TW521020B - System for cutting brittle materials - Google Patents

Abstract

A system for laser cutting brittle materials. In one aspect, the outer perimeter of a base plate of brittle material, which contains therein a workpiece defined by a laser micro-crack cut line, is heated. The heating causes the base plate material to expand away from the micro-crack cut line, therein expanding the interstice between the base plate and the workpiece, releasing the workpiece defined by the micro-crack cut line. Alternatively, a gas emitting tape is positioned under a micro-crack cut line and applies a force against the brittle material along the micro-crack cut line, therein propagating the micro-crack through the thickness of the material and completely separating the brittle material along the micro-crack cut line. Another aspect employs ultrasonic energy to cause breakage of a brittle material along a micro-crack scribe line. Yet another aspect employs the application of high pressure fluid along a micro-crack cut line, therein forcing the material on either side of the cut line apart. Still another aspect embodies the use of two beams of laser energy to create a laser beam incident composite footprint which efficiently creates stress vectors required to split brittle materials.

Description

521020 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Field of the invention: The present invention relates to a system for cutting brittle materials, which includes the use of laser micro-crack growth technology (ZERO WIDTH CUTTING TECHNOLOGY, OWCT ®) Process and equipment for separating (cutting) brittle materials. Background of the invention: Glass cutting has been widely used for centuries, but today, glass cutting technology developed years ago has remained largely unchanged. Glass cutting technology uses a material that is much harder than glass as a cutting material, usually diamond or zirconia. The cutting material cuts the geometric shape of the object to be cut in a line on the glass surface, and then Cut the glass along the cut line. When the scribe chip leaves the glass surface, glass microchips are generated on the surface and a small dent is left at the cut mark, and the dent is a locally high stress area. Due to the above-mentioned local stress, when the applied stress exceeds the strength limit that the glass can withstand, the glass will break along the scribe line. Therefore, to break a broken glass, first cut a piece of glass, and then bend the glass until it breaks. The problem with the above method is that the scribe line is unpredictable when it breaks, and when the cutting chip leaves the glass, the glass particles are peeled off, resulting in an unexpected and irregular geometry. Cutting the narrower and deeper scribe lines as much as possible is the best way to control the predictability of the rupture of the scribe lines. However, there are practical restrictions on the narrowness and depth of the scribe lines, some of which are limited. The factors are: cut point page 5 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)

521020 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (diameter, cutting point geometry, cutting pressure, glass substrate homogeneity, cutting rate, etc.) 7 Application limits of industrial diamond head radius It is 0.0015, (.00j81 cm), although smaller diamond heads can also be manufactured, but diamond heads of size d are not suitable due to the increased wear factor and higher brittleness; In applications, although a larger-sized diamond head can make the slicing more robust, it will produce larger-sized glass fragments, form a larger stress area, and a deeper groove, causing unpredictable and more irregular fracture lines. The geometry of the scribe point will also affect the quality of the rupture line. When the scribe point is abraded and converted into a facet (abrasion of the flat point occurs on the tip of the spherical diamond), when the facet of the scribe point is left in the glass ± i4 with a cut As a result, the pressure applied to the glass will change accordingly. The above pressure (stress) change will cause a difference in the degree of glass cut, thus affecting the uniformity of the v-shaped cuts and the formation of a stress field, which in turn affects the glass. Bad characteristics (eg *: quality of burrs, etc.) The above description of characteristics is similar to the "point, cut method", but different from the cutting method of grinding wheels used by some industrial glass cutting machines. The pressure variable is difficult to control This is true even with automated machinery, because of the amorphous nature of the glass, irregularities in the surface, hardness, heterogeneity, variables at the actual (micro) contact point between the cut point and the glass surface, and other factors. Because of the homogeneity of the glass material, if the glass material is cut by traditional mechanical means, it is not easy to produce a neat crack. Unless the stress surrounding the scribe line has a uniform and symmetrical pattern distribution, otherwise the glass — — — — — — — — I ·!! II ^ 1 II · 11! 1! 111 (Please read the precautions on the back before filling out this page) 521020 Α7 Β7 V. Description of the invention () It will not be able to rupture as expected ', which results in The geometry of the burr will affect the cutting accuracy. The geometry of the front edge will cause the brittleness of the edge, and the kneeling of the edge will cause the restriction of the glass safety control. It can be overcome by using specific process steps and equipment. When stress is applied to the brittle edge (there is no predetermined stress limit here), microscopically, cracks are generated everywhere in the glass, and the cracks will grow with time. 'Reliable It is impossible to predict when cracks weaken glass and induce damage. Thermal cycling and vibration will accelerate crack formation and growth, so it is impossible to predict a crack rate and path. Each part of glass has its own combination of variables The above is the most difficult random destruction mode in the current technology. The change of the glass surface (convex and concave) will cause the change of the cutting rate, make the effective cutting pressure change, and cause the difference in the depth and width of the cutting line. Therefore, it affects the reproducibility and predictability of the glass's damage path, edge geometry, quality, brittleness and accuracy. Another disadvantage of mechanical scoring is that it produces large amounts of fine glass particles. Unless these particles are collected (which will add more operating equipment and costs), the particles will float into the air and eventually fall to a work surface, or more severely, to a work surface. Because these fine glass flakes are abrasive and contaminating, they cannot be cleaned or controlled with traditional low-cost methods. Mechanical slicing is the only practical method for cutting glass for centuries, forming an initial (initial) fracture at or above the edge of a glass substrate. According to the above argument, cut the common edges or V-shaped engraving. Page 7 The national standard (CNS) A4 specification (21 () χ 297) of the New Zealand standard timely (1) (Please read the precautions on the back before filling this page )

· Fill in this V. • Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 Printed by the Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Traces are the most unreliable approach as a starting point . For general mechanical cutting methods, due to the influential and limiting characteristics of glass and cutting tools, the edge starting point or "cutting initial defect" produced by mechanical cutting also has the unpredictability and irregularity of cracking. . In recent years, laser thermal ablating technology has been used to cut glass materials. This technology has many functions, but also has some characteristics that are not required. First, when cutting with thermally ablated lasers, the heat generated by the laser beam causes one part of the glass to be ablated or volatilized. This process consumes materials, so the cutting loss (cutting) must be adjusted to fit the size Demand for parameters. Secondly, the cutting edge of the glass is a melting edge, which has an unpredictable fracture and an irregular geometric shape. Subsequent processing of the cutting edge still requires a diamond or zirconia grinding wheel for grinding to achieve the required geometry. The above process is both material intensive and time consuming, and because the grinding process generates vibrations, it transmits additional shear stress to the glass, which may further increase the risk of cracking or the formation of erroneous micro-cracks. The third 'the heat generated by cutting glass with laser ablation (or volatilization) technology will induce stress generation'. The cutting edge in the heat-affected zone generates a thermal residual stress that is not easy to control. This residual stress causes the brittleness of the edge, and therefore greatly Increase the chance of edge damage. This random stress will make subsequent cutting processes more complicated. When these objects must be subjected to other cyclic processes or the edge is used as the final processing step, it will be more difficult to perform the cutting process again. Page 8 The paper standard outline of the paper towel (CNS) A4 secret 〇χ 29? ^^-(Please read the precautions on the back before filling this page) tr! -Line --------- B7__ — V. Explanation of the invention () Due to the above-mentioned unpredictable characteristics, in most practical applications, the rupture method of mechanical cutting and glass cutting is still better than that of thermal peeling laser cutting. U ’S. Patent No. 5609284 (Kondratenko) has disclosed a technology that allows the cutting of glass and the breaking process without chipping, cutting waste or loss of slits. Laser-based glass (or other brittle materials) cutting systems are called ZERO WIDTH CUTTING TECHNOLOGY (OWCT®). The printing system of the consumer cooperative of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs does not need to be eroded. Cutting glass by melting or melting method is based on the thermophysical properties of the glass, using a laser under a control program to heat a predetermined glass area to a specific temperature, followed by cooling nozzles in one of the glass heating areas. Partially cooled. (The glass project here is called due to the convenience of traditional methods, but it should include all brittle materials, ceramics, metallic glass, etc.) suitable for this treatment. Through precise laser heating (or other suitable energy transfer methods), a high tensile stress is induced from the heated surface to penetrate into the glass body, and then it is cooled with a water / cooled gas jet or other fluid medium. This stress overcomes the molecular bonding force of glass and forms micro-cracks of angstrom width, and creates a slightly measurable distance across the cutting line on the cleaved surface, which is expected to cause intermolecular bonding The destruction of the knot. A controllable size (height) micro-crack extends straight down from the top of the surface (where heat is applied) to the glass body, and is orthogonal to the glass surface in a plane. This is followed by a laser beam / cooling nozzle located above the glass surface to create a heating / quenching path. The above process is similar to a traditional mechanical cutting procedure, but zeR〇 Page 9

