550988550988
五 、發明說明（ 15 經濟部智慧財產局員工消費合作社印製 20 本發明係與電子產業有關，特別是關於一種印刷電路 板(PCB)之電結構。 在習知的印刷電路板80的製造流程中，請參閱第〜 圖，首先先預製一基板(substrate) 81，其上具有一電路体巧 (conductor pattern) 82以及複數個電鍍通孔（PTH)822。該電 路佈局82係由複數個銅導線821所構成。該基板81上具 有一匯電導線(bus trace) 83，藉以導接各該銅導線821。在 完成預定程序後’可在該匯電導線83通電，藉以在各該鋼 導線821之預定位置電鍍導接層84(即業界習稱之金手指 (golden finger))。完成電鍍導接層84之程序後，該匯電導 線83會被移除，該印刷電路板80即形成如第二圖所示之 型態。 由圖中可很清楚地瞭解，該基板81在二銅導線82u， 821b之間必須保留預定之空間821，讓其他銅導線之無效 段821c，821d，821f通過。所謂的無效段為使該等銅導線 821與该匯電導線83導接之區段，藉以電鍍該等導接層 84。但在該電路佈局82運作時，該等無效段是沒有電流流 過的。換s惑，孩基板81上具有許多無效區域，而且該等 無效區域是不能避免的。因此，該基板81無法有效的縮小。 本發明之主要發明目的在於提供印刷f路板之結構，其 可減少該印刷電路板上之無效空間，令該印刷電路板之尺 寸縮小。 為達成前接之發明目的，本發明所提供之印刷電路板之 結構’包含有：-基板。-電路佈局，設置於該基板，係 -3- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公复） (請先閱讀背如之注t:事項再填寫本頁) 裝. ----訂--------- 550988 A7 _B7 五、發明說明（） (請先閱讀背面之注意事項再填寫本頁) 由複數個金屬導線所構成。該電路佈局包含有至少一第一 區段以及至少一第二區段，其中該第一區段可供電流流 通，其上具有至少一電鍍部，而各該電鍍部上分別設有一 導接層，各該第二區段可電性導通至至少一個前述之電鍍 5 部，以及一防焊層，設置於該基板上，該防焊層覆蓋該電 路佈局，但在對應於該等電鍍部之位置被打開，藉以使該 導接層暴露。該防焊層具有至少一個微孔，位於對應於該 •電路佈局之第二區段之位置。 以下茲舉一較佳實施例，配合圖示，對本發明作進一步 10 之說明，其中 第三圖係本發明一較佳實施例之外觀示意圖； 第四圖係本發明較佳實施例之剖視圖； 第五圖係為一銅導線之示意圖，顯示微孔位於一電鍍穿 孔的旁邊； 15 第六圖係為一銅導線之示意圖，顯示微孔位於一焊墊的 旁邊； 第七圖係為製作本發明實施例之印刷電路板之流程 圖，以及 經濟部智慧財產局員工消費合作社印製 第八圖係為另一種本發明較佳實施例之印刷電路板之 20 外觀示意圖。 請參閱第三圖與第四圖所示，本發明一較佳實施例所提 供之印刷電路板之結構，包含有： 一基板10，其係以多功能環氧樹脂（multi-function epoxy resin)所製成，具有一第一側101以及一第二側102。 -4- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 550988 A7 _B7__ 五、發明說明（） 該基板10上設置有預定數目個穿孔11，由該第一側101 貫穿至該第二側102。 (請先閱讀背面之注意事項再填寫本頁) 一電路佈局20，係由複數個銅導線21所構成，設置於 該基板10之第一側101與該第二側102上。在該等穿孔11 5 中亦有銅導線連接該第一側101與該第二側1〇2之電路佈 局20，使該等穿孔11形成電鍍穿孔。各該銅導線21儘可 能的彼此接近，使該基板10可具有較小之尺寸。 請參閱第五圖，該電路佈局20具有第一區段211以及 第二區段212。 10 該等第一區段211係為該電路佈局20中具有電流流過 之銅導線，因此，諸如電鍍穿孔11以及焊墊12等均是位 於該電路佈局20之第一區段211中。該等第一區段具有複 數個電鍍部213，供導接層22設置於其上。該導接層22 即為業界通稱之金手指（golden finger)，為鎳-金合金層。該 15 等導接層22在實務上係供打線(wire bonding)、設置焊塾或 是電性連接至另一迴路等之用。 經濟部智慧財產局員工消費合作社印製 該等第二區段212係為在該等第一區段211尾端之一小 段銅導線，其可經由該第一區段211與該等電鍍部213電 性導通。該等第二區段212在該電路佈局20運作時是沒有 20 電流流過的，換言之，該等第二區段212為該電路佈局20 之無效區段。該等第二區段212可位於該電鍍穿孔11的旁 邊(如第五圖所示），或是位於該焊墊12的旁邊(如第六圖所 示），或是位於該導接層22的旁邊，亦可為該電路佈局20 中任何電流部流過之區段。 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 550988 A7 B7 五、發明說明（） 一防焊層30，請參閱第四圖，設置於該基板1〇之第一 側101以及第二側102，並且填滿該等電鍍通孔11。本實 施例中，該防焊層30可以多功能環氧樹脂為期構成材料。 該防焊層30覆蓋住該電路佈局20，但在對應於該等導接 5 層22之位置被打開，藉以使該等導接層22暴露，以供前 述之打線、銲焊墊等之用。該防焊層30在對應於該等第二 區段212之位置具有微孔34，且該等微孔34底端之第二 區段212亦被移除。 請參閱第七圖，以下我們揭露一個印刷電路板之製造程 10 序，藉以說明為何該防焊層30上具有該等微孔34之印刷 電路板結構，其基板10之尺寸可縮小。 請參閱圖七A，首先我們預製該基板10，其上具有該 電路佈局20。 接著，請參閱圖七B，在該基板10上設置該防焊層30, 15 以覆蓋該電路佈局20，並將該防焊層30的在對應於該電 路佈局20之電鍍部213，以及該等微孔34的部分移除， 令該電路佈局20之第一區段211之電鍍部213以及第二區 段212暴露。 第三，請參閱圖七C，在該防焊層30上設置一導電層 20 50,令該導電層50經由該等第二區段212與該等第一區段 211之電鍍部213電性導通。 第四，請參閱圖七D，在該導電層50上設置第二防焊 層60，並將該第二防焊層60之預定部位打開，藉以令該 電路佈局20之電鍍部213暴露。 -6· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背氣之注*'事項再填寫本頁) ^1 --------^---------' 550988 A7 、發明說明（ 第五，請參閱圖七E,通電力至該導電層5〇，藉以在該 電路佈局20之電鍍部213上電鍍該等導接層22。 最後，凊參閱圖七F，蝕刻掉殘餘之該第二防焊層6〇 以及孩導電層5G。在進行本步驟之同時，該電路佈局2〇 之第-區段22經由孩等微孔34暴露之部分亦—同被移除。 由前接的製造方法可知，其可在無須在基板上設置匯電 鋼導線的狀況下，在電路佈局之預定位置電鍍導接層。如 此，以前揭方法所製作的印刷電路板上，無須為該電路佈 局<無效段預留2間，換言之，以本方法所製作的印刷電 1〇路板，請比較第二圖與第四圖，可達成縮小尺寸之功效。 而以W述方法所製作的印刷電路板上具有非常明顯的特徵 為，在戒防焊層30上具有微孔34，位於對應於該電路佈 局20之第二區段212。 經濟部智慧財產局員工消費合作社印製 丨丨.— (請先閱讀免面之没意事項再填寫本頁) 第八圖係為另一種本發明所提供之印刷電路板之外觀 15圖，其與前述之差異在於該電路佈局20具有複數個傳導部 214，用以電性導通複數個電鍍部213。藉此，在經由該傳 導部214導通之銅導線上，僅需要有一個或二個第二區段 212，即可達成在該等電鍍部213上電鍍該等導接層22之 目的。