TW530394B - Electrical device with metal plugs and method for making the same - Google Patents

Abstract

An electrical device with metal plugs is provided. The electrical device includes a plurality of bumps with metal plugs. The bumps also have elastic bodies formed on contacts pads of a substrate. Each elastic body has a through hole connecting to the corresponding contact pad. The metal plugs are formed at the through holes, the ends of metal plugs are connected to the corresponding contact pads, and the other ends of metal plugs are protruded on top of the elastic bodies. Thus, the elastic bodies are surrounded corresponding metal plugs so as to enhance the structure of the metal plugs and prevent the metal plugs from collapsing at the time of surface mounting.

Description

530394 V. Description of the invention (1) '---- ^ [Field of the invention] The present invention relates to an electronic device with metal detection and its manufacturing method w1. In particular, it relates to an electronic device using an elastic block to reinforce a metal plug structure. And its manufacturing method. [Previous technology] For miniaturized and high-density electronic devices (or semiconductor devices), such as Chip Scale Package (CSP), the internal electrical connection methods include wire bonding and flip-chip bonding. The flip-chip bonding method uses bumps to electrically connect the substrate and the wafer. As the wafer becomes smaller, the distance between the solder joints between the wafers decreases, the height of the bumps also decreases, and the filling material (underfi 1 ling) is increased. material), the thermal stress generated between the wafer and the substrate cannot be effectively absorbed. Therefore, the structure of the bump itself should be better to improve electrical connection, solder bonding and thermal stress absorption. 〃 As shown in Figure 6, in US Patent No. 6, 〇28,357 "Semiconductor Device with Bump-Covered Cylinder", a semiconductor device is disclosed, which forms a conductive surface on a circuit + substrate 1 Film 2 and cover the conductive film 2 with a solder resist layer 3, the solder resist layer 3 has openings so that the conductive film 2 has an electrode 4 'on the electrode 4 by printing to form a columnar conductive adhesive 5' The pillar-shaped conductive paste 5 contains copper metal powder. After the pillar-shaped conductive paste 5 is cured, a solder bump 7A is formed on the opening of the solder resist 3. The solder bump 7A covers the pillar-shaped conductive paste 5. The solder bump 7A covered with the columnar conductive adhesive 5 is formed in a hemispherical shape by means of reflow (ref l0w). Therefore, the formation height of the solder bump 7A can be determined in advance. However, the solder bump 7A is formed in advance. Of 7A

Page 5 530394 5. Description of the invention (2) "--The material is tin-lead alloy, etc., does not have excellent elasticity, so it cannot effectively absorb the thermal stress generated between the wafer, substrate and solder bump 7A : / [Objective and summary of the invention] ^ " The main object of the present invention is to provide an electronic device with a reinforced metal plug structure. A plurality of bumps of the electronic device have metal plugs, and the periphery of each metal plug is elastic. The block is covered to strengthen the structure of the metal bolt. When the surface of the electronic device is bonded to an external circuit board, the elastic block with a spring will make the metal bolt less likely to crack and cause a short circuit problem. A second object of the present invention is to provide a method for manufacturing an electronic device, which first forms an electrically insulating elastic layer on a substrate, then etches to form a plurality of elastic blocks with through holes, and forms metal bolts in the through holes. Therefore, 'bumps with reinforced metal plug structures can be produced in large numbers on a substrate. An electronic device with a reinforced metal plug structure according to the present invention includes a substrate and a plurality of bumps, wherein the substrate may be a wafer, a printed circuit board, a substrate or a thin film, and a plurality of bumps Formed on the conductive pad of the base f, each of the bumps includes an elastic block and a metal plug. The elastic block is an electrically insulating and highly elastic high molecular organic substance, which has a through hole. The through hole system It is connected to the corresponding conductive pads. Preferably, the top surface of the elastic block is covered with a layer of conductive material, and the plurality of metal pins are electrically connected to the corresponding conductive pads through the through holes of the elastic blocks. The other end protrudes from the top surface of the elastic block. ^ The method for manufacturing an electronic device according to the present invention includes the steps of: lifting, a board, such as a wafer, a wafer, a printed circuit board, a ceramic substrate, or a thin film. The surface of the substrate has a plurality of conductive pads. ; Printing, spin coating

