TW522533B - Optical chip package with metal extension to the outside of glue. - Google Patents

Abstract

This invention discloses a package for optical chip such as light emitting diode or laser diode with metal substrate extention to the outside of the glue to result in good heat dissipation to dissipate heat generated from the LED chip.

Description

522533 V. Description of the invention (1) 1 · Field of application of this technology This technology is applicable to the heat dissipation package of light-emitting diodes, laser diodes, and optoelectronic semiconductor wafers. The following uses only the light-emitting diode wafer 2 as an example. . ft 2. Background Description Due to the advancement of technology, the heat is getting higher and higher. If the whole product will be good, the high-brightness brightness display screen ... One concave diode wafer 10 has a diode wafer 10 and a dimetal 12. Finally, the lower end of the first metal is used as the lower end as the upper end of the second extended first metal 1 1 to achieve a high heat dissipation efficiency. The brightness of the light-emitting diode cannot be effectively concentrated in real time to burn the light-emitting diode. Other products can be developed. Known techniques such as this packaging method will burn out the product. Figure cup 14 is used to accommodate the light-emitting two bottom electrodes, which are electrically lightly connected to the surface electrodes. Extension electrode 0 electrode 0 This technology will increase the load-bearing area and extend to the fruit of the light emitting diode package, the higher the heat generated, the product will be dissipated. If the heat-dissipating effect produces lighting and high brightness, as shown in FIG. 1 'after highlighting ^, due to the heat-dissipating effect 1, the first metal electrode body wafer 10 is displayed, and the first metal 11 is illuminated. The light-emitting mode is electrically coupled to the # it j it piece, which is bare and also bare. The second metal light-emitting diode chip J 〇 Encapsulation gel 15

3 · Detailed description of this technique Figure 2 · This technique is ancient and has an example of heat-dissipating metal that extends outside the encapsulant

522533 V. Description of the invention (2) --------- and Figure 1 · The first electrode of the conventional technique + + :: ί 封 =-the upper end of the electrode 11 The upper part of the electrode η = within the encapsulant 15 is partially exposed in the sheet metal 111 of the encapsulation A, and there is a polar crystal mo on its periphery; Fully effective and instantaneous divergence 'while maintaining high-brightness light-emitting diodes: tablets ^ :: 哥 命 and practical effects. Especially high heat dissipation effect. The film h can best show the height of the case with the packaging of this technology. Because the extension film used in this technology is thin and private, it belongs to the political heat film 111. It is a relatively thin metal diode coated in a positive photodiode. The negative things about the brightness of the plastic are: α Fei: Tao. Therefore, for those who can't get the word that can be obtained through the development of a packaging technique, relatively, after this result, you can still get The technology of offsetting its negative light blocking effect is quite suitable for high demand; …, So the light-emitting diode chip package = 3. The heat sink extends into a condensing cup to display the heat-dissipating metal 111, which can be polygonal, etc., t π 41% becomes cylindrical, concave cup, or 蚪Get the effect of spotlight. Larger, the political and thermal effect is more, the same as Figure 4. Known Skills J ^ 33 V. Invention Description (3) = Point. The figure shows that the first metal 21 has a first end 211, and the light emitting diode wafer 20 with A $ is used. I > a -1: ia2VI, i! &Quot; . After taking out, the encapsulant 25 will use the body wafer, the factory & 11, the second end 221 of the second metal, and the second end of the light-emitting diode metal 22 as the extension electrodes of the two electrodes of the body-day sheet 20. ， 5 _; — Knowledge technique (cross-sectional view of FIG. 4) = = curved into an M-shaped plane out of the encapsulation colloid 35, sores ^ ^ The peripheral area of the wound is extended, and the horse is connected to the first metal substrate 31 and Second metal substrate 32.

Page 6 V. Description of the invention (4) Fig. 8 The light-emitting diode of this technology has a double bottom surface. This technology is also applicable to the seal with a double-side surface °, as above »— pole light-emitting diode wafer 4 0

Encapsulation, two light-emitting diode wafers 40 and two U-shaped wafers 4U. Do not press contact to make the electrical coupling $ 镇 = bottom electrode 431, 432, Figure 9: Sectional view of Figure 8. A metal 41 and a second metal 42. The first metal 41 and the first leg are shown to provide the entire production port :: The outer end of the genus 42 is bent into an L-shaped flat house flat adhesive package. Φ Fig. 10 · Fig. 8 · Adding heat-dissipating metal shows the thermal effect of extension metal 4 in Fig. 8 ·. The heat-dissipating metal 4 can further be provided with a heat-dissipating sheet 41 2 to improve the heat dissipation. It belongs to 4U and heat sink 412, which can also be integrally formed. Figure 11. The technology of the eight display metal base village 51 double 3 extended structure is the same principle: in the figure, the white and white have extended metal 511, 521, and the remaining 531, 532, Respectively, the photo-polarity wafer 50 has a double-bottom electrode metal substrate 51, and is electrically and electrically coupled to the metal substrates 51 and 52. The colloid 55, which forms a small part of the surrounding area, is extended to protrude. This technique can also increase the thermal metal 511, 521, which provides heat dissipation. The two-pack colloid 55 can be 'two-hole' art metal substrates 51, 52, so that The adhesion between the seals 5 and 5 is stable. Second, Q, Q, lifting the metal substrate 5 1, 5 2 and the sealing gel

