TW509716B - Thermo-curable mono-componented adhesive system for adherence in micro-scope - Google Patents

Thermo-curable mono-componented adhesive system for adherence in micro-scope Download PDF

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TW509716B
TW509716B TW086110140A TW86110140A TW509716B TW 509716 B TW509716 B TW 509716B TW 086110140 A TW086110140 A TW 086110140A TW 86110140 A TW86110140 A TW 86110140A TW 509716 B TW509716 B TW 509716B
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adhesive
adhesive system
resin
micro
flow
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TW086110140A
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Klaus Hoehn
Heiner Bayer
Martin Honsberg-Riedl
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Siemens Ag
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • H01L2224/29099—Material
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    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Description

509716 A7 B7 五、發明説明（i ) 本發明有關一種製模用樹脂条統，其適合構成尺寸公 差在μ m至次μ »範圍之粘結 就微粘結而言，已知之粘著劑粂統一般傺由樹脂及硬 化劑成分組成。此二成分粘著劑条統在需要撤米範圍之 粘結時，有一關於小量的問題。尤其是應用精確之配量 、混合及均勻性之單一成份時更是如此。另一缺點偽： 其一般有太高的粘度，且在高溫（約70¾)時太稀薄而造 成撤配量（所諝LVA(低粘度粘著劑）一粘著劑）之粘著破 廣。此外，該二成分条統有另一缺點：因為其在薄層中 的不均勻性或在惰氣（或氮氣）中的小滴而不能完全硬化 。這些因素導致：其迄今未能實現有關於粘著穩固性及 u in、次w m範圍尺寸公差之所需的、可重複的有技術價值 之粘著、品質的工業生産。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 對於一種能夠達成合理、自動、安全且節省成本之粘 箸技術以應用於電子及光電子之低成本条統的粘著劑条 統而言，偽有需求的。尤其是對於一種Μ ®及次wm範圍 粘結之粘箸劑条統更有需求，其中該粘著劑条統處於極 端薄層或小滴時，亦能可靠地被酚量及硬化。因此前述 之數量亦應依循硬化之要求。 本發明之課題因而即在於一種可資使用之粘箸劑条統 ，其在小量時亦不會有不均勻性，且適合檝量配量。 本發明進一步課題在於一種可資使用之粘著劑条統，其 在薄層中時可完金硬化。藉此条統，能提高粘著之可靠 度及穩固性，並降低不欲之完成粘箸之汽提。接箸，本 -3 一 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 509716 A7 B7 五、發明説明（2 ) 發明之粘著劑条統在與已知条統比較時，有較低之粘度 及較大之流動—特種。最後，該粘著劑条統之使用期限龙 許具徹米範圍尺寸公差之單成分構成元件之使用。 這些課題藉由本發明之粘著劑条統予以解決。本發明 之一項目的僳一種熱固性單成份製模用樹脂条統，包括： 60 - 98 wU製模用樹脂 2 - 30 醇類或糖 0. 2- 2.0wt!K熱引發劑 0.2- 2.0wtS!粘著劑及/或 0 - 3.0wU促流劑及/或 0 - 4 wU流變改質劑及/或流動改良劑。 此外，本發明另一目的為使用這類製模用樹脂以形成 //in及次範圍尺寸公差之粘結。其他有利之安排參見 以下之說明，實施例及申請專利範圍。 在本發明中，"製模用樹脂”像指熱固性樹脂条統及反 應性樹脂，其粘度甚低，以致於能以相對應之形狀通過 塑模，於其中該樹脂受熱（即藉由高溫及現有之添加劑， 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 如引發劑，加速劑及其他成分）而硬化。璟氣製模用樹 脂僳有利之本發明製模用樹脂。依照本發明配方，製模 用樹脂之劑量佔60-98wtJ：,較佳為75-95vt!K,更佳為 80-95wtJ!,特別佳為 85-93wt!K。 ”璟氣製模用樹脂”像指環脂族環氣樹脂，如Ciba Geigy公司之Harz CY177(3,4-環氣基環己基甲基）-己二 酸酯，或Harz CY179(3,4-環氣基-環己基甲基）-3’，4’- -4 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 509716 A7 B7 五、發明説明（3 ) 環氣基-璟-六碩酸酯）。此外，線性脂族璟氣樹脂，如環 氧化之：聚f二烯或環氧化之黃豆油。其他之陽韻子性固 化樹脂，如乙烯基醚或乙烯基芳香族，亦適合。亦可使 用縮水甘油醚型環氣樹脂。