JP2001311761A - Positioning method for tab automatic handler and tab automatic handler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To position a TAB tape with high precision and punch a high-precision punch hole. SOLUTION: The interval DH between the position of an IC chip 18 and a sorting position SP is determined and stored in advance with the position of the TAB tape detected by a position detecting device 11. For positioning the relevant IC chip 18 to the sorting position SP based on an inspection result, the TAB tape 1 is conveyed to a detection position by the position detecting device 11, and the TAB tape 1 is conveyed by the interval DH and stopped, thereby the high-precision positioning of the TAB tape 1 can be made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB auto-handler for inspecting and sorting IC chips on a TAB tape, in which a mark punch hole or a reject punch hole is punched at a position of an IC chip determined to be ineligible by inspection. The present invention relates to a TAB auto-handler positioning method for suitably positioning a TAB tape for the TAB tape, and a TAB auto-handler capable of suitably performing the above-mentioned positioning.

[0002]

2. Description of the Related Art FIG. 7 is a schematic view showing a conventional TAB auto-handler, and FIG. 8 is a view showing the surface of a TAB tape. The TAB auto-handler is a device that transports a TAB tape 1 formed by bonding an IC chip 18 such as a semiconductor chip to a film 19 such as a polyimide, and inspects and sorts the IC chip 18 on the TAB tape 1. is there.

A conventional TAB auto handler has a supply reel 2A and a storage reel 2B as shown in FIG. 7, and has a TAB tape 1 wound between these reels 2A and 2B. TAB tape 1 between these reels 2A and 2B
Is held by a supply side sub-sprocket 7, a storage side sub-sprocket 8, a supply side tension guide 5, a storage side tension guide 6, a supply side main sprocket 9, a storage side main sprocket 10, and the like.

A pusher 3 is provided between the main sprockets 9 and 10. The pusher 3 is provided with the main sprockets 9 and 10 together with the main sprockets 9 and 10.
The TAB tape 1 held between the ten grips is gripped so that the TAB tape 1 can be pushed and pulled back in the directions of arrows C and D in FIG.

That is, the TAB tape 1 between the reels 2A and 2B is sequentially conveyed in the direction of arrow A in FIG. 7, and the TAB tape 1 conveyed to the position of the pusher 3 is pushed by the pusher 3 to drive the arrow D in FIG. Extruded to the side. Extruded TA
The IC chip 18 on the B tape 1 is brought into contact with a probe on a probe card (not shown). The probe card is connected to an IC tester (not shown), and an inspection of the IC chip 18 by an electric test is performed by the IC tester.

On the downstream side of the pusher 3 (between the accommodation side tension guide 6 and the accommodation side sub-sprocket 8),
It has a classification device 4 for classifying the IC chips 18 on the TAB tape 1 based on the inspection result by the C tester.

[0007] The classification device 4 classifies the IC chips by punching holes at the positions of the IC chips 18 on the TAB tape 1 based on the inspection results. As shown in FIG. 8, the punch hole has a reject punch hole 15 for punching out the disqualified IC chip 18. Further, there is a mark punch hole 16 for making a round hole having a diameter of 1 mm to 3 mm near the IC chip 18 based on the inspection result. In FIG. 8, two types of punch holes 15 and 16 are shown on the same TAB tape 1 for explanation, but only one type of punch holes is actually punched.

In FIG. 8, reference numeral 13 denotes a perforation formed on the film 19 of the TAB tape 1 so as to mesh with the teeth of the sprockets 7, 8, 9, and 10. Reference numeral 20 denotes a pad, and each pad 20 and the IC chip 18 are electrically connected by a pattern 21. The mark punch hole 16 is the pad 2
It is not permissible to damage the TAB tape 1 if it hits 0 or the pattern 21.

