TW515939B - Heat radiation module of notebook personal computer - Google Patents

Abstract

The present invention is a heat radiation module of notebook personal computer (PC) for reducing the surface temperature of the chip inside a notebook PC. The heat radiation module includes a fan, a first heat radiator, a second heat radiator, and a heat conducting structure. The fan is installed inside the notebook PC and includes a first air outlet and a second air outlet where the two air outlets are used for exhausting air sucked in by the fan. The first and the second heat radiators are installed at the first the second air outlets, respectively, and the bottom of the first heat radiator contacts with the chip for heat exchange. Coupled in parallel with both the first and the second heat radiators, the heat conducting structure is used for transferring heat from the first heat radiator to the second heat radiator.

Description

515939 V. Description of the invention (1) [Field of the invention] The present invention relates to a cooling module for a notebook computer, and in particular, to a cooling mode that uses a plurality of air outlets α to increase air volume and wind pressure to improve heat dissipation performance. Group 0 [Background of the Invention] With the development of electronics industry technology, the density of transistors of various types of chips (especially central processing units) has increased. Although the speed of data processing is getting faster, the power consumed and the The amount is also increasing. In order for the central processor to operate stably, the two-efficiency diffuser becomes a necessary requirement. In order to maintain the efficiency of the diffuser, the size and weight of the diffuser also have to follow. The bigger and heavier it is, the lack of limited space in the -irfL · Han meter of the laptop— It is always the biggest bottleneck in the design. The most common and effective method in the existing technology is to use a fan to drive air flow, so that it can exchange with the fins of the collection to take away the number of fins to achieve the purpose of cooling. At this time, the amount of fan air pressure Λ and the area of fin heat exchange determine the performance of the heat sink. The larger the fin exchange area, the better the effect of dispersion, but it is thinner and shorter than the notebook Λ. -irn. 6 is also contrary to the spirit. Therefore, how to raise J before increasing the volume of the diffuser as much as possible to effectively improve the performance of the diffuser 1 has become the direction of the efforts of many engineers. Please refer to Figure 1A, which is drawn The display is the & Π. Han Ji of the traditional notebook computer. As shown in the figure, the main board 1 00 is equipped with a central processing unit 101. Thermal module includes a fan 110 to 120 and a bulk skillfulness () of the fan 110 is disposed in the notebook computer for causing air flow:; Radiator

515939

V. Description of the invention (2) Places 1 to 20 are arranged in the wind of the fan 1 i 〇, the heart ... w 丨 ~, ... ~ The contact surface 121 is widely used to communicate with the Y central processor 2 factory 2 Flakes) contact and heat exchange. Among them, when the fan Γΐ 〇 疋 is transported, the air can enter the fan in the direction of the air flow 丨 into the fan 丨 丨 〇, and then leave the fan 11 from the air outlet in the direction 0; because the radiator 12 is arranged at the air outlet to 1 1 0 Therefore, when the fan i 〇 blows out the wind, the heat on the radiator feather 120 can be dissipated, so as to reduce the temperature of the radiator 120. σ Please refer to Figure 1B, which is a top view of Figure 丨 A. When the notebook computer is operating, the CPU 1101 generates high heat due to calculations. The heat generated is brought to the heat sink 1 2 0 by the contact end 121 made of a material with high thermal conductivity, and the heat sink 1 2 0 A plurality of parallel-arranged fins 130 ′ are provided to allow air flowing along the air outlet direction 0 from the air outlet to pass through, and heat is exchanged with the air through the fins 130 to dissipate the heat on the fins 13. The performance of the cooling module is mainly determined by the contact area of the fins 130 with the air and the air volume and pressure of the fan 110. Therefore, the cooling mode can be improved by increasing the air volume, wind pressure, and heat exchange area of the fins 130. Group effectiveness. Traditionally, two methods can be used to increase the number of readings: 130, or increase the clock length to increase the heat exchange area of the fins. However, increasing the number of fins 130 may cause the wind to be unsmooth, and then generate noise or wind cut sounds. Increasing the length of the fins 1 30 will increase the volume of the heat dissipation module, and increase the air and fins 1 The resistance of 30 friction causes the fan to increase in speed at 1 10 or cause boundary effects of heat dissipation, but it reduces the efficiency of heat dissipation. If you want to increase the air volume or wind pressure of the fan 1 10, you must increase the power and size of the fan 丨 1 〇, but this is not in line with the characteristics of notebook computers light, thin, short, small, because

