TW539843B - Thermal treatment unit with removing capability of particles generated by filter - Google Patents

Thermal treatment unit with removing capability of particles generated by filter Download PDF

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Publication number
TW539843B
TW539843B TW091118684A TW91118684A TW539843B TW 539843 B TW539843 B TW 539843B TW 091118684 A TW091118684 A TW 091118684A TW 91118684 A TW91118684 A TW 91118684A TW 539843 B TW539843 B TW 539843B
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Taiwan
Prior art keywords
gas
heat treatment
filter
gap
aforementioned
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TW091118684A
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Chinese (zh)
Inventor
Yukio Nagano
Ikuo Kanamori
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Espec Corp
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0083Chamber type furnaces with means for circulating the atmosphere
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0025Especially adapted for treating semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Furnace Details (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
  • Ventilation (AREA)

Abstract

A clean oven as a thermal treatment unit with removing capability of particles generated by a filter has a fan 4, the filter 3, a heat treating room 6 and a heater 9 according to an air circulating pass 5 as a general construction, and an air extracting hole provided at a clearance part produced between an inlet and outlet frames 1 and 7. an outside of a filter casing 31. and the oven casing. The particles generated by a packing 2 of the filter are sucked and discharged by the fan 4 and catched by the filter 3 preventing to be carried into the heat treating room 6.

Description

539843 五、發明説明( [技術領域] 本發明係有關於一種埶 摄μ ^ 禋熱處理I置,其係構建成在姓椹 構件上以密封構件為中 構 供熱處理用氣體循環之抵 - 為且 、循衣路徑將該氣體通過前述過濾哭 後進入熱處理室者,特別是以作為—種用以高溫: 淨化環境條件下進行熱處理之W玻璃基板等半導妒 產品在㈣t氣及t子零件崎熱處狀減理 2 於利用。 且 [習知技藝] 液晶玻璃基板等之半導體製品,其品質保持上由於必 須極力減少微小應垃夕& ^ ,^壓墣之粒子產生,所以在施行熱處理時, 通$疋構築成在稱做無塵烤箱之恆溫槽中透過被稱為 HEPA過濾器之高性能過濾器,而將熱處理用之循環空氣供 給至熱處理室者。 其結果,如於第8圖一形態所示,在習知處理通常到 300 C私度之熱處理溫度之裝置中,令由到達1〇〇。〇左右之 預熱溫度迄至300 °C左右間之熱處理溫度之昇溫運轉中(Τι) 及昇溫達成後之3001:固定溫度運轉中(丁2)中之塵粒之粒 子數限於100個以下,姑且滿足所要求之潔淨度。又,上述 100個係指熱處理室内之lcf(ft3K約28公升)之容積中粒子 之粒徑在0·5 μ m以上之個數。 [發明欲解決之課題] 惟,最近,以電子零件生產線及測試暨研究用之無塵 烤箱而言已製造出高達500°C程度之熱處理溫度者,而已了 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公楚) 4 (請先閲讀背面之注意事項再填寫本頁)539843 V. Description of the invention ([Technical Field] The present invention relates to a type of photo-treatment of heat treatment, which is constructed to provide a gas circulation for heat treatment with a sealing member as a medium structure on the surname member--and 1. The person who passes the gas through the aforementioned filter and enters the heat treatment room after passing through the filter, especially as a kind of semi-conductive products such as W glass substrates used for high temperature: heat treatment under purified environmental conditions. The heat treatment is used to reduce the use of heat treatment. [Knowledge technology] The quality of semiconductor products such as liquid crystal glass substrates must be minimized due to the need to minimize the generation of micro-response & ^, ^ pressed particles. At that time, it was constructed such that a high-performance filter called a HEPA filter was passed through a constant-temperature tank called a dust-free oven, and the circulating air for heat treatment was supplied to the heat treatment chamber. As a result, as in the eighth As shown in the form of Fig. 1, in the conventional processing device, the heat treatment temperature usually reaches 300 C, and the heat treatment temperature is from a preheating temperature of about 100 ° to a temperature of about 300 ° C. 3001 during heating operation (Ti) and after heating up: The number of dust particles in fixed temperature operation (Ding 2) is limited to 100 or less, and the required cleanliness is met. The above 100 refers to the heat treatment room The number of particles in the volume of lcf (ft3K about 28 liters) is more than 0.5 μm. [Questions to be solved by the invention] However, recently, electronic parts production lines and dust-free ovens for testing and research For those who have produced a heat treatment temperature of up to 500 ° C, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297). 4 (Please read the precautions on the back before filling this page)