530394

Techniques such as glue are used to form the elasticity of the electrical insulation on the surface of the substrate, and cover the conductive pads; the elastic layer, ^ ^ should be connected to the elastic blocks of the 余, and these elastic blocks are shaped; There are = complex = to the corresponding conductive pads, preferably, a conductive material can be covered on the elastic surface so that the top surfaces of the plurality of elastic blocks. The conductive layer, ^ ^ ^ ^ ♦ tail material, forming a metal plug to avoid elasticity Through holes, one end of the metal bolts are electrically coupled to the corresponding conductive pads, and the other end is protruded from the top surface of the elastic block. [Detailed description of the invention] Please refer to the attached drawings. The present invention will enumerate the following embodiments: According to a specific embodiment of the present invention, as shown in FIG. 5, an electronic device having a reinforced metal plug structure includes a substrate.丨 〇 The amount of convexity on the surface of the substrate, the substrate can be ^ (ctip), wafer (wafer), printed circuit board (PCB), ceramic substrate (ceramic substrate) or film (th lnf 11 m). In this embodiment, the substrate j 0 is a wafer, and a plurality of conductive pads 12 (such as aluminum pads or copper pads) are formed on the surface 11. Cu pad. The plurality of bumps 20 includes a spring-shaped block 2i and a metal bolt 23, and the elastic blocks 21 are formed on the conductive pads 2 of the substrate 10, which is an electrical insulation and has a high elasticity. Molecular organics (〇rganic poiymer), such as polyimide, benzecyclobutene, polypropylene (rubber) or silicone (siHc〇ne) Etc., the elastic blocks have a through hole 2 2 ′, and the through hole 22 is connected to the corresponding lead pad 12.

530394

^ The top surface of the elastic block 21 is covered with a layer of conductive material 24. The conductive material 24 is 3 Ni (Ni), gold (Au), silver (Ag), copper (Cu), palladium (pd), or tin-lead ( Sn-Pb alloy) composite metal layer (composite metal layers), or nickel, gold, silver, copper, palladium, tin-lead, silver glue or anisotropic conductive adhesive

), And a metal plug 23 is formed in the through hole 22 of the elastic blocks 21, and the metal cymbal 23 is nickel, gold, silver, copper or a handle. One end of the metal plugs is electrically coupled to the corresponding guide. The other end of the pad 丨 2 is projected from the top surface of the elastic block 21. Therefore, the periphery of each metal bolt 23 is covered by the elastic block 21. The elastic block 21 can strengthen the metal. The structure of the pin 23, when the electronic device must be surface-bonded to an external circuit board, the elastic block 2 of the bump 2 0 makes the metal inspection 2 3 less likely to crack, and prevents problems such as short circuits from occurring. Furthermore, the elastic block 21 of the bump 20 has excellent elasticity. After the surface of the electronic device is bonded to the external circuit board, the thermal stress caused by the thermal expansion coefficient (CTE) mismatch at the bonding interface, It can be absorbed by the elastic blocks 21 of the bumps 20 to prevent mechanical fatigue of the bumps 20 located at the bonding interface. The method of manufacturing the electronic device with a reinforced metal plug structure according to the present invention is described in detail below. : First, as shown in Figure 1 As shown, a substrate 10 is provided, such as a wafer, a wafer, a printed circuit board, a ceramic substrate, or a thin film, etc., and a plurality of lead pads 12 are formed on the surface 11 of the lead pads. Array, central or peripheral arrangement ', and then printing, spin coating

Page 8 530394

) Or film adhering, etc., forms an electrically insulating elastic layer 25 on the surface 11 of the substrate 10, and the elastic layer 25 covers the pads 12. The μ-diode is preferably, as shown in FIG. 2, a conductive layer 26 is covered on the elastic layer 25 by means such as electrodeless plating, printing, or pasting, so as to improve the soldering bonding property when the surfaces are bonded.

Then, as shown in FIG. 3, the photolithography and dry / wet etching techniques are used to etch the elastic layer 25 and the conductive layer 26 to form a plurality of elastic blocks corresponding to the conductive pads 12, and the The top surfaces of the elastic blocks 21 are covered with the conductive material 2 4 ′ formed by the conductive layer 26, and the elastic blocks 21 are covered with the corresponding conductive pads 2, and a through hole 2 2 is formed. The through hole 2 2 It is connected to the corresponding lead pad 1 2.

After that, as shown in FIG. 4, a lead frame 27 (lead frame) is provided. The lead frame 27 is formed by a plurality of metal bolts 23 by semi-etching or welding, and the lead frame 27 is thermally pressed. On the surface u of the substrate 10, some metal pins 23 pass through the through holes 22 of the corresponding elastic block 21, and one end thereof may have a conductive bonding agent 28, such as gold, tin-lead or conductive glue, to electrically bond the two. The lead pads 12 to the substrate 10, preferably, the material of the lead frame 27 is different from that of the conductive material 2 /, so as to facilitate the removal of the lead frame 27 by etching. When the lead frame 27 is removed, The plurality of metal bolts 23 formed at the time are paired with the through holes 22 located at the elastic block 2 = 1, and are electrically coupled to the conductive pads 12 of the substrate 10. ▲ —Finally, as shown in FIG. 5, after removing the lead frame 27 by etching, each electronic device having the structure of the reinforced metal plug 23 described above is manufactured, and the metal kings 23 are formed in the corresponding through holes 22 Inside, and the other end is protruding from the elasticity

Page 9 530394 V. Description of the invention (6) On the top surface of the block 21, the periphery of each metal bolt 23 is covered by the elastic block 21, and has a more enhanced structure. The electrically insulating elastic block 2 1 Because it can effectively absorb the thermal stress generated at the bonding interface, the metal plug 2 3 is not easy to crack during surface bonding. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall be protected by the present invention. range.

