540264540264
技術領域 本發明係關於一種電子組件 ’供外部連接之引線及包括焊 線互相連接。本發明另係關於 法0 ’包含一供電子元件之載體 料結合面供將載體結合至引 一種用於製造此種組件之方 發明之背景 以上ϋ貝之電子組件’常在一種包括回流嘿接之過程製 成。在過程㈣’將組件加熱，並且將焊料結合面部份或 完全重新熔化，其可能導致其永久分開。供有些組件，不 2對個別連接’而是因此也對組件結構，回流步驟可能具 有危險。在特定之表面安裝，如果將弓丨線與元件載體間之 、’’σ σ面加熱至程度超過其機械穩定性之限制，由引線所支 承之分組件便有總體破壞之危險。在隨後步驟利用較多分 組件及元件構成其母板時，該等分組件常受到超過一種回 流過程。 避免結構故障故障問題之一種解決方法，將會為使用一 種較高熔點之焊料供引線框架結合面，及一種較低熔點之 焊料供隨後之回流過程。然而，難以找到具有足夠高熔化 溫度，而其他特性，諸如脆性，高成本，危險物質之内容 物等’不使其不合格之焊料。另夕卜，有很多元件無法經得 起在使用此等高溫焊料時所需要之升高溫度。另一可能性 將為使用一種銅焊材.料，但是所需要之高溫，超過45〇。c ’再次將會損壞很多元件及甚至載體本身。 供有些應用，可能使用一種導電黏合劑作為焊料之一種BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component ′ which is used for externally connecting a lead wire and a solder wire to each other. The present invention also relates to a method for bonding a carrier material including an electron-donating element for bonding a carrier to an electronic component of the above-mentioned invention that is used to manufacture such a component. Process is made. During process ㈣ ', the component is heated and the solder joint surface is partially or completely re-melted, which may cause it to separate permanently. For some components, not 2 pairs of individual connections' but therefore also the component structure, the reflow step may be dangerous. In a specific surface installation, if the ‘’ σ σ plane between the bow and the component carrier is heated to a degree exceeding the limit of its mechanical stability, the sub-assembly supported by the lead may be in danger of being damaged in general. When more sub-assemblies and components are used to form the motherboard in subsequent steps, the sub-assemblies are often subjected to more than one type of backflow process. One solution to avoid structural problems is to use a higher melting point solder for the lead frame bonding surface and a lower melting point solder for the subsequent reflow process. However, it is difficult to find solder having a sufficiently high melting temperature and other characteristics, such as brittleness, high cost, the contents of hazardous substances, etc., which do not make it unacceptable. In addition, there are many components that cannot withstand the elevated temperatures required when using these high temperature solders. Another possibility would be to use a brazing material, but the required high temperature exceeds 45 °. c 'again will damage many components and even the carrier itself. For some applications, a conductive adhesive may be used as a solder
540264 A7 B7 五、發明説明（2 ) 替代’但在要求高電效率時，此解決方法便不可能。原因 為可利用之黏合劑材料不具有足夠導電性。解決問題之另 -方式將為使用另外機械裝置作為引線，設計為夾緊在載 體之相對側S ’以在過程期間獲得一種機械性完整無 才貝之組件。此性質之另外解決方法，將為利用一非導電材 料如環氣樹脂過度模製載體及引線框架，或附著一聚合材 料之非導電框架，其在整個過程使引線框架固著。:二另 外材料或零件之所有解決方法之—般缺點，為其帶來新材 料，較多處理設備及處理時間之成本。 在US5，155,904號說明一種焊接方法，其包括將一在元件 安裝在一印刷電路板之一側前，將元件粘結及回流焊接在 其另一側之步驟。在板予以倒反，並完成隨後之回流焊接 及波動焊接步驟時，將黏合劑點置於板上，以將元件附著 及固定其位置。該方法相似於以上利用環氧樹脂過度模^ 之概念，並將會帶來另外之過程步驟，並且不適合所有組 件’特別是不適合在一載體有很多元件之分組件。 發明之概述 :發明之主要目的為提供一種電子組件，其有引線利用 可靠經得起一次或多次重新加熱期間，而不喪失嗜 八守电或機 械特性之互相連接安裝在元件載體。該目的包括一種制、告 此種電子組件之方法。另一目的為達成此種電子組件== 法’其特別適合自支承表面安裝安裝分組件。 T 丹一目的為 提供一種電子組件及其製造方法，較之於已知解決方、去 其不加增成本或複雜性。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) -6- 540264 A7540264 A7 B7 V. Description of the invention (2) Replacement ’But when high electrical efficiency is required, this solution is not possible. The reason is that the available adhesive materials are not sufficiently conductive. Another way to solve the problem would be to use another mechanical device as a lead, designed to be clamped on the opposite side S 'of the carrier to obtain a mechanically intact component during the process. Another solution to this property would be to overmold the carrier