This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male H 521020 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of invention () WIDTH CUTTING TECHNOLOGY, OWCT® has no slit loss, perfect Square and straight edges, no mechanical and thermal stress residues, excellent cutting geometry accuracy and regularity, etc. This cutting material will be tightly bonded, and a working object defined by a closed geometry will also be left over Inside the substrate, there is no obvious distance to separate the materials. When the micro cracks in the glass are generated by ZERO WIDTH CUTTING TECHNOLOGY, OWCT® technology can be used to separate the glass using several traditional methods. As described above, apply the glass A bending moment, a vector is added to the micro-cracks on either side of the top surface of the glass, and immediately below the cutting line (micro-cracks) produced by ZERO WIDTH CUTTING TECHNOLOGY, 0WCT®, a rotation vector is applied in the opposite direction On the bottom surface of glass. Based on the bending moment, the glass will be lighter along the direction of the micro-crack growth. Easily cracking. In a typical conventional laser beam / quench nozzle "cutting" application technique, a lead crack or "cutting initial defect" is used to enhance the generation of ZERO WIDTH CUTTING TECHNOLOGY, OWCT® micro-cracks. For the traditional method, a "defect" on the "cutting or breaking edge" is necessary, because the defect can be used as a starting point for cutting by ZERO WIDTH CUTTING TECHNOLOGY, OWCT⑧ to ensure that ZERO WIDTH CUTTING TECHNOLOGY, OWCT® The generated micro-cracks can be accurately and initially grown from a predetermined area. This technology does not have the residual stress caused by the traditional “cut or break” method to form a weak point distribution. In addition, because there is no residual stress on the working surface, any advance Laser cutting edge is more traditional than "cutting or destroying edge" method. Page 10 This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

521020 A7 ______ Β7 _ ____ 5. Description of the invention () has five to ten times the strength, so ZERO WIDTH CUTTING TECHNOLOGY, OWCT® technology is applied to the position of a "cutting initial defect" on the edge of the surface for the success of laser scratches and No has its importance. The generation of previously induced cracks or "cutting initial defects" can be achieved by a traditional mechanical cutting, laser ablation, laser induced stress, and spalling along the edge of the glass. Employees' Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Purpose of printing and summary of the invention: In one aspect of many embodiments of the present invention, the outer periphery of the board bounded by a laser micro-crack cutting line is included. When the work object heats the substrate material, the substrate expands, and the substrate is thus expanded. The work object defined by the cutting line with the crack cutting seam releases the second tape in many embodiments of the present invention. The tape is designed to release nitrogen on the tape after the tape is slightly heated, and release nitrogen under the micro-crack cutting line. The formed micro-crack cutting line of the upper glass (brittle material) extends along the opposite side of the position and is lower than this phase. The stress vector is very small in the destructive force couple. The micro-cracks penetrate the thickness of the material and cause the separation. The third and eleventh pages in the examples are in accordance with China National Standard (CNS) A4 (210 X 997 public meals), one of which is brittle. The work object fixed by the material substrate will be released from the substrate. The crack line between the work object and the work object is separated, so the laser microcrack is in the form of a gas-releasing adhesive or other composition. Or other gaseous matter. In the gaseous matter, a vector force can be applied along the glass, but it is the degree to which the surface is subjected. The important vector, that is, the material uses ultrasonic energy along the micro-crack cutting line to ( Please read the precautions on the back before filling in this page) Ί-δ- · • Line-521020 A7 ___- —____ B7__ V. Description of the invention () This energy cuts the line along a micro-crack, causing the brittle material to crack. The fourth aspect of the embodiments of the invention uses a high-pressure gas or fluid to cut a line along a micro-crack of a material, forcing the material to separate from either side of the cutting line. The fifth aspect of the embodiments of the invention uses a double The laser beam generates a laser incident composite track, which generates an effective stress vector to control the expansion of a brittle material, which causes the brittle material to further rupture. In addition, the two lasers The light beam can accurately control the laser energy parameters and the micro-crack extension characteristics generated by the laser. Without recalibrating the laser system, the trajectory of the laser energy can be changed, and the highest-order brittle materials can be maintained. / Intermolecular stress. For the physical and mechanical characteristics of different types of brittle materials, the energy track of this laser system can be easily reset without the need for special types of lasers, laser control and power supplies. The detailed drawings are listed in the detailed description of the implementation of the detailed examples. The Chinese version of the drawings and the attached drawings are also attached. The Yuanzhong together stated that the parts and components are listed as follows (Please (Read the notes on the back before filling out this page)

---- Order --------- Line I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the first and second figures are printed on the flat side as the working king & &封 封 1 1 is shown as shown in Figure 11 2 X fln is shown on the side of the seal. I is shown as shown in Figure 3 Figure 4 is shown as shown in Figure 4. Including the package as X. Closing the object for drawing-Br ,,-J & face seal flat. Page 2 97 2 X 10 9Jτ (A4 s) N (c quasi-standard home country one country I in China 521020 A7 B7 V. Description of Invention (Printed in Figure 5a of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the figure 5a shows a brittle substrate that adheres to a gas release rubber fee; Figure 5b shows a brittle substrate and _ Enlarged detail of a gas release tape; Figure 6 shows a gas release tape that enables a work item to be separated from a brittle substrate; Figure 7 shows a ultrasonic burst system using an ultrasonic acoustic cavity Figure 8 shows a perspective view of an ultrasonic burst system using an energized fluid; Figure 9a And FIG. 9b is a perspective view of a brittle substrate including a micro-crack cutting line, and FIG. 9c is an enlarged cross-sectional view and a plan view of both of them; After the step of FIG. 9c, a perspective view of separation of the brittle substrate; FIG. 11 shows an exemplary device for separating a brittle substrate in the fourth aspect of the embodiment of the present invention; and FIG. Demonstration equipment for laser cutting of brittle materials; Figures 13a-13b show the method of adjusting the variable beam; Figures 14a-14d are cross-sectional views of the variable energy trajectories of the present invention; and Figures 15a- Figure 15e shows a comparison of the profile of the energy track and the comparison of the energy distribution and net energy distribution of the beam trajectory. Page 13 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 meals) ί Please first (Read the notes on the back and fill out this page)

-Packing ------- Order --------- Line I 521020 A7 B7 V. Description of the invention () Drawing number comparison description: 10 base plate 1 3 larger work objects 1 6 top surface 20 residual objects 200 substrate 206 gas release tape 208 vacuum table 2 1 2 support material 3 0 1 ultrasonic generator 3 0 4 work object 308 ultrasonic acoustic cavity 312 acoustic cavity surface 3 1 6 cement 322 power converter 402 fragile substrate 406 nozzle 424 Nozzle 502 Laser source 506 Laser beam 507 Reflective mirror surface 5 1 0 Target brittle substrate 1 2 Closed work object 1 4 Micro-crack cutting line 1 8 Opposite surface 22 Second micro-crack cutting line 202 Micro-crack cutting line 204 bottom surface 2 1 0 Gas adhesive 3 00 Ultrasonic explosion equipment 3 02 Brittle material substrate 3 06 Micro-crack cutting line 3 1 0 Electric energy converter 3 1 5 Cable 320 supplier 324 Ultrasonic generator 404 Micro-crack cutting line 420 Ultrasonic generation 500 equipment 5 04 laser source 508 laser beam 509 reflecting mirror 5 1 2 beam splitter or V-type mirror (please read the precautions on the back before filling this page)

I installed -------- Order --------- line I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 14 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 521020 A7

