TW529068B - Package method of manufacturing electronic chip element on wafer - Google Patents

Abstract

A package method of manufacturing electronic chip element on wafer comprises following steps: (1) manufacturing electronic chip elements on a wafer, in which the electronic chip elements are aligned alternatingly; (2) etching to form long trenches on the wafer where there is no electronic chip element formed; (3) completely covering a photo resist layer on the wafer etched with long trenches using a vacuum film press apparatus or covering the whole wafer with a layer of photo resist by soaking the wafer in a container containing liquid photo resist; (4) heating the wafer to dry the photo resist film or the photo resist so that the photo resist closely adheres to the wafer; and (5) finally cutting the electronic chip elements from the wafer to package the electronic chip element unit completely. This package method of manufacturing electronic chip element on wafer can quickly produce electronic chip elements and thus achieve the goals of conserving production cost and production time.

Description

529068 Case No. 91100505 Fifth, description of the invention (1) <Scope of invention> The present invention relates to a method, in particular, a method of using a predetermined width to overlap or vacuum laminating in order to save manufacturing costs and The purpose of time (the description of the previous technology) The conventional electronic chip element structure is made on the ceramic substrate. The ceramic substrate is based on the electronic chip element unit 1 1 0; the way 'the packaging material is sprayed with a thin film and its policy is The thermal polymer layer is coated on an electronic electronic chip element. The above-mentioned electronic chip packaging still has disadvantages: 1. The coated electronic chip element unit is sprayed with one on the electronic chip unit, and the chip element unit is used for it. Therefore, after the film is installed, the packaging film must be used with inconvenience in the connection surface. Amend the packaging method for manufacturing electronic chip components from wafers. Electronic chip components are arranged at intervals in the wafer and are etched into long holes and grooves, and then the photoresist is used to quickly package the electronic chip components to achieve the savings. As shown in Figures 1A to 1c, the board is first mounted on the board 100, and then the entire completed component must be cut into individual pieces by cutting the auxiliary tool 8 0 and then sprayed. (S pu 11 ering) or other spraying facilities 90 0 on the electronic wafer element unit j 1 () dry, 3. Or use the coating method (not shown) to make the sub wafer element unit 1 1 0, and then Packager: l The manufacturing method is effective, but the heat dissipation polymer layer is applied after the cutting method or the sputtering method is used to spray the equipment on the film, because it takes time for a single electronic device. It takes a lot of work, and the spray package of the electronic chip unit covers the entire electronic chip element unit, removes it from the packaging film, and has more manufacturing procedures. Because the above-mentioned method of packaging the wafer element has its disadvantages, it has After another package is formed on the substrate, the electrons on the substrate are first

Page 5 529068 _Han No. 9 丄 100505 --- year-month-day correction_ V. Description of the Invention (2) '^ ^ Wafer element is covered with packaging film' and then cut into electronic wafer element units, but this packaging method, The peripheral surface of the electronic chip component cannot be covered with a packaging film, and it is often used as a second package when it is reused, which also has inconveniences. In view of the conventional manufacturing method of electronic chip components, the above-mentioned shortcomings exist. The inventor researched and improved the shortcomings. After long-term research and improvement, the invention finally came into being. <Summary of Invention> In view of this, the present invention aims to provide a packaging method for manufacturing electronic chip components from wafers. According to the packaging method for such electronic chip components according to the present invention, packaging of electronic chip components can be achieved quickly. The purpose of the present invention is to save the cost and the process. This is the first object of the present invention. According to the packaging method of the electronic chip component of the present invention, it can not only quickly achieve the purpose of packaging the electronic chip component, but also maintain the better quality of the electronic chip component; this is another object of the present invention. According to the packaging method of the electronic chip component according to the present invention, the packaging of the completed electronic chip component is a complete package, and it is not necessary to perform inconvenience such as second packaging when it is used again. As for the detailed structure, application principle, function and effect of the present invention, it can be fully understood by referring to the description made in the following drawings. <Description of Preferred Specific Embodiments> Figures 1A to 1C are schematic diagrams of an embodiment of a conventional method for manufacturing electronic chip components; their functions and disadvantages are 'as described previously' and will not be repeated here. FIG. 2 is a flowchart of a packaging method for 70 electronic wafers of the present invention. As shown in the figure, the present invention includes several procedures: — __- 丨 — —

529068 _-_ 91100505 _3 Amendment V. Invention Description (3) 1 · First make electronic chip components on the wafer (wafer), so that the electronic chip components are arranged at intervals (program A), and the electronic chip components on them are spaced Arrange so that the two rows of electronic chip components are spaced apart by a distance (refer to Figure 3); 2 · Secondly, the part of the above wafers where no electronic chip components are formed, according to the interval between electronic chip components on Shuaiyuan Length, the long hole and groove are etched (procedure B); 3 · A vacuum photoresist film (program C1) is applied to the wafer with the long hole and groove etched by means of vacuum lamination. ), The whole piece can also be dipped into the tank of the liquid photoresist, so that the wafer is completely covered with a layer of photoresist (Procedure D1); 4 · The wafer is heated to make the photoresist film closely adhere to The wafer (procedure [2] or phase photoresist is dried and covered with a layer of photoresist (procedure D 2); 5. Using the method of exposure and development 'to expose the contact pair in the wafer that must be in contact with the external circuit, and it will also be exposed. Separate from the photoresistor between rows, at this time Φ 2 ^ ”T electron 7G The upper and lower sides and the left and right sides have been protected by photoresist (program E); 6. The packaged wafer is placed in a nitrogen oven of 150 ~ 20 (TC nitrogen oven, the phase photoresist will be crosslinked) Reaction (cross-linking 7 · Finally, the electronic chip components are separated from the wafer, that is, a…… ”J Ba Zhanyuancheng ’s I sub-chip component unit (program G). Figure 3 shows the invention Packaging method for electronic wafers of wafer manufacturing 侔 _ fv 10: Among them, the schematic diagram of the wafer; the present invention is to first manufacture the shape of a wafer with an electronic wafer element structure on the surface (procedure A); wafer 10 The structure diagram is shown in Figure 3aM; where the wafer 10 has the structure of most electronic wafers 丨 〇 丄, 102, ..., the structure of the electronic wafer elements 101, 102 are arranged at intervals, so that two rows are adjacent The structure of the electronic chip components is between 〇1, 〇2 and there is an ancient one called γ 彳, ··, with an interval of 1 1,