下列者可作為縮水甘油醚之 基料：雙酚（如A,雙-或多羥芳基，如間苯二酚，多芳 基烷基（具有酚0H基者）），清漆，多烷基二醇、多醇（如 甘油或新異戊二醇）。進一步之適合者為縮水甘油醚-酯-型的粘箸劑，如對羥基苯甲酸縮水-甘油醚酯；具脂族 或芳族核之多磺酸如六氳酞酸或肽酸的甘油醚。 在本發明中，”醇類或糖”僳指具有卜15傾羥基之醇類 或糖。較佳地傺使用1-5個羥基之醇類。醇類或糖之基 本結構可隨意予以改變，其可為脂族、環或雙環，其能 由單一化合物或多種化合物予以組成，亦得有關芳族条 統。較佳之可適用者為Hoechst公司所製之TCD-Alkohol, 其為3(4), 8(9)雙（羥甲基）三環〔5·2·1·02;6〕癸烷 。較佳為多元之醇類，在粘著劑配方中佔2-30 wtX。其 重量份較佳為2.5-20vt!K,更佳為4.5-12wtSi。 可作為熱引發劑者為常用之依照習用機制予以硬化之 熱引發劑，如_鹽。在本發明中較佳為Aldrich製之苯 基硫鏘六氟銻酸鹽。 可作為粘著劑者像Huls之A187,其為3 -縮水甘油氣丙 基三甲氣基矽烷。 以Modaflow(Monsanto公司製）作為促流劑，流動調節 劑或流變改質劑像商業上常用之Aerosil-Typen(Degussa -5 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)
、1T .0 經濟部中央標準局員工消費合作社印製 509716 A7 B7 五、發明説明（4 ) 製）〇 ，了在前文所述之成分以外，本發明粘著劑条統中亦 得含有已知添加劑。藉此，使粘著劑条統具有額外之待 擻，如（尤其）顔色或透明度及阻燃或耐溫性。添加劑在 本文中僳指顔料、染料、流動改質劑，一般之穩定劑、 燃燒保護劑或硫物及其他镇料。因而以下偽可能的：可 藉添加劑取得待定待性，例如可選擇的吸收，或穿透顔 料之透明度。 粘著劑条統偽以同類粘著劑之生産方法予以製造。配 方成分，如環氣樹脂，多元醇、熱引發劑、粘著劑及視 需要之促流劑等，可在高溫下，以可去除之溶劑予以互 相混合。亦得參考習用技術方法予以生産粘著劑条統。 於下文，本發明基於實施例予以更清楚地閫釋。表1 偽代表性粘箸劑之配方成分。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁)
509716
7 7 A B 經濟部中央標準局員工消費合作社印製 五、發明説明（S ) 表1:代表性配方之成分及化學式 成分（生産商） 含量 化學式 [重童份） CY177 (Ciba Geigy), 雙（3,4-環氣環己甲基）己二酸酯 100 TCD-A 1 koho 1 DM (Hoechst), 3(4),8(9)-雙（羥甲基）-三環 10 [5 · 2 · 1 . 0 2/ 6 ]癸烷 執弓1發割 S-苯基硫鏘六氟銻酸鹽 1 粘箸_ 〜 A187 (Huls) 3-縮水甘油氧丙基三甲氯基矽烷 0,5 在表2中總結前述配方之例子之工作材料特性。 -7 - -----；—；--¢11 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） 509716 A7 B7 五、發明説明（6) 經濟部中央標準局員工消費合作社印製 表2 :所用粘著材料之工作材料特性及加工數據 硬化一 1 h 1 2 0 1C— (完全硬化） Harzeii^enschaften · , 粘度 r? 〔rnPas〕 室溫 880 60¾ 120 δ〇υ 80 反應性： 2 η (80*0) [min] 55 DSC (10K/»in)： T (啓動）[t] 96 τ(分）[υ ] 130 熱流 Η R 〇j/g] 415 餺椹用材料轉袢 丨 玻璃轉位點〔1C〕 68 (DSC , 10 1/ min) 熱化學分析 (移動模數，3 K/inin) E-模數（2010 ) [N/mn 2 ] 2.400 α (-60 bis 40¾ ) [ρρπι/Κ] 96 α -過渡〔1C〕 〜 63 冷_過渡〔t!〕 -64 簫氏硬度 D 81 熱穩定性： TG/DTA (10K/rain) , Η 2 ) 5%質量損失〔iC〕 350,4 DTG(max)〔1C〕 413,4 分解率 〔％ /min〕 22,7 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 509716 經濟部中央標準局員工消費合作社印製 A7 B7 五'發明説明（7 ) — 表3顯示配方之可儲存性研究。觀察期間係2傾月， —其中在^收縮儲存下（5 -·8 υ >降假既_用性』性，例 如熱引發劑結晶析出。 表3各種儲存溫度下之粘度流n (t) 貯存時間 室溫下π (60° ) 7 t：下 η (60 *0 ) [bPa s ] [aPas] i 0 120 120 60 2200 120 使用本發明粘著劑条統能達成自動、安全的及次 u a範圍之電子及光電子微粘結。本發明單成分瓌氣製 模用樹脂的硬化方式，並非可允許單成分元件之使用$ 至徹底硬化之程度。為了撤粘箸之利用，環氧樹脂成分 及整値粘箸劑条統偽低粘度。最後，藉由醇類或糖之$ 用（尤其是多元醇），粘著雨条統之去滴化、潤濕性及@ 動特性及粘著劑粘結之機槭待性得以被賦予。 該粘著劑条統在微量配量時像沒有問題的並且在添加 傻流劑下，其去滴化、潤濕性及流動性能夠最佳化。 在前文中所述之雙成分撤粘結技街用之粘著劑配方之 缺點可因而解決。尤其，可配量性及配量準確性可被改 良，並避免不完全混合及混合失效以及降低粘度。 本發明的單成分粘着劑条統至少由製模用樹脂（尤其 是環氣製模用樹脂）及多元醇組成。此低粘度粘著劑条 統可撤配量啲。貯藏穩定的、完全可硬化的，並且適合 尺寸公差在a m及次/i m範圍之應用。 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁)
、1T .0

