JP2825732B2 - Partial plating equipment for IC lead frames - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention
The present invention relates to a partial plating apparatus for an IC lead frame which performs partial plating by setting lead frames one by one.

[0002]

2. Description of the Related Art FIGS. 3 and 4 show a conventional structure of a partial plating apparatus for an IC lead frame. In these figures, 11 is a carry-in conveyor, 15 is a loading machine, 21A is a partial plating cell, 41 is a carry-out conveyor, and 45 is a discharge machine. Each of these components (11, 15, 21A, 41, 4)
5) are arranged in a row along the transport direction (the arrow X direction which is the right direction in the figure).

[0003] The above-mentioned partial plating apparatus is of a batch type, in which an IC lead frame W is loaded one by one into a partial plating cell 21A from a carry-in conveyor 11 by using a loading machine 15 to perform partial plating, and then a discharger 45 is used. Then, it is delivered to the carry-out conveyor 41 side and sent to a post-processing step.

[0004] Specifically, the preprocessed IC lead frame W conveyed by the carry-in conveyor 11 is held by the loading machine 15 at the end of the carry-in conveyor 11, and in that state, is transported (in the direction of the arrow X). ) Is transported to the partial plating cell 21A by a constant stroke S1 '.
In the partial plating cell 21A, the IC lead frame W is partially plated by being sandwiched between the lower mask 22 and the upper mask 23.

[0005] The IC lead frame W that has been subjected to the partial plating is carried by the discharger 45 from the partial plating cell 21A in the carrying direction (the direction of the arrow X) by a fixed stroke S3 'and delivered to the start end of the carry-out conveyor 41. And
It is sent to the post-processing step by the unloading conveyor 41.

[0006] Regardless of the type of the IC lead frame W, the pre-processing step (electrolytic degreasing, base plating, activity) and the post-processing step (collection, drying) are the same.

In the above-mentioned partial plating apparatus, when switching the type of the IC lead frame W, before and after the partial plating apparatus 21A, an operator for mask replacement work and masks (22, 23) for the next type are provided. Prepare and arrange. When the final product (W) of the current product is partially plated and sent to the post-processing step by the unloading conveyor 41,
Stop the operation of the equipment. Next, in this state, after replacing the mask (22, 23) of the partial plating cell 21A with that for the next type by the operator, the operation of the apparatus is resumed, and a series of loading to the new type IC lead frame W is performed. , Partial plating and unloading operation.

[0008]

By the way, at present,
Since there are a wide variety of devices on which the IC lead frame W is mounted, many types of IC lead frames are produced in small quantities in response thereto, and the type is switched more frequently. Therefore, in order to improve the production efficiency, it is necessary to quickly switch types, but in the above-described partial plating apparatus, personnel for mask replacement work must be arranged before and after the partial plating cell 21A. This increases the cost and increases the cost. Further, even if the number of workers is increased so that the mask exchanging operation can be performed promptly, the next type of IC lead frame W cannot be carried in before the exchanging operation. I can't get into partial plating. Therefore, it is impossible to significantly reduce the type switching time, and a drastic solution is required.

It is an object of the present invention to provide a partial plating apparatus for an IC lead frame capable of quickly and surely switching types while improving production efficiency while reducing costs.

[0010]

In the above-mentioned conventional structure, personnel for mask replacement work must be arranged before and after the partial plating cell, which increases the number of personnel and increases the cost, and the final product of the previous type is discharged. After that, the operation of the apparatus must be stopped to perform the mask replacement work for the next type, and it is impossible to greatly reduce the type switching time.
Since the C lead frame is small, the strokes of the loading and unloading machines are short, and even if the distance between the component plating apparatus and the carry-in (carry-out) conveyor is slightly changed, the IC lead frame can be smoothly transferred just by switching the stroke. Focusing on this, two partial plating cells were prepared, and while one was in use, a mask for the next product was attached to the other unused one. The discharger is of a movable stroke type, and the strokes are switched so that the IC lead frame can be transferred between the partial plating cells after the replacement and the respective conveyors.

That is, the partial plating apparatus for an IC lead frame according to the present invention comprises a carry-in conveyor, a loading machine, a partial plating cell, a discharger, and a carry-out conveyor which are arranged in a row along the carrying direction. IC that has been transported
In a partial plating apparatus for an IC lead frame formed to perform partial plating while setting lead frames one by one in a partial plating cell, the lead frame is arranged between the input device and the discharge device in the transport direction and has a transport center. Two partial plating cells mounted movably in a direction perpendicular to the axis are provided, and a movable stroke is provided so that the loading machine can be loaded into any of the partial plating cells with the IC lead frame received from the end of the carry-in conveyor. The discharger is formed so as to be switchable, and the discharger is formed so that the movable stroke can be switched so that the IC lead frame can be received from any of the partial plating cells and transferred to the start end of the unloading conveyor, and any one of the partial plating cells can be transferred. Selective positioning means for selective positioning on the center axis and compatible with selectively positioned partial plating cells It was characterized by providing a stroke switching control means for switching corresponding movable stroke of the discharge device and the closing machine.