539843 A7 B7 五、發明説明(2 解如此之無塵烤箱逐漸無法滿足熱處理室之淨淨度了。 亦即,以如此無塵烤箱,為了縮短製程時間,乃將溫 度上升時之速度由習知之4〜5t/min提高到為其2倍之8〜1〇 。口―者’由於熱處理溫度本身為高溫,且昇溫速度也加 所以如第6圖之習知無塵烤箱的圖示,可曉得升降溫過 私中’在介於南性能之過渡器3的周圍框31與無塵烤箱的入 口框1之間之襯墊2之部位上,兩框的熱形變量產生差異, 且對襯墊2加上如圖示之壓縮犯戈寬度方向及長度方向 (在圖中為垂直紙面之方向)之剪切力τ等會變動之外力, 生壓縮應力、剪切應力及伴隨此等所生之形變,使襯墊 其中尤以黏合劑黏著玻璃纖維等各魏㈣生灰塵,藉〜 如箭頭符號Α所示,塵粒被帶入熱處理室6,致使全粒子數 超過目標值者。 依照發明人的實驗可知,如第7圖所示,對於熱處理 溫度4HTC,由熱處理室之中央部分採收之樣本空氣在昇溫 犄及IV服日守之塵粒之產生個數,粒徑〇·3 &quot;瓜以上者超過 100個,這就無法得到預期潔淨度之結果。 在此,本發明係以提供一種熱處理裝置為課題,即, ,決習知技術之上述問題,且減少被帶人熱處理室之塵 里且將熱處理室之潔淨度維持在良好狀態者。 [發明之揭示] 本發明為了解決上述課題,第1態樣之發明係構建; -種熱處理裝置,其係於結構構件以密封構件為中介 衣過濾而由由具有送風機且供熱處理用氣體循環 發 此 粒 而 之 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適财_家標準Α4規格(21[297/JJ7 539843 五、發明說明 二錢則述氣體通過前述過濾器後進人熱處理室者,包 :有.:隔構件’係由前述熱處理室將含前述 ^在前述熱處理室側形成之間隙部分關者 間隙氣體之機構,係可取出前述間隙部分之氣體者 ,第2態樣之發明,係於上述態樣加上,前述吸取間隙 氣體之機構為一導入間隙氣 八#… 承乳體之機構,即可將前述間隙部 刀之氣體導入前述循環路徑。 产第3態樣之發明,係於上述態樣加上,前述導入間隙 讀之機構係可將前述氣體導人前述循環路徑中靠 風機之吸入側者。 刖’L运 [發明之實施型態] 第1圖係顯示作為適用本發明之熱處理裝置之無塵 相之構成例。 、 器 無塵烤箱100,係作成如下之裝置,即,在作為結構 構件之入口框1以為密封構件之襯墊2為中介安裝過濾 3,並由具有送風機4且供熱處理用氣體循環之循環路徑 將氣體通過過濾器3後進入熱處理室6者,其係具有作為 隔構件之出口框7及以取出間隙氣體之機構作為間隙氣 導入機構之抽氣口 8。熱處理室6及循環路徑5,係以形成尸 熱壁之内侧壁面之殼體101所包圍,在循環路徑5配設有韵 處理用之加熱器9。 又,本例之無塵烤箱係作高溫用,可昇溫至5〇〇。〇者 。又有至内急冷用之冷卻器1 〇 (可以未圖示之節流哭切換) 被加熱以便進行熱處理而循環之氣體,係對應氮濃縮空氣 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 流。〈里對象物與熱處理溫度等而使用空氣與惰性氣體氣 符其周圍被周圍框31包圍著,循環氣體如箭頭 付说所不通過除了盆绫 、 係夾設於與對應周圍 :框7,係構成為—二:= U理至6侧所形成之間隙部分71者H 密封熱處理室6與其入口側之循環物的部分之間= 在熱處理室6側亦產生間隙部分,但是,在本例,該間隙气 分7卜係藉襯墊2’直接與此相接觸之入口 : = 周圍㈣、無塵烤箱i。。之殼體二 八去〜 部分的周圍。出口框7係、包圍以隔開料 刀者。攸而’雖㈣部分與熱處理室6之間, 狀態,不過導通部分變狹小。 又,區隔構件並毋須設於第1圖所示之出口船之位 置’只要為含概墊2在内隔開間隙部分者,即使為隔成更狹 小之構件亦可。 抽氣口 8,係-作為可取出間隙部分71之氣體之間隙氣 體取出機構之導入部,在本例中,形成取出間隙部分的氣 體後導入循環路徑5中靠送風機4吸入側者。亦即,在本例 之無塵烤箱⑽中,間隙部分71的—部分形成於隔板m 側’該部分面向送風機4吸入之㈣,所以將間隙氣體取出兼 導入機構作成最簡單之構造時,則為單由開口所形成之抽 539843 A7 _____B7 五、發明説明(5 ) ^~ ~ 氣口 8。 (請先閱讀背面之注意事項再填寫本頁) 又,為可調整該部分之大小,亦可設置如以雙虛線表 示之具有緊縮機能之滑板81。若構成如此形態時,可調整 朝送風機吸入側的回送氣體量,可以最少量之氣體用相對 應之比率吸入由襯塾2所產生之塵粒。 如以上之無塵烤箱1〇〇係按如下運轉,可發揮其作用效 果。 熱處理室6内,如圖中以雙虛線所示者,於框架構造之 S盒200中載置多層欲行熱處理之對象物即由液晶玻璃基 板等所成之基板W後放入其中。接著,運轉送風機4及加熱 器9,使調整過空氣或濃度之氮濃縮氣體等之氣體循環成, 由循環路控5經由過濾器3後通過熱處理室6者。又,一完成 熱處理,即停止加熱器9的運轉,運轉冷卻器丨〇。 Φ 如此處於運轉中之熱理室6内之溫度,通常被程式所控 制。亦即,該運轉,如第2圖及第7圖所示,係在適當之升 降溫度及溫度維持時間之前提下進行到達1〇(rc左右之預 ”、、由此迄至400 C程度之熱處理溫度的昇溫、到達昇溫後 之熱處理溫度之基板W的加熱、朝2〇(rc程度以下之溫度之 冷卻等之各運轉。 如此使加熱氣體循環後,在昇溫及降溫時,在構成熱 處理裝置之各機器及構件,因其形狀與尺寸與熱容量與氣、 一每^况之不同,所以溫度變化之狀態亦變化不定, 又,其等之構件,由於選擇了由不鏽系材料所形成適合於 各個邛刀之材料,也由於其種類不同熱膨脹係數也有相當 本紙張尺度適用中國 539843 A7 B7539843 A7 B7 V. Description of the invention (2 Solution: The dust-free oven is gradually unable to meet the cleanliness of the heat treatment room. That is, in order to shorten the process time with such a dust-free oven, the speed when the temperature rises is known 4 ~ 5t / min is increased to 8 ~ 10 which is twice of that. Since the heat treatment temperature itself is high temperature and the heating rate is also increased, as shown in the conventional dustless oven diagram in Figure 6, we can know that The temperature rises and rises too much privately 'At the position of the gasket 2 between the surrounding frame 31 of the transitional device 3 of the south performance and the entrance frame 1 of the dust-free oven, the thermal deformation of the two frames is different, and 2 As shown in the figure, the shearing force τ in the width direction and length direction (in the figure is the direction of the vertical paper surface) of the compression force will change the external force, resulting in compressive stress, shear stress and the accompanying forces. Deformation causes the pads, especially adhesives, to adhere to the glass fiber and other dust, and as shown by the arrow symbol A, the dust particles are brought into the heat treatment chamber 6 so that the total number of particles exceeds the target value. According to the inventor The experiment shows that, as shown in Figure 7, The temperature is 4HTC, and the sample air collected from the central part of the heat treatment room is heated up and the number of dust particles produced by the IV service is kept. The particle size is 0.3 and more than 100, which cannot be expected to be clean. Here, the present invention aims to provide a heat treatment device, that is, to solve the above-mentioned problems of the known technology, reduce the dust brought into the heat treatment room, and maintain the cleanliness of the heat treatment room in a good state. [Disclosure of the invention] In order to solve the above-mentioned problems, the present invention is constructed according to the first aspect of the invention; a heat treatment device for filtering a structural member with a sealing member as an intermediary filter and using a blower and a gas for heat treatment This particle is circulated (please read the precautions on the back before filling this page) This paper is suitable for the standard _ home standard A4 specifications (21 [297 / JJ7 539843 V. Description of the invention Second, the gas passes through the aforementioned filter and then enters For the heat treatment room, including: Yes .: The partition member is a mechanism in which the aforementioned heat treatment room will contain the gap gas formed by the aforementioned part of the gap formed on the side of the aforementioned heat treatment room. Those who get out the gas in the gap part, the second aspect of the invention is based on the above-mentioned aspect, the mechanism for sucking the gap gas is a mechanism for introducing the gap gas eight # ... The gas is introduced into the aforementioned circulation path. The third aspect of the invention is added to the above aspect, and the introduction gap reading mechanism can guide the gas to the suction side of the fan in the aforementioned circulation path. 