TW543130B - Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage - Google Patents
Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage Download PDFInfo
- Publication number
- TW543130B TW543130B TW091106810A TW91106810A TW543130B TW 543130 B TW543130 B TW 543130B TW 091106810 A TW091106810 A TW 091106810A TW 91106810 A TW91106810 A TW 91106810A TW 543130 B TW543130 B TW 543130B
- Authority
- TW
- Taiwan
- Prior art keywords
- tool
- wire
- patent application
- scope
- item
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78745—Suction holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/78981—Apparatus chuck
- H01L2224/78985—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/797—Means for aligning
- H01L2224/79743—Suction holding means
- H01L2224/79745—Suction holding means in the upper part of the bonding apparatus, e.g. in the pressing head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/79981—Apparatus chuck
- H01L2224/79985—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001127511 | 2001-04-25 | ||
JP2002056989A JP2003017532A (ja) | 2001-04-25 | 2002-03-04 | ボンディングツール並びにボンディングステージ及びボンディングツール用先端部並びにボンディングステージ用ステージ部 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW543130B true TW543130B (en) | 2003-07-21 |
Family
ID=26614176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091106810A TW543130B (en) | 2001-04-25 | 2002-04-04 | Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2003017532A (sl) |
KR (1) | KR20020082786A (sl) |
TW (1) | TW543130B (sl) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007123413A (ja) * | 2005-10-26 | 2007-05-17 | Elpida Memory Inc | 半導体装置の製造方法 |
KR102039769B1 (ko) * | 2012-10-23 | 2019-11-01 | 토레이 엔지니어링 컴퍼니, 리미티드 | 본딩 툴 냉각 장치 및 본딩 툴 냉각 방법 |
WO2022211370A1 (ko) * | 2021-04-02 | 2022-10-06 | 일진다이아몬드(주) | 초경 몸체에 일체화 된 다결정 다이아몬드 팁을 구비하는 고평탄 본딩 공구 |
-
2002
- 2002-03-04 JP JP2002056989A patent/JP2003017532A/ja active Pending
- 2002-04-04 TW TW091106810A patent/TW543130B/zh not_active IP Right Cessation
- 2002-04-24 KR KR1020020022371A patent/KR20020082786A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2003017532A (ja) | 2003-01-17 |
KR20020082786A (ko) | 2002-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |