5U291 八7 B7 經 濟 部 慧 財 局 消 費 合 作 社 印 製 張尺度適用中國國家標準（CNS)A4規珞(210 X 297 五、發明說明（ 發明所屬技術韻域 本發明為關於一種將電鍍浴槽設為移動自如，並將 具有複數組合之金屬材料的電鍍膜形成為單層或至少2層 以上之電鍍裝置。 曰 習知技術 一禋將網（L.U)單體、銅（Cu)合金或鐵_鎳（^_沁）合金 之導電構件的表面以錫(Sn)單體或錫(Sn)合金之電鍍層被 覆的導線(iead)材’係具有Cu單體或Cu合金所具備的優 良導電性和機械強度。而且’此導線材係為同時具有^ 早體取Sn合金所具備的耐蝕性和良好之 導體。_’多半被運用在各種料、連㈣、導線等月; 氣/電子器具或電縵方面。 ,,將半I體晶片裝載於電路基板時，藉ώ在半導體晶 乃之外導線（outer lead)部磚以使用錫（Sn)合金之熱浸鍍 (hot galvanizatlon)或電鍍，以提高該外導線部之焊接性。 此種錫合金之代表例為銲錫（Sn_pb合金），其焊接性、 耐蝕性皆良好，因而廣泛被利用於連接器或導線架等電氣 /電子工業用零件之工業用電鍍。 第3圖係第2圖所示之半導體引線框架之冬A剖面 之導線材的基本構成之剖視圖。例如，導電構件21係以 將則及網做為主成份之銅乐合金或是將鐵_鎳（Fe_Ni)做為 主成份I鐵-鎳系合金阳構成者。於這些導電構件2丨之表 面抱加有不同金屬材料的2層電鍍膜。例如，以錫（Sn)為 第1電鍍膜22，而錫-鉍（Sn-h)為第2電鍍膜23的順序 312341 -------------^--------^---------線 (請先閱讀背面之注意事項再填寫本頁) — 經濟部智慧財產局員工消費合作社印製 511291 Α7 Β7 五、發明說明（2 ) 形成之。在此，將第1電鍍膜22之厚度設為t i，而將第 2電鍍膜之厚度設為t2時，設q約為3至1 5微米（# m)、 t2約為1至5 // m、而1;2/%約為0.1至0.5的話，在成本、 焊接性和财熱性方面，甚而銲錫之接合強度或是與#g線等 之溶接部的熔接強度有良好的特性，因而適於提高導線材 之性能。 第4圖係自動電鍍裝置整體之配置。首先，於鹼電 解洗淨浴槽3 1將妨害導電構件2 1表面之銲錫電鍍皮膜之 密著性（Adhesion)或焊接性之油脂等有機性的污染物質除 去。接著，於水洗用浴槽3 2内洗淨後，於化學浸ϋ浴槽 33進行化學浸蝕處理（基本上係利用氧化-還原反應之處 理），將由於晶界或夾雜物的存在而形成不均一表面之導 電構件2 1的表面均一化。 繼之，於水洗兩浴槽34内洗淨後，於氧活性化浴槽 3 5除去在水洗用浴槽3 4所附著之氧化膜。然後，於水洗 用浴槽36内洗淨後，於銲錫電鍍裝置37進行電鍍。銲錫 電鍍液係屬強酸性，因此電鍍後之表面呈酸性。此表面經 過一些時間後皮膜會變色，焊接性會惡化。所以，於水洗 用浴槽3 8和中和處理浴槽3 9内中和殘留於電鍍表面的酸 並去除吸附到的有機物。之後，在水洗用浴槽4 0和熱水 洗用浴槽4 1洗淨，於乾燥裝置42内使經過電鍍之導電構 件乾燥。 第5圖係第4圖所示之整體電鍍裝置中，化學浸餘 浴槽3 3之Β - Β方向的剖視圖。 本纸張尺度適用中國國家標準（CNS)A4規格口 10 X 297公蓳） 312341 (請先閱讀背面之注意事項再填寫本頁) r裝 丨訂---------線-5U291 8 7 B7 Printed by the Consumer Finance Cooperative of the Ministry of Economic Affairs, Bureau of Finance and Economics Co., Ltd. Applicable to Chinese National Standard (CNS) A4 Regulations (210 X 297) V. Description of the invention (Technical domain to which the invention belongs The invention relates to a method for setting a plating bath to mobile Freely, and forming a plating film having a plurality of combinations of metal materials into a single layer or at least two or more layers. The conventional technology is to use a single network (LU), copper (Cu) alloy or iron_nickel ( ^ _ 沁) The surface of the conductive member of the alloy is covered with tin (Sn) monomer or tin (Sn) alloy plating layer (iead) material has the excellent conductivity and mechanical properties of Cu monomer or Cu alloy Strength. And 'This wire is a conductor that has both the corrosion resistance and good resistance of the early alloy Sn alloy. _' Mostly used in various materials, flail, wire, etc .; gas / electronic appliances or electrical appliances In the aspect, when a semi-I wafer is mounted on a circuit substrate, the outer lead portion of the semiconductor wafer is borrowed to use hot galvanizatlon or electroplating of tin (Sn) alloy to improve The solderability of the outer lead portion. A representative example of this type of tin alloy is solder (Sn_pb alloy), which has good solderability and corrosion resistance, and is therefore widely used in industrial electroplating of electrical / electronic industry parts such as connectors or lead frames. Figure 3 is the second A cross-sectional view of the basic structure of the lead wire of the winter lead A section of the semiconductor lead frame shown in the figure. For example, the conductive member 21 is a copper-le alloy with a rule and a net as a main component or iron_nickel (Fe_Ni) as a main component. The main component