刖 'L [Implementation Mode of the Invention] FIG. 1 shows a configuration example of a dust-free phase as a heat treatment device to which the present invention is applied. The dust-free oven 100 is constructed as follows, that is, in an inlet frame as a structural member 1. The filter 2 is used as the intermediary of the gasket 2 of the sealing member, and the gas is passed through the filter 3 through the circulation path with the blower 4 and the gas for heat treatment is passed into the heat treatment chamber 6. 7 and the mechanism for taking out the interstitial gas as the exhaust port 8 of the interstitial gas introduction mechanism. The heat treatment chamber 6 and the circulation path 5 are surrounded by a casing 101 forming the inner wall surface of the dead wall, and the circulation path 5 is provided with a heater 9 for rhyme processing. In addition, the dust-free oven of this example is used for high temperature, and the temperature can be raised to 500. 〇 者. There is also a cooler 1 for internal quenching (can be switched by throttling, not shown). The gas that is heated for heat treatment and circulating is corresponding to nitrogen condensed air. The paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) flow. <Inside the object and heat treatment temperature, air and inert gas are used. The surrounding area is surrounded by the surrounding frame 31. The circulating gas does not pass through as indicated by the arrow. Except for the basin, it is sandwiched with the corresponding surroundings: frame 7, system The structure is as follows: == the gap portion 71 formed on the U-to-6 side is between the seal heat treatment chamber 6 and the portion of the circulating material on the inlet side = a gap portion is also generated on the heat treatment chamber 6 side, but, in this example, The gap gas content 7 is the entrance directly contacting this by the pad 2 ': = around, dust-free oven i. . The case two eight go ~ part around. The exit frame 7 is surrounded by a cutter. Although the state between the ㈣ portion and the heat treatment chamber 6 is in a state, the conduction portion becomes narrow. Further, the partition member need not be provided at the position of the exit ship shown in Fig. 1 'as long as it is a partition member including the approximate pad 2 and the member may be partitioned into a narrower member. Suction port 8, is the lead-in part of the interstitial gas take-out mechanism that can take out the gas in the interstitial part 71. In this example, after taking out the interstitial part of the gas, it is introduced into the circulation path 5 by the suction side of the blower 4. That is, in the dust-free oven ⑽ of this example, a part of the gap portion 71 is formed on the side of the partition m ', and this part faces the 吸入 where the blower 4 is sucked in. Therefore, when the clearance gas extraction and introduction mechanism is made as the simplest structure, It is a pump 539843 A7 formed by the opening alone _____B7 V. Description of the invention (5) ^ ~ ~ Gas port 8. (Please read the precautions on the back before filling in this page.) In order to adjust the size of this part, you can also set up a skateboard 81 with compaction function as indicated by double dashed lines. In such a configuration, the amount of the return gas to the suction side of the blower can be adjusted, and the dust particles generated by the liner 2 can be sucked in at a corresponding ratio with the smallest amount of gas. The above-mentioned dust-free oven 100 is operated as follows to exert its effect. In the heat treatment chamber 6, as shown by double dashed lines in the figure, a plurality of objects to be heat treated, that is, a substrate W made of a liquid crystal glass substrate or the like, is placed in an S box 200 having a frame structure, and then placed therein. Next, the blower 4 and the heater 9 are operated to circulate a gas such as adjusted air or a concentrated nitrogen-concentrated gas, and the circulation path control 5 passes through the filter 3 and passes through the heat treatment chamber 6. When the heat treatment is completed, the operation of the heater 9 is stopped and the cooler is operated. Φ The temperature in the thermal treatment chamber 6 in operation is usually controlled by a program. That is, as shown in FIG. 2 and FIG. 7, the operation is performed before the appropriate raising and lowering temperatures and temperature maintaining time are reached to reach 10 (about rc), and thus up to 400 C. Heat treatment temperature is increased, substrate W is heated to the heat treatment temperature after the temperature increase, and cooling is performed to a temperature of less than 20 ° C. After the heating gas is circulated in this way, a heat treatment device is configured when the temperature is increased and decreased. Each machine and component is different in shape and size, heat capacity and air condition, so the state of temperature change is also variable. Moreover, due to the selection of other components, suitable materials made of stainless-based materials are suitable. The material of each trowel is also quite different due to its different thermal expansion coefficient. This paper is applicable to China 539843 A7 B7

