TW526690B - Forming conformal mask method for PCB manufacturing process - Google Patents
Forming conformal mask method for PCB manufacturing process Download PDFInfo
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- TW526690B TW526690B TW91114904A TW91114904A TW526690B TW 526690 B TW526690 B TW 526690B TW 91114904 A TW91114904 A TW 91114904A TW 91114904 A TW91114904 A TW 91114904A TW 526690 B TW526690 B TW 526690B
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Abstract
Description
526690 五、發明說明(1) 【發明領域】 本發明係關於〜種 特別有關於印刷電路 方式〔暴光、顯影] 方法。 【先前技術】 目前雷射孔成孔製 間形成構造導通,如 連接〔導通〕。然而 時,易導致雷射如工 銅窗成型位置必須精 第1 A至1 F圖揭示印 之局部剖面示意圖。 請參照第1 A圖所示 層1 0上覆蓋形成一銅 層。 清參照第1 B圖所示 阻層1 2,該光阻層1 2 〔sensitizer 〕及溶 混合形成。 請參照第1 C圖所示 光及顯影形成一孔1 3 將底片〔未緣示〕的 層1 2吸收適當的能量 印刷電路板之鋼窗成型製造方法,其 板上利用雷射加工方式取代影像轉移 之銅窗〔conformal mask〕成型製造 程應用在印刷電路板之兩層線路層之 此可再加工使該兩層線路層形成電性 ,當雷射孔成孔製程產生位置偏移 破孔、孔小、少孔等技術缺點。 確,否則無法避免上述的技術缺點 刷電路板之習用雷射孔成孔製程步驟 ,習用雷射孔成孔製程首先在一的 箱層11,該銅箱層11用以形成線 \ - ,接著在該銅箱層丨丨上覆蓋形 一般由樹脂〔resin〕、感光劑成先 劑〔solvent〕等三種不同的成份所 ’接著在該光阻層12之預定位 。在暴光製程時,投影機〔未i上暴 圖案投射移轉至該光阻層12日不〕 後發生光化轉換。# 二& ,该光阻 兴在顯影製程時,經526690 V. Description of the invention (1) [Field of the invention] The present invention relates to ~ specially, to the printed circuit method [exposure, development] method. [Prior technology] At present, structural conduction is formed between laser hole forming systems, such as connection [conduction]. However, it is easy to cause the laser to work. The molding position of the copper window must be precise. Please refer to Figure 1A to form a copper layer over the layer 10. Referring to FIG. 1B, the resist layer 12 is formed. The photoresist layer 12 [sensitizer] is formed by mixing with the photoresist layer. Please refer to Fig. 1C to form a hole through light and development. 1 3 A method for forming a steel window of a printed circuit board by absorbing the appropriate layer 12 of a negative film [not shown]. The board is replaced by laser processing. The copper mask (conformal mask) for image transfer is applied to the two circuit layers of the printed circuit board. This can be reprocessed to make the two circuit layers form electrical properties. When the laser hole forming process generates position shift holes , Small holes, few holes and other technical disadvantages. Indeed, otherwise, the above technical disadvantages cannot be avoided. The conventional laser hole forming process steps for brushing circuit boards are used. The conventional laser hole forming process is first in a box layer 11 which is used to form a line. The covering layer on the copper box layer is generally composed of three different components, such as resin [resin] and photosensitizer solvent [solvent], and is then positioned at a predetermined position of the photoresist layer 12. During the exposure process, after the projector [the pattern of the exposure pattern is not transferred to the photoresist layer for 12 days], the photochemical conversion occurs. # 二 & The photoresist is developed during the development process.