529068

529068 Case No. 91100505 Modified the fifth, invention description (5) packaging method, which can be effectively formed by 4 insects to form a predetermined interval between the array of electronic components on the wafer into a long hole slot, and then with the light Resistor and vacuum laminating film and heating, or using the method of dipping photoresist to quickly package electronic chip components, to achieve the effect of saving manufacturing costs and time, but has not been used in the public, in compliance with the provisions of the Patent Law , Please kindly grant a quasi-patent, it is a virtue. Those who need to be clear, the above are the preferred and specific embodiments of the present invention. If the changes made according to the concept of the present invention and the functional effects do not exceed the spirit covered by the description and drawings, Within the scope of the present invention, Chen Ming is here.

Page 9 529068 _Case No. 91100505_ Year Month Revision _ Brief Description of Drawings Figures 1A to 1C are schematic diagrams of an embodiment of a conventional method for manufacturing electronic chip components. Fig. 2 is a flow chart of a packaging method of an electronic wafer component manufactured by a wafer according to the present invention. FIG. 3 is a schematic diagram of a method for packaging electronic wafer components by using a wafer according to the present invention. Figure 3A is a schematic diagram of the wafer structure in Figure 3. The fourth method is a packaging method for manufacturing an electronic wafer element from a wafer according to the present invention, in which the photoresist film is closely adhered to the wafer during the vacuum lamination process. Fig. 4B is a diagram showing a method for manufacturing an electronic wafer element by wafer according to the present invention. In the vacuum lamination process, the electronic wafer element is covered with a photoresist-type protective layer. FIG. 4C is a schematic diagram of the packaging method of the present invention for manufacturing electronic wafer components by wafers, in which the electronic wafer components manufactured by vacuum lamination are structured. FIG. 5A is a schematic diagram of a method for manufacturing an electronic chip component by using a wafer according to the present invention, in which the entire wafer is immersed in a photoresist tank to completely cover the wafer with a layer of photoresist. Fig. 5B is a view showing a method for manufacturing an electronic wafer element by wafer according to the present invention, in which an electronic wafer element impregnated with a photoresist is covered with a photoresist-type protective layer. Fig. 5C is a schematic structural diagram of a packaging method for manufacturing an electronic wafer element by a wafer according to the present invention, in which a photoresist is impregnated.

529068 _Case No. 91100505_ Year Month Amendment _ Brief description of the drawing &lt; Comparison of component names and symbols in the drawing &gt; I 0 0 · Tao Jing substrate II 0 ·· Electronic chip component unit 8 0 0: Cutting machine 9 0 0: High-pressure sprayer 10 * Wafer 11: Long hole slot 12: Photoresist film 13: Photoresist 14: Electronic chip component 15: Contact point between electronic chip and external circuit 8 0: Vacuum heating tank 9 0: The photoresist tank (procedure A) first etches a wafer with electronic chip components (procedure B) into a long hole trench on the wafer. (Procedure C 1) The surface of the wafer is covered with a layer of Photo Resist Film through a vacuum lamination process. (Procedure C 2) The wafer is heated so that the photoresist film can be closely attached to the wafer. (Procedure D1) The whole wafer is immersed in the liquid photoresist tank, so that the wafer is completely covered with a layer of photoresist. (Procedure D 2) The photoresist is coated on the wafer into a thin film by a drying process. (Procedure E) Finally, the wafer is divided into pieces of electronic chip components.

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Claims (1)

529068 Case No. 91100505 Amendment VI. The scope of patent application includes the following: 1. A packaging method for manufacturing electronic wafer components from wafers; Steps: Fabricate electronic wafer components on the substrate of the wafer, and arrange the electronic wafer components at intervals. Etching the gaps between the electronic wafer components of the above wafers into elongated holes and grooves; By means of a vacuum lamination facility, the wafers of the electronic wafer elements with the elongated holes and grooves are covered with a layer of negative type Photo Resist Film; The wafer is heated to make the photoresist film closely adhere to the wafer's electronic chip components and the slot wall of the elongated hole; the method of exposing and developing the wafer and the external circuit The contact points of the contacts are exposed, and at the same time, the photoresist of the row and the row are separated, so that the upper and lower sides and the sides of the electronic component are protected by the photoresist. Finally, the wafer is divided into individual electronic chip components. 2. The packaging method for manufacturing electronic wafer components from wafers as described in item 1 of the scope of the patent application, wherein the electronic wafer components that have been etched with long holes and grooves are whole wafers immersed in a negative photoresist The photoresist tank allows the wafer to be completely covered with a layer of photoresist. __ Page 12