而該等傳導部214在完成電鍍該等導接層後，會被 2〇私除。因此，請比較第三圖與第八圖所示，本發明所提供 之印刷電路板，該防焊層30並非在每一銅導線21上居具 有微孔34。 本紙張尺度適用中國iii^NS)A4規格⑽χ 297公复- 550988 A7 B7 五、發明說明（) 圖示之簡單說明： 第一圖係傳統在印刷電路板上設置匯電銅導線之示意 圖； 第二圖係第一圖中該匯電銅導線被移除後之示意圖； 5 第三圖係本發明一較佳實施例之外觀示意圖； 第四圖係本發明較佳實施例之剖視圖； 第五圖係為一銅導線之示意圖，顯示微孔位於一電鍍穿 孔的旁邊； 第六圖係為一銅導線之示意圖，顯示微孔位於一焊墊的 10 旁邊； 第七圖係為製作本發明實施例之印刷電路板之流程 圖，以及 第八圖係為另一種本發明較佳實施例之印刷電路板之 外觀示意圖。 (請先閱讀背面之^一意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 550988 A7 B7 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 主要成分代表圖號： 10基板 101第一側 102第二側 11電鍍通孔 12焊墊 20電路佈局 21銅導線 211第一區段 5 212第二區段 213電鍍部 214傳導部 22導接層 30防焊層 34微孔 50導電層 60第二防焊層 10 80習用印刷電路板 81基板 82電路佈局 821銅導線 822電鍍通孔 83匯電導線 84導接層 -裝--- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）V. Description of the invention (15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 This invention is related to the electronics industry, and particularly relates to the electrical structure of a printed circuit board (PCB). The manufacturing process of the conventional printed circuit board 80 Please refer to Figures ~. First, a substrate 81 is prefabricated, which has a conductor pattern 82 and a plurality of plated through holes (PTH) 822. The circuit layout 82 is composed of a plurality of copper It is composed of a conducting wire 821. The substrate 81 is provided with a bus trace 83 for conducting each of the copper wires 821. After completing the predetermined procedure, 'the conducting wire 83 can be energized to thereby connect each of the steel wires. The conductive contact layer 84 (a golden finger commonly known in the industry) is plated at a predetermined position of 821. After the completion of the electroplating conductive layer 84 procedure, the bus wire 83 is removed, and the printed circuit board 80 is formed. As shown in the second figure, it can be clearly understood from the figure that the substrate 81 must reserve a predetermined space 821 between the two copper wires 82u, 821b, so that the invalid sections of other copper wires 821c, 821d, 821f Pass. So-called none The effective section is a section where the copper wires 821 and the power conducting wires 83 are connected, thereby electroplating the conductive layers 84. However, when the circuit layout 82 operates, no current flows through the ineffective sections. In other words, there are many invalid areas on the child substrate 81, and these invalid areas are unavoidable. Therefore, the substrate 81 cannot be effectively reduced. The main object of the present invention is to provide a printed circuit board structure, which can To reduce the invalid space on the printed circuit board, the size of the printed circuit board is reduced. In order to achieve the purpose of the preceding invention, the structure of the printed circuit board provided by the present invention includes:-a substrate.-A circuit layout, provided in The substrate, -3- This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 public copy) (Please read the note t: Matters before filling in this page). ---- Order- -------- 550988 A7 _B7 V. Description of the invention () (Please read the notes on the back before filling out this page) It consists of multiple metal wires. The circuit layout includes at least a first section and At least one second section, wherein the first section It can be used for current flow, and it has