[0012]

According to the present invention having the above-mentioned structure, a mask for the next product is attached to another unused partial plating cell while one partial plating cell is being used.

When the type of the IC lead frame is switched, when the final product of the current type is delivered from the partial plating cell to the discharger, the operation is stopped immediately by the selective positioning means without stopping the apparatus operation. The used partial plating cells are retracted out of the transport center axis, and the partial plating cells set up for the next product are positioned on the transport central axis.

Simultaneously, the movable strokes of the charging machine and the discharging machine are switched by the stroke switching control means in accordance with the partial plating cells positioned on the transport center axis.

Thus, the next type of IC lead frame sent by the carry-in conveyor without stopping the operation of the apparatus and without a delay after the last product of the previous type is transferred to the partial plating cell by the loading machine. After performing the partial plating, the partially lead-processed IC lead frame is received by the discharger, delivered to the carry-out conveyor, and then conveyed to the post-processing step by the carry-out conveyor.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. The partial plating equipment for this IC lead frame is shown in FIG.
As shown in FIG. 2 and FIG. 2, the basic configuration is the same as that of the conventional example (FIG. 2).
A mask for the next product is attached to another unused one while one is prepared, and the partial plating cells (21, 31) are replaced and inserted by using the selective positioning means 51 when the product is switched. The movable strokes of the machine 15 and the ejector 45 are switched by using the stroke switching control means so that the type can be switched without stopping the operation of the apparatus. Note that the same components as those in the conventional example (FIGS. 3 and 4) are denoted by the same reference numerals, and description thereof will be omitted or simplified.

First, two partial plating cells (2) arranged in the transport direction and movably mounted in the direction perpendicular to the transport center axis 9 are provided between the input device 15 and the discharge device 45.
1, 31) are provided. Both partial plating cells (2
1, 31) have the same structure to facilitate maintenance management.

Thus, one partial plating cell (2
During partial plating using 1), a mask for the next product can be attached to another unused partial plating cell (31). Further, the loading machine 15 is provided for the loading conveyor 11.
The movable stroke can be switched so that the IC lead frame received from the end of the substrate can be loaded into any of the partial plating cells (21, 31). Similarly, discharging machine 4
5 also receives the IC lead frame W from any of the partial plating cells (21, 31) and carries out the conveyor 41.
The movable stroke is formed so that it can be transferred to the start end of the movable stroke.

Thus, two partial plating cells (2
1, 31), the IC lead frame can be smoothly and reliably transferred between the carry-in conveyor 11, the replaced partial plating cell (31), and the carry-out conveyor 41, and the two partial plating cells 21 can be transferred. , 31 can be used alternately.

In this embodiment, the charging machine 15 is provided with a main body 16 which can reciprocate a predetermined stroke (S1, S2) along the guide rail 19, and an IC lead frame which can be held and released from the main body 16. Gripper 17
It is composed of driving means (not shown) for driving the main body 16 to move. The ejector 45 has the same configuration as the input machine 15, and has a main body 46 that can reciprocate a predetermined stroke (S3, S4) along the guide rail 19, and holds and holds an IC lead frame on the main body 46. It comprises a releasable gripper 47 and a driving means (not shown) for moving the main body 46.

The selective positioning means 51 is means for selectively positioning one of the partial plating cells (21 or 31) on the transport center axis 9. In the present embodiment, the selective positioning means 51 uses the mask (22, 23) for the next type with respect to another unused partial plating cell (31) while using one partial plating cell (21). So that two partial plating cells (21, 3
1) are alternately positioned on the transport center axis 9.

Specifically, as shown in FIG. 2, the selective positioning means 51 includes a guide member 52 for guiding each of the partial plating cells (21 or 31) in a direction perpendicular to the transport center axis 9.
And a female screw part 54 rotatably supported by the case body 29 and provided on each of the partial plating screws (21 or 31).
And a switching handle 55 attached to the distal end of the screw shaft 53.
Therefore, each partial plating cell (21 or 31) is positioned on the transport center axis 9 by appropriately rotating the screw shaft 53 in the forward or reverse direction using the switching handle 55,
It can also be evacuated.

The stroke switching control means controls the partial plating cell (21) selectively positioned on the transport center axis 9.
Or 31) is a means for correspondingly switching the movable stroke of the input device 15 and the discharge device 45 in correspondence with (31). In the present embodiment, the stroke switching control means is configured using a part of the function of a control device for controlling the drive of the entire device.

Next, the operation will be described. In this partial plating apparatus, while one partial plating cell (21) is in use, an unused partial plating cell (31) is attached with a mask for the next product.