I is an iron-nickel alloy anode. Two conductive coatings of different metal materials are clad on the surface of these conductive members 2. For example, tin (Sn) is used as the first plating film 22, and tin-bismuth (Sn-h) is the order of the second plating film 23 312341 ------------- ^ -------- ^ --------- line (please first Read the notes on the back and fill in this page) — Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 511291 Α7 Β7 5. The invention description (2) is formed. Here, the thickness of the first plating film 22 is set to ti, and When the thickness of the second plating film is set to t2, set q to be about 3 to 15 microns (# m), t2 to be about 1 to 5 // m, and 1; 2% to about 0.1 to 0.5. cost, In terms of solderability and thermal properties, even the bonding strength of solder or the welding strength of the welded part with #g wire etc. has good characteristics, so it is suitable for improving the performance of the wire. Figure 4 shows the overall configuration of the automatic plating device. First, in the alkaline electrolytic cleaning bath 3 1, organic pollutants such as the adhesion of the solder plating film on the surface of the conductive member 21 1 or the solderable grease are removed. Next, in the bath 3 2 for water washing, After washing, a chemical etching treatment is performed in the chemical immersion bath 33 (basically a treatment using an oxidation-reduction reaction) to uniformize the surface of the conductive member 21 that forms a non-uniform surface due to the presence of grain boundaries or inclusions. . Then, after washing in the two water washing baths 34, the oxide film attached to the water washing baths 34 and 4 was removed in the oxygen activation baths 35. Then, after washing in the water washing bath 36, plating is performed in a solder plating apparatus 37. The solder plating solution is strongly acidic, so the surface after plating is acidic. After a period of time has passed on this surface, the film will discolor and the weldability will deteriorate. Therefore, in the water washing bath 38 and the neutralization treatment bath 39, the acid remaining on the plating surface is neutralized and the adsorbed organic matter is removed. After that, they are washed in a bath 40 for water washing and a bath 41 for hot water washing, and the electroplated conductive member is dried in a drying device 42. Fig. 5 is a cross-sectional view taken along the B-B direction of the chemical leaching bath 33 in the whole electroplating apparatus shown in Fig. 4. This paper size is applicable to China National Standard (CNS) A4 size port 10 X 297 mm. 312341 (Please read the precautions on the back before filling this page)
經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明（3 ) 此化學浸姓洛槽3 3 此電鍍裝置之構造。於該電二=上：述。在此’說明 和搬送執332均可向上及向下:動：:::二進機33 i 之範圍的上限及下限位置，且 ^ ^決疋可移動 333係因應作業目的以適 ‘助作。掛鉤 ^ - 、間I网掛在搬迗執3 3 2上。通 …㈣之浴槽的中心之間的距離 、 之導電構件2i的電鍍輔助 卢掛有接受·电錢 而裝配於該電鍍裝置。接荖/ 掛鉤333上 ……接者’敘述橫向移動式推進機331。 …” — 1的距離’基本上係與相鄰之％ 槽之間的距離幾乎相等。而 1 σ 七,tk 寻吨此價冋移動式推進機331設置 有一支機械臂，在往作業方向 又1 、士 口肘掛詞力）向前移動一跨度 (啊脚’就隨即回到原點。而且此推進機331係設定在 ，限位直往前移動—跨度，而在下限位置回到原點。又， 搬达飢332係往上下方向運轉而不往行進方向運轉。藉以 此作業的反覆運作使此電鍍裝置發揮功能。 