V. Description of the invention () Yanming's detailed description: First Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Please refer to Figures 1-4. The figure shows that in a first aspect of the present invention, a work object defined by the cutting line is separated from a substrate material due to a temperature difference at the cutting line of the M-micro crack. In the embodiments of FIGS. 1 to 3, the principle of the present invention is used to make a closed work object i 2 released from a substrate 10 advantageous. The closed work object 12 defined by the micro-crack cutting line may be a closed or partially closed geometry. The substrate 10 can be a brittle material (not limited), such as: mineral glass, vitrified silicon dioxide, metallic glass, crystalline materials, and ceramics. The micro-crack cutting line that defines the work object is preferably formed by the Zero WIDTH CUTTING TECHNOLGOGY, OWCT® method. The outer periphery of the cutting line 14 in the substrate 10 is heated, and the closed working object can be released from the substrate 10. When the substrate 10 is heated in the above manner, the heating speed of the substrate 10 is faster than that of the closed work object, which causes the substrate 10 to expand. The expansion of the substrate 10 widens the distance between intermolecular splits of the micro-cracks 14 and the sufficient micro-crack separation can overcome the Van der Waal force and / or any residue between the substrate 10 and the work object 12 With the electrostatic force, the work object 12 can be released from the substrate 10. From this point of view, it can be understood that the degree of temperature difference required to separate the work object 12 from the substrate 10 will vary with many control parameters. For example, the above-mentioned control parameters include: the relative size of the work object, the thickness of the brittle material, the composition of the brittle material, and the heat and chemistry of the brittle material. Page 15 This paper applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) (Please read the precautions on the back before filling out this page) -Installation • βιϋ n ί ϋ nn ϋ One mouth τ · 'nnnnn an n I line i 521020 A7 B7 V. Description of the invention () Mechanical characteristics, etc. FIG. 3 shows a closed work object defined by a micro-crack cutting line 14 shown in another embodiment of the present invention, in which a peripheral edge of the cutting line 14 on a top surface 16 of a substrate i 0 is The periphery of the cutting line 14 beyond the opposing surface i8. Preferably, the surface 16 of the substrate 10, which is a large work object 13, is heated, and the work object 12 shown in the drawing is detached by the temperature difference caused. Laser or other energy beams can be used to achieve the purpose of heating the substrate 10. When the substrate material is a glass material, a carbon dioxide laser having a wavelength of 106 micrometers is preferably used, because the laser can have excellent thermal effect on the glass and the efficiency. Lasers of this wavelength cannot penetrate deeply inside the glass substrate, heat is generated at the laser incident track on the surface of the glass substrate 10 and passes through the substrate. Since there is no need to continuously focus on such dangerous factors, the characteristics of this heat transmission through the glass material can be controlled. Although high frequency lasers are used (eg Nd: YAG lasers), the focus of laser focusing must be strengthened to prevent local overheating inside the substrate 10. Improper focus control and / or difficult-to-control heat penetration will generate thermal energy inside the substrate 10, form a stress plane at the surface of the parallel substrate, and the material may have uncontrollable or unpredictable cracking. In addition, another heating method different from laser may be used, and heating is performed along a micro-crack cutting line on the surface of the substrate 10, and the substrate 10 is separated due to a difference in temperature. The above heating methods (but not limited to) include at least: radiant heating and heating using quartz or infrared elements. Page 16 This paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 29T? Il _ '(please first (Read the 沭 意 顼 on the back of this page to save and fill in this page) tr --------- Line-Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economy 521020 A7 B7 Description of the invention (Gas nozzle and flame heating are used. When the above heating method is used, the heating area, heating rate, heating intensity and continuous heating time and other factors must be highly controlled. No matter what heating method is used, all of the above must be mastered The principle is to provide enough specific heat to cause a temperature difference across the micro-cracks i4, especially when the micro-cracks 14 are widened. If you do not want to create harmful stress surfaces inside the substrate 10, pay special attention. In addition, make the work surface When deforming or appearing defects, and performing material changes such as tempering and / or introduction of pollutants, it is necessary to keep the work in mind The purpose of the final application of 12). The expansion of the micro-crack cutting line 14 and the release of the work object 12 is related to other parameters, and also the temperature difference across the cutting line 14. Sincerity As understood above, at a predetermined temperature of a substrate 10, the work object 12 is cooled relative to the substrate temperature to increase the temperature difference across the micro-crack cutting line, which will help or accelerate the The work object 12 is released from the substrate 10. Further, reducing the temperature of the work object 12 or applying a rapid cooling process will cause the closed work object 12 to shrink from the substrate 10, and then at the micro-crack cutting line 14 Expand the degree of intermolecular splitting. When the work object 12 is subjected to rapid cooling treatment and the substrate 10 is heated, the required temperature difference degree and micro-crack cutting line 1 can be achieved under the lower substrate 10 temperature requirements. 4 The effect of widening or separation. In addition, it is also possible to apply a rapid cooling treatment only to the work object 12 separately, that is, without heating the substrate 10, a temperature difference is generated across the micro-crack cutting line 14 Promote the object 12 to be separated from the substrate. The paper size on page 17 applies the Chinese National Standard (CNS) A4 specification (21Q χ 297) -------- 1 --------- (Please read the precautions on the back before filling in this page) 5. Description of the invention () The process of cooling the work object 12 and separating it from the substrate 10 has the following advantages. 'First, it is not necessary to heat the substrate 10 to a specific High temperature can reduce energy requirements and improve economic efficiency. The second lower temperature substrate 10 can reduce the risk of damage to the work object 12 or the substrate 10 due to local annealing, induced internal stress or defect generation. Finally, the work object 12 is subjected to The quenching process also reduces the need to control the laser beam to be heated during the heating process because more diffused thermal effects can be used. Various methods can be used in accordance with the above principles to achieve the purpose of quenching the working object 12. The first quenching embodiment of the present invention includes introducing a quenching gas or other fluid medium to the surface of the work object 12, wherein the quenching fluid may be quenched air, dry liquid nitrogen, vaporized liquid nitrogen, carbon dioxide, or a fluid. Carbon dioxide "snow". An embodiment of the second quenching process of the present invention includes applying a low boiling point substance to the surface of the work object 12. When the low boiling point substance contacts the surface of the work object 12, it will vaporize due to the lower boiling point, and Allow work items 12 to cool. The first quenching embodiment of the present invention uses a thermoelectric and / or thermomechanical device to rapidly cool the work object 12 by using a method such as conduction cooling. A suitable cooling device may include a standard compressor and a coil unit or A Peltier cooler. When releasing a work object containing a closed residual object 20, it is more useful to incorporate a quenching process during the separation of the work object 12 from a substrate 10 due to temperature differences. The release of this object from the quenching process will be more effective. Please refer to the example in FIG. 4, which shows a substrate 10 with a micro-crack cutting line 14 of a closed geometry 14 Page 18 The paper's wattage is in accordance with China National Standard (CNS) A4 (210—521020 A7) V. Description of the invention (a work object 12, the closed work object 12 further includes a residual object 20 (or PLUG), wherein the residual object 20 is defined by a micro-fracture cutting line 22 of a second closed geometry, and the second The micro-crack cutting line 22 is located inside the first micro-crack cutting line 14. The substrate 10 is subjected to careful heating treatment, and then the remaining objects 20 are subjected to rapid cooling treatment. In this single and consistent process, the work object 12 can be separated from the substrate 10 and the residual object 20 at the same time. According to the above process, a multi-stage temperature difference is established, and heating on the substrate 10 causes the expansion of the inter-molecular splits at the micro-crack cut line 14; The residual object 20 causes the residual object 20 to shrink from the work object 12, and thus the micro-cracks of the second micro-crack cutting line 22 are expanded and separated. The above is a single and consistent treatment of the present invention, According to the content of the present invention, it can be understood that if the work object 12 is separated from the substrate 10 first, and then the residual object 20 is separated from the work object 12, it is also regarded as the same consideration. Based on this further consideration, heating and One of the two is to perform the quench treatment first, and then the other is completed as a sequential step.

As described above, a closed work item can be released, and a non-closed work item can also be released in accordance with the principles of the present invention. The above description of the present invention is also applicable to ZERO WIDTH CUTTING TECHNOLOGY, OWC ^ technology or other similar technologies (including general mechanical cutting technology) for cutting or cutting brittle materials. Two bears make one