515939 V. Description of the invention (3) There are many shortcomings to be overcome in the above methods. [Objective and Summary of the Invention] In view of this, the object of the present invention is to provide a cooling module for a notebook computer, which uses a fan outlet and a heat sink disposed at the air outlet D to increase the heat of the heat sink. Exchange the area and the fan's air volume and wind pressure to improve the cooling performance. The cooling module of this notebook computer is used to reduce the surface temperature of the chip in the notebook computer. The cooling module includes a fan, which is arranged in the notebook computer and includes a first air outlet and a second air outlet. An air outlet and a second air outlet are used to exhaust the air sucked by the fan; a first radiator is arranged at the first air outlet; the bottom of the first radiator is used to contact the chip and perform heat exchange; the second The heat sink is disposed at the second air outlet; and the heat conducting structure is coupled in parallel with the first heat sink and the second heat sink, and is used to transfer heat from the first heat sink to the second heat sink. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with reference to the accompanying drawings. [Explanation of the invention] A large part of the heat dissipation efficiency of the heat dissipation module depends on the thermal resistance value of the material. The thermal resistance value is similar to the concept of resistance value. The smaller the resistance value of the material, the higher the efficiency of transmitting electrical energy; Similarly, the smaller the thermal resistance of a material, the higher its efficiency in transferring thermal energy. Please refer to Figure 2, which shows a schematic diagram of heat conduction between two points. As can be seen from the figure, there are two points between point X and point Y.

515939 V. Description of the invention (4) Two kinds of parallel and different heat transfer materials 2 0 1, 2 0 2 whose thermal resistance values are 0 1 and 0 2 respectively. According to the way to calculate the resistance value of the parallel circuit, the thermal resistance value 0 between point X and point Y can also be obtained by similar calculation: Θ = Θ \ Θ2 / {Θ \ + Θ2) Thermal resistance between point X and point Υ The value of 0 must be less than the thermal resistance of 0, 1, and 2, as can be seen from the above description, the thermal resistance can be reduced by connecting additional heat transfer materials in parallel. [Embodiment 1] Next, please refer to FIG. 3, which shows a top view of a heat dissipation module according to Embodiment 1 of the present invention. As shown in the figure, the heat dissipation module includes a fan 3 1 0 and two heat sinks 3 2 1, 3 2 2, and the heat sinks 321 and 322 are connected by a heat pipe 3 4 0, and a heat pipe 340 is used as a heat sink. Thermal structure of heat dissipation module. The bottom surface of the heat sink 3 2 1 forms a contact surface (not shown) for contacting and performing heat exchange with the CPU 1 0 1 (or other types of chips); the fan 3 1 0 is arranged in the notebook computer, It is different from the traditional fan in that it has two air outlets. The radiators 3 2 1 and 3 2 2 are respectively disposed at the two air outlets of the fan 310 and are coupled to the heat pipe 340. The radiators 321 and 322 are provided with a plurality of fins 330 to allow air to pass therethrough, and the fins 330 exchange heat with the passing air to dissipate heat. When the notebook computer is operating, the central processing unit 101 generates high heat due to calculations, and the generated heat is transmitted to the radiator 321 and the heat conducting tube 340 made of a material with high thermal conductivity through the contact surface, and the heat conducting tube 340 transmits heat Go to the radiator 3 2 2 place. The air discharged along the wind direction A will pass through the radiator 3 2 1 and exchange heat with the air through the fins 3 3 0 to dissipate the heat of the fins 3 3 0; similarly, along the wind direction The exhaust air from B will pass

515939 V. Description of the invention (5) Pass the radiator 322 and exchange heat with the air through the fins 330 to dissipate the heat. It can be known from the above description that when the air flows through the radiator 3 2 1, it performs a heat exchange with the fins 3 3 0, and when the air flows through the radiator 3 2 2, it performs another heat exchange with the fins 3 3 0. Increase the heat dissipation efficiency by increasing the number of heat exchanges; due to the increase of the air outlet of the fan 310, the air volume, wind pressure and heat exchange area of the heat dissipation module also increase, so the thermal resistance of the heat dissipation module is also increased. The reduction greatly improves the heat dissipation performance of the heat dissipation module, and can more effectively use space and avoid noise and heat dissipation boundary effects than traditional methods. [Embodiment 2] Please refer to FIG. 4 for a plan view of a heat dissipation module provided according to Embodiment 2 of the present invention. As shown in the figure, the heat dissipation module includes a fan 4 10 and three heat sinks 4 2 1, 4 2 2, 4 2 3, and the heat sinks 421, 422, and 423 are connected by a heat pipe 440 to heat The duct 440 is used as a heat conducting structure of the heat dissipation module. The bottom surface of the radiator 4 2 1 forms a contact surface (not shown) for contacting and performing heat exchange with the CPU 1 0 1 (or other types of chips); the fan 4 1 0 is arranged in a notebook computer, It is different from the traditional fan in that it has three air outlets. The radiators 4 2 1, 4 2 2, and 4 2 3 are respectively arranged at the three air outlets of the fan 4 10 and are coupled to the heat pipe 440. The radiators 421, 422, and 423 are provided with a plurality of fins 430 to allow air to pass through, and the fins 43 0 exchange heat with the passing air to dissipate excess heat. When the notebook computer is operating, the central processing unit 101 generates high heat due to calculations, and the generated heat is brought to the radiator 421 and high thermal conductivity through the contact surface.

