TW529137B - Semiconductor device - Google Patents
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- TW529137B TW529137B TW091105391A TW91105391A TW529137B TW 529137 B TW529137 B TW 529137B TW 091105391 A TW091105391 A TW 091105391A TW 91105391 A TW91105391 A TW 91105391A TW 529137 B TW529137 B TW 529137B
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Description
529137
五、發明說明(1) 【發明背景】 1 ·發明之領域 本發明係關於一種半導體裝置, 封裝結構的半導體裝置。 尤有關一種表面黏著 2 ·相關技術之描述 半導體裝置的安裝模式 著型,而表面黏著型係成為 流0 係包含引出線插入型及表 達成高密度之表面黏著的 面黏 主 在表面黏著型的各種方式中 複數之球形栅極的BGA (球柵陣列 板之上的橫剖面。 圖4係顯示其底面具有 封裝已黏著在安裝基 如圖4所示,被載持在bga封裝ιι〇之上的半導體晶片 後戚^由/己線115及引出線113而電連至球形柵極112。s 置在印刷電路板101的表面之上。球形栅法 1^2係豐置在配線端子1〇2之上’並接著加熱而使其融化 精以使球形栅極112固定至配線端子1〇2之上。 士然而,當印刷電路板1 〇 1受到外部作用力之作用而彎 曲日守’ BGΑ封裝11 〇的球形柵極丨丨2從配線端子丨〇 2之上脫落 的問題將從而發生。 而上述情況係起因於BGA封裝1 1 〇之剛性大於印刷電路 板1 0 1之剛性的事實,所以,BGA封裝丨丨〇的變形量將無法 與印刷電路板1 0 1的變形量一致。 【發明的綜合說明】
第5頁
529137 五、發明說明(2) 本發明之一目的在於提供一 一封裴從一印刷電路板之上脫落 係關於一種半導體裝 本發明 封裝,係經由黏著 安裝基板;一半導 配線,用以 種半導體裝置,其能降低 的可能性。 置,包含一安裝基板;一 在該安 體晶片 在該半 該連接球狀 設至一撓性 撓性帶將使 表面藉由介 帶之具有該 線與該連接 配線而互相 將設置 部;其中,該 帶的同一表面 該撓性帶之具 置於其間的一 連接球 球狀部 電連。 狀部裝 兩者則 裝基板 ,係被 導體晶 半導體 ,而折 有該半 缓衝材 設至其 藉由形 的連接球狀部 載持在該封裝 片之上的連接 晶片與該連接 彎呈180 °之-導體晶片裝設 料而實質上平 上的'一表面, 成在該撓性帶 而電連至該 上;及接合 端子電連至 球狀部係裝 -形狀的該 至其上的一 行於該撓性 及該接合配 之中的連接 【較佳實施例 以下參見 苐一實施例。 子之半導體封 顯示第一實施 分別製備 具有焊接球狀 11、裝設至撓 體晶片1 4與電 片1 4與配線1 5 之詳細說明】 圖1 A及圖1 B,俾讀日η 士 η 兄月本發明之半導體裝置 圖1A及圖1 B係顯示切齡” + ^ ^ , 157斷焊接球狀部及配線 裝及印刷電路板的甚立丨 ^ '剖面圖。圖1A及圖1B 例的製造步驟。 具有配線端子2設置右龙| 都1 9 XX兩a 1 在其上的印刷電路板1 口P 1 2及電路板配線1 3形 ^ 形成在其上的撓性帶 性帶1 1之上的半導體曰μ,λ ^ L 聪日日片U、用以連接半 路板配線13的配線15、爲m .干 沾戸β、及用以密封半導體 的%氧树月日1 6。此時 作 τ 蛘接球狀部12、電
529137 五、發明說明(3) 板配線1 3、配線1 5、及氣樹脂1 6皆設置在挽性帶11、 一表面上。撓性帶11係區隔成半導體晶片14的區域、$同 球狀部1 2的區域、及彎曲區域1 7,而其上未形成有構焊接 彎曲區域1 7係設置用以供撓性帶1丨之半導體晶片J 4 2的 朝向圖中箭號所示之方向彎曲。 '區域 在將形成於撓性帶11之上的焊接球狀部;[2黏著至訊 於印刷電路板1之上的配線端子2之後,係藉由當作繳二^ 的彎曲區域1 7而使撓性帶1丨朝向圖中箭號所示之方:=軸 曲,俾能獲得圖示之橫剖面。 $ 在進行撓性帶11的彎曲操作之前,當作緩衝材 氧樹脂18係黏著至撓性帶丨丨之具有焊接球狀部12設置在^ 上的表面之反面之上(如圖1A)。 ’、 使撓性帶11進一步地朝向\箭號所示之方向.彎曲時, ,生帶",具有半導體晶片"設置在其上的表面之反二 者至石夕氧樹脂1 8。(如圖1 b )。 ’、 ,性帶之承載半導體晶片14的區域與撓性㈤ & ^ . 、,a 士认 &域係藉由矽氧樹脂1 8而互相 1的":非直接地黏著在一 & ’藉以減小由於印刷電路板 1的彎曲變形所造成之半導體a 丨冲」电峪板 線損壞及晶片脫落等故障曰曰片的變形置,進而降低配 施例以二參/;圖-2,俾說明本發明之半導體裝置的第二實 剖面圖:糸』不本發明之半導體裝置的第二實施例之橫 類似於第一實施例’焊接球狀部12、電路板配線13、