The second aspect of the present invention is the use of a gas release tape. Page 19 This paper is a standard for timely home care (CNS) A4 secret 521020 A7. V. Description of the invention A brittle material substrate is separated. Please refer to FIG. 5a and FIG. 5b, which shows a brittle substrate 2 00 including a micro-crack 202 inside the substrate 200, the micro-crack 202 depicts a predetermined cut The path is to separate the substrate 200 into a work object and a substrate 200. A gas release tape 206 is adhered to the bottom surface 204 of the brittle substrate 200, and a vacuum table 208 is used to support the substrate 200 and fix the substrate 200 so that The substrate does not move during a cutting process. Adding a gas release tape 206 between the brittle material 200 and the vacuum table 208 has two excellent advantages. First, the gas release tape 206 can be firmly supported The fragile substrate 200 includes fixing any small objects to be cut from the fragile substrate 200. Second, the gas release tape 206 is an external substance, and the fragile substrate is gently supported and tightly connected in a block form. In order to make the distribution of the vacuum stress applied to the substrate more uniform during the vacuum process, the gas release tape 206 can be used to normalize the stress. The two advantages mentioned above, among which the latter is suitable for cutting small or easily broken Objects are particularly important, that is, the thin brittle substrate located above the vacuum hole tends to deform immediately, which affects the geometry and cutting characteristics of the brittle substrate 200. It is better for the present invention to support the brittle substrate in the above manner. The gas release tape is a special adhesive tape, which is a technology well-known in semiconductor technology. The gas release tape in the embodiment of the present invention can be single-sided or double-sided. The tape 2 06 will be slightly heated. Releases a gaseous substance (such as nitrogen or carbon dioxide, etc.) In addition, the gas release tape can be designed to emit light at a specific wavelength (for example: infrared page 20 This paper applies Chinese National Standard (CNS) A4 Specifications (210 X 297 meals) 521020 Printed clothing A7 B7 for consumer cooperatives of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention () Line or Ultraviolet light) can activate its gas release function after exposure. The vaporized outer layer of the tape prepared by this method is less affected by radiation photosensitization, that is, only those exposed directly to the "heat and / or heat" of the radiation Gas is released from the outer area of the tape. When the gas tape is heated in a narrow strip or track, it does not release gas from the entire area of the tape, only the heated tape area will release gas. The outer layer is characterized by the ability to selectively apply a suitable stress vector to the glass (brittle material) and laser / quenching at the same time to generate micro-cracks, so the material can also be separated at the same time during cutting. Connecting small objects together Various types of tape technology are well known. When the tape releases gas, the gas or semi-released gas generated from the surface of the tape will push or lift the adhered semiconductor object or other materials. Please refer to FIG. 5b. The single-sided gas release tape 206 according to the embodiment of the present invention includes a gas adhesive 210 and a support material 212 (for example, a paper or a polymer support material). In addition, the vacuum table 208 can fix a brittle substrate 200 and normalize stress. The gas release tape is used during cutting to provide complete fracture and / or separation of the brittle substrate. As shown in FIG. 6, a brittle substrate 2 0 0 in which a laser traces a trajectory induces a micro crack 2 2 2 in the figure, and controls the laser source to provide sufficient thermal energy to transfer to the gas adhesive 2 1 0 to make the tape 2 0 6 Generates a thermal reaction that releases gas. In addition, when the gas release reaction is activated with light of a specific wavelength, a micro-crack 202 is formed (such as the same separation process that does not require gas release), and the gas release reaction and material are induced at a later time. Separation. Page 21 This paper size applies Chinese National Standard (CNS) A4 specification (210 X 29f male f) (Please read the precautions on the back before filling this page) Μ -------- 1 ----- ---- Line _ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 A7 _____B7 V. Description of the invention () When a gas release reaction occurs, a large amount of gas is generated below the laser beam trajectory and balanced and symmetrical to the laser On either side of the linear axis of the beam path, that is, when the gas 204 cuts the brittle substrate 200, the gas 204 is located below the micro-crack cutting line 202 generated by the laser beam and generates a linear shape along the micro-crack cutting line. Local high pressure. The pressure of the gas 2 1 4 under the micro-crack cutting line and the adhesion between the tape 206 and the brittle substrate (adjacent to the micro-crack cutting line) form a force couple. The effect of the force couple is the same as the mechanical bending force couple on the micro-crack. Similar effect of crack cutting line. See Figure 6. The figure shows that the above-mentioned force couple precisely follows the laser path and causes a fracture of the brittle material 200 along the micro-crack cutting line 202. Due to the adhesive characteristics of the adhesive tape 206, this embodiment is different from a normal breaking process. The gas is released under the micro-crack 202 and the brittle substrate 200 or the moving cutting object is not damaged, so the substrate is completely broken and Fully detached but still attached exactly to the same direction as the previous cutting process. This cutting process can be applied to small objects with brittle substrates, such as objects of 4 cm2 or smaller. When the second aspect of the embodiment of the present invention is adopted, the problems of cutting the brittle material into high-density small squares in the sub-centimeter range in the conventional cutting process can be overcome. In the traditional cutting process, when the thickness of a thin substrate is completely cut, the resulting object may float around the substrate, thus causing damage to the object and / or interface during subsequent cutting, unless a vacuum of sintered metal is used. A table or a vacuum table (each corresponding cutting object has a vacuum hole). However, the use of this special vacuum table may cause deformation of the substrate and it is almost impossible to achieve high tolerance cutting. Page 22 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 meals) (Please read the precautions on the back before filling this page)

521020 A7 ------ —__ B7__ 5. Description of the invention () As mentioned above, the support material 212 of the adhesive tape 202 helps to normalize the stress generated by the vacuum table, minimize the distortion of the substrate 200, and The adhesive characteristics of the tape 206 allow the cutting object to be fixed in position and prevent the edge of the object from being damaged. In the subsequent cutting process, the tape 20 or the brittle substrate 2000 is slowly heated and thus releases gas to release the block or selective cutting object. In addition, “Adhesive 21 〇 is a pressure-sensitive adhesive, so you can gently roll the adhesive tape 2060 attached to the substrate to a square edge or a needle fence, so that there is no damage, The cutting object is peeled off from the adhesive tape 206. In addition to the advantages and features described above, the use of gas tape 206 can also bring benefits under high-speed cutting processing. Highly abrasive glass materials have a low coefficient of friction. 'In a high-speed cutting process, the high-speed acceleration or deceleration of the grinder' may cause the brittle material on the grinder to slip. When the gas glue w 206 is used, the brittle substrate 200 on the tape 206 can not only increase the interface coefficient with the vacuum table 208, but also the supporting material 212 in the tape 206 than the rigid body grinding substrate 200 and the vacuum table 20 8 Strong bonding between surfaces. In addition, the use of the adhesive tape 20 can protect the glass surface from any damage at the substrate / vacuum table interface. -------- ^ ----- (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economy The figure is shown in the picture. Figure 7: Please refer to the material. The material is brittle and workable. The component is closed. Do not seal it as a non-working point. The system can close the wave and use the sealing sound to take out. Extraction from the middle of the sub-board, sheet sample base sheet 3 2 S S 7 29 X-10 2 / V Gage A4 S) NR (C quasi-standard home country, national moderate rule paper on paper 521020 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Can be effectively completely separated from the brittle material substrate. As shown in FIG. 7, one of the ultrasonic explosion equipment 300 includes a brittle material substrate 3. 2. The working object 304 of the substrate 302 is defined by a micro-crack cutting line 306. The aforementioned brittle materials (but not limited to) can be mineral glass, vitrified silicon dioxide, metallic glass, Crystalline materials, ceramics, etc., and the micro-crack cutting line 306 is preferably ZEROWIDTH cutting TECHNOLOGY, OWCT® technology. The device 300 in the embodiment of the present invention includes an ultrasonic acoustic cavity 308, the acoustic cavity 308 Coupling to an ultrasonic generator 301 via a cable 315 and an electrical energy converter 310. The ultrasonic acoustic cavity 308 constructed in the manner described above, wherein the acoustic cavity surface 312 and the work object 304 can be precisely geometrically and structurally accurate Fit. The material of the cavity 308 may be steel, aluminum or other materials (those that excite a suitable frequency to separate the substrate). When an ultrasonic acoustic cavity 30 is constructed of a metallic material, an elastic rubber or polymer cement 3 1 6 must It is adhered between the acoustic cavity and the work object to prevent the acoustic cavity from causing surface damage to the material, and the bonding agent 3 1 6 can effectively provide ultrasonic energy coupling to the work object. In order to effectively provide energy coupling, the The acoustic cavity must be implemented in a static release mode that completely surrounds the micro-cracks. Followed by the field shot / quenching nozzle trajectory, but must be implemented in a dynamic separation mode that covers both sides of the micro-cracks laterally. This ultrasonic wave burst from the substrate The working object 304 is removed in 〇2, and the acoustic cavity 308 can be mechanically coupled to the working object 304 ', wherein the mechanical coupling can make the ultrasonic acoustic cavity Mg make physical contact with its bonding agent 316 and the working object 304. The sonic generator 301 has been energized, and a supersonic pulse is generated from the supersonic wave -------------------- Order · — (Please read the precautions on the back first (Fill in this page again) Line 0 Page 24

