TW507120B - Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site - Google Patents

Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site Download PDF

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TW507120B
TW507120B TW90111549A TW90111549A TW507120B TW 507120 B TW507120 B TW 507120B TW 90111549 A TW90111549 A TW 90111549A TW 90111549 A TW90111549 A TW 90111549A TW 507120 B TW507120 B TW 507120B
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trajectory
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Bradley L Hunter
Christopher P Cullen
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Gen Scanning Inc
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    • G05B13/02Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
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    • G05B13/024Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system in which a parameter or coefficient is automatically adjusted to optimise the performance

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Abstract

Method and subsystem are provided for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site utilizing an estimated change in temperature of motors caused when the motors drive the stage according to a number of possible trajectories. The method includes receiving reference data which represent locations of microstructures to be processed at the site, determining a plurality of possible trajectories based on the data, and estimating a change of temperature of motors caused when the motors drive the stage based on each of the possible trajectories. The method also includes determining a substantially optimum trajectory from the possible trajectories wherein positioning accuracy of the stage is maximized by following the substantially optimum trajectory.

Description

507120 Α7 Β7 五、發明説明(1 ) 本發明之背暑 1 · 本發明之範疇 本發明係關於產生當於雷射處理點處理微構造物時欲 山馬達驅動級台循行之軌線的方法和子系統。 2. 技術背景 記憶體修補是一種處理程序,它被使用於製造記憶體 橫體電路(DRAM或者SRAM)以改進製造產量。記憶體晶 厂「利用外加的記憶胞列與行被製造。在測試記憶體晶片時 (儘管仍然是爲晶圓形式),任何被發現的缺陷都會被紀錄 於資料庫中。具有缺陷晶片的晶圓可以利用具有脈衝雷射 之鏈路來加以修補。系統一般採用運送半導體晶圓至雷射 !t理程序機器之晶圓處理設備,並且得到相關資料庫型式 的資訊,其指示鏈路應該在何處被切斷並進行各晶圓必需 的鏈路熔損。 經濟部智慧財產局員工消費合作社印製 連續幾代的DRAM採用精緻的元件幾何以便包裝更多 的記憶體於較小的晶片。這較小元件的製造影響被安置給 ·ι!ΐ射多餘量之鏈路幾何。當元件更小時,鏈路也就更小而 Ν.問隙(鏈路至鏈路間隔)也縮短。較小的鏈路幾何需要較 小的雷射點尺寸以便順利地移除被選擇之鏈路而不影響相 郯之鏈路,最好是幾乎不(如果可能)損及產量。 鏈路以小群組被配置於共同間隙。一般的群組可以由 20-50組大約〇·8 // Μ寬,6 # Μ長並且以3 // Μ間隙分隔鏈 路所構成。群組可以平行於X或者y軸之間隙向量被配置。 Μ常,多重群組將被發現爲共線的,而在一群組的結束以 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 507120 A7 ____B7__ 五、發明説明(> ) 4接著群組的開始之間僅有2或3個”間隙”。在其他的時 候,共線的群組會被分隔幾百微米遠。一般的DRAM晶片 π丁以具有幾百組跨越晶片的延伸配置之鏈路群組。 上面所提到的實用性專利申請披露一種使用於安置一 組半導體晶圓於靜止的雷射光束之下的高性能χ-y級台。 χ-y級台被需要以達成處理晶圓之一區域所需的許多高速 移動, 通常χ-y級台受限制於位置、速率、加速度以及電壓 條件。位置限制爲級台行程之界限。速率之限制可能係由 於被使用於級台之置放感知元件的界限及/或所使用軸承型 式所加諸的界限。加速度限制通常係由於馬達、放大器或 汽電源供應之考慮而可用於驅動級台之電流限制。電壓限 制通常較少發生。需要超量電壓之移動必須被避免以防止 收大器飽和。電壓限制一般會在短暫的高-加速度移動時遭 遇° 本級台能夠使用相當大數値之加速度(如3G)執行移動 抱且能夠在移動結束時迅速地停止。同時級台也必須以非 常高精確性(奈米程度之精確性)操作。非常高的性能以及 極端精確度的需求之組合產生級台之另外的限制。級台易 • 2被消耗於馬達線圈之功率位準影響。如果被消耗之功率 沒致線圈溫度上升超過攝氏2度,則將會危及級台之精確 'rt 同時,如果施加至級台之力量的頻譜內容包含高於系 統之第一機械模式之頻率的超出位準之能量,則將會引起 級台之機械元件的共振。這些共振將損及精確度或者在必 5 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) I- _ - - - - ml In _ -------1¾衣 II (請先閱讀背面之注意事項再填寫本頁) 線 Μ濟部智慧財產局員工消費合作社印製 507120 A7 B7 五、發明説明(> ) 要之精確性位準被達成之前,在移動終止時需要額外的安 定時間。 槪要 本發明之一目的是提供一種用以產生當於雷射處理點 處理微構造時欲由馬達驅動級台循行的軌線之改進方法以 及子系統。 爲完成本發明上面之目的和其他之目的’一種用以產 乍當於雷射處理點處理微構造時由馬達驅動級台循行的軌 線方法被提供。本方法包含接收代表在將被處理之微構造 的位置之參考資料,並且依據該資料決定多數可能的軌 線。當至少一組馬達依據各可能的軌線驅動級台時,所導 致之至少一組馬達的溫度改變被估計。本方法進一步地包 含從可能的軌線中決定一組大致最佳軌線,其中級台之定 位精確度利用循行該大致最佳軌線而被最大化。 該至少一組馬達可以包含至少一組線圈並且其中估計 步驟是依據在該至少一組線圈中各可能的軌線之消耗能 請 先 閱 讀 背 τέ ί 事 項 再507120 Α7 Β7 V. Description of the invention (1) The summer of the present invention1 · The scope of the present invention The present invention relates to a method for generating a trajectory of a mountain motor driving stage when processing a microstructure at a laser processing point And subsystems. 