and lead frame with a non-conductive material, such as an epoxy resin, or attach a non-conductive frame with a polymeric material, which holds the lead frame throughout the process. : Second, the general shortcomings of all solutions to materials or parts, which brings new materials, more processing equipment and processing time costs. No. 5,155,904 describes a soldering method which includes a step of bonding and reflow soldering a component on the other side before mounting the component on one side of a printed circuit board. When the board is reversed and the subsequent reflow and wave soldering steps are completed, the adhesive dots are placed on the board to attach and secure the components in place. This method is similar to the above concept of using epoxy overmolding, and will bring additional process steps, and is not suitable for all components', especially for sub-components with many components on a carrier. Summary of the invention: The main object of the invention is to provide an electronic component which is interconnected and mounted on a component carrier with lead wires that can withstand one or more reheating periods without losing the electrical or mechanical characteristics. The purpose includes a method for making and reporting such electronic components. Another purpose is to achieve such an electronic component == method, which is particularly suitable for self-supporting surface-mount sub-assembly. The purpose of T Dan is to provide an electronic component and a method for manufacturing the same, without adding cost or complexity compared to known solutions. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -6- 540264 A7
簡要而言，本發明之此等目 製造此種組件之方法所達成， 及供外部連接之引線，藉包括 彼此連接。為了維持加熱期間 間之焊料結合面外，至少該等 結合面 0 的i’T、错一種電子組件及一種 在其中一供電子元件之載體 焊料結合面之互相連接予以 ’除了施加在載體與一引線 互相連接之一包含一黏合劑 ，本發明之優點為其使各種性質之電子組件能在載體與引 、泉之間k仔可罪之互相連接，供很多不同焊料材料，包括 非MPb)| 3優點為諸組件可獨立於載體及引線框架之 相互位置設有合併之焊料及黏合劑結合面…另外優點為 在所有正‘回极過程期Fa1，諸組件將會保持機械性完整無 損。又-優點為黏合劑可在進行焊料回流之相同過程步驟 予以固化。再-優點為自支承表面安裝分組件如電源模組 ’可使本發明適配’而較之於純焊料結合面原㉟，無設計 及結構之任何實際變化，及製造步驟之很小變化。 自下列詳細說明，配合附圖及申請專利範圍考慮時，將 會明白本發明之其他諸多目的，優點及新穎特色。 附圖之簡要說明 本發明將參照下列附圖予以更詳細說明，在附圖中： 圖1為一根據本發明之電子組件之側視圖， 圖2為一根據本發明之替代性組件之側視圖， 圖3為一包括在在圖1中所揭示之組件，在一載體與引線 間之互相連接之側視圖， 圖4為在圖3中所揭示之互相連接之一焊料點及一黏合劑 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 540264 A7 _______ B7 五、發明説明（4 ) 點之側視圖，以及 圖5為自根據圖4之諸點上面之視圖。 發明之詳細說明 在圖1中所揭示之電子組件Π，為一設置為連同各種性質 其他電子細部（未示）安裝在一母板1 2之分組件。分組件包含 一供若干電子元件14之載體13，其可如在圖1中所示，予以 安裝在載體之頂側15或底側16，或安裝在其兩側。載體正 常為一在其上構成或附著一積體電路之基板。分組件藉一 包含一個或多個個別引線1 8之引線框架17，以一種慣常方 式予以自支承。引線之基本功能通常為在分組件與母板i 2 間之電接觸。 引線框架及引線可具有很多不同設計，但是一項共同特 色為至少一引線1 8藉一設置在載體與引線之一端部2〇間之 互相連接19，予以電連接至在載體上之至少一電路及元件 。分組件通常可包含電連接至載體之引線，及無此等連接 之盲引線。然而，所有引線較佳為利用相同型式之互相連 接安裝至載體。該互相連接應該不僅具有必要之導電性， 而是也具有經得起載體之重量及由運動，溫度等所導致之 所有可能外部力之機械強度。此等特性係藉一種.如自圖 所顯現，包含一焊料結合面2 2及一黏合劑結合面2 3之合併 焊料及黏合劑結合面2 1所達成。結合面22，23可以很多方 式方式設置，並具有不同構形，但較佳為合併之結合面2 i 係由焊料之一點24，及並排施加具有實際相等面積之黏合 刎之一點2ό所形成。在圖4中，將諸點施加在一附著至載體 -8- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公董) 一.、- 540264 A7Briefly, these objects of the present invention are achieved by a method of manufacturing such a component, and the leads for external connection include, for example, connection to each other. In order to maintain the solder bonding surfaces during the heating period, at least the i'T of the bonding surfaces 0, an electronic component, and a solder bonding surface of a carrier on one of the electron-donating elements are interconnected to each other except for applying to the carrier and a One of the interconnections of the leads includes an adhesive. The advantage of the present invention is that it enables electronic components of various properties to