521020 Α7 Β7 V. Description of the invention The device 3 Ο 1 is transmitted to the power converter 3 via the boundary line 3 1 5 and then reaches the ultrasonic acoustic cavity 308 to excite the work object 304 by ultrasonic vibration. The ultrasonic wave oscillates / translates at a high frequency and a very low amplitude to excite a work object 304 inside the substrate 300. The vibration of the acoustic cavity 308 is in the same plane as the work object 304, that is, face to face or another direction (up and down) perpendicular to the work object 304. The vibration of the acoustic cavity 308 may be multi-directional. By applying a forward stress to the surface of the work object 304, the work object 304 can be extracted from the substrate 302. Various methods can be used to apply a positive stress to a work object 304 that has been ultrasonicated. When it is pulled away from the work object 304, it will be affected by the vertical movement of the sound cavity 308, that is, the sound cavity "pushes" the work through the substrate 302 Article 304. In addition, in the opposite direction of the acoustic cavity 308, a vacuum is applied to the side of the energized work object 304 to extract the object 304. There is a method that mentions applying liquid / air pressure to any side of the work object 304. The embodiment of the present invention further uses a fluid to apply liquid / air pressure to any side of the work object 304. For example, a The gas nozzle is disposed on the surface 312 of the acoustic cavity 308. Similarly, the surface 312 of an ultrasonic acoustic cavity 308 may also include one or more vacuum holes, so the vacuum force can extract the energized work piece 304 from the substrate 304. The other way is to use an ultrasonic acoustic cavity to energize the work object, and to ultrasonically energize a fluid medium and bombard the work object. Please participate in the first embodiment of FIG. 8 and use a steam (for example: air, air, Nitrogen, carbon dioxide, etc.) pass directly through a supplier 3 20 and through a power converter 322 to be coupled to the ultrasonic generator 324. The paper on page 25 of this supersonic is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 meals) (Please read the precautions on the back before filling out this page) | --------- Line. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () The wave generator 324 via the power converter 322 and The operation is generated, and the steam is energized by an ultrasonic pulse wave, and the energized steam is directly transported through a nozzle 326 to impact a working object 304 in a brittle material substrate 302, where the working object 304 is formed by a micro-crack cutting line 306 Define it. In this embodiment, the use of energized steam has two purposes, that is, to energize the work object 304 in an ultrasonic manner and apply an extraction force to the work object 304. Based on the above principles, it is known that the skilled person may use a variety of fluids suitable for the application of the present invention, including non-gas fluids, such as water and other liquids, without departing from the spirit and scope of the scope of the attached patent application. The ultrasonic system described in the present invention also references a variety of control parameters. For example, the ultrasonic frequency, ultrasonic energy, and trajectory of the high-frequency energy generated by the sound cavity, etc., the system generates a mechanical force and pushes the work object. It penetrates from the substrate, but it is different from the phenomenon of displacement caused by mechanical force. In addition, the speed at which the work object is pushed through the substrate can be regular. With the above control parameters, when processing very small objects or sensitive surface coatings, very detailed operations can be performed to reduce the degree of undesired damage or reduce the cycle duration. Aspect gg of the present invention In a fourth aspect of the embodiments of the present invention, a system uses a pressurized fluid to separate a brittle substrate along a micro-crack cutting line. See Figures 9a to 9c and Figure 10. The brittle substrate 402 in the picture can be mineral glass, vitrified silicon dioxide, metallic glass' ceramics or crystalline materials. Page 26 This paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f ---- -------- Installation -------- Order --------- (Please read the precautions on the back before filling this page) 521020 A7 B7 V. Description of the invention () The substrate includes a micro-crack cutting line 4 0 4 ′ along the cutting line 4 0 4 to form a predetermined separation region. A nozzle 406 for dispensing a pressurized fluid is located above the micro-crack cutting line 404 and directly Directly to the cutting line. Spray a pressurized fluid or gaseous fluid to and along the micro-cracks 404. This dynamic force can provide a sufficient local stress to grow the micro-cracks and penetrate the interior of the brittle substrate 402 'and along The micro-crack cutting line 404 causes the brittle substrate 402 to separate. The nozzle is set to spray fluid into the micro-crack and on both sides of the micro-crack. Cutting line 4 0 4. The known laser beam / quench nozzle (located in the first quarter) is fixed The working object under the laser beam moves from right to left. The mouth of the separation object is located to the right of the quench nozzle (the quench nozzle is located to the right of the laser beam). If the cutting line is the X axis, use the cutting line The depth is the Z axis. The nozzle of the separated object can be at a suitable angle (the first quarter of a circle) between 0 and 90 degrees, the Y axis of 0 degrees (normal), and any necessary Z axis distance from the microcrack. The Z-axis displacement is affected by the geometry, ejection pressure, and fluid medium of the cavity created by the nozzle's final departure. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling this page) In one embodiment of the present invention, the micro-cracks 404 are formed by locally heating the brittle substrate 4 0 2 using a laser control and then quenching by a rapid cooling The nozzle 406 provides a cooling fluid medium to cool the brittle substrate 402. The quench nozzle 406 used in the cutting process is used to cool the brittle substrate 402, and a high pressure regulator can be additionally provided to supply a pressure of 60 to 120 psi. Compressed gas in the separation process. The quench nozzle 406 is installed in a manner that can selectively provide a cooling medium and high-pressure gas. The paper size on page 27 applies Chinese National Standard (CNS) A4 (210 X 297 mm) 521020 A7 ___________B7 ------- --- V. Description of the invention () (Please read the notes on the back before filling in this page) It is better to cooperate with the cutting or separation stage. Using a quenching nozzle 4 06 to supply a high-pressure steam can bring additional benefits. It is obvious that the nozzle 406 can be switched to provide a compressed gas along a micro-fracture path 404. This selling feature can eliminate the need for the first connection device. However, the need for precise focusing using high pressure steam to achieve separation of the brittle substrate 402 is not as good as the cutting process using a cooled steam medium. Appropriately adjust the air pressure and attack angle of the mouth, for example: about 30 ~ 60 degrees, but about 45 degrees is better. A sufficient amount of mechanical stress can make the micro-cracks 404 grow through the interior of the brittle substrate 40 2 and Material separation. In addition, when a brittle substrate 402 is supported by the vacuum of a vacuum table, when the compressed gas penetrates under the brittle substrate 402, the vacuum will cause the material to drop enough to separate a few microns as a solid. The pressurized steam can induce the brittle substrate 402 to expand the separation distance enough to separate the entire substrate. Before removing the work object from the cutting equipment, visually inspect and appropriately change the separation distance at which the brittle substrate occurs. This change can be accomplished by automatic image recognition and surface raster scanning. With the degree and variation of the separation produced by today's technology, it is not easy to provide a separation of only a few Angstroms in size. In another embodiment of the present invention, the modified pressurized steam is a steam containing ultrasonic excitation, as shown in FIG. 11. The ultrasonic generator 420 in the figure generates an ultrasonic pulse wave and is coupled with an electric energy converter to excite a fluid vapor medium. A nozzle 424 shoots the steam directly at a micro-crack cutting line nozzle. When the steam is activated in the manner described above, the pressure of the gas nozzle can be reduced, thereby reducing the possibility of damage to the thinner thickness or coating material. Make the paper size on page 28 applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f) 521020 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Materials and materials to achieve faster cutting rates and higher yields. Fifth aspect of the invention The fifth aspect of the invention relates to a system that applies a multiple separation or partially overlapping geometric energy field to a brittle material, The material generates surface tension and internal stress and penetrates into a micro-crack inside the material, thus causing internal separation of some or all of the material. Various methods using different hardware equipment can achieve multiple laser energy trajectories, such as: The energy field is adjusted to different energy levels and applied to a brittle material. In the following embodiments of the present invention, two kinds of laser beam energy are used to split a brittle material, wherein the brittle material is not limited. It can be mineral glass, metallic glass, vitrified silicon dioxide, crystalline materials and ceramics, but is not limited to those mentioned above. The present invention uses The dual laser system developed by one laser is to separate a single laser into two energy beams and operate them separately. The advantage of using the two independent laser systems is that the power output, energy beam curve, energy distribution and The pulse wave characteristics of any laser beam can completely control the energy trajectory pattern left by the laser beam hitting the brittle substrate. Furthermore, the multiple overlapping or non-overlapping laser energy generated by multiple lasers or multiple energy beams is further explained. The trajectory will cause a high degree of stress between the molecules of the substrate, so the micro-cracks can be controlled to grow in a predetermined manner and penetrate the material. See Figure 12 and Figures 13a to 13b. The device 500 in the illustration includes two laser sources 502 and 504. Laser source 502 and 504 of any of the two provinces page 29 This paper size applies Chinese National Standard (CNS) A4 specification (21G X 297 male " '

