TW526690B - Forming conformal mask method for PCB manufacturing process - Google Patents

Abstract

A forming conformal mask method for PCB manufacturing process comprises steps of: a copper foil layer is disposed on an insulating layer; a photo-resist layer is disposed on the copper foil layer; a first laser driller means drills a plurality of first holes on the photo-resist layer to the copper foil layer; the first holes of the photo-resist layer is treated by desmear process; the copper foil layer exposed in the holes are etched to form a conformal mask; and a second laser driller means drills a plurality of blind-holes through the conformal mask.

Description

526690 V. Description of the invention (1) [Field of the invention] The present invention relates to ~ specially, to the printed circuit method [exposure, development] method. [Prior technology] At present, structural conduction is formed between laser hole forming systems, such as connection [conduction]. However, it is easy to cause the laser to work. The molding position of the copper window must be precise. Please refer to Figure 1A to form a copper layer over the layer 10. Referring to FIG. 1B, the resist layer 12 is formed. The photoresist layer 12 [sensitizer] is formed by mixing with the photoresist layer. Please refer to Fig. 1C to form a hole through light and development. 1 3 A method for forming a steel window of a printed circuit board by absorbing the appropriate layer 12 of a negative film [not shown]. The board is replaced by laser processing. The copper mask (conformal mask) for image transfer is applied to the two circuit layers of the printed circuit board. This can be reprocessed to make the two circuit layers form electrical properties. When the laser hole forming process generates position shift holes , Small holes, few holes and other technical disadvantages. Indeed, otherwise, the above technical disadvantages cannot be avoided. The conventional laser hole forming process steps for brushing circuit boards are used. The conventional laser hole forming process is first in a box layer 11 which is used to form a line. The covering layer on the copper box layer is generally composed of three different components, such as resin [resin] and photosensitizer solvent [solvent], and is then positioned at a predetermined position of the photoresist layer 12. During the exposure process, after the projector [the pattern of the exposure pattern is not transferred to the photoresist layer for 12 days], the photochemical conversion occurs. # 二 & The photoresist is developed during the development process.

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The photoresist layer 2 is formed by the developer, and the hole 13 is formed. Layer of the light 11 :: = shown in the figure, and then the copper falling steel under the photoresist layer 12 is etched through the holes 13 of the photoresist layer 12 and is selectively etched at, σ = Ϊ A copper window 14 is formed, which completes the process of opening the copper window. Please make the photoresist layer 12 as shown in Fig. 1E, and then remove the photoresist layer 12 using an organic solvent to clean the photoresist layer 12 to make the light The valley of the resist layer 12 is in an organic solvent. At this time, the copper foil layer 11 is completed to form a copper window, as shown in FIG. 1F, and finally on the copper window of the copper foil layer. A laser processing process is performed to form a blind hole I 5 on the insulating layer 丨 and communicate with another circuit layer [not shown], which completes the laser hole forming process. The structural conduction is formed between the copper foil layers. As shown in Figure 1C, the Ming Dynasty father and the father, in the exposure process, once the negative (exposure) shrinks or each printed circuit board size specifications are different, the predetermined position and the The holes 13 are offset, resulting in subsequent lithography, etching processes, copper-opening processes (as shown in Figure 1D), and laser hole-forming processes (as in Section 丨 F The factory does not]. Therefore, the conventional laser hole forming process is easy to cause technical disadvantages such as laser processing holes, small holes, and small holes. In view of this, the present invention is used in the copper window molding of the printed circuit board manufacturing method. The laser processing method replaces the image transfer method to improve the accuracy of the laser hole forming process of the printed circuit board. [Summary of the Invention] The main purpose of the present invention is to provide a method for manufacturing a copper window of a printed circuit board, which is used for forming a copper window. Use laser processing instead of image transfer

526690

The method of the present invention, the method of making the photoresist layer according to the process of containing the photoresist layer on the step bacteria layer [invented in order to confirm the formula, the top layer of the hair layer is made into a hole texture, and the copper window 1 is a blind copy Develop better and better master 2A The present invention has a clear secondary purpose. The invention has the following steps in the invention of the copper window: the cover is formed to form a hole; the hole is used on the copper®. The solution of the invention will be described in detail below. The printed electrical cover forms a light path to form a dagger and then follows the light hole in the hole. In the foregoing embodiment, the technical content will be revealed to the 2 G diagram. ^ Nw is a type that provides a simplified circuit for making a brush, an insulating photoresist layer, and the accuracy of the second laser hole forming process in the optical copper foil layer. . A copper window molding for printed circuit board. Laser processing is used to replace the image transfer function. A method for forming and manufacturing a copper window of a plate. This method covers a copper foil layer on the layer; performs a de-sweat treatment on the steel layer by using a first laser to form a resist layer on the photoresist layer; Forming a copper window; and forming a blind hole in the copper injection hole forming process. The above and other objects, features, and advantages can be used to illustrate the preferred embodiments of the present invention, and to cooperate with the following. The manufacturing method of copper windows for road boards is mainly in copper?且 F and the layer 'then use the first thunder body on the photoresist layer', and then perform decontamination in the hole of the photoresist layer = the copper foil layer is engraved on the hole of the layer to form a layer. The main technical content of using the second laser hole-forming process on the copper window is normally disclosed in the enumerated below to use this preferred embodiment in conjunction with the related technology to properly implement this technology. . The copper window of printed circuit board