at least one electroplated part, and each electroplated part is provided with a conductive layer, and each of the second sections can be electrically connected to at least one of the foregoing electroplated 5 parts, and a solder resist layer. Is disposed on the substrate, the solder resist layer covers the circuit layout, but is opened at a position corresponding to the plating parts, so that the conductive layer is exposed. The solder resist layer has at least one micro-hole, which is located corresponding to The position of the second section of the circuit layout. A preferred embodiment is illustrated below to further illustrate the present invention in conjunction with the illustration. The third diagram is a schematic diagram of the appearance of a preferred embodiment of the present invention; The fourth figure is a cross-sectional view of a preferred embodiment of the present invention; the fifth figure is a schematic diagram of a copper wire, showing that the microvia is located next to a plated perforation; the sixth figure is a schematic diagram of a copper wire, showing the microhole Next to the solder pad; the seventh diagram is a flowchart of the printed circuit board of the embodiment of the present invention, and the eighth diagram printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is another preferred embodiment of the present invention. Example 20 of the printed circuit board. Referring to the third and fourth figures, the structure of a printed circuit board provided by a preferred embodiment of the present invention includes: a substrate 10, which is made of a multi-function epoxy resin It is made with a first side 101 and a second side 102. -4- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 mm) 550988 A7 _B7__ 5. Description of the invention () The substrate 10 is provided with a predetermined number of perforations 11 and is penetrated by the first side 101 To the second side 102. (Please read the precautions on the back before filling in this page) A circuit layout 20 is composed of a plurality of copper wires 21 and is arranged on the first side 101 and the second side 102 of the substrate 10. There are also copper wires in the perforations 11 5 that connect the circuit layout 20 of the first side 101 and the second side 102, so that the perforations 11 form electroplated perforations. The copper wires 21 are as close to each other as possible, so that the substrate 10 can have a smaller size. Referring to the fifth figure, the circuit layout 20 has a first section 211 and a second section 212. 10 The first sections 211 are copper wires with current flowing in the circuit layout 20, and therefore, such as plated through-holes 11 and pads 12 are located in the first section 211 of the circuit layout 20. The first sections have a plurality of plating portions 213 on which the conductive layer 22 is disposed. The conductive layer 22 is a golden finger commonly known in the industry, and is a nickel-gold alloy layer. The 15th-level conductive layer 22 is practically used for wire bonding, soldering, or electrical connection to another circuit. The second section 212 printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is a small section of copper wire at the end of the first section 211, which can pass through the first section 211 and the plating sections 