曰Printed by the Consumer Affairs Agency of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (3) The chemical impregnated Luo tank 3 3 The structure of this electroplating device. In the electric second = above: described. Here, both the description and the transfer holder 332 can be moved upwards and downwards: Move :::: The upper and lower limit positions of the range of the second machine 33 i, and ^ ^ must be moved 333 is appropriate for the purpose of the operation . Hooks ^-, and I nets are hung on the moving handle 3 3 2. It is connected to the distance between the centers of the baths, and the electroplating aid of the conductive member 2i is attached to the electroplating device. On the coupling / hook 333 ... The receiver 'describes the horizontally movable propeller 331. … ”— The distance of 1 is basically the same as the distance between the adjacent% slots. The price of 1 σ 7, tk is the same as the price. The mobile propulsion machine 331 is equipped with a mechanical arm. 1, Shikou elbow hanging words force) move forward a span (ah feet 'then return to the original point. And this thruster 331 is set at the limit position to move forward-span, and return to the original point at the lower limit position In addition, the Reach 332 is operated in the up and down direction without moving in the direction of travel. The repeated operation of this operation makes this electroplating device function.
上述之電鐘裝置具有一條電鍍前處理線以及一條録 锡電鍍線。例如，有於導電構件21形成作為第i電錢膜 22之錫電鍍膜、作為第2電鍍獏23之錫^(Sn_Bi)i鍍 膜的情形，和於導電構件21形成作為第1電鍍膜22之^ 宅鍍膜、作為第2電鍍膜2)之錫-銀⑼卜八幻電鍍獏的情 形。此時，第i電鍍膜22可雙方皆使用錫電鍍液，但是 第2電鍍膜23使用之電鍍液卻不同。因此，於導電構= z1形成完前者之電鍍膜後，先使電鍍裝置停止，於更換 <後者所用之電鍍液和浴槽内之電鍍液後才於導電構件U 尺度適用中國國家標準（CNS)規格（210 X i --------- -------------^--------^---------線 (請先閱讀背面之注意事項再填寫本頁) 511291 A7 11 B7 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明（4 ) 形成電鍍膜。 發明欲解決 如上述’此銲錫電鍍裝置具有-條電鍍前處理線及 -條銲錫電鑛作業線。因此，於導電構件2ι _具有複 數組合之電鍍暝時，會產生要更換電鍍膜之組合時卻益法 連續進行作業的問題。換言之，此電^置係於㈣Μ 電鍍液將可電錢之導電構件21 Μ浸潰，才可連續地形 成具有相同電錢膜組合之電鍍旗。然而，並無法按照接受 電鍍之導電構件21之使用用途，而在導電構件21上連續 地形成具有後數組合之電鍍膜。也就是說，鲜錫電錢作業 線在更換電鍍液上有花費多餘的時間與功夫的問題。 更進^步言之，於管理銲錫電鍍作業線方面也耗費 很多的勞力。例如，有在使用i個電鍵浴槽内之電鐘液之 後’使用不同電鍍液構成之其他電鍵液的情形。此時，若 不確實去除前者之電鍍液的話，後者之電鍍液之液體構成 會發生變4b X ’所使用之電鍍液構成不同的話，在電铲 洛槽使用的陽極也不同，必須更換不可。也就是說，在電又 渡漱官理或電鍍浴槽管理等維護方面有耗費很大勞力的問 題。 課題欲解決之手段 為達成上述之目的’本發明係於電鍍作業線設置滑動機構，藉此可用—條搬送轨於導電構… : 具有複數組合之單層或是兩層以上之電鐘膜。 發明之實％_形態 、 $7氏張尺度過用t國國準 312341 (請先閱讀背面之注意事項再填寫本頁) —訂i tv n It ϋ n n I ^ // . A7 A7 經濟部智慧·財產局員工消費合作社印製 _______B7__ 五、發明說明（5 ) ^ 第1圖係為具有用以實施本發明之電鍍裝置的滑動 有=第1列具有二個第丨電鍍浴槽，而於第2列具 於2電鐘浴槽之鋒锡電錢作業線的配置。又係相當 Q所示整體之電鍍裝置的銲錫電錢裝置37。 浴样二第1圖，此電鍍裝置具有預浸浴槽371、第1電鍍 和⑺、第2電錢浴槽374、375和376、水洗用 /7。又於每一個電鍍浴槽設置溢流槽378、379、380、 382。這些浴槽的功能係將不溶性之不純物等利用電 之。價内的水流帶入浴槽内。然後，過濾帶往這些浴槽内 1電錢液，再將過濾好的電鍍液送往電鍍浴槽372、373、 374 ' 375 、 376 内。 ^ 本發明之特徵係可於銲錫電鍍作業線以一條搬送執 兒鍍之導電構件2 i上將具有複數組合之電鍍膜按照 使用用途予以連續形成者。 、具體言之，此銲錫電鍍作業線之結構與第5圖相同。 例如，味 ’弟1圖之銲錫電鍍作業線係於電鍍浴槽373加入錫 Ί液’於電鍍浴槽375内加入錫-銀（Sn-Ag)電鍍液，而 ;電鍍 >谷槽376内加入踢-叙（Sn-Bi)電鍍液，而電鍍浴槽 ’2、374則為空的。這些電鍍浴槽按照接受電鍍之導電 構件21的使用用途，選擇必要之電鍍浴槽後往搬送執的 下方移動，而於導電構件21形成電鍍膜。結果，會於導 電構件21上形成錫之單層電鍍膜，抑或形成第1層為錫、 第2層為Sn-Ag或Sn-Bi之電鍍膜等。此外，導線材之構 造I叫弟j圖’故符號相通。 本紙張<度適用中國國家標準（CNS)A4規烙（LMO X 297公餐） 312341 -------------^-----------------^ (請先閱讀背面之注意事項再填寫本頁) A7 A7 經 濟 部 智 慧 財 產 局 消 費 合 社 印 製 鍍 之 處 去 下 槽 發明說明（ 第1，敘述於逡Φ…” 膜22之例子。4 ·稱午21形成僅有錫之單層第1電 第1電鍍浴槽3f3t’如上所述，選擇加有錫之電鍵液 理缘和空的電鍍浴槽374。於上述電鍍前 理線所處理之導雷 μ 义毛簌則 除表面之氫氧化瞎“ ―邊在預浸浴槽371進行 方移動。然Π二間第1電錢浴槽373往搬送執的 374 、形风錫之電鍍瞑的當中，第2電鍍浴 3/4彺搬送執的下方銘叙…、 件η雖移動至第）I動1成有“電鍍膜之導電構 未加有電铲浚…鍍浴槽374，但是此電鍍浴槽内因 电嫂液阳热法形成電鍍膜。繼之 =過電鍍之導電構件21後 二= 僅有錫之單層電鍍瞑。 