Page 7 526690 V. Description of the invention Partial cross-section diagram of the manufacturing process of (4) type. As shown in FIG. 2A, the preferred embodiment of the present invention firstly overlays an insulating sound 20 to form a copper layer 26. The copper foil layer 21 is used to form a circuit layer. Please refer to FIG. 2B, and then cover the copper foil layer 2 丨 to form a two-resistance layer 2 2 ′, which is the same as the foregoing prior art. The photo-resistive layer 2 2 is generally made of resin, photosensitizer, and solvent. The ingredients are mixed to form. Please refer to FIG. 2C, and then perform a first laser processing process at a predetermined position of the photoresist layer 22, so that the laser is formed into a hole shape on the photoresist layer 22 and a hole 23 is connected to the copper foil layer. 21. It completes the laser hole forming process. As far as the * process technology is concerned, it can accurately perform thunder hole formation at a predetermined position, so the hole formation is unlikely to be offset. Please refer to FIG. 2D, and then perform a desmear process in the holes 23 and 23 of the photoresist layer 22 in order to perform the subsequent etching process. For example, the decontamination treatment technology is as follows: ^ ”year 丨丨 Permanganate Decontamination of Printed Circuit Boards, issued by U.S. Patent No. 5 98 5 040 to others on January 16, is incorporated herein by reference. Please refer to FIG. 2E, and then perform an etching process on the copper box 21 under the photoresist layer 22, and select the copper layer 21 to be etched through the holes 23 of the photoresist layer 22, and in the copper foil layer A copper window 24 is formed on 21, which completes the process of opening the copper window. 0 Please refer to FIG. 2F, and then perform a photoresist removal process on the photoresist layer 22. The photoresist is cleaned with an organic solvent as in the previous technique. Layer 22, which dissolves the photoresist of the photoresist layer 22 in an organic solvent. At this time, the copper layer 21 completes the copper window forming process. Say

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526690 As shown in the figure, the most manufacturing process, by which the copper of the other circuit layer circuit board and the main process shown in Figure 2C, the pre-swelling of the resistive layer 12 or the production process and laser method of the hole 13 are mainly in So accomplished? L has not used the above-mentioned how to get familiar with this technique and make various more patent applications. After that, in the [unpainted foil layer, the custom steps are different. Each piece of printing is offset into a hole. The photoresist is easy to produce a good implementation. Artists, the boundary of the movement and repair. V. Description of the invention (5) Please refer to 2G Brother Yi Laser. The processing of the blind hole 25 is connected to the process. Please refer to 1C for this printing. The comparison shows that the two methods are mainly in the light 13. Once the negative film, the predetermined position process, the copper window copper window forming and manufacturing process, although the invention is within the scope of the present invention, A laser is shown on the copper edge layer 20 of the copper foil layer 21 that is attached to the rear view], and the structure is formed between the copper guide window forming and manufacturing. Exposure and development of the printed circuit board size on a conventional copper window caused a shift in subsequent processes. The pre-position of the reverse layer 12 is shifted. The example reveals that, however, it does not deviate from this development, so the issuer shall prevail. A hole is formed in the window 24 to form a laser hole. The method and the original molding forming method to form a hole of different specifications, lithography, j insects to watch ’this creation is not to limit the spirit of the Ming and the protection of the Ming

C: \ Logo-5 \ Five Cont inents \ PK8533.ptd Page 9 526690 Brief description of the drawings [Illustration of the drawings] Figures 1 A to 1 F: Part of the conventional laser hole forming process steps for printed circuit boards Schematic cross-section. Figures 2A to 2G: Partial cross-sectional schematic diagrams of the manufacturing steps of the copper window forming of the printed circuit board in the preferred embodiment of the present invention. [Illustration of drawing number]

10 Insulating layer 11 Copper foil layer 12 Photoresistive layer 13 14 Copper window 15 Blind L 20 Insulating layer 21 Copper foil layer 22 Photoresistive layer 23 24 Copper window 25 Blind L

1L

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Claims (1)

526690 6. Application Patent Scope 1. A method for manufacturing a copper window of a printed circuit board, comprising the following steps: Covering a copper foil layer to form a photoresist layer; using the first laser to form a hole in the photoresist layer A hole is formed in the manufacturing process; the copper foil layer is etched to form a copper window on the hole of the photoresist layer; and a blind L is formed on the copper window of the copper foil layer by a second laser hole forming process. 2. The method for manufacturing a copper window of a printed circuit board according to item 1 of the scope of the patent application, wherein a decontamination treatment is also performed in the hole of the photoresist layer for subsequent etching process. 3. According to the method for manufacturing a copper window of a printed circuit board according to item 2 of the scope of the patent application, firstly, an insulating layer is covered to form the copper gallium layer. C: \ Logo-5 \ Fi ve Cont inents \ PK8533.ptd Page 11