514975 五、發明說明（1) 本發明係有關於一種晶片沾銅（銀）之製程，尤其是 指一種可以免除為數可觀之膠帶且利用磁力板直接吸附晶 片而達到大幅減少製造程序的晶片沾銅（銀）創新製程首 先發明應用者。 如第二圖所示，為一般所見之晶片沾銅（銀）之製造 流程圖，首先 1 ·貼附膠帶：於滿布孔洞（2 1 )的沾具板（2 )上貼附 膠帶（2 2 ); 2 _振動入料：將貼附有膠帶（2 2 )的沾具板（2 2 )翻 轉1 8 0度，使膠帶（2 2 )朝下並封住孔 洞（2 1 )供晶片（3 )利用振動——進入 每一孔洞2 1中； 3 ·晶片壓合：晶片（3 )連同沾具板（2 )，送至壓合平 台（4)上，由氣缸（5)帶動之壓板（5 1 )往下壓，使晶片（3 )與膠帶之結合而 確實被黏固； 4 ·晶片沾漿：再將沾具板（2 )連同晶片（3 )翻轉1 8 0度後，利用真空吸附平台（6 )將F R P 製成之沾具板（2)，及朝下的晶片（3) 吸附至沾漿平台（6 1 )上沾附銅（銀）膏 (62)； 5.輸送乾燥：真空吸附平台（6 )將已沾漿完成的晶片（ 3 )及沾具板（1 )吸附至輸送平台（6 3 )上送入乾燥爐（6 4 )中完成乾燥。514975 V. Description of the invention (1) The present invention relates to a process of attaching copper (silver) to a wafer, in particular, a wafer that is free from a considerable amount of tape and uses a magnetic plate to directly adsorb the wafer to significantly reduce the manufacturing process. (Silver) Innovative processes first invent users. As shown in the second figure, it is a general manufacturing flow chart of wafers coated with copper (silver). First, attach the tape: attach the tape (2) to the board (2) full of holes (2 1). 2); 2 _Vibration feeding: Turn the dipstick board (2 2) attached with the tape (2 2) 180 degrees, so that the tape (2 2) faces down and seals the hole (2 1) for the wafer (3) Use vibration to enter each hole 21; 3 · Wafer pressing: The wafer (3) is sent to the pressing platform (4) together with the dipstick plate (2), which is driven by the air cylinder (5). The pressure plate (5 1) is pressed down so that the wafer (3) and the adhesive tape are bonded together. 4 · Wafer dipping: After the wafer (2) and the wafer (3) are turned over 180 degrees, Use the vacuum adsorption platform (6) to adsorb the dipstick plate (2) made of FRP and the downward facing wafer (3) to the dipstick platform (6 1) and attach the copper (silver) paste (62); 5. Conveying and drying: The vacuum adsorption platform (6) adsorbs the wafer (3) and the squeegee plate (1) that have been pasted to the conveying platform (6 3) and sends them to the drying furnace (6 4) to complete the drying.
514975 五、發明說明（2) 由上述之製程可知，該製程在實際實施上有許多的缺 · 點存在，如： 1. 須貼附膠帶才能完成晶之搬運，在每個月的運轉操作中 ，會損耗為權祖當可觀的膠帶，該損耗的膠帶費用成本 驚人。 2. 利用膠帶沾黏晶片，整個製程中至少必須作二次的1 8 0度翻轉，會增加時間的耗費及製程的延遲。 緣是，發明人有鑑於此，秉持多年該行業的豐富專業 設計及開發製作的經驗，乃針對習用之製程的缺失予以改 良，提供一種創新的晶片沾銅（銀）之製程，以期完全改 ® 善習用之在有缺失者。 本發明之主要目的係在於提供一種晶片沾銅（銀）之 製程，係藉由真空吸附平台底面所設之磁力板可以免除膠 * 帶之使用，且可同步吸附晶片及沾具板作搬移本進行各加 工製程，可以在每個月的平時運轉操作中省巨額的膠帶費 用，對於成本之有效降低相當明且毋庸置疑。 本發明之另一目的係在於提供一種晶片沾銅（銀）之 製程，磁力板的設置，使該沾具板不需再作任何的1 8 0 度翻轉，而是直接平移即可，即可簡化沾銅（銀）機之旋 轉機構外，更可以藉此大幅縮小每一道製程之時間，如此 長年曰積月累，對於製程之效率提昇有相當明確的幫助。 本發明之再一目的係在於提供一種晶片沾銅（銀）之 製程，係藉由磁力板可以吸附晶片作搬運外，亦可直接塗 抹銅（銀）膏作為晶片之沾漿操作，並藉此形成沾漿端朝514975 V. Description of the invention (2) According to the above process, there are many shortcomings in the actual implementation of the process, such as: 1. Adhesive tape must be attached to complete the handling of the crystals. During the monthly operation, It will consume a considerable amount of adhesive tape, and the cost of the lost adhesive tape is amazing. 