稱件」形風 第1圖之電鍍裝詈φ，协室、、^ 構呈有*的”置令於弟2列之電鍍浴槽移動機 '、工电鍍浴槽，因而如上所述，可於導電； 二成，單層之電鎪膜。然而也有如下的情 移動機構不將電鍍洛槽配置於搬送執下方的 ^ ^ <擇使用艰洗用浴槽的情形。前 、月/，电鍍欣不存在於搬送執下方，導電構件21 不會：成電鍍膜。後者的情形，僅藉由純水洗淨經過電鍍 之導电構件21的表面，電鍍膜不會形成。 第2，敘述於導電構件21形成兩層之第i電鍍獏κ =第2電鍍膜23的例子。於導電構件21形成電錢膜一的 過程係和上述内容相同。然而，此次係選擇第2電鍍浴槽 或376，而於導電構件21形成Sn_Ag或Sn_Bi之第2 電鍍膜23。此結果，導電構件21會形成％和s^Ag或 31234 (請先閱讀背面之注意事項再填寫本頁) 裝 訂--------線4 本紙張&度適用中國國家標準（CNS)/V丨規烙（210 X 297公望） 經濟部智慧·財產局員工消費合作社印製 A7 B7 五、發明說明（7 )The above-mentioned electric clock device has a pre-plating line and a tin-plating line. For example, there is a case where a tin plated film as the i-th electric film 22 and a tin (Sn_Bi) i plated film as the second plated 貘 23 are formed on the conductive member 21, and a first plated film 22 is formed on the conductive member 21 ^ The case of tin plating and silver plating as the second plating film 2). At this time, the tin plating solution may be used for both the i-th plating film 22, but the plating solution used for the second plating film 23 is different. Therefore, after the former electroplating film has been formed in the conductive structure = z1, the electroplating device is stopped first, and the U & D dimensions of the conductive member are subject to the Chinese National Standard (CNS) after replacing the plating solution used in the latter and the plating solution in the bath. Specifications (210 X i --------- ------------- ^ -------- ^ --------- line (please first Read the notes on the back and fill in this page) 511291 A7 11 B7 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (4) Forming a plating film. The invention wants to solve the above-mentioned 'This solder plating device has-before plating Processing line and-one solder electric ore operation line. Therefore, when the conductive member 2m _ has a plurality of combinations of electroplating 暝, there will be a problem of continuous operation when the combination of electroplating film is to be replaced. In other words, this electrical installation The electroplating flag 21M can be continuously formed by the immersion of the electroconductive member 21M in the ㈣ electroplating solution. However, it cannot be used to conduct electricity according to the use of the electroconductive member 21 which is electroplated. A plating film having the following combination is continuously formed on the member 21. Also, That is to say, the fresh tin electric money operation line has the problem of taking extra time and effort to replace the plating solution. Furthermore, it is also more labor-intensive to manage the solder plating operation line. For example, there is a use of i In the case of the electric key liquid in each electric key bath, 'the case of using another electric key liquid composed of a different electroplating solution. At this time, if the former electroplating solution is not removed, the liquid composition of the latter electroplating solution will change 4b X' used If the composition of the electroplating solution is different, the anode used in the shovel slot is also different and must be replaced. In other words, there is a problem that it takes a lot of labor to maintain the power supply and the management of the electroplating bath. Means of Solution In order to achieve the above-mentioned object, the present invention is provided with a sliding mechanism on