$ 7頁 529137 五、發明說明(4) 配線15、及環氧樹脂16皆形成在撓性帶的相同表面之上, ^撓性帶11亦藉由彎曲區肪而區隔成半導體晶片14的區 域與焊接球狀部1 2的區域。 在將形成於撓性帶u之上的焊接球狀部12黏著至設置 ,:刷電路板〗之上的配線端子2之後,係將撓性帶u彎曲 ,半=體晶所在之撓性帶n的區域與焊接球狀部⑴斤 ίίί:帶11的區域並不在同一平面上呈對齊的狀態,且 考曲區域17亦保持直線狀態。詳言之 =性帶區域係黏著一補強用之樹脂或金屬(舉例而 ° 、’5 ,如圖不之補強材料21,因而形成一直線外形。 此時,為了使焊接球狀部12與配線端子2穩固地互相 將穿透撓性帶11、#____々 = 接球狀部12設置在其上的撓性帶11之區域的 周邊固疋至印刷電路板1。 彎曲】’7 f 5帶11係藉由具有直線外形並介置於其間的 丐曲&域17而區隔成半導體晶片區域 且所有之構件則構成一半導體單元1〇。坪接…£域, 具有與半導體單元10之構造相同的另一半 則形成在鄰接於半導體單元i。之處。圖示4 係使其焊接球狀部所在之撓性帶的 之下的狀態而配置在印刷電路板i之上。在牛¥體早心 於設ϋ煤:H電路板被半導體單元所佔用的區域係僅限 地將半ίϊϊ=ί if性帶的區域,因此具有可高密度 V ®早70黏者至印刷電路板的優點。 Η 第8頁 529137 五、發明說明(5) 如圖3所示之第二實施例的一變化例,電路板配線 13、配線15、及環氧樹脂16係形成在撓性帶丨丨之具有 球狀部1 2形成在其上之表面的反面之上。 如上所述,在第一實施例中,半導體晶片盥 部係分別設置在^生帶之上的μ區域上,且換性帶之^ 導體晶片區域與焊接球狀部區域係互相疊置在同一平 上,故由於印刷電路板之變形而對 ί所產生的負面影響將可藉由介置於撓= : = 以減小。 間且作為綾衝材料的矽氧樹脂而加 而在挽性帶之半導轉曰y 疊置在同一平面上的另體:片£域與焊接球狀部區域並非 之上的複數之半導體單元价田各形成在一撓性帶 —半導體單元之撓性帶印刷電路板之上時,其 導體單元之撓性帶的焊體區域係設置在相鄰之半 地將半導體單元整合= = t方,藉以高密度 很明顯地,以上所沖土 之較佳實施例,而並非::恭僅為了用於方便說明本發明 例。凡依本發明所做的任^狹義地限制於該較佳實施 範圍。 何變更,皆屬本發明申請專利之
第9頁 529137 圖式簡單說明 圖1 A及圖1 B係依據本發明之半導體裝置的第一實施例 之製造步驟順序而而顯示其橫剖面的橫剖面圖。 圖2顯示本發明之半導體裝置的第二實施例之橫剖面 圖。 圖3顯示本發明之半導體裝置的第二實施例之變化例 的橫剖面圖。 圖4顯示習知半導體裝置的橫剖面圖。 【符號說明】
1、 1 0 1〜印刷電路板 10、20〜半導體單元 11〜撓性帶 1 2〜焊接球狀部 1 3〜電路板配線 1 4、11 4〜半導體晶片 1 5、11 5〜配線 1 6、11 6〜環氧樹脂 17〜彎曲區域
1 8〜秒氧樹脂 1 9〜螺栓 2、 1 0 2〜配線端子 2 1〜補強材料 110〜BGA封裝 11 2〜球形桃極
第10頁 529137 圖式簡單說明 11 3〜引出、線
IIHI
Claims (1)
- 529137 六、申請專利範圍 1. 一種半導 一安裝 一封裝 體裝置, 基板; ’係經由 連至該安裝基板; 半導 體晶片, 線,用以 連接球狀 該半導體 帶的同一表面,而折 具有該半 接合配 子電連至該 其中, 該撓性帶之 置於其間的 連接球狀部 球狀部兩者 電連。 一缓衝材 裝設至其 則藉由形 包含: 黏著在該安裝基板的連接球狀部而電 係被載持在該封裝上;及 將u又置在該半導體晶片之上的連接 部; 晶片與該連接球狀部係裝設至一撓性 彎呈1 8 0。之一形狀的該撓性帶將使 導體晶片裝設至其上的一表面藉由介 料而實質上平行於該撓性帶之具有該 上的一表面,及該接合配線與該連接 成在該撓性帶之中的連接配線而互相 如申請專利範圍第i項之半導體 為—矽氧樹脂。 ,、干及綾衝材枓 3.—種半導體裝置,包含: 一安裝基板; 連至:基:經由黏著在該安裝基板的連接球狀部而電 一半導體晶片,係被載持在該封裝上·及 接合配線,用以將設置在該半導體晶片之上的連接端第12頁 529137 六、申請專利範圍 子電連至該連接球狀部; 其中,將該撓性帶折彎呈該撓 區域與該撓性帶之具有連接球狀部 二有該封裝的— 該安裝基板的一表面而隔開地彼此相二區,,者係相對於 相平行的一狀態,及該接合配線與該 f貫質上彼此互 由形成在該撓性帶之中的連接配線而互相部兩者則藉 2申請專利範圍第3項之半導體裝置 片與該連接球狀部係裝設至該撓性帶的同、一中表該面半之導上體晶 5.如申請專利範圍第3項之半導體裝 並 片與該連接球狀部係裝設至該撓性帶的不同表該面丰之導上體晶 6·如申請專利範圍第3項之半導體 J、該連接球狀部、及該撓性帶的複數之、中各具有該封 虞至該安裝基板之上,及該複數之半導體嚴體早凡係安 封裝係位在該複數之半導體單元之的n-的該 部之上方。 W的另一的連接球狀 7·如申睛專利範圍第3項之半導體裝,1 ▼之具有該封裝的該g域與該撓& 旦有立該撓性 間的該撓性帶的-區域=設=== …金屬’俾能使其間的該區域具有一直線树 II 第13頁