2. Stick the wafer with tape. The whole process must be turned at least 180 degrees twice, which will increase the time and delay of the process. The reason is that the inventor has taken this into account and has many years of rich professional design and development experience in the industry. He has improved the lack of conventional processes and provided an innovative wafer-copper (silver) process with a view to completely changing Good practice is used in those who lack it. The main purpose of the present invention is to provide a process for dipping copper (silver) on a wafer. The magnetic plate provided on the bottom surface of the vacuum adsorption platform can eliminate the use of adhesive tapes, and can simultaneously adsorb the wafer and the dipping plate as a moving plate. By carrying out various processing processes, it can save a huge amount of tape costs during the normal operation of each month, and it is quite clear and effective that the cost can be effectively reduced. Another object of the present invention is to provide a process for dipping copper (silver) on a wafer and the setting of a magnetic plate so that the dipping plate does not need to be turned any more 180 degrees, but can be directly translated. In addition to simplifying the rotating mechanism of the copper (silver) machine, it can also greatly reduce the time of each process. Such a long accumulation of years has a clear help for improving the efficiency of the process. Another object of the present invention is to provide a process for dipping copper (silver) on a wafer. The magnetic plate can be used to adsorb the wafer for transportation, and a copper (silver) paste can be directly applied as a wafer dipping operation. Form a slurry end
第5頁 514975 五、發明說明（3) 上送入乾燥爐 輸送平台碰觸 為使本發 功效易於明白 首先，請 一、振動入料 晶片沾聚 中作乾 的特殊 明使用 了解， 參閱第 :將於 利用 使之 :將真 燥，不需要再使用必須防止沾漿端與 輸送帶。 之技術 銅（ 壓合 台（ 板（ 吸附 (銀 三、輸送乾燥：完成6 ) )及 )上 製程之 列優點 相較， 激烈的 藉由上述 用相較具有下 1.與習用製程 迅速且競爭 兹配合 一圖所 壓合平 孔洞（ 達到振 空吸附 ，並在 銀）膏 平台（ 6 )及 2 )及 的同時 )膏（ 上述步 的位移 沾具板 進入乾 改善， ，如： 至少減 現代工 手段、發 圖式及圖 示，本發 台（4 ) 2 1 )使 動入料的 平台（6 該磁力板 (62) 4 )，以 磁力板（ 晶片（3 ，使晶片 6 2); 驟時時， 將已完成 (2 )搬 燥爐（6 可以很明 少二個以 業而言， 明特徵 號詳細 明之製 上的沾 晶片 （ 目的； )底部 (1 ) 且隨之 達到利 1 )作 )之目(3 ) ，達成目的及 說明如下： 程如下： 具板（2 )， 3 )配合振動 設一磁力板（ 下塗抹所需的 同時下壓配合 用真空吸附平 同步吸附沾具 的，並在同步 頂端沾附銅 藉由真空吸附平台（ 沾漿製程的晶片（3 運到輸送平台（6 3 4 )中作乾燥； 確的發現本發明與習 上之步驟，對於產量 可以有效提高產能及Page 5 514975 V. Description of the invention (3) Conveying on the conveying platform of the drying furnace to make the effect of the hair easy to understand First of all, please understand the special use of the dry wafer in the vibration of the feed material, see page: Will be used to make it: it will be really dry, do not need to use again, must prevent the slurry end and the conveyor belt. Compared with the advantages of the process on the technical copper (compression table (plate (adsorption (silver III, conveying and drying: complete 6)))), the fierce use of the above-mentioned comparison has the following 1. It is fast and competitive with the conventional process It is hereby combined with the flat holes (achieved vibratory adsorption, and the silver) paste platform (6) and 2) and (a) the paste (displacement of the above step to improve the dryness of the paste), such as: Working methods, development diagrams and illustrations, the hair table (4) 2 1) the platform (6 the magnetic plate (62) 4) to move the material, to the magnetic plate (wafer (3, the wafer 6 2); At the moment, the completed (2) moving oven (6 can be very clear, there are at least two in terms of industry, the