according to claim 6 , wherein the test is performed. 8. The semiconductor device according to claim 7 , wherein semiconductor devices other than the one rank information are intensively punched from the semiconductor carrier film by the concentrated punching device connected to the handler device via the database in the network. Test equipment. The plurality of handler devices are configured to be able to perform a re-measurement test, and are provided with a monitoring control unit that monitors the measurement test results obtained from the plurality of handler devices. When a semiconductor device of information is detected or when a detection rate of a predetermined rank information semiconductor device equal to or higher than a predetermined reference value is detected, the handler device in which the predetermined rank information semiconductor device is detected is automatically stopped.
8. The semiconductor device test according to claim 7 , wherein the predetermined rank information semiconductor device data in the tape map data of the database is changed by tape map synthesis to another predetermined rank information semiconductor device data as result data of a remeasurement test. apparatus. Based on tape map data in a database in which measurement test results measured by one or more handler devices that perform predetermined measurement tests on a plurality of semiconductor devices are stored as tape map data via a network. A device for punching a rank device from the semiconductor carrier film,
A central punching apparatus for punching the defective device or the predetermined rank device from the semiconductor carrier film after collating the relationship between the empty device position in the tape map data and the address data of the defective device or the predetermined rank device.

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