Aw -------- ^ --- (Please read the notes on the back before filling out this page) Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, Yin Yannong 521020 A7 r ------ B7 V. Invention Explanation (1) A 'both project a laser beam 506 and 508, and the central axes of the two laser beams 506 and 508 are substantially parallel. The two laser beams 506 and 508 described above pass directly through the mirror surfaces 507 and 509 with zero phase angle offset to generate a uniform mirrored optical path. A movable spectroscopic or '' V ,, type mirror 5 1 2 (zero phase angle offset) causes the two laser beams 50 06 and 508 to be substantially parallel and directly bombard a target brittle substrate 5 1 0. According to the above hardware configuration, when the beam splitter or V-shaped mirror 512 is moved along or away from the target axis of the laser beams 506 and 508, both the laser beams 506 and 508 are incident on the brittleness. A trajectory is generated in the substrate 5 10, and the distance between the trajectories will also change accordingly. It will change from a nearly overlapping configuration to a configuration separated by a distance. When any of the laser beams 506 and 508 has an elliptical trajectory configuration, the combined change of the energy trajectory causes a composite trajectory arrangement to change from a single ellipse (including an accurately overlapping laser beam trajectory) to Two completely separated, parallel ellipses, as shown in Figures 14a to 14d. The device 500 projects two separate laser beams 506 and 508 with two separate lasers 502 and 504. The laser beams 506 and 508 are bombarded straight from the "V" mirror 5 1 2 to the parallel axis to Target substrate 5 〇. In addition, other methods of the present invention may constitute a double laser beam pattern. In another first embodiment, a 'separated sight' projects the separated laser beams 506 and 508 onto the target substrate 510 without using a common "V" mirror 512. In another embodiment, a “V” -shaped mirror 5 丨 2 is used, but not in the form of moving “v,” the mirror faces toward or away from the axis of the laser beam 506 and 508, but instead uses a V-shaped mirror. Mirror to control the degree of laser beam overlap, but there is a fact that must be considered, that is, the energy distribution of the laser beam relative to the basis of page 30. This paper size applies Chinese National Standard (CNS) A4 (210 x 297 mm) £ 7 ------------ install -------- order ---- (Please read the precautions on the back before filling this page)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 V. Description of the invention The board will produce an attack bevel, which will be changed by the energy distribution of the laser trajectory with a vertical attack angle. The configuration of the laser beam energy distribution can be seen through the Gaussian distribution pattern of the center line of a laser beam profile, as shown in the single laser beam in Fig. I 5a. In ZERO WIDTH CUTTING TECHNOLOGY, 〇WCT® technology, the laser beam geometry may be an elongated ellipse, a knife edge, or various shapes. The elongation axis of the laser beam is usually exactly parallel to the "cut line," so the energy distribution of the laser trajectory on the substrate will be similar to the Gaussian distribution near the elliptical main axis orthogonal to the center axis of the laser beam, that is, close to Near the center axis of the laser beam. Please refer to Figure 15a, which shows the Gaussian distribution of the elliptical laser beam. The energy is concentrated at the center of the laser beam, and the energy produces a depleting effect when it is far from the main axis of the laser beam to either side. That is, decay. According to the Gaussian function, the accumulator of the energy density distribution of energy beams (overlapping or partially overlapping energy beams) is a displacement function of the lateral position of one laser beam and other laser beams. Therefore, the net energy of the laser At the peak of the distribution curve, that is, the energy trajectory distribution of the composite trajectory of two fully overlapped laser beams of the same power source is twice the energy density distribution of a single laser beam, as shown in Figure 15b. See Figure 15a Figures to 15e, which show the relationship between individual laser beam trajectories, individual laser beam energy distributions, and laser beam compound trajectory energy distributions. When the two overlapping laser beams are separated later The secondary axis is still in a straight line, the position of the Gaussian peak of each individual laser beam energy distribution curve will be replaced, the two laser beams are separated from each other and each other, and the concentration distribution of the two laser beams is split. It will cause the effect of changing the energy distribution on the surface of the target brittle substrate. This operation is on page 31. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 meals) ----------- -Install ---- (Please read the precautions on the back before filling this page) Order- 丨 521020

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () As a result of the change in the energy distribution, the major axis distance of each elliptical laser beam will be separated and replaced. Assume that one of the reference lines of two fully overlapping elliptical laser beams has the same main axis at the pre-foot cutting line, as shown in Figure 5b. As the laser beams move along the center of the composite trajectory (cutting line), the energy concentration will decrease, as shown in Figures 15b to 15e. Due to the cumulative energy of the laser beam energy, when two lasers leave their positions, the energy distribution applied to the surface of the brittle substrate shows three types of trajectories. Separating the two lasers and generating the energy trajectory enables the composite energy trajectory on the predetermined material to be more precisely controlled. The composite energy trajectory generates internal molecular stresses within the material that cause the material to separate along the intermolecular interface. When common micro-cracks are generated, focus the laser beam to make the energy trajectory place appropriate energy on the surface of the brittle substrate and apply stress to expand the micro-cracks. When a gas or liquid cooling nozzle is applied to the surface of the brittle substrate, the surface immediately shrinks. The above-mentioned difference in heat generates a stress vector that penetrates into the interior of the brittle material and separates the material, typically up to 80% of the thickness of the object. In contrast, in the present invention, one of the cutting lines divides and derives a composite energy distribution, for example, three patterns

Energy trajectory or a "head and shoulders" trajectory. This energy distribution produces L — 'different thermal gradient regions. Three separate laser beams are used to generate three regions, two of which have cumulative energy distribution trajectories and thus a "head and shoulder" response, which indicates that the head is a Gaussian distribution The amount of overlap and recombination at the peak is also because the distance is a function of the overlapping laser beam. Page 32 This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------- ----- Equipment ----------- Order --- (Please read the precautions on the back before filling out this page) Part No. 521020 Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____________ Β7 ____________ 5. Description of the Invention () After the laser beam is separated by a specific distance, the energy on either side of the two has a downward trend, as shown in Figures 15b to 15e. When a form of energy is applied to a specific area of the target substrate, it is necessary to consider that when the laser beam is separated or combined, a cumulative energy distribution trajectory is generated instead of the energy at a predetermined point on the substrate, that is, a specific concentration is increased. Energy is on each side of the substrate. Each side of the main expansion zone on the fragile substrate surface continues to produce additional expansion. The above-mentioned situation of additional expansion on each side of the main node will cause the main node to split quickly, that is, in some states, the assistance of a quench nozzle is not required, and a lower energy can be used to separate the substrate. . This embodiment can generate a very high internal stress for a brittle substrate, which is suitable for completely separating glass materials and some materials having a thickness of less than or equal to 0.7 cm. The above is explained by referring to an energy beam with a Gaussian energy distribution. It can be seen that the present invention is not limited to the above method, and the same general effect can be achieved by using another energy distribution, for example: with uniform energy The second distribution is laser, that is, the energy distribution at this energy level can evenly traverse the width of the energy and the trajectory to generate a stepped "head and shoulder energy distribution pattern. It can be the same with other types of energy distribution patterns. You get an energy distribution similar to "head and shoulders," with patterns or other advantages. This embodiment can also completely separate brittle materials with a thickness greater than or equal to 0.7 cm, and control the overlapping laser beams at the optimal energy level or geometric position to obtain a superior heat distribution and generate additional stress, resulting in a specific kind of The best way to expand brittle materials. In this example, the paper size on page 33 applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----------------- (please first Read the notes on the back and fill in this page) Order --- 521020 A7 B7 V. Description of the invention () It is quite flexible and can be applied to many forms of brittle materials and eliminates the limitations of conventional technology. Printed on page 34 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) Binding ----- # · This paper size applies to China National Standard (CNS) A4 (210 x 297g t)

Claims (1)