Claims (1)

  1. 50971
    々、申請專利範圍 第861 10140號「微米範圍黏結用之熱固性單成分IVA(低黏 度黏著劑）-黏著劑系統」專利案 （91年5月修正） 六申請專利範圍 1. 一種用於黏結尺寸公差在//m及次/zm範圍之熱固性的單 成分粘著劑系統，含有下列成分： 85-93wt%環氧製模用樹脂，如雙（3,4-環氧環己基甲基）-己二酸酯； 4.5-12wt%多元醇如 3(4)，8(9)，雙（羥甲基）-三環 〔5.2.1.02,6 10〕癸烷， 0.7-1.Owt%熱引發劑，如苯基硫鏺六氟銻酸鹽；及 0.3-0.6wt%粘著劑；及/或 0 - 1.5wt%促流劑；及/或 1 - 2.0wt%流動改質劑及/或流動改質劑。
TW086110140A 1996-07-18 1997-07-17 Thermo-curable mono-componented adhesive system for adherence in micro-scope TW509716B (en)

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US20030138434A1 (en) * 2001-08-13 2003-07-24 Campbell Robert L. Agents for enhancing the immune response
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
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US4480059A (en) * 1982-08-26 1984-10-30 General Electric Company Epoxy adhesives for poly(butylene terephthalate)
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