515939 It is stated that the transmission to the h is the heat transfer of the tube and it is blown out to the side. 44 is along the tube. The heat guide is 23 to 4 of the 2 system. The quality of the heat dissipation of the 42-quality equipment will be bf and G. Will be 3, I 4 pass the piece of air to the square wind out of it% 3 eight mouths 4, and /, the fins of the sample borrow the same; and go 1 scattered 2, the calorimeter heat will exchange heat The air and air are dissipated through the through-fin fins, and the C and the air are dissipated into the passing air through the inflow and outflow of air. Leave it empty, the amount of dispersal can be said to be bright, in exchange for the exchange of heat from the fins to the meeting, the heat exchanges the two heats and the other one for the 0 rate of effective heat 43 (scattered fins and wind When the number of times of the incoming module is 23, the 4 exchanges will be 2 times, and the 42 heat adder will increase the heat and increase the temperature. The thermal efficiency of the module can be reduced. The scattered and scattered sounds are caused by the sound of the group noise. The module avoids heating and avoids the increase and dispersion. In addition, it also increases the empty product with the rise. The ability to suppress the wind and the wind due to the amount of wind is also more control of the wind value transmission than the group heat and group heat dissipation of the EEG type of writing of the pen to reveal the examples and implementation of the results described in the first. The effect should be effective. The increase and increase of the wind pressure can be set to D: the wind point is superior and the increase is increased. 1 has a high surface area heat efficiency. The heat dissipation is high. The scattered low and multiple drops are set by the time limit. The degree of density and efficiency of the brain heat fins can be dissipated or ascended. Provide long pen note sheet with oct-mentioned fin effect preceded the increase in volume of the body has more phases by adding 5 4 too do not amount present in a relatively Ming

515939 V. Description of the invention (7) Boundary effects that are not easy to generate noise and heat dissipation. In summary, although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes without departing from the spirit and scope of the present invention. And retouching, therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

Page 10 515939 Schematic description [Simplified illustration of the diagram] Figure 1A shows the design of the cooling module in a traditional notebook computer. Figure 1B is a top view of Figure 1A. Figure 2 shows the heat transfer between two points. FIG. 3 is a top view of a heat dissipation module according to the first embodiment of the present invention. FIG. 4 is a top view of the heat dissipation module provided according to the second embodiment of the present invention. [The figure is not labelled.] 100 motherboard 101 central processor 110 fan 120 diffuser 121 contact surface 130 fin 2 0 1, 2 0 2: heat transfer material 3 1 0: fan 321, 32 2: heat sink 3 3 0: fin 34 0: heat pipe 4 1 0 · fan 421, 422, 423: heat sink 43 0: fin 44 0: heat pipe

515939 Schematic description I: Wind direction 〇: Wind direction A, B, C: Wind direction Drawing Hi Page 12

Claims (1)

515939 VI. Application for Patent Scope 1. A cooling module for a notebook computer for reducing the surface temperature of a chip in the notebook computer. The cooling module includes: a fan configured in the notebook computer and including a A first air outlet and a second air outlet, the first air outlet and the second air outlet are used to exhaust the air sucked in by the fan; a first radiator is arranged at the first air outlet, and the first air outlet A bottom of a heat sink is used to contact the chip and perform heat exchange; a second heat sink is disposed at the second air outlet; and a heat conducting structure is connected in parallel with the first heat sink and the second heat sink The coupling is used to transfer heat from the first radiator to the second radiator. 2 · The heat dissipation module according to item 1 of the scope of patent application, wherein the heat conducting structure is made of a material with high thermal conductivity. 3. The heat dissipation module according to item 1 of the scope of patent application, wherein the heat conducting structure is a heat pipe (h e a t p i p e). 4. The heat dissipation module according to item 1 of the scope of patent application, wherein the heat sinks are configured with a plurality of fins (f i η). 5. The heat dissipation module according to item 1 of the patent application scope, wherein the chip is a central processing unit (CPU). 6. —A cooling module for reducing the surface temperature of a chip in a computer. The cooling module includes: a fan arranged in the computer and including a first air outlet and a second air outlet. An air outlet and the second air outlet are used to blow out the air sucked in by the fan; Page 13 515939 Heat Dissipation-The Fifth Place Breathing Out-The First Place In The Dispenser's Heat Dispersion Surroundings Is The First One, Please Apply Sixthly And Exchange The Hot Air Out In The Second Place And Touch The Placement To Connect With The Chips The two parts of the first and the first with the heat dissipation system are connected to the heat exchanger and the second heat exchanger is the second one. The first and the second pass are passed to the heat exchanger. The thermal structure will be followed by a thermal guide system to guide the heat dissipation of its module. The 6th Fan Li special application, please apply for the material, the high perimeter Fan Li special application, please apply for the application. Structure 8 · The description of the heat dissipation of the material forming mold is described in the item 6 of the group of the mold heat dissipation. Fan Guanli's special guide asks for a system such as the structure 9 of the junction heat, which should guide some of the crystals. In the description of the heat dissipation of the group molds, the first 6 fins of the surrounding 々 巳 number of M Μ. The complex device has a rationale and is located at the place of the central device. In the central device, the thermal model of the 11 thermal system is described in Section 6. The range 0. Page 14