a plating line, thereby being able to use one transport rail to a conductive structure ...: a single layer with a plurality of combinations or two or more layers of an electric clock film. Real% _ pattern, $ 7's Zhang scale used t country national standard 312341 (Please read the precautions on the back before filling this page) — order i tv n It ϋ nn I ^ //. A7 A7 Ministry of Economy Printed by the Consumer Cooperative of the Property Bureau _______B7__ V. Description of the Invention (5) ^ The first picture is a slide with a plating device used to implement the present invention = the first column has two first plating baths, and the second The configuration of two rows of tin electric money operating lines with 2 electric bell baths. It is also a solder electric money device 37 which is equivalent to the whole electroplating device shown in Q. Bath sample 2 Figure 1. This electroplating device has a prepreg bath 371 , The first electroplating bath, the second electro-money baths 374, 375, and 376, and water-washing / 7. Each of the electroplating baths is provided with overflow tanks 378, 379, 380, and 382. The function of these baths is to use insoluble impurities and the like by electricity. The water flow in the price is brought into the bath. Then, the filter tape is charged into these baths, and the filtered plating solution is sent to the plating baths 372, 373, 374, 375, and 376. ^ The feature of the present invention is that a plating film having a plurality of combinations can be formed continuously on a conductive plating member 2 i which is plated on a solder plating line according to the use. Specifically, the structure of this solder plating line is the same as that in FIG. 5. For example, "The solder plating operation line of Figure 1 is adding a tin bath to the plating bath 373." A tin-silver (Sn-Ag) plating bath is added to the plating bath 375, and a kick is added to the plating bath 376. -Sn (Bi) plating solution, while the plating baths' 2, 374 are empty. These plating baths are selected according to the use purpose of the electroconductive member 21 to be electroplated, and the necessary electroplating baths are selected and moved below the transfer holder to form a plating film on the conductive member 21. As a result, a single-layer plating film of tin is formed on the conductive member 21, or a plating film of tin-first layer and Sn-Ag or Sn-Bi second layer is formed. In addition, the structure of the wire rod I is called "Picture", so the symbols are the same. This paper < degree applies to Chinese National Standard (CNS) A4 regulations (LMO X 297 public meals) 312341 ------------- ^ ------------- ---- ^ (Please read the precautions on the back before filling in this page) A7 A7 Description of the Invention of the Printing and Plating Place of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (First, described in 逡 Φ… ”Film 22 An example. 