C.\Logo-5\Fi ve Cont inents\PK8533.ptd 第5頁 526690C. \ Logo-5 \ Fi ve Cont inents \ PK8533.ptd Page 5 526690
义$光的忒光阻層丨2被顯影劑清除後形成該孔1 3。 層 該 光 11::=圖所示,接著在該光阻層12底下的該銅落 鋼ί ^ 衣程,經該光阻層12之孔13選擇性蝕刻,在 、,σ = Ϊ ” 士形成一銅窗14,其完成開銅窗製程。 請麥照第1Ε圖所示,接著將該光阻層12進行去光阻製 一八利用有機溶劑清洗該光阻層1 2,使該光阻層1 2之 谷於有機溶劑。此時,該銅箔層11完成開銅窗成型製 兩明芩知、第1 F圖所示,最後在該銅箔層丨丨之銅窗丨4上進行 雷射加工製程,藉此在該絕緣層丨〇上雷射成孔形成一盲孔 I 5連通至另一線路層〔未繪示〕,其完成雷射成孔製程。 如此印刷電路板之銅箔層之間形成構造導通。 P明再爹照第1 C圖所示,在暴光製程上,一旦底片〔暴 光〕舍生脹縮或每片印刷電路板尺寸規格不一時,預定位 置與该孔1 3產生偏移,導致後續的微影、蝕刻製程、開銅 自製程〔如第1 D圖所示〕及雷射成孔製程〔如第丨F圖所厂 不〕的偏移。因此習用雷射孔成孔製程易導致雷射加工 孔、孔小、少孔等技術缺點。 有鑑於此,本發明在印刷電路板製造方法之銅窗成型上 利用雷射加工方式取代影像轉移方式,以提升印刷電路板 的雷射成孔製程精準度。 【發明概要】 本發明主要目的係提供一種印刷電路板之銅窗成型製造 方法,其在銅窗成型上利用雷射加工方式取代影像轉移方The photoresist layer 2 is formed by the developer, and the hole 13 is formed. Layer of the light 11 :: = shown in the figure, and then the copper falling steel under the photoresist layer 12 is etched through the holes 13 of the photoresist layer 12 and is selectively etched at, σ = Ϊ A copper window 14 is formed, which completes the process of opening the copper window. Please make the photoresist layer 12 as shown in Fig. 1E, and then remove the photoresist layer 12 using an organic solvent to clean the photoresist layer 12 to make the light The valley of the resist layer 12 is in an organic solvent. At this time, the copper foil layer 11 is completed to form a copper window, as shown in FIG. 1F, and finally on the copper window of the copper foil layer. A laser processing process is performed to form a blind hole I 5 on the insulating layer 丨 and communicate with another circuit layer [not shown], which completes the laser hole forming process. The structural conduction is formed between the copper foil layers. As shown in Figure 1C, the Ming Dynasty father and the father, in the exposure process, once the negative (exposure) shrinks or each printed circuit board size specifications are different, the predetermined position and the The holes 13 are offset, resulting in subsequent lithography, etching processes, copper-opening processes (as shown in Figure 1D), and laser hole-forming processes (as in Section 丨 F The factory does not]. Therefore, the conventional laser hole forming process is easy to cause technical disadvantages such as laser processing holes, small holes, and small holes. In view of this, the present invention is used in the copper window molding of the printed circuit board manufacturing method. The laser processing method replaces the image transfer method to improve the accuracy of the laser hole forming process of the printed circuit board. [Summary of the Invention] The main purpose of the present invention is to provide a method for manufacturing a copper window of a printed circuit board, which is used for forming a copper window. Use laser processing instead of image transfer
526690526690
式,使 本發 方法, 式,使 根據 包含步 菌層上 孔製程 光阻層 箔層之 【發明 為了 確被了 式,作 本發 層上覆 成孔製 理,再 銅窗1 成一盲 本發 較佳實 明之主 第2A 本發明具有 明次要目的 其在銅窗成 本發明具有 本發明之印 驟如下:在 覆蓋形成一 形成一孔; 之孔上對該 銅®上利用 說明】 讓本發明之 解,下文將 詳細說明如 明之印刷電 蓋形成一光 程形成一孑匕 接著在該光 隶後在該_ 孔。 明將前述的 施例内,並 要技術内容 至2 G圖揭示 ^ n w 係提供 型上利 簡化製 刷電路 一絕緣 光阻層 在該光 銅箔層 第二雷 射成孔製程精準度之功效。 一種印刷電路板之銅窗成型製造 用雷射加工方式取代影像轉移方 程之功效。 板之銅窗成型製造方法,該方法 層上覆蓋形成一銅箔層;在該鋼 •,在該光阻層上利用第一雷射成 阻層之孔内進行去汗處理;在該 進行钱刻形成一銅窗;及在該銅 射成孔製程形成一盲孔。 上述和其他目的、特徵、和優點能更甲 特舉本發明較佳實施例,並配合所附围 下。 路板之銅窗成型製造方法主要在一銅?彳 F且層’接著在該光阻層上利用第一雷身 ’再接著在該光阻層之孔内進行去汙肩 =層之孔上對該銅箔層進行姓刻形成一 、洛層之銅窗上利用第二雷射成孔製程开 主要技術内容適常揭示於以下所列舉以 利用該較佳實施例配合相關技術將本潑 予以適當實施。. 本毛明車父佳實施例印刷電路板之銅窗成The method of the present invention, the method of making the photoresist layer according to the process of containing the photoresist layer on the step bacteria layer [invented in order to confirm the formula, the top layer of the hair layer is made into a hole texture, and the copper window 1 is a blind copy Develop better and better master 2A The present invention has a clear secondary purpose. The invention has the following steps in the invention of the copper window: the cover is formed to form a hole; the hole is used on the copper®. The solution of the invention will be described in detail below. The printed electrical cover forms a light path to form a dagger