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JP2001085789A JP2002289741A (ja) | 2001-03-23 | 2001-03-23 | 半導体装置 |
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TW529137B true TW529137B (en) | 2003-04-21 |
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TW091105391A TW529137B (en) | 2001-03-23 | 2002-03-20 | Semiconductor device |
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US (1) | US20020135050A1 (zh) |
JP (1) | JP2002289741A (zh) |
KR (1) | KR20020075280A (zh) |
CN (1) | CN1377077A (zh) |
TW (1) | TW529137B (zh) |
Families Citing this family (6)
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EP1953819A4 (en) * | 2005-11-15 | 2010-09-29 | Nec Corp | SEMICONDUCTOR ASSEMBLY, ELECTRONIC ELEMENTS, AND ELECTRONIC DEVICE |
JP4561729B2 (ja) | 2006-11-06 | 2010-10-13 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
JP5028968B2 (ja) * | 2006-11-17 | 2012-09-19 | 日立電線株式会社 | 半導体装置、積層型半導体装置およびインターポーザ基板 |
US7833456B2 (en) * | 2007-02-23 | 2010-11-16 | Micron Technology, Inc. | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece |
JP2010212273A (ja) * | 2009-03-06 | 2010-09-24 | Elpida Memory Inc | 半導体パッケージ用基板、該基板を用いた半導体パッケージ、および半導体パッケージ用基板の製造方法 |
US10090259B2 (en) * | 2015-12-26 | 2018-10-02 | Intel Corporation | Non-rectangular electronic device components |
-
2001
- 2001-03-23 JP JP2001085789A patent/JP2002289741A/ja not_active Abandoned
-
2002
- 2002-03-14 US US10/096,839 patent/US20020135050A1/en not_active Abandoned
- 2002-03-20 TW TW091105391A patent/TW529137B/zh active
- 2002-03-21 KR KR1020020015408A patent/KR20020075280A/ko not_active Application Discontinuation
- 2002-03-22 CN CN02107972A patent/CN1377077A/zh active Pending
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US20020135050A1 (en) | 2002-09-26 |
KR20020075280A (ko) | 2002-10-04 |
JP2002289741A (ja) | 2002-10-04 |
CN1377077A (zh) | 2002-10-30 |
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