be interconnected between the carrier, the lead, and the spring, for many different solder materials, including non-MPb) | 3 The advantage is that the components can be provided with a combined solder and adhesive bonding surface independently of the mutual position of the carrier and the lead frame ... Another advantage is that during all the positive return process Fa1, the components will remain mechanically intact. Another advantage is that the adhesive can be cured in the same process steps as solder reflow. A further advantage is that self-supporting surface-mounted sub-assemblies such as a power supply module can make the present invention adaptable, without any actual changes in design and structure, and small changes in manufacturing steps compared to pure solder joints. Many other objects, advantages, and novel features of the present invention will become apparent from the following detailed description, when considered in conjunction with the accompanying drawings and the scope of patent application. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be described in more detail with reference to the following drawings, in which: Figure 1 is a side view of an electronic component according to the present invention, and Figure 2 is a side view of an alternative component according to the present invention FIG. 3 is a side view of the interconnection between a carrier and a lead included in the component disclosed in FIG. 1, and FIG. 4 is a solder joint and an adhesive bond disclosed in FIG. 3. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 540264 A7 _______ B7 V. Side view of point (4) of the invention description, and Figure 5 is a view from above the points according to Figure 4. Detailed description of the invention The electronic component Π disclosed in FIG. 1 is a sub-assembly which is arranged to be mounted on a motherboard 12 together with various electronic details (not shown). The subassembly includes a carrier 13 for a number of electronic components 14, which can be mounted on the top side 15 or the bottom side 16 of the carrier, or on both sides thereof, as shown in FIG. The carrier is usually a substrate on which an integrated circuit is formed or attached. The subassembly is self-supported in a conventional manner by a lead frame 17 containing one or more individual leads 18. The basic function of the leads is usually electrical contact between the subassembly and the motherboard i 2. The lead frame and the lead may have many different designs, but one common feature is that at least one lead 18 is electrically connected to at least one circuit on the carrier by an interconnection 19 provided between the carrier and one end portion 20 of the lead. And components. Subassemblies can generally include leads electrically connected to the carrier, and blind leads without such connections. However, all the leads are preferably mounted to the carrier using the same type of interconnections. The interconnection should not only have the necessary conductivity, but also the mechanical strength to withstand the weight of the carrier and all possible external forces caused by movement, temperature, etc. These characteristics are achieved by a combination of solder and adhesive bonding surface 2 1 including a solder bonding surface 22 and an adhesive bonding surface 23 as shown in the figure. The bonding surfaces 22, 23 can be arranged in many ways and have different configurations, but the combined bonding surface 2 i is preferably formed by one point 24 of the solder and one point 2θ which is applied side by side with a substantially equal area of bonding. In Figure 4, the points are applied to a carrier attached to the carrier. -8- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public director) I.,-540264 A7
