538430 A7 五、發明説明（i ) 曼j月之技術頜拔 本务明疋關於一種使用於半導體工業之托盤，用來運 送封裝如BGA、QFP、TQFP，及類似的封裝之積體電路。 特別的是，本發明是關於一種具有可移除組合件之托盤， β亥組合件是可被置入托盤的一邊緣，藉此讓使用者可藉由 該組合件相關之指標或顏色來辨視托盤内特殊的容納物。 登明之背景 電器設備如個人電腦、行動電話，及伺服器上用來固 持多數已組裝之封裝半導體元件的托盤，是眾所皆知的。 半導體元件不同的封裝方式早已存在，如「BGA封裝」、 「QFP封裝」、「TQFP封裝」。舉例來說，如第i續的俯視 圖顯示，這種型式的托盤，是在測試該封裝元件前、後用 於輸送該封裝元件，置放該封裝元件到使用者，供使用者 在該封裝元件被組裝在電路板完工之前，操作該封裝元 件。第1A圖中的托盤100包含框架1〇3。該框架ι〇3具有數 個可放置該半導體元件之開口 1〇M〜1〇1_1〇。每個開口 10M〜1G1_1()包含—用來在測試前後固持—封裝元件、或 從製造者輸送至使用者的架子，如架子1〇2ι〜ι〇2_⑺。二 細上的托盤可上下互相堆疊’且緊緊地捆在_起，用來 從製造者裝運到使用者。一般而言，每一托盤會固持許多 +同型式組裝封裝半導體元件其中之_。伴_㈣的該 I 發貨單會指出在每個托盤包含那種特別的設備。然而，因 為該使用者具有數個不同元件在本質相似的托盤上，使用 者可能會在不正確的托盤中，發生在目標系統封裴半導體 本紙張尺度適國家標準（CNS) A4規格（210X297公釐)--------538430 A7 V. Description of the Invention (i) Mandible Technology Jaw Extraction This task is about a tray used in the semiconductor industry to transport integrated circuits such as BGA, QFP, TQFP, and similar packages. In particular, the present invention relates to a tray having a removable assembly. The beta-hai assembly can be placed on an edge of the tray, so that the user can identify it by the indicators or colors associated with the assembly. Depending on the special contents in the tray. Background of the electrical appliances It is well known that electrical equipment such as personal computers, mobile phones, and trays on servers used to hold most of the assembled semiconductor components packaged. Different packaging methods for semiconductor components already exist, such as "BGA package", "QFP package", "TQFP package". For example, as shown in the top plan view on page i, this type of tray is used to transport the packaging component before and after testing the packaging component, and to place the packaging component to the user for the user to place the packaging component on. The assembly is handled before the circuit board is completed. The tray 100 in FIG. 1A includes a frame 103. The frame ι03 has a plurality of openings 10M to 1010_1 where the semiconductor element can be placed. Each opening 10M ~ 1G1_1 () contains—for holding before and after the test—encapsulating the component, or a shelf that is transported from the manufacturer to the user, such as a shelf 1022 ~ ι〇2_⑺. The two pallets can be stacked on top of each other ’and tightly packed together for shipment from the manufacturer to the user. In general, each tray will hold many of the same type of packaged semiconductor components. The I invoice accompanying _㈣ will indicate which special equipment is included in each pallet. However, because the user has several different components on a tray that is similar in nature, the user may occur in the incorrect tray in the target system. Feng Pei Semiconductor ’s paper size is in accordance with the national standard (CNS) A4 specification (210X297). Li) --------