521020 A8 B8 C8 D8, patent application scope 1. A method for separating a brittle material, the method is separating along a cutting line on the brittle material, the method includes at least the following steps: the cutting line on the brittle material Heating on one or both sides of the material to generate a higher temperature difference across the cutting line of the material 2. The method described in item 1 of the scope of patent application, wherein the above heating step includes at least one Energy beam. 3. The method according to item 2 of the scope of patent application, wherein the above-mentioned high-energy beam includes at least one laser. 4. The method according to item 3 of the scope of patent application, wherein the heating step described above includes at least applying the laser energy to the periphery of the brittle material. 5. The method according to item 3 of the scope of patent application, wherein the heating step described above includes at least applying the laser energy to the interior of the brittle material. 6. The method according to item 3 of the scope of patent application, wherein the above laser includes at least a carbon dioxide laser. 7. The method according to item 3 of the scope of patent application, wherein the above laser includes at least one Nd: YAG laser. Page 35 This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 meals_) «nnn (n J0 ί ϋ —Λτ lnn I · mml · n (Please read the precautions on the back first to write this page) Order ·.! Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 A8 B8 C8 D8 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to declare the patent scope 8 · The method described in item 丨 of the scope of patent application, where the above The heating step includes at least bombarding the brittle material with a heating fluid. 9 · The method described in item 1 of the patent application range, wherein the heating step includes at least applying an infrared energy. I. 0 as in the patent application range 1 The method described in the above item, wherein the heating step includes at least applying an ultraviolet ray or a shorter wavelength energy. II. The method according to item 1 of the patent application range, wherein the cutting line includes at least one micro-crack. The method according to item 1 of the scope, wherein the brittle material can be composed of a mineral glass, vitrified silica, metallic glass, ceramics, and crystalline materials. Choose one from the group. 13 · —A method for separating part of the brittle material, wherein the part of the brittle material is defined by a "closed shape," and along a closed cutting line, the cutting line can be made by itself. The "closed state" does not necessarily require openings or openings on the peripheral surface of the brittle material, and the method includes at least the following steps: quenching one side of one of the cutting lines of the brittle material to cut across the material A temperature difference occurs at the line. 14. The method described in item 13 of the scope of patent application, where page 36 on the above side (please read the precautions on the back first to write this page), install two π * -lines · 521020 A8 B8 C8 Printed by the Intellectual Property Bureau of the Ministry of Economy's Consumer Cooperative, and the scope of patent application. At least one inner edge is formed, and a higher temperature is formed on the outer surface of the part and a lower temperature is formed on the inner surface of the part. 15. The method according to item 13 of the scope of patent application, wherein the cutting line is quenched to the side of the material part. 16. The method according to item 13 of the scope of patent application, wherein the cutting line includes at least one micro-crack. 17. The method according to item 13 of the scope of patent application, wherein the quenching step at least includes applying a quenching fluid to the surface of the brittle material. 18 · The method according to item 15 of the scope of the patent application, wherein the quench fluid can be selected from quench gas, dry liquid nitrogen, and vaporized liquid nitrogen. [19] The method according to item 15 of the scope of patent application, wherein the quench fluid contains at least carbon dioxide. 20. The method according to item 15 in the scope of patent application, wherein the quench fluid contains at least a fluidized solid carbon dioxide "snow", '° 2 1 · The method according to item 13 in the scope of patent application In which, the above-mentioned material is subjected to a rapid cooling step by applying a low boiling point material to the brittle material. Page 37 This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 meals). C Please read the notes on the back first (Write this page) Installation-Line 521020 A8 B8 C8 D8, those who apply for patent scope surface. 22. The method described in item 13 of the scope of patent application, wherein the above materials are quenched with thermoelectric cooling equipment. 23. The method described in item 13 of the patent scope, wherein the quenching step includes quenching using thermo-mechanical equipment. 24. A method for separating a brittle material, the method is separating along a cutting line on the material , The method includes at least the following steps: heating the outer periphery of one of the cutting lines on the brittle material so that the temperature of the outer periphery is higher than the inner periphery of the cutting line so that A temperature difference occurs across the cutting line. 25. The method according to item 24 of the scope of patent application, wherein the heating step is performed around the outside of the cutting line, and at the same time, rapidly cooling the inside of the cutting line. 26. The method according to item 24 of the scope of patent application, wherein both the outside and the inside of the cutting line are heated, and the temperature of the outside periphery is higher than the temperature of the inside periphery. The method according to item 24, wherein the above-mentioned cutting line includes at least one micro-crack. Page 38 The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- J --- -P ---- IT I (Please read the note on the back first to write this page) · -Printed by the Consumers 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economics 521020 A8 B8 C8 D8 Patent application scope 28. The method according to item 24 of the patent application, wherein the above-mentioned heating step includes at least using a high energy beam. 2 9. Method according to item 24, wherein the above A south energy beam includes at least one laser. 30. The method as described in item 24 of the patent application scope, wherein the heating step at least includes applying the laser energy to the outside of the material to form a closed shape surrounding area. 3 1. The method according to item 24 of the scope of patent application, wherein the heating step described above includes at least applying the laser energy to the material to form a closed-shaped inner area. 3 2. As described in the scope of the scope of patent application, item 29 The method described above, wherein the above laser includes at least a carbon dioxide laser or a Nd: YAG laser. 3 3. The method according to item 24 of the scope of patent application, wherein the above heating step includes at least bombarding the brittle material with a heating gas. 34. The method according to item 24 of the scope of patent application, wherein the heating step includes at least using infrared energy. Page 39 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 male f) ----------------- Install LI (Please read the precautions on the back first to write (This page) · Line-521020 A8 B8 C8 D8 VI. Patent Application Range 3 5. The method described in item 24 of the patent application range, wherein the quenching step at least includes applying a quench gas to the surface of the brittle material. (Please read the notes on the back page first to write this page) 3 6. The method described in item 35 of the scope of patent application, wherein the above-mentioned quench gas contains at least one quench gas. 37. The method according to item 35 of the scope of patent application, wherein the quench gas includes at least dry liquid nitrogen or vaporized liquid nitrogen. 38. The method according to item 35 of the scope of patent application, wherein the quench gas contains at least carbon dioxide. 39. The method according to item 24 of the scope of patent application, wherein the quenching step at least comprises applying a low boiling point material to the surface of the brittle material. 40. The method according to item 24 of the scope of patent application, wherein the quenching step includes at least quenching using a thermoelectric device. 4 1. The method as described in item 24 of the scope of patent application, wherein the above-mentioned step of rapid cooling is printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, at least including the use of thermomechanical equipment for rapid cooling. 42. The method as described in claim 24, wherein the heating step is performed before the quenching step. Page 40 This paper size applies to China National Standard (CNS) A4 (210 X 297 g t) 521020 6. Scope of patent application 43. The method according to item 24 of the scope of patent application, wherein the above heating step may be performed subsequently or simultaneously with the quenching step. 44. A method for separating a brittle material along a cutting line, the method comprising at least the following steps: before forming the cutting line, placing a gas tape on the surface of the brittle material so that at least a part of the gas tape is located on the cutting line The gaseous substance released by the gas tape is usually located below the cutting line, the gaseous substance can generate sufficient mechanical pressure to cause the brittle material to rupture along a cutting line. 45. The method according to item 44 of the scope of patent application, wherein the gas tape is thermally activated. 46. The method according to item 45 of the scope of patent application, wherein the cutting line includes at least a micro-crack generated by a laser cut, and the laser cut can provide a sufficient amount of thermal energy to cause the gas tape to release gas. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 47. The method described in item 44 of the scope of patent application, wherein the gas tape is activated by exposing it with light of a preset wavelength. 48. The method as described in item 47 of the scope of patent application, wherein the gas release system is produced by bombarding a gas tape along the cutting line with a laser of a preset wavelength. Page 41 This paper size applies Chinese National Standard (CNS) A4 specification (21 × 297 mm) 521020 A8 B8 C8 D8 VI. Application for patent scope 49. The method described in item 47 of the scope of patent application, in which the above-mentioned gas The tape is activated by exposure to infrared light. 50. The method according to item 47 of the scope of patent application, wherein the gas tape is activated by exposure to ultraviolet light. 5 1 · The method according to item 44 of the scope of patent application, wherein the gas tape includes at least one single-sided tape. 52. The method according to item 51 of the scope of patent application, wherein the single-sided tape includes at least a paper support. 53. The method according to item 51 of the scope of patent application, wherein the single-sided tape includes at least one polymer support. 54. The method according to item 44 of the scope of patent application, wherein the gas tape includes at least one double-sided tape. 5 5-A method of separating a brittle material along a closed shape cutting line, the method including at least the following steps: ultrasonic energy energizes one side of the cutting line on the brittle substrate. 56. The method as described in item 55 of the scope of patent application, wherein the cutting line can define a work object with a closed shape and ultrasonic energy. Page 42 This paper applies the Chinese National Standard (CNS) A4 specification. (210 ^ 297mm) (Please read the precautions on the back ^ 丨 installed 1 bu fill in this page) · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 A8 B8 C8 D8 Closed shape work object. 