4 · Weigh 21 o'clock to form a single-layer first electric first plating bath 3f3t 'with tin only. As mentioned above, the tin plating liquid edge and the empty plating bath 374 are selected. The wire is treated before the above plating. The treated lead μ, the hair brush, except the surface of the hydroxide blindness ― while moving in the prepreg bath 371. However, the two first electric money baths 373 are transferred to the 374, shaped wind tin plating 瞑Among them, the inscription of the second plating bath 3/4 彺 is described below ... Although the parts are moved to the first) I have 10% of the conductive structure of the plating film without electric scooping ... The plating bath 374, but this The electroplating bath is used to form a plating film in the electroplating bath. Followed by = electroplated conductive members 21, followed by 2 = single-layer electroplated tin with only tin. Weighing "shape wind" Figure 1 plating equipment φ The association room, and the ^ structure are provided with the "plating bath moving machine" and the electroplating bath in the second row, so as mentioned above, they can conduct electricity; 20%, a single-layer electric film. However, there are also the following The moving mechanism does not arrange the electroplating tank under the transfer holder ^ ^ < Choose the case of using a hard wash bath. Front, month /, electroplating Xin does not exist under the transport holder, and the conductive member 21 does not: become electricity Plating film. In the latter case, only the surface of the electroplated conductive member 21 is cleaned by pure water, and the electroplated film is not formed. Second, it is described that the i-th electroplating of the two layers formed on the conductive member 21 貘 κ = second electroplating An example of the plating film 23. The process of forming the electric film 1 on the conductive member 21 is the same as the above. However, this time, the second plating bath or 376 is selected, and the second plating film 23 of Sn_Ag or Sn_Bi is formed on the conductive member 21. . As a result, the conductive member 21 will form% and s ^ Ag or 31234 (Please read the precautions on the back before filling this page) Binding -------- Line 4 This paper & degree applies Chinese national standards ( CNS) / V 丨 Regulation Branding (210 X 297), Employees of Wisdom and Property Bureau, Ministry of Economic Affairs Fee cooperatives printed A7 B7 V. invention is described in (7)
Sn_Bl之2層電鍍膜。 痛，，“圖之包鍍裝置中，第1電鍍浴槽之電鍍液的金 屬材科係為 Stl，结 Λ而α ^ 笔級浴槽之電錢液的金屬材料係為 i>n-Ag 或 §η-Βί。而函达一 ^ 句囚為廷些金屬和除了溶解這些金屬之 今劑…+外的/奋液你屬相同之液體構成，所以可於導電構件 相〜μ地形成電鍍膜。然而，也有用不同液體構成之電 •鍍液在導％構件2 i上形成電鍍膜的情形。此時，藉由第 列之電鍍心槽移動機構具有之洗淨用之水洗用浴槽，可 土此化槽内將導電構件21的表面洗乾淨，因此與電鍍液 之夜體構成無關，可用—條搬送執連續地形成具有複數組 合之電鍍膜。 因此’本發明事先準備加有電鍍液構成相異之複數 電錢液的電錢浴槽。而且可按照使用用途選擇使用這些電 鍍冷槽。如此一來，可用一條搬送軌連續地形成具有複數 組合之電鍍膜。 也就是說’和上述電鍍前處理線相同，可連續地用 一條搬送執將具有複數組合之電鍍膜形成於導電構件2] 上。由於此’便無須按照電鍍膜之組合使電鍍裝置暫時停 止以更換浴槽内之電鍍液。如此可使作業時間大幅縮短， 並且省卻更換電鍍液的工夫。又，於更換同一個浴槽内之 電鍍液時，各電鍍液之間不會混合，可大幅降低在電鍍液 的管理以及電鍍浴槽、電鍍用設備等的維護所花費之勞 其他，也可用一條搬送軌連續地形成具有複數組合 -------------^--------^---------^ (請先閱讀背面之注*事項再填寫本頁) 本呔張尺度適用中國國家標準（CNS)A4規格（210 x 297公坌） 7 312341 511291 A7 、發明說明（8 ^ 幻如於弟1 %鍍浴槽選擇空的電鍍浴槽而於第 -及第3免鍍心槽形成電鍍膜的方法，或是於第1及第2 (請先閱讀背面之注意事項再填寫本頁) 電鍍浴槽選擇空&雷#、义# 的電錢冷槽而僅於第3電鍍浴槽形成單層Sn_Bl 2-layer plating film. Tong, "In the coating plating device of the picture, the metal material of the plating solution of the first plating bath is Stl, and the metal material of the electric liquid of the α ^ pen-level bath is i > n-Ag or § η-Βί. And Han Dayi ^ sentence prisoner is composed of some metals and the agent except for dissolving these metals ... + you are the same liquid composition, so you can form a plating film on the conductive member phase. However, it is also