--------- ——鲁…： (請先閱讀背面之注意事項再填寫本頁) •、盯| f 4 538430 A7 ____B7 五、發明説明（2 ) 元件置放位置的錯誤。據上所述，需要一種方法及結構來 讓使用者輕易地辨別出在每一托盤封裝半導體元件特別的 型式。 發明之概要說明 根據這種發明，提供一種方法及結構用來讓使用者輕 易地分辨帶著封裝半導體元件之托盤内元件的型式。 該發明之一具體實施例，一個可移除的組合件，可以 被塞進该托盤的一個邊緣，藉由該組合件上的指標的方 式，讓使用者辨別托盤内元件特別的型式。 在另一具體實施例，該可移除的組合件可由組合件的 顏色，顯示托盤内元件的型式。該托盤可有數個顏色中的 其中之一，或是這些顏色的組合，這些顏色或是顏色的組 合指出托盤内具有元件的型式。 根據該發明另一個具體實施例，該組合件包含如字母 或數子或這些組合的指標，用來分辨托盤内具有元件的型 式。 該發明的優點是使用者可以藉由組合件的顏色或是 組合件上該指標對照事前決定每個顏色或指標關連的特別 凡件列表，而輕易地辨別托盤上具有元件的型式。放置一 組裝封裝半導體元件在一種電子系統上的印刷電路板上， >果不忽、略本發明該方式或結構的話，錯誤的可能性可以 大幅地減少。 在對照下面詳細的敘述與搭配的圖式，該發明會 全地被了解。 元 5張尺度義巾關緖準~--- (請先閲讀背面之注意事項再填寫本頁) 、可— f 538430 A7 -------B7 五、發明説明（3 ) 第1Α圖顯示用於本發明一種托盤型式之俯視圖。 (請先閱讀背面之注意事項再填寫本頁) 第1Β圖顯示第1Α圖中該托盤之ΑΑ截面圖。 第1C圖顯示第1Α圖中該托盤之ββ截面圖。 第1D圖顯示第1Α圖中該托盤之一邊緣結構的俯視 圖’該邊緣結構可以根據本發明接收一組合件。 第1E圖顯示根據本發明之該可固持該組合件之托盤 更多的細節。 第2A、2B、2C及2D圖分別顯示一適合搭配本發明第 1A圖的托盤中之組合件的側邊、上方截面、後視及邊緣視 圖。 第3A到3C圖顯示一用來搭配本發明之組合件之--------- ——Lu ... (Please read the precautions on the back before filling out this page) •, stare | f 4 538430 A7 ____B7 5. Description of the invention (2) The component placement position is wrong. According to the above, there is a need for a method and structure for the user to easily identify the particular type of semiconductor device packaged in each tray. SUMMARY OF THE INVENTION According to this invention, a method and structure are provided for allowing a user to easily distinguish the type of components in a tray with packaged semiconductor components. In a specific embodiment of the invention, a removable assembly can be tucked into an edge of the tray, and the user can identify the particular type of components in the tray by means of indicators on the assembly. In another specific embodiment, the removable assembly can display the type of the components in the tray by the color of the assembly. The tray can have one of several colors, or a combination of these colors. These colors or combinations of colors indicate the type of components in the tray. According to another embodiment of the invention, the assembly contains indicators such as letters or numbers or combinations of these to identify the type of components in the tray. The advantage of the invention is that the user can easily identify the type of the component on the tray by the color of the assembly or the index on the assembly to determine in advance the list of special items related to each color or index. Placing an assembled and packaged semiconductor element on a printed circuit board on an electronic system, > If the method or structure of the present invention is omitted, the possibility of errors can be greatly reduced. The invention will be fully understood in contrast to the detailed description and accompanying drawings below. Yuan 5 Zhang Yizhang Guan Xuzhun ~ (Please read the precautions on the back before filling in this page), can — f 538430 A7 ------- B7 V. Description of the invention (3) Figure 1A Top view showing a tray type used in the present invention. (Please read the precautions on the back before filling out this page) Figure 1B shows the AA cross section of the tray in Figure 1A. Figure 1C shows a ββ cross-sectional view of the tray in Figure 1A. Fig. 1D shows a top view of an edge structure of the tray in Fig. 1A. The edge structure can receive an assembly according to the present invention. Figure 1E shows more details of the pallet capable of holding the assembly according to the present invention. Figures 2A, 2B, 2C, and 2D show the side, upper cross-section, rear, and edge views of an assembly suitable for use with the tray of Figure 1A of the present invention, respectively. Figures 3A to 3C show a schematic diagram of an assembly used with the assembly of the present invention.