number of the dip wafer on the system (purpose;) bottom (1), and then the profit 1 The purpose and description of (3) are as follows: The process is as follows: The plate (2), 3) A magnetic plate is provided in conjunction with the vibration (the pressure required for the lower application and the vacuum absorption level is used for simultaneous synchronous adsorption of the detacher). And attach copper on the top of the synchronization by vacuum adsorption platform ( Wafer (3 transported to the delivery platform (634) for the drying; correct step of the study found that the present invention with respect to yield and can effectively increase capacity
第6頁 514975 五、發明說明（4) 工作效率之積極目的。 2. 整個製程免除煩瑣之膠帶黏附及撕離，更可以免除每個 月驚人的膠帶損耗費用，其節省之運轉操作成本相當可 觀驚人。 3. 免除膠帶後，就無需再設複雜之翻轉機構及氣缸壓合機 構，對於沾銅（銀）機之結構簡化及成本降低亦有實質 的幫助。 4. 無需膠帶無需再作二次的1 8 0度翻轉，對於每一製程 間的時間可以大幅縮小。 5. 藉由磁力板之吸附，無論晶片大小均可順利達成完整的 吸附，不會有吸附不完全而掉落的缺失。 6. 除利用磁力板直接塗抹銅（銀）膏作上部沾漿外，亦可 於振動的壓合平台直接形成塗抹銅（銀）膏的下部沾漿 之沾漿平台，兩者均可視需要作實施。 綜上所述，本發明實施例確能達到所預期之使用功效 ，又其所揭露之具體構造，不僅未曾見諸於同類產品中， 亦未曾公開於申請前，誠已完全符合專利法之規定與要求 ，爰依法提出發明專利之申請，懇請惠予審查，並賜准專 利，則實感德便。Page 6 514975 V. Description of the invention (4) Positive purpose of working efficiency. 2. The entire process eliminates the cumbersome sticking and tearing of the tape, and it can also avoid the amazing tape wear and tear costs every month, and the savings in operating costs are considerable. 3. After the tape is removed, there is no need to set up a complicated turning mechanism and a cylinder pressing mechanism, which will actually help the simplification of the structure and cost reduction of the copper (silver) machine. 4. No need for tape, no need to make 180 ° flip twice, the time between each process can be greatly reduced. 5. With the magnetic plate adsorption, complete adsorption can be achieved smoothly regardless of the size of the wafer, and there will be no missing due to incomplete adsorption. 6. In addition to using a magnetic plate to directly apply copper (silver) paste for the upper dipping paste, a vibrating pressing platform can also be used to directly form a lower dipping paste dipping platform for applying copper (silver) paste. Both can be used as required. Implementation. In summary, the embodiments of the present invention can indeed achieve the expected use effect, and the specific structure disclosed is not only not found in similar products, nor disclosed before the application, and has fully complied with the provisions of the Patent Law In accordance with the law, the application for an invention patent was submitted in accordance with the law, and we are kindly requested to review it and grant the patent.
514975 圖式簡單說明 爹照圖式·β 第一圖：本發明之實施製程 第二圖：習用之製程實施示 參照圖號： (1 ) 磁力板(21) 孔洞 (3 ) 晶片 (5 ) 氣缸 (6 ) 真空吸附平台 (62) 銅（銀）膏 (64) 乾燥爐 不意 意圖 圖 2 ) 2 2 4) 5 1 6 1 6 3 沾具板 膠帶 壓合平台 壓板 沾漿平台 輸送平台514975 Schematic description of the schematic diagram. Β Picture 1: The implementation process of the present invention. Picture 2: The implementation process of the conventional process. Refer to the drawing number: (1) Magnetic plate (21) Hole (3) Chip (5) Cylinder (6) Vacuum adsorption platform (62) Copper (silver) paste (64) The drying furnace is not intended Figure 2) 2 2 4) 5 1 6 1 6 3
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