213. Electrically conductive. The second sections 212 have no current flowing when the circuit layout 20 operates, in other words, the second sections 212 are invalid sections of the circuit layout 20. The second sections 212 may be located beside the plated through hole 11 (as shown in the fifth figure), or beside the pad 12 (as shown in the sixth figure), or on the conductive layer 22 It can also be the section through which any current section flows in the circuit layout 20. -5- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 550988 A7 B7 V. Description of the invention () 1 Solder resist 30, please refer to section Four figures are arranged on the first side 101 and the second side 102 of the substrate 10 and fill the plated through holes 11. In this embodiment, the solder resist layer 30 may be made of a multifunctional epoxy resin. The solder mask layer 30 covers the circuit layout 20, but is opened at a position corresponding to the conductive layer 5 to expose the conductive layers 22 for the aforementioned wiring, soldering pads, etc. . The solder mask layer 30 has micro holes 34 at positions corresponding to the second sections 212, and the second section 212 at the bottom end of the micro holes 34 is also removed. Please refer to the seventh figure. Below, we disclose the manufacturing process 10 of a printed circuit board, so as to explain why the printed circuit board structure with the micro-holes 34 on the solder resist layer 30 can reduce the size of the substrate 10. Referring to FIG. 7A, first we prefabricate the substrate 10 with the circuit layout 20 thereon. Next, referring to FIG. 7B, the solder mask layers 30, 15 are disposed on the substrate 10 to cover the circuit layout 20, and the solder mask layer 30 is disposed on the plating portion 213 corresponding to the circuit layout 20, and the The part of the micro-holes 34 is removed, so that the plating section 213 and the second section 212 of the first section 211 of the circuit layout 20 are exposed. Thirdly, referring to FIG. 7C, a conductive layer 20 50 is disposed on the solder resist layer 30, so that the conductive layer 50 passes the second section 212 and the plating section 213 of the first section 211 electrically. Continuity. Fourth, referring to FIG. 7D, a second solder resist layer 60 is disposed on the conductive layer 50, and a predetermined portion of the second solder resist layer 60 is opened to expose the plating portion 213 of the circuit layout 20. -6 · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the note of back gas * 'before filling this page) ^ 1 -------- ^- -------- '550988 A7, description of the invention (fifth, please refer to FIG. 7E, apply electricity to the conductive layer 50, thereby electroplating the conductive layers on the plating section 213 of the circuit layout 20 22. Finally, referring to FIG. 7F, the remaining second solder resist layer 60 and the conductive layer 5G are etched away. At the same time as this step, the second section 22 of the circuit layout 20 is passed through the microcomputer and the like. The exposed part of the hole 34 is also removed. According to the manufacturing method of the front connection, it can be known that it can plate a conductive layer at a predetermined position in the circuit layout without the need to set a steel wire on