[0009]

The conventional TAB described above.
TAB tape 1 in the classifier 4
Is realized by the transport positioning function of the TAB tape 1 by the sprocket. The punched holes 15 or 16 are formed at the positions thus determined. It is not possible to confirm whether the position thus positioned is accurate or not.Even if the positioned position is incorrect, the punch hole is punched without correcting the position, etc. It could not be pierced.

In recent years, in a TAB tape, the size of one device (a portion shown by a broken line in FIG. 8 and denoted by reference numeral 14) has been reduced, and the number of pads and patterns has been increased to increase the density. I have. For this reason, the area where the punch holes are formed becomes narrower, and the TAB auto-handler is required to punch the punch holes with high precision. When a mark punch hole is made in a good device to distinguish it from an unmeasured device, further accuracy is required.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a TAB auto-handler positioning method and a TAB auto-handler capable of positioning a TAB tape with high accuracy in punching holes, and thereby enabling high-precision punching. Related to the purpose of providing.

[0012]

According to the first aspect of the present invention, as shown in FIG. 1, a plurality of perforations (1) having a fixed size and shape are provided.
3) A TAB tape (1) in which a plurality of IC chips (18) are installed at regular intervals in the extension direction on a tape material (19) formed and arranged at regular intervals in the extension direction. And sequentially inspects the IC chips (18) on the TAB tape (1) sent by transporting the TAB tape (1), and based on the inspection result, the corresponding IC chip (18) Are sequentially positioned at the sorting position (SP), and the IC chip (18) positioned at the sorting position (SP) is classified. The TAB auto-handler (30) detects the perforation (13). The tape position detecting means (11) for detecting the position of the TAB tape (1) is provided in advance, and the TAB tape (1) is previously detected by the tape position detecting means (11). The position of the IC chip (18) in a state where the position of 1) is detected, the classification position (S
P) is stored, and when the corresponding IC chip (18) is positioned at the classification position (SP) based on the inspection result, the tape position detecting means (11) uses the same. The TAB tape (1) is transported to a position where the TAB tape is detected, and the TAB tape (1) is further transported by the stored interval (DH) and stopped. Positioning method in the auto handler.

According to a second aspect of the present invention, the TAB tape (1) includes a plurality of sprockets (7, 8, 9, 1).
0), and when the corresponding IC chip (18) is positioned at the classification position (SP) based on the inspection result, the classification position (SP) is used.
, The downstream sprocket (8) is driven later than the upstream sprocket (7, 9, 10), and thereafter, the upstream sprocket (8) is stopped and the downstream sprocket (7) is stopped. , 9, 10), the TAB tape (1) is transported in the transport direction (A) to a position detected by the tape position detecting means (11), and the TAB tape (1) is further transported. 2. The positioning method in the TAB auto-handler according to claim 1, wherein the transport is performed in the transport direction (A) by the stored interval (DH) and stopped.

According to a third aspect of the present invention, there are provided two sprockets (1) located upstream and downstream of the sorting position (SP).
0, 8), a tension means (6) for adjusting the tension of the TAB tape (1) is provided.
3. The positioning method in a TAB auto-handler according to claim 2, wherein the tension of the TAB tape (1) between two sprockets (10, 8) is adjusted by the tension means (6).

According to a fourth aspect of the present invention, as shown in FIG. 1, a tape material (19) in which a plurality of perforations (13) having a constant size and shape are formed and arranged at regular intervals in the extension direction. Transport means (2A, TAB tape (1) comprising a plurality of IC chips (18) arranged at regular intervals in the extension direction) for transporting the TAB tape (1) in the transport direction (A);
2B, 7, 8, 9, 10) and inspection means (3) for sequentially inspecting the IC chip (18) on the TAB tape (1) sent by transporting the TAB tape (1);
Positioning means (1) for sequentially positioning the corresponding IC chip (18) at the classification position (SP) based on the inspection result.
TAB auto-handler (3) comprising: a classification unit (4) for classifying the IC chip (18) positioned at the classification position (SP);
In (0), the positioning means detects a position of the TAB tape (1) by detecting the perforation (13).
And the TAB by the tape position detecting means (11).
Interval storage means (12) for storing an interval (DH) between the position of the IC chip (18) in a state where the position of the tape (1) is detected and the classification position (SP); When positioning the corresponding IC chip (18) at the classification position (SP) based on the result, the TAB tape (1) is moved until the position of the TAB tape (1) is detected by the tape position detecting means (11). 1), and the T
A transport controller (3) for controlling the transport means (7, 8, 9, 10) to transport the AB tape (1) by the interval (DH) stored in the interval storage means (12) and to stop the transport;
And 5) an auto handler for TAB.