When the type of the IC lead frame W is switched, when the final product of the current type is delivered from the partial plating cell 21 to the discharger 45, the partial positioning is immediately performed by the selective positioning means 41 without stopping the apparatus operation. The plating cell 21 is retracted outside the transport center axis 9 and the partial plating cell 31 set up for the next product is positioned on the transport center axis 9.

Further, at the same time, the IC receives the movable stroke of the charging machine 15 from the end of the carry-in conveyor 11 corresponding to the partial plating cell 31 by the stroke switching control means.
The lead frame W is switched so that it can be put into the partial plating cell 31. Further, the movable stroke of the discharger 45 is switched so as to receive the IC lead frame W from the partial plating cell 31 and transfer it to the start end of the carry-out conveyor 41.

Thus, the next type of IC lead frame W sent by the carry-in conveyor 11 without stopping the operation of the apparatus and without a delay after the final product of the current type is subjected to the partial plating cell by the loading machine 15. After the partial plating process is performed by passing the sheet to the discharger 45, the partially plated I
The C lead frame W can be received and delivered to the carry-out conveyor 41, and then sent to the post-processing step by the carry-out conveyor 41.

According to this embodiment, two partial plating cells (21, 31) which can be selectively positioned on the transport center axis 9 by the selective positioning means are provided, and any of the partial plating cells (21, 31) is provided. Even if 31) is selected, the movable strokes of the input device 15 and the discharge device 45 can be switched so that the IC lead frame can be reliably transferred between the carry-in and carry-out conveyors 11 and 41. The partial plating of the next product can be performed without stopping the process without stopping the process from the final product of the previous product. Therefore, the type change can be performed quickly and reliably. Also, one partial plating cell (21)
Another partial plating cell (31) not used while using
(22, 23) for next product with sufficient time
Can be attached. Therefore, there is no need to arrange personnel for mask replacement work before and after the partial plating cell at the time of product type switching, and there is no increase in cost.

Further, since the two partial plating cells 21 and 31 have the same configuration (excluding the mask), maintenance can be easily performed.

[0030]

As described above, according to the present invention, it is possible to selectively position on the transport center axis by using the selective positioning means.
One partial plating cell is set up, and while the partial plating is being performed with one partial plating cell, a mask for the next product is attached to another unused partial plating cell, and the partial plating cell is replaced. The movable stroke of the input machine and the ejector can be changed using the stroke switching control means, so that the next type of IC lead frame can be loaded without stopping the operation of the equipment and without leaving a gap from the last product of the previous type. And can be partially plated. Further, it is not necessary to arrange personnel for mask replacement work before and after the partial plating cell. Therefore, it is possible to improve the production efficiency by quickly and surely switching the type while reducing the cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a plan view for explaining replacement of two partial plating cells.

FIG. 3 is a plan view illustrating a configuration of a conventional partial plating apparatus.

FIG. 4 is also a perspective view.

[Explanation of symbols]

 9 Conveying Center Axis 11 Loading Conveyor 15 Loading Machine 21 Partial Plating Cell 31 Partial Plating Cell 41 Unloading Conveyor 45 Discharger

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Noriyuki Yuguchi 1-1-1, Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Takuya Hayashi 1-chome, Ichigaya-cho, Shinjuku-ku, Tokyo No. 1 Inside Dai Nippon Printing Co., Ltd. (72) Inventor Teruo Omori 3-6-1 Hirao, Inagi-shi, Tokyo Inside Mitomo Engineering Co., Ltd. (72) Inventor Shogo Kurachi 3-6, Hirao, Inagi-shi, Tokyo 1. Inside Mitomo Engineering Co., Ltd. (72) Inventor Tetsuo Matsushita 3-6-1 Hirao, Inagi-shi, Tokyo Inside Mitomo Engineering Co., Ltd. (56) References JP-A-53-83936 (JP, A) 58-185793 (JP, A) JP-A-2-249841 (JP, A) JP-A-6-62551 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23 / 50 C25D 5 / 02,7 / 12 H01L 21/50

Claims (1)

(57) [Claims] 1. An IC lead frame conveyed by a carry-in conveyor is provided to a partial plating cell, comprising a carry-in conveyor, a loading machine, a partial plating cell, a discharger, and a carry-out conveyor, which are arranged in a row along the carrying direction. In a partial plating apparatus for an IC lead frame formed so as to perform partial plating while setting one by one, it is arranged in a row in the transport direction between the input machine and the ejector and moves in a direction perpendicular to the transport center axis. Two partial plating cells are provided so as to be mounted, and the loading machine is formed so that the movable stroke can be switched so that the IC lead frame received from the end of the carry-in conveyor can be loaded into any of the partial plating cells. A movable stroke so that the discharger can receive the IC lead frame from any of the partial plating cells and transfer it to the start end of the unloading conveyor. Replacement capable to form a selection positioning means for selectively positioning either one of the partial plating cell to the transport center axis,
Stroke switching control means for switching the movable stroke of the charging machine and the discharging machine in correspondence with the selectively positioned partial plating cell.
Partial plating equipment for C lead frame.