之共同塾片26。然而，依組件之設計而定，也可將一或二 點均施加在引線上。 有二分組件之主要設計，一種（圖丨）其中將互相連接19設 置在載拉〜頂側1&另-種（圖2)其中將互相連接設置在 载體之底側16。根據第一種設計，將載體設置在一懸吊位 置在自母板延伸之引線端部2〇下面，其在互相連接導致 高拉伸應力，但是-種輕巧組件之優點。㈣二種設計， 將載體支承在引線之相同自由端2Q，但總體位於引線上面 。此種構形產生較少拉伸應力，但是要求較多垂直空間。 獨立於所選擇之設計，所有互相連接必須為可靠足夠經得 起正常回流過程。 根據本發明，一分組件之製造，包括施加焊料及黏合劑 至載體及/或引線上之所選擇之諸點之步驟。焊料予以選擇 為一種具有熔點低於450 C之合金。引線較佳為成一聯接結 構或引線框架之形式，其可為具有所有個別引線所構形之 最緣結構，或一種半製成結構，其稍後將行接受切斷及彎 曲作業，以便形成個別引線至希望之形狀。有若干用於施 加焊料及黏合劑之適當習知方法，，諸如網板印刷，模板 印刷及施配。在施加黏合劑及焊料後，在一適當夾具將引 線框架及載體彼此附著’以供另外處理。黏合劑，較佳為 一種可固化粘膠，可藉熱，紫外線（uv)輻射或任何其他方 便之固化過程予以固化，但由於在分組件之製造包括至少 一回流過程，其一項優點為將一種熱可固化粘膠之固化與 回流步驟合併。 本紙張尺度適用中國國家標準(CNS)今4規格(210 X 297公釐) 540264 A7 B7 五、發明説明（6 ) 在所有製造步驟完成時，分組件便準備供安裝在母板。 在該過程期間，正常再次將分組件再加熱，並且使至少母 板之一份部受到一次或多次回流過程。在焊料結合面之焊 料然後將會軟化或熔化至一種液體狀態，但固化之黏合劑 11保持其粘附特性，並維持互相連接完整無損。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Of common cymbals 26. However, depending on the design of the component, one or two points can be applied to the leads. There are two main components of the design, one (Figure 丨) in which the interconnection 19 is set on the load side ~ top 1 & the other (Figure 2) in which the interconnection is set on the bottom side 16 of the carrier. According to the first design, the carrier is placed in a hanging position under the lead end portion 20 extending from the mother board, which causes high tensile stress when interconnected, but has the advantage of a lightweight component. (2) The two designs support the carrier at the same free end 2Q of the lead, but are generally located above the lead. This configuration produces less tensile stress but requires more vertical space. Independent of the chosen design, all interconnections must be reliable enough to withstand the normal reflow process. According to the present invention, the manufacture of a subassembly includes the steps of applying solder and adhesive to selected points on the carrier and / or leads. The solder is selected as an alloy with a melting point below 450 ° C. The lead is preferably in the form of a connecting structure or a lead frame, which may be the most marginal structure with all the individual lead configurations, or a semi-finished structure, which will be subjected to cutting and bending operations later to form individual Lead to the desired shape. There are several well-known methods for applying solder and adhesives, such as screen printing, stencil printing, and dispensing. After applying the adhesive and solder, the lead frame and the carrier are attached to each other 'in an appropriate jig for additional processing. Adhesive, preferably a curable adhesive, can be cured by heat, ultraviolet (UV) radiation or any other convenient curing process, but because the manufacture of sub-assemblies includes at least a reflow process, one advantage is that The curing and reflow steps of a heat-curable adhesive are combined. This paper size applies to China National Standards (CNS) today 4 specifications (210 X 297 mm) 540264 A7 B7 V. Description of the invention (6) When all manufacturing steps are completed, the sub-assembly is ready for installation on the motherboard. During this process, the subassembly is normally reheated again, and at least one portion of the motherboard is subjected to one or more reflow processes. The solder on the solder joint surface will then soften or melt to a liquid state, but the cured adhesive 11 maintains its adhesion characteristics and maintains the integrity of the interconnections. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)