According to a fifth aspect of the present invention, the tape position detecting means (11) is provided with the perforation (1).
5. The TAB auto-handler according to claim 4, further comprising a transmission type sensor for detecting the edge (13a) of (3).

[Operation] IC to be classified by the above configuration
When positioning the chip (18) at the sorting position (SP), the TAB tape (1) is transported to a position detected by the tape position detecting means (11), and the TAB tape (1) is further separated by an interval (DH). ) And stop. The interval (DH) is set to TAB by the tape position detecting means (11).
Since this is the transport distance between the position of the IC chip (18) in the state where the position of the tape (1) is detected and the classification position (SP), the IC chip (1) on the TAB tape (1)
8) is positioned at the classification position (SP).

Note that the numbers in parentheses are for convenience showing corresponding elements in the drawings, and therefore, the present description is not limited to the description on the drawings.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall schematic diagram showing a TAB auto-handler. In the TAB auto-handler shown in FIG. 1, the same parts as those of the TAB auto-handler shown in FIG.

That is, as shown in FIG. 1, the TAB auto-handler 30 includes a supply reel 2A and a storage reel 2B, and a TAB tape 1 wound between the reels 2A and 2B.
Supply-side sub-sprocket 7, storage-side sub-sprocket 8, supply-side tension guide 5, storage-side tension guide 6, supply-side main sprocket 9, supply-side main sprocket 9, which hold TAB tape 1 between reels 2A and 2B so as to be transportable. Main sprocket 10 (the above 2A, 2B, 7, 8,
5, 6, 9, and 10 constitute a transport means for the TAB tape 1), a pusher 3 provided between the main sprockets 9 and 10, and a probe card (not shown) provided on the arrow D side of the pusher 3. And an IC tester (inspection means is constituted by the above-described pusher 3, probe card, and IC tester), and a classification device 4 provided between the accommodation-side tension guide 6 and the accommodation-side sub-sprocket 8. ing.

FIG. 6 is a conceptual diagram showing the structure of the accommodation tension guide. The accommodation side tension guide 6 is a mechanism that moves up and down so as to keep the tension state of the TAB tape 1 between the accommodation side main sprocket 10 and the accommodation side sub sprocket 8 constant. That is, as shown in FIG. 6, the accommodation-side tension guide 6 is rotatable in the directions of arrows E and F in FIG. 6 by the rotation shaft 24, and the accommodation-side tension guide 6 is moved by the weight 23 in the direction of the arrow W ( (Direction of arrow E). The accommodation side tension guide 6
It is also possible to employ a spring or the like other than the weight 23 for the biasing. Since the supply-side tension guide 5 is not directly related to the present invention, a detailed description thereof will be omitted, but the configuration is basically the same as that of the accommodation-side tension guide 6.

When the tension of the TAB tape 1 becomes weak, the accommodation side tension guide 6 moves upward (in the direction of arrow E) in FIG. 6, and conversely, when the tension of the TAB tape 1 becomes too strong, the accommodation side tension guide 6 moves downward (in the direction of arrow E). By moving in the direction of arrow F), the tension of the TAB tape 1 between the housing-side main sprocket 10 and the housing-side sub-sprocket 8 is kept constant.

FIG. 2 is a perspective view showing the classification device and the position detection device. A position detection device 11 is provided near the classification device 4 as shown in FIGS. The position detecting device 11 of the present embodiment has a transmission sensor. A memory 12 capable of storing information is connected to the position detecting device 11. Further, a transport control unit 35 is connected to the position detecting device 11, and the transport control unit 35 can control the transport means such as a reel and a sprocket.

Since the TAB auto-handler 30 is configured as described above, in order to inspect and classify the IC chip 18 on the TAB tape 1, a conventional TAB auto-handler (see FIG. The IC chip 18 is inspected at the position of the pusher 3 in the same manner as described above), the TAB tape 1 is positioned in the classification device 4, and punch holes are punched in the IC chip 18 based on the inspection result.

The difference between this embodiment and the conventional one lies in the method of positioning the TAB tape 1 in the classification device 4. Hereinafter, this positioning method will be described. FIG. 3 is a diagram showing a position detected by the position detecting device at the time of position adjustment, FIG. 4 is a diagram showing a state where the position detecting device has detected a perforation boundary line, and FIG. 5 is a diagram showing a state immediately after the TAB tape stops. FIG.

First, before actually starting the inspection / classification of the TAB tape 1, a position adjusting operation is performed. That is, T
By moving the AB tape 1 (for example, any method such as manual operation), a certain IC chip 18 can be placed in a predetermined classification position where the classification device 4 can accurately punch a specified punch hole for the IC chip 18. Position to SP.
In the state where the position adjustment is completed, the detection area 70 of the position detection device 11 is completely inside one perforation 13A on the TAB tape 1 as shown in FIG. 3 (state A in FIG. 3).

Next, while transporting the TAB tape 1 in the rewinding direction (the direction opposite to the direction of the arrow A in the figure), as shown in FIG.
It is stopped in a state where the center of the detection area 70 is positioned with respect to a. (FIG. 4-B state). This state can be easily detected as the state at the time when the amount of transmitted light from the transmission type sensor is reduced and it is determined that the light is not transmitted. Alternatively, it is also possible to measure the amount of transmitted light of the transmission type sensor and detect the state where the amount of transmitted light becomes 50%. The state at the time of detection in this manner is a unique state because the boundary line 13a of the perforation 13A is used as a reference,
It can be considered that a specific position of the B tape 1 has been detected.

TAB tape 1 in the above-mentioned rewinding direction
Along with the transport, the transport controller 35 detects the distance required for the transport (the distance the TAB tape 1 was transported from the state shown in FIG. 3A to the state shown in FIG. 4B) from the rotation amount of the sprocket. The detected distance is calculated by the position detecting device 11 as TA.
IC chip 18 in a state where the position of B tape 1 is detected
, And the distance DH between the classification position SP,
It is stored in the memory 12 as the interval DH.

Next, the inspection / classification of the TAB tape 1 is actually started. In the conventional TAB auto-handler, the supply-side sub-sprocket 7, the storage-side sub-sprocket 8, the supply-side main sprocket 9, and the storage-side main sprocket 10 are synchronized, and one of the sprockets corresponds to one device (reference numeral in FIG. 8). 14), the other sprockets also carried the amount of one device.

In the present embodiment, however, the supply side sub-sprocket 7, the supply side main sprocket 9, and the accommodation side main sprocket 10 are synchronized with each other, but the accommodation side sub-sprocket 8 operates with a delay. I have. That is, when the other sprockets 7, 9, and 10 carry the amount of one device, the housing-side sub-sprocket 8 carries the amount represented by the following equation (1).

(Conveyance amount for one device) − (Conveyance amount DH + α) (1) α in the equation (1) is in the state shown in FIG. 5-C (between the perforations 13 and 13 where the detection area 70 is adjacent). TAB required to transition from (State) to Figure 4-B
This is the transport amount of the tape 1. α has an error of about several 100 μm depending on the transfer accuracy by the sprocket.