五、發明説明(ό ) &quot; &quot; B 程度不同,所以各變形量不同,在各個部分產生相對變位。 其結果’在襯墊2之部分’即使在與此相接觸之入口框 1與過遽器3之周圍框31之間亦引起不均等變形,如前述對 襯墊2上有壓縮力與剪斷力施加’在其内部產生對應於彼等 之應力與形變’其微細成分由襯墊2形成塵粒而飛散。 此時,在本例之裝置中,係對於間隙部分71而設有抽 氣口8,所以在間隙部分71,產生其中之氣體經常由熱處理 =6流向循環路徑5之送風機吸人側之氣流,當有塵粒產生 時’彼等藉氣體流而由間隙部分71通過抽氣口 8出去,以送 風機4送出’再度通過過濾器3。結果使塵粒被過渡器㈣ 捉。而—且不會使氣體由間隙部分71被排出至熱處理室^側。 —第2圖係顯示作如以上之無塵烤箱100的運轉試驗,測 定塵粒產生狀態之結果。 在該試驗使用之無塵烤箱為以下規格者。 基板處理方式;批式 處理能力;20枚/ 1次Fifth, the description of the invention (ό) &quot; &quot; B The degree is different, so the amount of deformation is different, and relative displacement occurs in each part. As a result, the 'part of the cushion 2' causes uneven deformation even between the inlet frame 1 and the peripheral frame 31 of the shutter 3 which are in contact with it. As described above, there is compressive force and shear on the cushion 2 The force application 'generates stresses and deformations corresponding to them', and its fine components are formed into dust particles by the pad 2 and scattered. At this time, in the device of this example, the air inlet 8 is provided for the gap portion 71, so the gas generated in the gap portion 71 is often heat-treated = 6 and flows to the suction side of the air flow path of the fan 5 of the circulation path. When there are dust particles, 'they pass out of the gap portion 71 through the exhaust port 8 by the gas flow, and are sent out by the blower 4', they pass through the filter 3 again. As a result, dust particles are captured by the transition device. And—without causing the gas to be discharged from the gap portion 71 to the heat treatment chamber side. —The second graph shows the results of measuring the dust particle generation state by performing the operation test of the dustless oven 100 as described above. The dust-free oven used in this test is the one with the following specifications. Substrate processing method; batch processing capacity; 20 pieces / 1 time

最高熱處理溫度;500°CMaximum heat treatment temperature; 500 ° C

加熱器輸出;54.6W 過濾器型式;耐熱特殊過濾器 襯墊材質;無機質系纖維 抽氣口 8的大小;直徑8〇1Ήΐη X 4個 該無塵烤箱,係除了具有抽氣口 8之點外與第7圖所示 之運轉結果相同。依據第2圖及第7圖之測定結果,未設置 抽氣口 8之通常構造中,在粒徑〇 · 3 # m以上之塵粒,在昇 本紙張尺度適用中國國家標準(CNS) A4規格(2K)&gt;&lt;297公釐) 9 (請先閱讀背面之注意事項再填寫本頁) 訂| 539843 A7 B7 五、發明説明(7 溫時凡及降溫時几均大幅超過平均每lcf5(H@,粒徑〇.5〆m 以上之粒子也接近50個,更進一步對於粒徑1〇/zm以上之 粒子也有相當數目,在設置適用本發明之本例之抽氣口8 之裝置,即使具有粒徑0.3 “η以上之粒子,其數目也在5〇 個以下,全體而言粒子的個數降低至第7圖的場合之一半程 度或彼等以下。 在此等之第2圖及第7圖之運轉,不導入昇溫速度及外 氣而使用冷卻器11急冷時之降溫速度同時為約8(t/min,在 第8圖所示之習知通常溫度之運轉之昇溫速度約6t:/min之 1.3倍以上,形成塵粒產生量較多之條件,不過在本例之裝 置,如上述可將試驗室内之粒子數量作成相當低之值。從 而,依適用本發明之第丨圖之裝置,在極為簡單之構造之 下,即使具有升降溫之速度較快之無塵烤箱,亦可以減低 塵粒可進熱處理室6之帶入量,可將其清淨度維持於良好之 狀態。又,在通常之熱處理溫度者,更可將其清淨度降低 至尚有多餘空間之較低等級。 又,在間隙部分71,由於將過濾器3的周圍框31與出口 框之間隙縮小,所以雖設置了所謂8〇匪之比較大口徑之抽 氣口 8 $過通過此等之氣體流量只為約2〜如^4,為循 %空乳置的約3〜5%之極少量。從而,即使設置如此之氣體 回送系統,亦不會對無塵烤箱給予影響。 第3圖係顯不適用本發明之無塵烤箱之另一形態。 本例之烤相比較於第丨圖之形態,其不同點在於在抽氣 口 8的位置之上游側配置送風機4,由抽氣π 8到其吸入側導 本紙張尺度適财關緖準(⑽μ祕⑽Heater output; 54.6W filter type; heat-resistant special filter pad material; size of inorganic fiber exhaust port 8; diameter 801Ήΐη X 4 dustless ovens, except for the point with exhaust port 8 and the first The results shown in Figure 7 are the same. According to the measurement results in Figures 2 and 7, in the normal structure without the suction port 8, dust particles with a particle size of 0.3 m or more are applicable to the national paper standard (CNS) A4 in the paper size standard ( 2K) &gt; &lt; 297 mm) 9 (Please read the precautions on the back before filling out this page) Order | 539843 A7 B7 V. Description of the invention (7 Wen Shifan and the temperature during cooling are significantly more than the average per lcf5 (H @ , The particle size above 0.5〆m is also close to 50. Furthermore, there is a considerable number of particles above 10 / zm. In the device provided with the suction port 8 of this example of the present invention, even if it has The number of particles having a particle size of 0.3 "or more is also 50 or less, and the number of particles as a whole is reduced to one-half or less of the case of Fig. 7. Here, Fig. 2 and Fig. 7 In the operation shown in the figure, the cooling rate when the cooler 11 is used for rapid cooling without introducing the heating rate and outside air is about 8 (t / min, the conventional heating temperature shown in Figure 8 is about 6t: / Min 1.3 times or more, the condition that a large amount of dust particles are formed, but in the device of this example, As described above, the number of particles in the test chamber can be made to a relatively low value. Therefore, according to the device of FIG. 丨 applying the present invention, with a very simple structure, even a dust-free oven with a faster temperature rise and fall rate, It can reduce the amount of dust particles that can be brought into the heat treatment chamber 6, and maintain its cleanliness in a good state. Moreover, at ordinary heat treatment temperatures, it can reduce its cleanliness to a lower level with excess space. In the gap portion 71, the gap between the surrounding frame 31 and the outlet frame of the filter 3 is reduced. Therefore, although a so-called large-sized suction port 8 is provided, the flow rate of gas passing through it is only Approximately 2 to 4, such as ^ 4, is a very small amount of about 3 to 5% that is placed in% empty milk. Therefore, even if such a gas return system is set, it will not affect the dust-free oven. Figure 3 shows that it is not applicable Another form of the dust-free oven of the present invention. Compared with the form of FIG. 丨, the roasting of this example is different in that the blower 4 is arranged upstream of the position of the exhaust port 8 and the exhaust air is π 8 to the suction side. Guide to paper size (⑽μ secret ⑽