and then follows the light hole in the hole. In the foregoing embodiment, the technical content will be revealed to the 2 G diagram. ^ Nw is a type that provides a simplified circuit for making a brush, an insulating photoresist layer, and the accuracy of the second laser hole forming process in the optical copper foil layer. . A copper window molding for printed circuit board. Laser processing is used to replace the image transfer function. A method for forming and manufacturing a copper window of a plate. This method covers a copper foil layer on the layer; performs a de-sweat treatment on the steel layer by using a first laser to form a resist layer on the photoresist layer; Forming a copper window; and forming a blind hole in the copper injection hole forming process. The above and other objects, features, and advantages can be used to illustrate the preferred embodiments of the present invention, and to cooperate with the following. The manufacturing method of copper windows for road boards is mainly in copper?且 F and the layer 'then use the first thunder body on the photoresist layer', and then perform decontamination in the hole of the photoresist layer = the copper foil layer is engraved on the hole of the layer to form a layer. The main technical content of using the second laser hole-forming process on the copper window is normally disclosed in the enumerated below to use this preferred embodiment in conjunction with the related technology to properly implement this technology. . The copper window of printed circuit board
第7頁 526690 五、發明說明(4) 型製造步驟之局部剖面示意圖。 凊芩照第2 A圖所示,本發明較佳實施例首先在一絕緣声 2 0上覆盍形成一銅、洛層2 1,該銅箔層2 1用以形成線路層。 請參照第2B圖所示,接著在該銅箔層2丨上覆蓋形成二 阻層2 2 ’其如同前述先前技術,該光阻層2 2 一般由樹脂、 感光劑及溶劑專二種不同的成份所混合形成。 、 請參照第2C圖所示,接著在該光阻層22之預定位置上 行第一雷射加工製程,藉此在該光阻層22上雷射成孔形 一孔23連通至該銅箔層21,其完成雷射成孔製程。就* 加工製程技術而言,其可準確的在預定位置上進行雷二成 孔,因而成孔不易產生偏移。 田 請參照第2D圖所示,接著在該光阻層22之孔23孔内進行 去汗處理〔desmear process〕’以便進行後續的蝕刻繫 程,例如去汙處理技術如於:^”年丨丨月16日頒予等 人之美國專利第5 98 5 040號之「印刷電路板之高錳酸鹽去 污處理」,於此併入參考。 風 請參照第2E圖所示,接著在該光阻層22底下的該銅箱廣, 21進行蝕刻製程,選擇經該光阻層22之孔23内蝕刻該銅 層21,在該銅箔層21上形成一銅窗24,其完成開銅窗製 程0 請參照第2F圖所示,接著將該光卩且層22進行去光阻製 程,其如同前述先前技術,利用有機溶劑清洗該光阻層 22,使該光阻層22之光阻溶於有機溶劑。此時,該銅^層 2 1完成開銅窗成型製程。 曰Page 7 526690 V. Description of the invention Partial cross-section diagram of the manufacturing process of (4) type. As shown in FIG. 2A, the preferred embodiment of the present invention firstly overlays an insulating sound 20 to form a copper layer 26. The copper foil layer 21 is used to form a circuit layer. Please refer to FIG. 2B, and then cover the copper foil layer 2 丨 to form a two-resistance layer 2 2 ′, which is the same as the foregoing prior art. The photo-resistive layer 2 2 is generally made of resin, photosensitizer, and solvent. The ingredients are mixed to form. Please refer to FIG. 2C, and then perform a first laser processing process at a predetermined position of the photoresist layer 22, so that the laser is formed into a hole shape on the photoresist layer 22 and a hole 23 is connected to the copper foil layer. 21. It completes the laser hole forming process. As far as the * process technology is concerned, it can accurately perform thunder hole formation at a predetermined position, so the hole formation is unlikely to be offset. Please refer to FIG. 2D, and then perform a desmear process in the holes 23 and 23 of the photoresist layer 22 in order to perform the subsequent etching process. For example, the decontamination treatment technology is as follows: ^ ”year 丨丨 Permanganate Decontamination of Printed Circuit Boards, issued by U.S. Patent No. 5 98 5 040 to others on January 16, is incorporated herein by reference. Please refer to FIG. 2E, and then perform an etching process on the copper box 21 under the photoresist layer 22, and select the copper layer 21 to be etched through the holes 23 of the photoresist layer 22, and in the copper foil layer A copper window 24 is formed on 21, which completes the process of opening the copper window. 0 Please refer to FIG. 2F, and then perform a photoresist removal process on the photoresist layer 22. The photoresist is cleaned with an organic solvent as in the previous technique. Layer 22, which dissolves the photoresist of the photoresist layer 22 in an organic solvent. At this time, the copper layer 21 completes the copper window forming process. Say
C:\Logo-5\Five Continents\PK8533.ptdC: \ Logo-5 \ Five Continents \ PK8533.ptd
526690 圖所示,最 製程,藉此 另一線路層 電路板之銅 及2 C圖所示 者主要製程 阻層1 2之預 發生脹縮或 與該孔1 3產 製程及雷射 方法主要在 如此成?L不 已以前述較 何熟習此技 作各種之更 申請專利範 後在該 在該絕 〔未繪 箔層之 ,習用 步驟差 定位置 每片印 生偏移 成孔製 該光阻 易產生 佳實施 藝者, 動與修 圍所界 五、發明說明(5) 請參照第2G 弟一雷射.加工 盲孔25連通至 程。如此印刷 請參照第1 C 作相較顯示兩 法主要在該光 13,一旦底片 時,預定位置 製程、開銅窗 銅窗成型製造 射加工製程, 雖然本發明 定本發明,任 範圍内,當可 圍當視後附之 銅箔層2 1之銅 緣層2 0上雷射 示〕,其完成 間形成構造導 銅窗成型製造 異。習用銅窗 上暴光及顯影 刷電路板尺寸 ,導致後續的 程的偏移。反 層1 2之預定位 偏移。 例揭示,然其 在不脫離本發 改,因此本發 定者為準。 窗2 4上進行 成孔形成一 雷射成孔製 通。 方法與本創 成型製造方 形成一孔 規格不一 微影、j虫到 觀’本創作 置上進行雷 並非用以限 明之精神和 明之保護範526690 As shown in the figure, the most manufacturing process, by which the copper of the other circuit layer circuit board and the main process shown in Figure 2C, the pre-swelling of the resistive layer 12 or the production process and laser method of the hole 13 are mainly in So accomplished? L has not used the above-mentioned how to get familiar with this technique and make various more patent applications. After that, in the [unpainted foil layer, the custom steps are different. Each piece of printing is offset into a hole. The photoresist is easy to produce a good implementation. Artists, the boundary of the movement and repair. V. Description of the invention (5) Please refer to 2G Brother Yi Laser. The processing of the blind hole 25 is connected to the process. Please refer to 1C for this printing. The comparison shows that the two methods are mainly in the light 13. Once the negative film, the predetermined position process, the copper window copper window forming and manufacturing process, although the invention is within the scope of the present invention, A laser is shown on the copper edge layer 20 of the copper foil layer 21 that is attached to the rear view], and the structure is formed between the copper guide window forming and manufacturing. Exposure and development of the printed circuit board size on a conventional copper window caused a shift in subsequent processes. The pre-position of the reverse layer 12 is shifted. The example reveals that, however, it does not deviate from this development, so the issuer shall prevail. A hole is formed in the window 24 to form a laser hole. The method and the original molding forming method to form a hole of different specifications, lithography, j insects to watch ’this creation is not to limit the spirit of the Ming and the protection of the Ming
C:\Logo-5\Fi ve Cont inents\PK8533.ptd 第9頁 526690 圖式簡單說明 【圖式說明】 第1 A至1 F圖:印刷電路板之習用雷射孔成孔製程步驟之 局部剖面示意圖。 第2 A至2 G圖:本發明較佳實施例印刷電路板之銅窗成型 製造步驟之局部剖面示意圖。 【圖號說明】C: \ Logo-5 \ Five Cont inents \ PK8533.ptd Page 9 526690 Brief description of the drawings [Illustration of the drawings] Figures 1 A to 1 F: Part of the conventional laser hole forming process steps for printed circuit boards Schematic cross-section. Figures 2A to 2G: Partial cross-sectional schematic diagrams of the manufacturing steps of the copper window forming of the printed circuit board in the preferred embodiment of the present invention. [Illustration of drawing number]
10 絕緣層 11 銅箔層 12 光阻層 13 14 銅窗 15 盲孑L 20 絕緣層 21 銅箔層 22 光阻層 23 24 銅窗 25 盲孑L10 Insulating layer 11 Copper foil layer 12 Photoresistive layer 13 14 Copper window 15 Blind L 20 Insulating layer 21 Copper foil layer 22 Photoresistive layer 23 24 Copper window 25 Blind L
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8037586B2 (en) | 2008-08-07 | 2011-10-18 | Unimicron Technology Corp. | Method for fabricating blind via structure of substrate |
US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
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2002
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8037586B2 (en) | 2008-08-07 | 2011-10-18 | Unimicron Technology Corp. | Method for fabricating blind via structure of substrate |
US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
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