When the transfer is performed with the above-described transfer amount, the transfer amount of the storage-side sub-sprocket 8 is smaller than the transfer amount of the storage-side main sprocket 10. During this time, the amount of the TAB tape 1 increases and tends to loosen. However, this slack is eliminated by the accommodation-side tension guide 6 described above.

The TAB tape 1 is conveyed by the above-described conveyance amount, and the detection area 70 of the position detecting device 11 is brought to the state shown in FIG. In this state, TAB tape 1
May be temporarily stopped or decelerated. Next, the other sprocket is stopped while driving only the storage side sub-sprocket 8 in the forward direction, and the TAB tape 1 is further moved in the direction of arrow A until the state shown in FIG. Even in this state, the TAB tape 1 may be temporarily stopped or decelerated. Further, from the state shown in FIG. 4B, the storage side sub-sprocket 8 is driven in the forward direction by the interval DH stored in the memory 12 to move the TAB tape 1 in the direction of arrow A and stop. This resulted in the state shown in FIG. That is, the classification device 4 was able to accurately position the punch hole with respect to the IC chip 18 to be punched.

As described above, in this embodiment, the IC chip 1
When the classification of No. 8 is performed by perforation such as the punch holes 15 and 16 (see FIG. 8), the TAB tape 1 can be positioned with high accuracy, so that high-precision punch holes can be formed.

The above-described position detecting device 11 has a transmission type sensor. In addition to this, for example, an image processing device having a camera and image processing / judging an image photographed by the camera may be used. It is also possible to employ.

In the above-described example, the TAB tape is transported in the rewinding direction (the direction opposite to the direction of arrow A in the figure) when calculating the interval DH. In this case, the TAB tape is transported in the direction of arrow A. In this case, the interval DH may be obtained. However, in this case, when the IC chip 18 is actually positioned at the classification position 18, the TAB tape 1 is transported to a position detected by the position detection device 11, and then the TAB tape 1 is further moved.
The B tape 1 is transported in the rewinding direction by the interval DH and stopped.

[0037]

As described above, according to the present invention, when positioning the IC chip to be classified at the classification position, the TAB tape is transported to the position detected by the tape position detecting means, and the TAB tape is further transferred. It is transported for the interval that has been stored and stopped. Since this interval is a transport distance between the position of the IC chip in a state where the position of the TAB tape is detected by the tape position detecting means and the classification position,
The IC chip on the TAB tape is positioned at the sorting position. Therefore, when the classification is performed by punching a punched hole or the like, the TAB tape can be positioned with high precision, so that the punching of the punched hole can be performed with high precision.

According to the second aspect of the present invention, a large amount of TAB tape is intentionally secured between the two sprockets located upstream and downstream of the sorting position, and only the downstream sprocket is used for positioning at the sorting position. By driving in the forward direction, the transport and positioning in the transport direction of the TAB tape can be performed. This facilitates control because there is no need to reverse the sprocket.

According to the third aspect of the present invention, even if the amount of TAB tape between two sprockets located upstream and downstream of the sorting position is intentionally increased, this TA
Since the B tape is stretched without slack, the transport of the TAB tape can be performed smoothly.

According to the fourth aspect of the present invention, since the positioning can be performed in the same manner as in the first aspect, the IC chip on the TAB tape can be accurately positioned at the classification position, and the classification is performed by punching a punch hole or the like. In such a case, it is possible to form a punch hole with high precision.

According to the fifth aspect of the present invention, the apparatus has a simple configuration by employing a transmission type sensor.
This results in an inexpensive device.

[Brief description of the drawings]

FIG. 1 is an overall schematic diagram showing an embodiment of a TAB auto handler according to the present invention.

FIG. 2 is a perspective explanatory view showing a classification device and a position detection device.

FIG. 3 is a diagram illustrating a position detected by a position detection device during position adjustment.

FIG. 4 is a diagram showing a state where the position detection device has detected a perforation boundary line.