Page 7 522533 V. Description of the invention (5) Figure 12 · 11 plus heat-dissipating metal Shows the extended metal 511, 521 of Figure 11-2, which can also be outside 522 to improve heat dissipation effect. The heat-dissipating metal 511 and the heat-dissipating months 1, 12 are integrally formed. The heat-dissipating metal 521, the loose sheet, and g ★ can also be integrally formed. …, Sheet 522, can also be as shown in Figure 1 3 · The heat sink with a condenser cup showing the heat dissipation metal 5 11 can be added with a cylindrical shape 5 丨 5, a concave cup shape, or a corner shape. The larger the heat dissipation effect is, the more π = the effect of condensing. Hour j Figure 14. The condenser cup has double support feet. The condenser cup 515 is extended by the heat-dissipating metal 511 on both sides of the metal substrate 51. It is not intended to support the condenser cup together. The foregoing description discloses the preferred embodiments and design drawings of the present invention. However, the preferred embodiments and design drawings are merely examples and are not intended to limit the scope of rights of the technology of the present invention. Those who implement the technology of the present invention, or those that extend from the scope of rights covered by the "Scope of Patent Application" described below, do not depart from the spirit of the present invention and are the scope of rights of the applicant.

Page 8 522533 Simple illustration of the diagram 4. Simple illustration of the diagram Figure 1. Known technique 1 Figure 2. This technique has a heat dissipation metal example that extends beyond the encapsulant 1 Figure 3. The heat sink extends into a condenser cup Figure 4 .Knowledge technology 2 Figure 5.Knowledge technology 2 (Sectional view of Figure 4) Figure 6. This technology has a heat dissipation metal example 2 that extends beyond the encapsulant. Figure 7. The light emitting diode of this technology has dual surface electrodes_ Double Line Coupling Figure 8. Light-emitting diode of this technology has double bottom electrode_Dual contact coupling Figure 9. Sectional view of Figure 8. Figure 10. Cross-linked metal Figure 11 · Bimetal extension structure of this technology Figure 1 2. Figure 11 with heat-dissipating metal Figure 1 3. Heat sink with condenser cup Figure 1 4. The condenser cup has double support feet 5. Component number table wafer 10, 20 · 30.40. 50. Metal substrate 11.21.31.41 .51.21. 1 2.22. 32. 42. 52. Wire 13.23.331.332. Concave cup 1 4 Encapsulation gel 1 5 Metal cylinder 16. 515 Thermal metal 111 · 3 11. 411.5 5 11 · 3 2 1 · 5 2 1

Page 9 522533

Page ίο

Claims (1)

Scope of patent application A metal substrate extension is provided, including: an optical chip heat-sealable optical wafer to the outside of the nested colloid, having at least two electrodes; a first metal substrate having a first #combined with the two electrodes; The aforementioned wafer, and the electrical re-export, "罘 ~ Teletop · Second metal substrate, has the second f pole in the first one; and 'Electric horses in the two electrodes as described above & encapsulating gel' The package protects each of the aforementioned components, exposing a part of the aforementioned metal to form a heat-dissipating metal on the outside of the protective colloid, which provides heat-dissipating power. 1 A metal substrate described in item 1 of the patent scope extends to the outside of the seal. The optical chip heat-seal package of 邛, wherein the first end of the first metal further includes a through hole, which provides the aforementioned package gel to be filled and filled, thereby improving the adhesion reliability between the package gel and the metal substrate. 3. An optical chip heat dissipation package as described in item 1 of the scope of the patent application, which extends to the outside of the encapsulant, wherein the two electrodes refer to one of the following combinations: a double-surface electrode, a surface electrode And a bottom surface electrode or a double bottom surface electrode. 4. A metal substrate as described in item 1 of the patent application scope extends to the package 522533 6. Scope of patent application The heat dissipation package of optical chip outside the colloid, where the said chip refers to: a light emitting diode chip or a laser diode chip. 5. As described in item 1 of the scope of the patent application, a metal substrate extending to the outside of the encapsulating colloid is an optical chip heat dissipation package, wherein the heat dissipation metal is extended into a large-area parallel heat sink. 6. As described in item 1 of the scope of the patent application, a metal substrate is extended to the outside of the encapsulant to dissipate the heat from the optical chip. The heat-dissipating metal is extended to a condenser cup ^ to provide light-concentrating and heat-dissipating functions. Page 12