Plug，讓不同的封裝型式或作業可根據本發明的原理辨別。 本發明之详細描诫 下面詳細的描述將說明幾種本發明具體實施例。該描 述是只是用來說明，並不是限制。從事該項技藝的人將清 楚了解本發明其他具體實施例。 根據s玄發明’苐1A圖中是關於一種具有一托盤邊緣 100結構105之托盤100。如第1A圖，結構1〇5是位於該托盤 100之右側104-2 ’該右側104-2是相對於旁側1〇4-1及1〇4-3 或104-4。一組合件200(第2A圖）是可被移除地塞在旁側 104-2的結構105。當然’如果需要，一結構如結構1 〇5如果 被製造在這些側邊其中之一，組合件2〇〇可以被安裝在二側 104-1及10 4-3其中之一 ’或该托盤1〇〇另一尾端⑺心斗。該 本紙張尺度適用中國國家標準(CNS) A4規格（210X297公釐) ' " 538430 A7 ---------- —___B7 五、發明説明（47 "" 一 ：— 等、、且σ件可以被安裝在托盤二個以上的旁側，如此一 來，藉觀看托盤1〇〇_或二個以上邊緣，可決定該托盤1〇〇 上具有該元件的型式。 第1B 1C圖分別顯示該托盤100上之ΑΑ截面及ΒΒ截 面。如第IB、1C圖，架子1〇2-卜1〇2-2，1〇2一3及1〇2_8分 別環狀延伸圍繞開口1_，1()1·2 , 1G1_3及⑻·8 ,讓封裝 半導體70件停留在每一開口 1〇Μ，1〇1_2，ι〇ι_3及⑻·8 的每一架子1G1]，⑻小1GU及1()1·8上。該等半導體元 件一般藉由地心引力被固持在架上。然而，不管置放或是 對托盤其他的作業時托盤丨〇〇的方向，如果需要，膠帶或是 其他結構可被用來固持該托盤上之封裝元件。這種在該托 盤100用來固持封裝元件的機構是眾所皆知的。 第1D圖顯示本發明用來固持該組合件2〇〇的該托盤 100的尾端104-2截面的一部份。如第1D圖所示，結構1〇5 包含二斜面邊緣106-1及1〇6-2。第⑺圖顯示該等斜面邊緣 106-1及106-2更多的細節。如第1E圖所示，斜面邊緣^64 從表面107延伸大約60。（如果需要，其他合理的角度可以 使用）使斜面邊緣106-1的點丨⑽-丨距對應的斜面邊表面 106-2的點108-2，比邊緣ι〇6·ι上的點1〇9-1距邊緣1〇6·2上 的點109-2更接近。 在第ιέ圖中一具體貫施例’平面的表面η〇·ι及η 自表面107垂直延伸一小段距離，直到具有角度表面開始的 點109-2及106-2。如此，該具角度的表面1〇6-1、1〇6_2設計 成接收一組合件，緊緊地藉表面107固持該組合件，該組合 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公釐）Plug, so that different package types or operations can be identified according to the principles of the present invention. Detailed Description of the Invention The following detailed description will illustrate several specific embodiments of the invention. This description is for illustrative purposes only and is not a limitation. Those skilled in the art will clearly understand other specific embodiments of the present invention. According to the invention of Xuan Xuan '苐 1A, a tray 100 having a tray edge structure 100 is shown. As shown in FIG. 1A, the structure 105 is located on the right side 104-2 of the tray 100. The right side 104-2 is opposite to the side 104-1 and 104-4 or 104-4. An assembly 200 (FIG. 2A) is a structure 105 that can be removed and tucked to the side 104-2. Of course 'if required, a structure such as structure 105 can be installed on one of the sides 104-1 and 10 4-3 if it is manufactured on one of these sides' or the tray 1 〇〇 The other end was struggling. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) '" 538430 A7 ---------- --___ B7 V. Description of the invention (47 " " I:-etc., And, σ pieces can be installed on two or more sides of the tray. In this way, by viewing the tray 100_ or two edges, the type of the component on the tray 100 can be determined. 1B 1C The figure shows the AA cross section and the BB cross section on the tray 100. As shown in Figs. 1 () 1 · 2, 1G1_3 and ⑻ · 8, let 70 pieces of packaged semiconductors stay at each opening 10M, 10_2, ι〇3_ and ⑻ · 8 each shelf 1G1], small 1GU and 1 () 1 · 8. These semiconductor components are generally held on the rack by gravity. However, regardless of the orientation of the tray when placing or other operations on the tray, if necessary, tape or other The structure can be used to hold the packaging components on the tray. Such a mechanism for holding the packaging components in the tray 100 is well known. Figure 1D shows A portion of the cross section 104-2 of the tail end 100 of the pallet 100 invented to hold the assembly 2000. As shown in FIG. 1D, the structure 105 includes two beveled edges 106-1 and 106-2. The second image shows more details of the beveled edges 106-1 and 106-2. As shown in FIG. 1E, the beveled edge ^ 64 extends from the surface 107 about 60. (If necessary, other reasonable angles can be used) Make the point