FIG. 5 is a diagram showing a state immediately after a TAB tape stops.

FIG. 6 is a conceptual diagram illustrating a configuration of a storage tension guide.

FIG. 7 is a schematic diagram showing a conventional TAB auto-handler.

FIG. 8 is a diagram showing the surface of a TAB tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TAB tape 2A Conveying means (supply reel) 2B Conveying means (containment reel) 3 Inspection means (pusher) 4 Classification means (classification device) 6 Tension means (containment side tension guide) 7 Conveyance means (supply side sub-sprocket) 8 Conveyance Means (accommodating side sprocket) 9 Conveying means (supply main sprocket) 10 Conveying means (accommodating main sprocket) 11 Tape position detecting means (position detecting device) 12 Interval storage means (memory) 13 Perforation 18 IC chip 19 Tape material (Film) 30 TAB auto-handler 35 Transfer control unit DH interval SP Classification position

Claims (5)

[Claims] 1. A TAB tape in which a plurality of IC chips are installed at a constant interval in the extension direction on a tape material in which a plurality of perforations having a constant size and shape are formed and arranged at a constant interval in the extension direction. Transporting in the transport direction, sequentially inspecting the IC chips on the TAB tape sent by transporting the TAB tape, and sequentially positioning the corresponding IC chips at the classification position based on the inspection result; In a TAB auto-handler for performing classification on the IC chip positioned at a position, the TA chip is detected by detecting the perforation.
A tape position detecting means for detecting the position of the B tape is provided, and the position of the IC chip in a state where the position of the TAB tape is detected by the tape position detecting means in advance;
The interval between the TAB tape and the classification position is stored, and when the corresponding IC chip is positioned at the classification position based on the inspection result, the TAB tape is transported to a position detected by the tape position detection unit. , And the T
A method for positioning a TAB auto-handler, wherein an AB tape is transported and stopped for the stored interval. 2. The TAB tape is conveyed through a plurality of sprockets. When positioning a corresponding IC chip at a classification position based on the inspection result, the TAB tape is positioned with respect to the classification position. By driving the downstream sprocket later than the upstream sprocket, and then stopping the upstream sprocket and driving the downstream sprocket,
Transporting the TAB tape in the transport direction to a position detected by the tape position detecting means, and transporting the TAB tape in the transport direction for the stored interval and stopping the TAB tape. The positioning method in the TAB auto-handler according to claim 1, wherein: 3. A tension means for adjusting the tension of the TAB tape is provided between two sprockets located upstream and downstream of the classification position, and the tension of the TAB tape between the two sprockets is adjusted by the tension. 3. The positioning method in the TAB auto-handler according to claim 2, wherein the adjustment is performed by means. 4. A TAB tape in which a plurality of IC chips are installed at a constant interval in the extension direction on a tape material in which a plurality of perforations having a constant size and shape are formed and arranged at a constant interval in the extension direction. Transport means for transporting in the transport direction, inspection means for sequentially inspecting the IC chips on the TAB tape sent by transporting the TAB tape, and sequentially applying the corresponding IC chips to the classification position based on the inspection result In a TAB auto-handler comprising: positioning means for positioning; and classification means for performing classification on the IC chip positioned at the classification position, wherein the positioning means detects the perforation, thereby detecting the TA.
A tape position detecting means for detecting a position of the B tape; an interval for storing an interval between the position of the IC chip in a state where the position of the TAB tape is detected by the tape position detecting means and the classification position A storage unit, when positioning the corresponding IC chip at the classification position based on the inspection result, transports the TAB tape to a position where the position of the TAB tape is detected by the tape position detection unit; A TAB auto-handler, comprising: a transport control unit that controls the transport unit to transport and stop the tape by the interval stored in the interval storage unit. 5. The TAB auto-handler according to claim 4, wherein said tape position detecting means has a transmission type sensor for detecting an edge of said perforation.