:者官82。即使在本例’亦可得到完全與第1圖者同樣之作 用效果。 第4圖係顯示適用本發明之另一形態。 在本例中,由於送風機4離開第1、3圖所示之抽氣口 ^ , 纟於間隙4分71之氣體很難回到循環路徑5中之 ^風機4吸入侧,所以在上方之殼體UH設置抽氣口 8,配設 \—及以达風機84,作成使間隙部分71之氣體回到循環 、中之過慮為3的上游侧。在本例中,回送送風機84雖有 : 不過^ 一要為極小容量者即可,所以對電力消費 裝置成本的影響輕微。 第5圖係顯示適用本發明之另一例。 在本例中,不是將間隙部分71之氣體再度回到循環 徑5’而是與第4圖之裝置同樣在上方之殼體ι〇ι導設排氣 及攸此之排氣官12 ’通常作成設置無塵烤箱或從此進叫 :伸配官而釋出至外面之大氣中。又,熱處理室6内由於通 常形成某種程度之正壓’所以雖然氣體沒有從外面流入, 不過為了更完全的排氣,如圖巾以雙點虛線所示,亦可設 置排氣送風機13。同樣該排氣送風機亦可為小容量者。 依本例之裝置,是構建成取入與所放出之量相抵之 體作為循裱氣體者,雖為些微但仍有熱損失產生。但是, 對於液晶玻璃基板等之熱處理對象物,因為由為了在基核 上形成電路而採用之光阻或各種溶劑等所產生之昇華 體等之濃度降低之故,而須經常換氣,在如此之裝置,也 可以將來自抽氣口的排氣作為如此之換氣氣體的一部分使 8 與 路 口 而 氣 性氣 也 (請先閱讀背面之注意事項再填寫本頁): 者 官 82. Even in this example, the same effect as that of the first figure can be obtained. Fig. 4 shows another aspect to which the present invention is applied. In this example, since the blower 4 leaves the suction port ^ shown in Figs. 1 and 3, the gas trapped in the gap 4 minutes 71 is difficult to return to the suction side of the fan 4 in the circulation path 5, so the upper casing The UH is provided with an air exhaust port 8 and a fan 84, so that the gas in the gap portion 71 is returned to the upstream side of the circulation. In this example, although the return blower 84 has: However, it is only necessary to have a small capacity, so the impact on the cost of the power consumption device is slight. Fig. 5 shows another example to which the present invention is applied. In this example, instead of returning the gas in the gap portion 71 to the circulation path 5 'again, the same upper device as in the device of Fig. 4 is used to guide the exhaust and the exhaust officer 12'. Make a dust-free oven or call from now on: release the officer and release it to the outside atmosphere. In addition, although a certain degree of positive pressure is usually formed in the heat treatment chamber 6, although the gas does not flow in from the outside, for more complete exhaust, an exhaust fan 13 may be provided as shown by a two-dot chain line in FIG. Similarly, the exhaust blower can also be a small-capacity one. The device according to this example is constructed to take in a volume that is equal to the amount released, as a circulating gas. Although it is a small amount, heat loss is still generated. However, for heat-treated objects such as liquid crystal glass substrates, the concentration of the sublimated body produced by the photoresist used in order to form a circuit on the base core or various solvents and the like must be changed frequently. Device, you can also use the exhaust gas from the exhaust port as part of the ventilation gas so that the 8 and the intersection of gas and gas (please read the precautions on the back before filling this page)

訂I 本紙張尺度適财關_準(⑽⑽X297公幻 [發明的效果] :本發明’在第縐樣之發明中,係構建成一種 係於熱處理裝置的結構構件以密封構件為 裝過濾器’使氣體由具有送風機且使熱處理用氣 :衣之循環路徑通過該過遽器後進人熱處理室者,其中 又有3 &amp;封構件在内且將熱處理室側所產生之間隙部分由 熱處理室隔開之區隔構件’因此可在間隙部分與熱處理室 之間防止氣體的自由導通。 而且’由於設有可取出前述間隙部分之氣體之間隙氣 -取出機構,所以藉此,可使小量氣體一邊進入藉區隔構 牛而由間隙部分隔開之熱處理室,一邊將間隙部分之氣體 取出者。亦即,可使間隙部分換氣。 狀另—方面,由於間隙部分包含密封構件,所以熱處理 衣置-運轉,運轉狀態變成昇溫過程或降溫過程後,熱處 理叙置的結構構件與過遽器的結構材料做不均句變形,造 成密封構件上產生各種應力及形變,使由密封構件產生塵 埃成分之塵粒,且彼等進人部分。此時,如上述由於 可使間隙#分換氣’所以藉換氣可將如此塵粒由間隙部分 排除。其結果’可使熱處理室内之清淨度㈣在良好狀態。 :且’使要求無塵環境之半導體產品在可容許之潔淨度的 環境下進行良好的熱處理。 取出機構作成可將氣體導 ,因此可將氣體再度通過 在第2態樣之發明中,令間隙氣體 入循環路徑之間隙氣體導入機構 539843Order I This paper size is suitable for financial relations _ quasi (⑽⑽X297 公 幻 [Effect of the invention]: The present invention 'in the crepe-like invention, it is constructed as a structural member connected to a heat treatment device with a sealing member as a filter' Those who have a blower and let the heat treatment gas: the circulation path of the clothes pass through the passer and enter the heat treatment chamber. Among them, there are 3 &amp; sealing members and the gap generated on the heat treatment chamber side is separated by the heat treatment chamber. The open partition member can prevent free conduction of gas between the gap portion and the heat treatment chamber. Furthermore, since a gap gas-removal mechanism can be used to remove the gas in the gap portion, a small amount of gas can be obtained by this While entering the heat treatment chamber separated by the gap part by the partition structure, the gas in the gap part is taken out. That is, the gap part can be ventilated. In addition, since the gap part contains a sealing member, the heat treatment is performed. Clothing placement-running, after the operating state becomes the heating process or the cooling process, the structural components of the heat treatment and the structural materials of the converter are deformed, Various stresses and deformations are generated on the sealing member, so that dust particles of dust components are generated by the sealing member, and they enter the part. At this time, as described above, because the gap can be ventilated, the ventilation can be used to remove such dust. The granules are partially excluded from the gap. As a result, the cleanliness in the heat treatment chamber can be kept in a good state.: And 'Semiconductor products requiring a dust-free environment can be subjected to good heat treatment in an environment of allowable cleanliness. Since the gas is conducted, the gas can be passed again in the second aspect of the invention, and the gap gas is introduced into the gap gas introduction mechanism of the circulation path 539843