Page 10 530394 Brief Description of Drawings [Illustration of Drawings] Figure 1: Sectional view of a substrate with an elastic layer formed in accordance with the present invention. Figure 9 Figure 2 • Sectional view of a substrate with a conductive layer formed in accordance with the present invention. Figure: Sectional view of a substrate with a plurality of elastic blocks with through holes formed according to the present invention. Figure 4: Sectional view of a substrate crimped with a lead frame with metal bolts according to the present invention. Figure 5 •• According to the present invention , A cross-sectional view of an electronic device with a reinforced metal plug structure; and FIG. 6 a cross-sectional view of a semiconductor device having a bump-coated pillar: US Patent No. 6,028,357. [Illustration of drawing number] 1 circuit board 4 electrode 10 substrate 11 surface 20 bump 21 elastic block 24 conductive material 2 7 lead frame 2 conductive film 5 conductive adhesive 12 lead pad 22 through hole 2 5 elastic layer 28 conductive adhesive 3 prevent Solder layer 7A solder bump 2 3 metal plug 26 conductive layer

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Claims (1)

530394 VI. Scope of patent application Scope of patent application, a substrate with a plurality of personality blocks, a plurality of through-holes and the top surface of the electrical block, such as the application of the elastic block of the electronic device, such as the application of the electronic device or tin, such as the application of the electronic Device lead, silver glue, such as applying for electronic devices, such as applying for electronic devices. An electronic device with a reinforced metal plug structure includes: a surface of the substrate has a plurality of conductive pads; an elastic block is formed on the conductive pad of the substrate; the elastics have a through hole; the through hole Connected to the corresponding lead pads; and metal bolts, one end of which is bonded to the corresponding lead pads by the elasticity of the elastic blocks, and the other end is protruded from the scope of the elastic patent, and it also includes a top surface . The scope of the patent, among which the scope of the composite metal patent is 'wherein the scope of the patent of anisotropy' where the scope of the patent is where the conductive material with a reinforced metal plug structure described in the first item is formed, and the conductive material is formed in these The electric material with a reinforced metal plug structure described in item 2 is a layer containing nickel, gold, silver, copper, and a handle. The electric materials with reinforced metal plug structure described in item 2 are nickel, gold, silver, copper, handle, tin conductive adhesive. In the item 1 with the reinforced metal plug structure, the elastic block covers the conductive pad of the substrate. Some of the elastic blocks with reinforced metal plug structure described in item 1 are polymer organics with electrical insulation 530394 Scope of patent application Polyacrylate, rubber or silicone. Silver, copper or 8, which is a tethered structure, as described in item 1 of the scope of the patent application, which has an enhanced gold electronic device ', wherein the material of the metal plug is a printed circuit board with a nickel or gold metal plug structure, such as the scope of the patent application The enhanced electronic device according to item 1, wherein the substrate is a wafer, a wafer, a ceramic substrate or a thin film. 10 kinds of electronic device manufacturing methods, the steps of which include: providing a substrate, the surface of the substrate has a plurality of conductive pads; forming an electrically insulating elastic layer on the surface of the substrate, the layer covering the Lead joint; money engraving the elastic layer to form a plurality of elastic blocks corresponding to the conductive pads', and the elastic blocks are formed with a through hole, and the through holes are corresponding conductive pads; and a metal bolt is formed on the elastic block One end of the metal bolts is electrically connected to the corresponding conductive pad, and the other end is protruded from the top surface of the elastic block. 11. The method for manufacturing an electronic device as described in item 10 of the scope of patent application, further comprising the step of forming a conductive layer on the elastic layer. 1 2. The method for manufacturing an electronic device as described in item 11 of the scope of the patent application, wherein the method for forming the conductive layer is electrodeless plating, printing, or pasting. 13. The method for manufacturing an electronic device as described in item 10 of the scope of patent application, wherein the method of forming the elastic layer is printing, spin coating or adhesive film. 530394 6. Scope of patent application 14. The method for manufacturing an electronic device as described in Item 10 of the scope of patent application, wherein the method of forming the through hole of the metal bolt in the elastic block is: press-fit a lead frame with a metal bolt to the substrate, and then remove The lead frame. 15. The method for manufacturing an electronic device as described in item 14 of the scope of the patent application, wherein a conductive adhesive is formed at a joint between the metal bolt and the lead pad. 16. The method for manufacturing an electronic device according to item 10 of the scope of patent application, wherein in the step of providing a substrate, the substrate is a wafer, a wafer, a printed circuit board, a ceramic substrate, or a thin film. Page 14