57. The method according to item 55 of the scope of patent application, wherein the above method includes at least the following steps: an ultrasonic acoustic cavity is coupled to one side of the cutting line on the brittle material, and the ultrasonic acoustic cavity is energized with ultrasonic waves. And the ultrasonic acoustic cavity is used for ultrasonic energy. 58. The method according to item 55 of the scope of patent application, wherein the method further includes applying an acting force, which is normal to the plane of the brittle material. 59. The method according to item 58 of the scope of patent application, wherein the above-mentioned force is applied to the brittle material through an ultrasonic acoustic cavity. 60. The method according to item 58 of the scope of the patent application, wherein the aforementioned force is applied to the brittle material by a fluid passing through a port in an ultrasonic acoustic cavity. 61. The method as described in item 59 of the scope of patent application, wherein the ultrasonic acoustic cavity is turned into the brittle substrate through the vacuum chirp, and when the ultrasonic acoustic cavity is far away from the brittle material, the above-mentioned force is applied On the brittle material. 62. The method as described in item 57 of the scope of patent application, wherein the paper method on page 43 of this method applies the Chinese National Standard (CNS) A4 Specification (2) GX 297 Public Issue 1 ---------- ,,-I--I (Please read the notes on the back to fill out this page first) Order-; Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economy 521020 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy A8 B8 C8 D8, The scope of patent application further includes urging the ultrasonic acoustic cavity to contact the surface of the brittle substrate so as to apply the force to the brittle material. 6 3 · The method according to item 57 of the scope of patent application, wherein the above method further includes The following steps: apply a pressurized fluid to the surface of the brittle material (relative to the ultrasonic cavity), so that the forward force is applied to the brittle material. The method, wherein the above method further comprises the following steps: ultrasonically energizing a fluid, and bombarding the brittle material with the energized fluid, wherein the fluid applied to the brittle material has been first energized by ultrasound. 65 . Such as The method described in claim 64, wherein in the step of bombarding the brittle material with a fluid, a forward force is applied to the brittle material. 66. The method described in claim 65 Where the above fluid contains at least a liquid stream or a gas stream, and the stream system directly interacts with the brittle material. 6 7. —A device for separating a brittle material along a cutting line on the brittle material 'The device contains at least one super Sonic generator, the device is coupled to an ultrasonic acoustic cavity; the contact surface of the ultrasonic acoustic cavity is the machine page 44 This paper is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please refer to First read the notes on the back and fill in this page) 521020 A8 B8 C8 D8 VI. The scope of patent application is mechanically coupled to the brittle material. (Please read the notes on the back to complete this page first) The device described above, wherein the contact surface of the ultrasonic acoustic cavity includes at least one vacuum port so as to apply a force to the brittleness with respect to the vacuum port of the contact surface. Material 69. The device according to item 67 of the scope of patent application, wherein the contact surface of the above-mentioned ultrasonic acoustic cavity includes at least one or more fluid ports, and the one or more fluid ports are coupled with a fluid supplier, the fluid supplier Transport a fluid from the one or more fluid ports and apply a force on the brittle substrate. 70. A device for separating a brittle material along a cutting line on the brittle material, the device comprising at least a pressurized fluid A pressurized fluid supplier coupled to at least one nozzle, wherein the nozzle includes an electrical energy converter coupled to an ultrasonic generator to excite a fluid vapor with an ultrasonic wave Pass it through the one or more nozzles. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 7 1 · The device as described in item 70 of the scope of patent application, wherein the pressurized fluid controller contains at least one gas. 7 2 · The device according to item 70 of the scope of patent application, wherein the pressurized fluid controller includes at least one liquid. Page 45 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 521020 Printed by A8 B8 C8 D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and the scope of patent application 7 3 A method for separating a brittle material from a previous micro-crack cutting line. The method includes at least the following steps: applying a pressurized fluid vapor along the micro-crack to generate a sufficient amount of dynamic fluid force to cause the brittle material to follow the micro-crack. The crack cutting lines are separated. 74. The method of claim 73, wherein the pressurized fluid includes at least one pressurized gas. 75. The method of claim 74, wherein the pressure of the pressurized fluid is 60 to 120 psi. 76. The method according to item 74 of the scope of patent application, wherein one of said pressurized fluids has an attack angle of 30 to 60 degrees. 7 7. The method according to item 76 of the scope of patent application, wherein an attack angle of one of the above-mentioned pressurized fluids is about 45 degrees. 78 · —A device for separating a brittle material along a micro-crack cutting line on the brittle material. The device includes at least a nozzle configuration, which can selectively supply a cooling medium and a high-pressure steam during laser cutting. The high-pressure steam can generate sufficient gas dynamic force to separate the brittle material along the micro-crack cutting line. 7 9. — Separate a brittle material along a micro-crack cutting line on the brittle material. Page 46 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm). Packing · 1 (Please read the back first (Notes on this page, please fill in this page) · Summary: 521020 Printing of clothing A8 B8 C8 D8 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. Method of applying for a patent, the method includes at least the following steps: applying the micro-crack cutting line Gas steam, where the pressurized gas steam is excited by an ultrasonic pulse wave. 8 0 · —A device for separating a brittle material along a micro-crack cutting line on the brittle material, the device comprising at least a nozzle, and the nozzle is coupled to a pressurized gas supplier, and the nozzle is also coupled to a The electrical energy converter uses an ultrasonic pulse wave to energize a fluid vapor passing through the nozzle. 8 1. A method of forming a micro-crack in a brittle material, the method includes at least the following steps: heating the brittle material, that is, heating along a cutting path predetermined by a composite track energy pattern, wherein the composite The trajectory energy pattern is composed of at least one first and one second incident trajectory which are projected by the first and second incident energy beams. 82. The method according to item 81 of the scope of patent application, wherein the above-mentioned composite track is generally symmetrical to the predetermined cutting path. 8 3. The method according to item 81 of the scope of patent application, wherein at least one of the first and second incident energy beams includes a laser beam. 84 · The method described in item 81 of the scope of patent application, where at least page 47 above (please read the precautions on the back ^ 丨 install · bu 1 f fill in this page) Order · This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) 521020 A8 B8 C8 D8 6. There is no overlap between the first and second incident trajectories of one or more patent applications. 8 5 · The method according to item 81 of the scope of patent application, wherein any one of the above at least one of the first and second incident trajectories usually crosses any trajectory width in the form of a Gaussian energy distribution. 86. The method according to item 81 of the scope of patent application, wherein at least a part of at least one of the first and second incident trajectories overlaps at least to define an overlapping area. 8 7. The method as described in item 81 of the scope of the patent application, wherein a net energy distribution of the composite trajectory is formed by accumulating at least one of the individual energy distributions of the first and second incident trajectories, and The energy distributions of the first and second incident trajectories are accumulated in the overlapping area. 88. The method as described in item 87 of the scope of patent application, wherein a net energy distribution of the composite trajectory has a three-pattern configuration, and the peak at the center of the net energy distribution is usually aligned with the cutting line. 89. The method according to item 87 of the scope of patent application, wherein the net energy distribution has a head and shoulder configuration, the energy peak region is usually aligned with the cutting line, and a first and a second secondary The peaks are located on either side of the peak region. Page 48 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 g) (please read the precautions on the back / fill in this page first) Order: Line! Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 521020 A8 B8 C8 D8 VI. Application for a patent scope 90 · —A device to induce a brittle material to form a micro-crack, at least A supply source including more than one of the first and a second energy beam, and an optical target is arranged so that the more than one of the first and a second energy beam are bombarding the brittle material. 9 1 · The device as described in item 90 of the scope of the patent application, wherein at least one of the above-mentioned supply sources of the first and a second energy beam includes at least one of the first and a second energy beam source . 92. The device according to item 90 of the scope of patent application, wherein the at least one of the above first and second energy beam supply sources includes at least a single energy beam source to excite a single energy beam, the single energy beam Split into at least one or more of a first and a second separate energy beam. 93. The device as described in claim 90, wherein the optical target includes at least one V-shaped mirror. 94. The device according to item 93 of the scope of patent application, wherein the v-shaped mirror includes at least two independent mirror surfaces with changeable angles. 95. The device as described in claim 90, wherein the optical target includes at least one Mitsubishi mirror. Page 49 This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) ------ ^ -------- install --- (Please read the notes on the back first and fill in (This page) Order · -line 521020 A8 B8 C8 D8 6. Application for patent scope 9 6. The equipment described in item 90 of the patent application scope, further equipped with at least one of the first and second offsets The mirror makes the one or more first and second energy beams directly face to the optical target. 97. The device according to item 90 of the scope of patent application, wherein the above-mentioned optical target is equipped to advance the one or more first and second energy beams in a straight path in parallel. 98. The device according to item 90 of the scope of patent application, wherein the at least one of the above first and second energy beam supply sources includes at least one laser source. (Please read the note on the back first to write this page) Consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs Du printed garments Page 50 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)