發明説明(10 過濾、為後再進入熱處理室。复 埶於a、, 八、、、。果,可以過濾器捕捉從襯 分之塵粒。而且,可將熱處理室維持 至循:路μ所由於由間隙部分取出之氣體被回收 所以不發生熱的損失,同時沒有必要補給氣 體/、'、、口果’不會影響敎處理奘署沾勒4古 …蜒理衣置的熱效率,又藉簡單的 構造,可以處理由襯墊發生之塵粒。 在第3態樣之發明中,由 …u 心將上述之間隙氣體導入機 構作成使氣體可以導人循環路徑中靠送風機吸人側者,所 以可將間隙部分的氣體藉送風機的吸人力送回循環路後。 其結果’加上上述作用效果,可構建成只要在間隙部分設 置與送風機之吸人側導通之導通口或設置用以導通之管程 度之極為簡單的構造者。 [圖面的簡單說明] 第1圖為顯示適用本發明之熱處理裝置之無塵烤箱之 全體構成例之說明圖。 第2圖為顯示上述無塵烤箱運轉中塵粒之測定結果之 說明圖。 ° 第3圖為顯示上述無塵烤箱之全體構造之另一例之說 明圖。 第4圖為顯示上述無塵烤箱之全體構造之又一例之說 明圖。 第5圖為顯示上述無塵烤箱之全體構造之又一例之說 明圖。 第6圖為顯示習知之高溫用無塵烤箱之全體構造例之 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公 13 (請先閲讀背面之注意事項再填寫本頁)Description of the invention (10 Filtration, and then enter the heat treatment chamber. Replicated in a ,, eight ,,, etc., the filter can capture the dust particles from the lining. Moreover, the heat treatment chamber can be maintained to the path: the road μ Because the gas taken out from the gap is recovered, there is no heat loss, and it is not necessary to supply gas /, ',, and fruit' will not affect the thermal efficiency of the processing department Zhanle 4 ancient ... The structure can handle the dust particles generated by the gasket. In the third aspect of the invention, the above-mentioned gap gas introduction mechanism is made by u u so that the gas can be guided into the circulation path by the blower suction side, so The gas in the gap part can be returned to the circulation path by the suction force of the blower. As a result, the above-mentioned effect can be constructed, as long as a conduction port is provided in the gap part for conducting with the suction side of the blower, or it is provided for conducting An extremely simple constructor. [Simplified description of the drawing] Fig. 1 is an explanatory diagram showing an overall configuration example of a dust-free oven to which the heat treatment device of the present invention is applied. Fig. 2 is a diagram showing The following is an explanatory diagram of the measurement results of dust particles during the operation of the dust-free oven. ° Fig. 3 is an explanatory diagram showing another example of the overall structure of the above-mentioned dust-free oven. Fig. 4 is another example of the overall structure of the above-mentioned dust-free oven. Fig. 5 is an explanatory diagram showing another example of the entire structure of the above-mentioned dust-free oven. Fig. 6 is a diagram showing the entire structure example of a conventional high-temperature dust-free oven. The paper size is applicable to the Chinese National Standard (CNS) A4 specifications (210X297 male 13 (Please read the precautions on the back before filling this page)