possible to use an electroplating solution composed of a different liquid to form a plating film on the conductive member 2 i. At this time, the water-washing bath provided by the electroplating core tank moving mechanism in the first row can be used for cleaning. The surface of the conductive member 21 is cleaned in this tank, so it has nothing to do with the composition of the electroplating solution, and can be used to continuously form a plating film with a plurality of combinations. Therefore, the present invention prepares a plating solution in advance to form a phase. Different electric money baths of electric money. And these plating cold baths can be selected according to the use. In this way, a plating rail can be continuously formed with a plurality of combinations of plating film. That is to say, and the aforementioned pre-plating treatment Phase It is possible to form a plating film with a plurality of combinations on the conductive member 2] with a single transfer holder. Because of this, there is no need to temporarily stop the plating device to replace the plating solution in the bath according to the combination of the plating films. This can make the operation The time is greatly shortened, and the time for replacing the plating solution is saved. In addition, when replacing the plating solution in the same bath, the plating solutions are not mixed with each other, which can greatly reduce the management of the plating solution, the plating bath, and plating equipment. The maintenance and other labor costs can also be continuously formed by a transport rail with a plurality of combinations ------------- ^ -------- ^ -------- -^ (Please read the notes on the back before filling in this page) The dimensions of this leaflet are applicable to the Chinese National Standard (CNS) A4 (210 x 297 cm) 7 312341 511291 A7, the description of the invention (8 ^ 如 如 如 于 弟For the 1% plating bath, select the empty plating bath and form a plating film on the-and 3 free plating baths, or on the 1st and 2nd (please read the precautions on the back before filling this page). Empty & 雷 # 、 义 # 's electric money cold tank and only form the third electroplating bath Floor
之電鍍膜的方法望。々 _ L 一 等又’於相鄰之電鍍作業線上具有放入 同、'、成之包鍍液的電鍍浴槽，經由連續選擇這些浴槽即 可於導電構件21形成厚的電鍍膜。 不&何種情形，如上述藉由使用本發明之滑動功能， 而可以用一條搬送執連續地形成具有複數組合之電鍍膜。 上述已將銲錫電鍍的情形當作例子說明，但此電鍍 裝置益不又限於銲錫電鍍。例如^電鍍、&電鐘、犯 電鍍等進仃這些電鍍時，可以使用此電鍍裝置以一條搬 送執連續地於導電構件21形成具有複數組合的電鍍膜。 發明之效果 經濟部智慧財產局員工消費合作社印製 由上述况明清楚得知，本發明可產生以下的效果。 亦即°亥電錢裝置由於在焊錫電鍍作業線具有滑動 功此，而可用一條搬送轨連續地形成單層或具有複數組合 之包鍍膜。因此無須每更換形成於導電構件之電鍍膜就更 換電鍍液’也不用將電鍍裝置暫時停止。#此，可以一條 搬送執連續地於導電構件形成具有複數組合之電鍍膜，而 且可省部更換電鍍液的工夫。又，於同一個浴槽内更換電 鍍液時，各電鍍液之間不會混合，可大幅降低在電鍍液的 管理以及電鍍浴槽 '電鍍用設備等的維護所花費之勞力。 圖式之簡單說明 第1圖為說明使用本發明之電鍍裝置之電鍍作業線 本紙張尺度適用中國國家標準（CNS)A4規格（2丨〇 X〕97 λ、餐 312341 5112pl— Α7 Β7 —、 經濟部智慧財產局員工消費合作社印製 五、發明說明（9 ) 的圖。 第2圖為說明施行本發明及習知之電鍍的半導體晶片 的圖。 第3圖為說明本發明及習知之由2層電鍍膜構成之第 2圖中所示之從半導體導線框架的A-A方向所見之剖面的 圖。 第4圖為說明本發明及習知之自動電鍍裝置全體之配 置的圖。 第5圖為說明從本發明及習知之化學浸蝕浴槽的第4 圖中B-B方向所見之剖視圖。 