of the bevel edge 106-1 丨 ⑽- 丨 from the point 108-2 of the corresponding bevel edge surface 106-2, than the point 109-1 on the edge ι〇 ·· ι from the edge 106 · 2 The point 109-2 is closer. In the specific figure, a specific embodiment of the 'planar surfaces η〇 · ι and η extend vertically from the surface 107 for a short distance until the points 109-2 and 106- 2. In this way, the angled surface 106-1, 10-6_2 is designed to receive an assembly, and the assembly is tightly held by the surface 107, and the paper size of this assembly applies the Chinese National Standard (CNS) A4 specification (210X297 mm)
----- (請先閲讀背面之注意事項再填寫本頁) •訂· •着， 7 538430 A7 B7 五、發明説明（5 ) 件如具有漸細尾端之組合件200。 --------- :…噃…： (請先閱讀背面之注意事項再填寫本頁) 第2 A圖到第2 D圖說明組合件2 0 0之一具體實施例。第 2 A圖到第2 D圖是一矩形件，包含多數個按扭，圖令顯示三 個按扭201-1、201-2及201-3。該組合件具有斜面尾端202-1 及202-2。這些尾端的斜面被彎折成同一角度自組合件2〇〇 之平面背204-2(第2B圖），如邊緣106-1及106-2被彎折自表 面107。在一具體實施例，自平面的背表面204-2算起，表 面202-1與表面202-2的角度大約60。 組合件200具有三凸出自面204-1之按扭201-1、201-2 及201-3。當組合件200放置在托盤1〇〇的邊緣1〇4-2上結構 105，面204-1自邊緣104-2面向外。托盤200的背表面204_2 、訂— 是被直接壓在托盤100邊緣104-2的外表面。按扭20^到 201- 3呈環狀。如果適合且需要，其他形狀的按扭可以被使 用。 t 第2C圖顯示該組合件2〇〇的後視圖。組合件2〇〇的表面 204-2有三形成在裡面之開口 2〇8-1、2〇8-2、2〇8_3，開口部 伤延伸入按紐201-1〜201-3。這些開口是製造過程的一部 份’用來減少組合件的重量，但落需要的話也可以忽略。 一縮格206是形成在組合件200之頂邊緣。縮格2〇6使 組合件200在接合於托盤1〇〇的邊緣ι〇4-2之角度表面 及106-2之間適度的對齊。一般而言，凹槽2〇6會面對上方 來確保該組合件是適度地置於結構105的凹槽内。 第2D圖顯示該具有可清楚看見之按鈕201-3及尾端 202- 2的組合件2〇〇的尾視圖。----- (Please read the notes on the back before filling out this page) • Order · • Book, 7 538430 A7 B7 V. Description of the invention (5) Pieces such as the combination piece 200 with tapered tail. ---------: ... 噃…: (Please read the notes on the back before filling out this page) Figures 2A to 2D illustrate one specific embodiment of the assembly 2 0 0. Figures 2A to 2D are rectangular pieces containing a large number of buttons. The figure shows three buttons 201-1, 201-2, and 201-3. The assembly has beveled ends 202-1 and 202-2. These bevels at the trailing ends are bent at the same angle from the flat back 204-2 (Figure 2B) of the assembly 2000, such as the edges 106-1 and 106-2 are bent from the surface 107. In a specific embodiment, the angle between the surface 202-1 and the surface 202-2 is about 60 from the planar back surface 204-2. The assembly 200 has three buttons 201-1, 201-2, and 201-3 protruding from the surface 204-1. When the assembly 200 is placed on the structure 105 on the edge 104-2 of the tray 100, the face 204-1 faces outward from the edge 104-2. The back surface 204_2 of the tray 200 is ordered directly on the outer surface of the edge 104-2 of the tray 100. The buttons 20 ^ to 201-3 are circular. If appropriate and required, other shapes of buttons can be used. t Figure 2C shows a rear view of the assembly 200. The surface 204-2 of the assembly 200 has three openings 208-1, 208-2, and 208_3 formed in the inside, and the wounds of the openings extend into the buttons 201-1 to 201-3. These openings are part of the manufacturing process ' used to reduce the weight of the assembly, but can be ignored if needed. A grid 206 is formed on the top edge of the assembly 200. The shrinkage 206 allows the assembly 200 to be properly aligned between the angular surface of the tray 100 bonded to the edge 1004 of the tray 100 and 106-2. Generally speaking, the groove 206 will face upwards to ensure that the assembly is properly seated in the groove of the structure 105. Figure 2D shows the rear view of the assembly 200 with the buttons 201-3 and the tail 202-2 clearly visible.