the substrate. The printed circuit board produced by the method does not need to reserve 2 spaces for the circuit layout < invalid section, in other words, the printed circuit board of the electric circuit produced by this method, please compare the second picture and the fourth picture. Achieve the effect of reducing the size. And the printed circuit board produced by the method described above has very obvious characteristics, There are micro holes 34 on 30, which are located in the second section 212 corresponding to the circuit layout 20. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 丨 丨 .— (Please read the unintentional matters before filling out this page) The eighth diagram is another appearance 15 diagram of a printed circuit board provided by the present invention. The difference from the foregoing is that the circuit layout 20 has a plurality of conductive portions 214 for electrically conducting a plurality of plated portions 213. On the copper wire that is conducted through the conductive portion 214, only one or two second sections 212 are required to achieve the purpose of plating the conductive layer 22 on the plating portions 213. The conductive After the portion 214 finishes plating the conductive layers, it will be removed by 20. Therefore, please compare the third and eighth figures. For the printed circuit board provided by the present invention, the solder resist layer 30 is not A copper wire 21 has micro-holes 34. The paper size is applicable to China iii ^ NS) A4 size ⑽χ 297 public compound-550988 A7 B7 V. Description of the invention () Simple illustration of the diagram: The first picture is a traditional printed circuit Schematic diagram of the copper wire on the board; The schematic diagram of the copper copper wire in the first figure after removal; 5 The third diagram is a schematic diagram of the appearance of a preferred embodiment of the present invention; the fourth diagram is a sectional view of the preferred embodiment of the present invention; the fifth diagram is A schematic view of a copper wire showing a microvia next to an electroplated perforation; the sixth diagram is a schematic view of a copper wire showing a microvia next to 10 of a solder pad; the seventh diagram is a print for making an embodiment of the present invention The flowchart of the circuit board and the eighth figure are schematic diagrams of the appearance of a printed circuit board according to another preferred embodiment of the present invention. (Please read the ^ Issue on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Employee Consumer Cooperatives This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) 550988 A7 B7 () Representative figures printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs: 10 substrate 101 first side 102 second side 11 plated through holes 12 solder pads 20 circuit layout 21 copper wire 211 first section 5 212 second Section 213 electroplated part 214 conductive part 22 conductive layer 30 solder resist layer 34 micro-hole 50 conductive layer 60 second solder resist layer 10 80 custom printed circuit board 81 substrate 82 circuit layout 821 copper wire 822 plated through hole 83 electric wire 84 guide layer-install --- (Please read the precautions on the back before filling in this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)