符號說明 導電構件 第1電鍍膜 第2電鍍膜 橫向移動式推進機 搬送執 掛鉤 電鍍輔助掛架 預浸浴槽 第1電鍍浴槽 第2電鍍浴槽 水洗用浴槽 382 溢流槽 21 22 23 331 332 333 334 371 372 374 377 378、379、380、381 373 375 376 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 9(修正頁） 312341 (請先閱讀背面之注意事項再填寫本頁)The method of plating film is hoped. L _L has a plating bath on the adjacent plating line where the same, ', and Cheng plating solution is placed. By continuously selecting these baths, a thick plating film can be formed on the conductive member 21. In any case, as described above, by using the slide function of the present invention, it is possible to continuously form a plating film having a plurality of combinations with a single conveyance holder. The case of solder plating has been described above as an example, but this plating apparatus is not limited to solder plating. For example, when performing plating such as electroplating, electric clock, and electroplating, the electroplating device can be used to continuously form a plating film having a plurality of combinations on the conductive member 21 with a single transfer holder. Effects of the Invention Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs From the foregoing, it is clear that the present invention can produce the following effects. That is to say, because of its sliding function on the solder plating line, the Hai Haidian device can continuously form a single layer or a coating film with a plurality of combinations by one conveying rail. Therefore, it is not necessary to change the plating solution every time the plating film formed on the conductive member is changed, and it is not necessary to temporarily stop the plating apparatus. #This makes it possible to continuously form a plating film with a plurality of combinations on a conductive member in a single transfer holder, and save time and effort to replace the plating solution. In addition, when the electroplating bath is replaced in the same bath, the plating baths do not mix with each other, which can greatly reduce the labor required for the management of the bath and maintenance of the plating bath and the equipment for plating. Brief description of the drawing. The first figure is an illustration of the electroplating line using the electroplating device of the present invention. The paper size is applicable to China National Standard (CNS) A4 specification (2 丨 〇X) 97 λ, meal 312341 5112pl— Α7 Β7 —, economical. The Intellectual Property Bureau employee consumer cooperative prints the fifth, invention description (9). The second figure is a diagram illustrating the plating of a semiconductor wafer that implements the present invention and the conventional technique. The third figure is a two-layer diagram illustrating the present invention and the conventional technique. A diagram of a cross section viewed from the AA direction of the semiconductor lead frame shown in the second diagram of the plating film configuration. The fourth diagram is a diagram illustrating the overall arrangement of the automatic plating apparatus of the present invention and the conventional one. A cross-sectional view of the invention and a conventional chemical etching bath as viewed in the direction of BB in the fourth figure. Symbols Description Conductive member 1st plating film 2nd plating film Transverse mobile propeller transport hook Plating auxiliary rack Pre-immersion bath 1st plating bath 1st 2Plating baths Baths for washing 382 Overflow tanks 21 22 23 331 332 333 334 371 372 374 377 378, 379, 380, 381 373 375 376 This paper size applies to Chinese national standards CNS) A4 size (210 X 297 mm) 9 (correction page) 312341 (Please read the back of the precautions to fill out this page)