538430 A7 B7 五、發明説明（6 ) (請先閱讀背面之注意事項再填寫本頁) 值待注意的是，平面的邊緣207-1及207-2是自組合件 200的背表面204-2垂直並鄰近形成，如第2]6圖。垂直背表 面204-2之平面的表面,與自表面1〇7平面 109-1及109-2(第1E圖）配對，該表面與表面⑺心丨及1〇6_2定 義出在托盤100尾端104-2的結構105之該凹槽。 一可移除的插塞300是可藉置放插塞3〇〇置兩環形插 塞201-1〜201-3被連接至組合件2〇〇。例如，凹槽302的區 域302-1會接收組合件2〇〇上的按鈕2〇1-2，而凹槽3〇2之區 域302-2可接收組合件2〇〇上之按姐201-3。第3B圖顯示一按 鈕300之尾視圖’而第3c圖顯示一插塞3〇〇之截面ff之側視 圖。 訂丨 t 插塞3 00可被設計成任何顏色，該特別的顏色關連一 在托盤100内之特別元件。也可以是，組合件2〇〇也可具有 辨別托盤1 00内元件之顏色。此外，如一組數字或字母的 指標，或是一組合之數字或字母符號可被置於組合件2〇〇 的外表面，或插塞300的外表面3〇5，用來辨別在托盤1〇() 内的元件型式。一使用者可以藉插塞3〇〇的顏色或指標來辨 別托盤100内的元件，且可容易置換插塞3〇〇為不同顏色的 插塞’或是一具有用來辨別一托盤1〇〇内不同型式元件之不 同指標。 當然，如果需要，托盤100可使用多於一組合件2〇〇， 不但可指出托盤100内之元件型式，更可指出下一托盤1〇〇 内之封裝元件要被帶到的作業，或是托盤100内封裝元件從 哪一作業帶來。在托盤1 〇〇上一個或多個邊緣形成多數的結 9538430 A7 B7 V. Description of the invention (6) (Please read the precautions on the back before filling out this page) It is worth noting that the edges 207-1 and 207-2 of the plane are the back surface 204-2 of the self-assembly 200 Formed vertically and adjacent, as shown in Figure 2] 6. The plane surface of the vertical back surface 204-2 is paired with the surface 107 surface 109-1 and 109-2 (Figure 1E) from the surface 107, which is defined at the end of the tray 100 and 10-6_2 The groove of the structure 105 of 104-2. A removable plug 300 is a releasable plug 300, and two ring plugs 201-1 to 201-3 are connected to the assembly 200. For example, the area 302-1 of the groove 302 will receive the button 201-2 on the assembly 200, and the area 302-2 of the groove 302 may receive the press 201- on the assembly 200. 3. Fig. 3B shows a rear view of a button 300 'and Fig. 3c shows a side view of a cross section ff of a plug 300. The plug 3 00 can be designed in any color, and the special color is associated with a special element in the tray 100. Alternatively, the assembly 200 may have a color for identifying components in the tray 100. In addition, a set of numbers or letters, or a combination of numbers or letters, can be placed on the outer surface of the assembly 2000 or the outer surface 305 of the plug 300 to identify the tray 1. () The type of the component. A user can identify the components in the tray 100 by the color or index of the plug 300, and can easily replace the plug 300 with a plug of a different color 'or have a tray 100 for identifying a tray. Different indicators of different types of components inside. Of course, if needed, the tray 100 can use more than one assembly 200, which can not only indicate the type of components in the tray 100, but also indicate the operation to which the packaging components in the next tray 100 are to be brought, or From which operation the packaged components in the tray 100 are brought. One or more edges form a majority of knots on the tray 100