539843 A7 B7 五、發明説明(Η ) 說明圖。 第7圖為顯示上述無塵烤箱之高溫運轉之塵粒之測定 結果之說明圖。 第8圖為顯示習知之通常熱處理溫度之無塵烤箱之程 序運轉時試驗室内之潔淨度之說明圖。 14 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 539843 A7 B7 五、發明説明(i2 元件標號對照 1_.·入口框(結構構件) 2···襯墊(密封構件) 3.. .過濾器 4.. .送風機 5.. .循環路徑 6…熱處理室 7.. .出口框(區隔構件) 8·.·抽氣口(間隙氣體取出機 構,間隙氣體導入機構) 9…加熱器 10.. .冷卻器 11···排氣口(間隙氣體取 出機構) 12···排氣管(間隙氣體取 出機構) 13.. .排氣送風機(間隙氣 體取出機構) 31.. .周圍框 31a_··緣 71.. .間隙部分 81.. .滑板 82、83...管(間隙氣體取出機 構,間隙氣體導入機構) 84···回送送風機(間隙氣 體取出機構,間隙氣 體導入機構) 100.. .無塵烤箱(熱處理裝置) 101.. .殼體 102.. .隔板 200··.匣盒 (請先閲讀背面之^一意事項再填寫本頁) 15 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)539843 A7 B7 5. Explanation of the invention (Η) Illustrative drawing. Fig. 7 is an explanatory diagram showing the measurement results of dust particles in the above-mentioned dust-free oven during high temperature operation. Fig. 8 is an explanatory diagram showing the cleanliness of the test chamber during the operation of a conventional dust-free oven having a conventional heat treatment temperature. 14 (Please read the precautions on the back before filling this page) This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 539843 A7 B7 V. Description of the invention (i2 component number comparison 1_. · Entrance frame (structure Components) 2 ··· Gaskets (sealing components) 3. Filters 4. Fans 5. Circulation paths 6 ... Heat treatment chambers 7. Outlet frames (separating components) 8 ·· Exhaust ports (Gap gas extraction mechanism, gap gas introduction mechanism) 9 ... heater 10 .. cooler 11 ... exhaust port (gap gas extraction mechanism) 12 ... exhaust pipe (gap gas extraction mechanism) 13. .Exhaust blower (clearance gas take-out mechanism) 31 .. Peripheral frame 31a_ ·· Edge 71 .. Clearance portion 81 .. Slider 82, 83 ... tube (clearance gas take-out mechanism, clearance gas introduction mechanism) 84 ··· Blow-back blower (clearance gas take-out mechanism, clearance gas introduction mechanism) 100.. Dust-free oven (heat treatment device) 101... Housing 102... Shelf 200... (Please read the back first) (Please fill in this page on the subject of ^ 1 intention) 15 This paper size applies to Chinese National Standards (CNS) A4 specifications (210X297 mm)

Claims (1)

539843 六、申請專利範圍 種尤、處理衣置,係構建成在結構構件以密封構件為 而女H慮器’而’由具有送風機且供熱處理用 孔體擔%之㈣路徑通過前述過濾器後使前述氣體 進入熱處理室者,包含有: 仏⑽傅什,係包含前 4在对構件在内而將刖延熟 處理室侧所產生之間隙部分由 丨刀由刖述熱處理室隔開者; 及, 間隙氣體取出機構,係可取出 體者。 %述間隙部分之氣 2. 如申請專利範圍第1項之熱處理裝置 體取出機構,係一可將前述間隙部分 循環路徑之間隙氣體導入機構。 如申請專利範圍第2項之熱處理裝置 體導入機構,係一可將前述氣體導入 靠前述送風機吸入側者。 ’其中該間隙氣 之氣體導入前述 ’其中該間隙氣 前述猶環路徑中 3.539843 VI. The scope of application for patents, special treatment and clothing, is constructed so that the structural member is a sealing member and the female filter is 'and' is passed by the filter with a blower and a hole for heat treatment. Those who make the aforementioned gas enter the heat treatment chamber include: 仏 ⑽ Fu Shi, which includes the first 4 in the opposite components, and the gap portion generated by the side of the maturation processing chamber side is separated by the knife by the heat treatment chamber; And, the interstitial gas take-out mechanism is a person who can take out the body. The gas in the gap part 2. If the heat treatment device body taking-out mechanism of item 1 of the patent application scope is a gap gas introduction mechanism capable of introducing the circulation path of the aforementioned gap part. For example, the heat treatment device body introduction mechanism in the scope of the patent application is the one that can introduce the aforementioned gas to the suction side of the aforementioned blower. ‘Where the gas of the interstitial gas is introduced into the aforementioned‘ where the interstitial gas is in the aforementioned still-loop path 3.
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JP4859514B2 (en) * 2006-04-20 2012-01-25 エスペック株式会社 Filter fixing mechanism, filter fixing method, and heat treatment apparatus
JP2007307445A (en) * 2006-05-16 2007-11-29 Espec Corp Air filter unit and thermal treatment apparatus equipped with the air filter unit
JP2012084805A (en) * 2010-10-14 2012-04-26 Koyo Thermo System Kk Heat treatment equipment
CN104617190B (en) * 2014-12-25 2017-06-06 鸿利智汇集团股份有限公司 The cleaning equipment and method for cleaning of a kind of LED dust granules
JP6291109B1 (en) * 2017-04-20 2018-03-14 中外炉工業株式会社 filter
WO2018193646A1 (en) * 2017-04-20 2018-10-25 中外炉工業株式会社 Clean oven
CN112289708B (en) * 2020-09-29 2023-09-08 北京北方华创微电子装备有限公司 Temperature regulation rate control device and method and semiconductor device

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JP3108460B2 (en) * 1991-02-26 2000-11-13 東京エレクトロン株式会社 Vertical heat treatment equipment
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