2. Technical Background Memory repair is a processing program that is used to manufacture memory crossbar circuits (DRAM or SRAM) to improve manufacturing yield. The memory wafer factory "is manufactured using additional memory cells and rows. When testing memory chips (although still in wafer form), any defects found will be recorded in the database. Crystals with defective wafers The circle can be repaired using a link with a pulsed laser. The system generally uses wafer processing equipment that transports semiconductor wafers to laser! Processing machines, and obtains information about the type of database, which indicates that the link should be in Where to cut off and carry out the necessary link melting of each wafer. Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs' consumer cooperatives printed successive generations of DRAM using delicate element geometries in order to pack more memory into smaller chips. This The manufacturing impact of smaller components is assigned to the link geometry of the excess radiation. When the component is smaller, the link is smaller and the N.interval (link-to-link interval) is shortened. Smaller The link geometry requires a smaller laser spot size in order to smoothly remove the selected link without affecting adjacent links, preferably with little (if possible) loss of yield. Groups are configured in a common gap. A general group can be made up of 20-50 groups of approximately 0 · 8 // Μ wide, 6 # Μ long and separated links with a 3 // Μ gap. Groups can be parallel to X or The gap vector on the y-axis is configured. 常 Often, multiple groups will be found to be collinear, and at the end of a group, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied at the paper scale 507120 A7 ____B7__ V. Description of the invention (>) 4 Then there are only 2 or 3 "gap" between the beginning of the group. At other times, the collinear group will be separated by hundreds of microns. General DRAM chips A group of links with an extended configuration with hundreds of wafers across the wafer. The above-mentioned utility patent application discloses a high-performance χ-y stage for placing a group of semiconductor wafers under a stationary laser beam. The χ-y stage is required to achieve the many high-speed movements required to process an area of the wafer. Usually the χ-y stage is limited by position, velocity, acceleration, and voltage conditions. The position limit is the limit of the stage travel. The rate limitation may be due to being used Limits for placing sensing elements at the stage and / or limits imposed by the type of bearing used. Acceleration limits are usually current limits that can be used to drive the stage due to considerations of motor, amplifier or gas power supply. Voltage limits are usually Rarely occurs. Movements that require excessive voltage must be avoided to prevent saturation of the receiver. Voltage limits are generally encountered during brief high-acceleration movements. ° This stage can be executed with a relatively large number of accelerations (such as 3G). It can be moved and stopped quickly at the end of the movement. At the same time, the stage must also be operated with very high accuracy (nano-level accuracy). The combination of very high performance and the need for extreme precision creates another stage stage Restriction. Stage Easy • 2 is affected by the power level consumed by the motor coil. If the consumed power does not cause the coil temperature to rise above 2 degrees Celsius, the accuracy of the stage will be endangered. At the same time, if the spectrum content of the force applied to the stage contains a frequency higher than the frequency of the first mechanical mode of the system The level of energy will cause resonance of the mechanical components of the stage. These resonances will impair accuracy or apply Chinese National Standard (CNS) A4 specifications (210X297 mm) at the required 5 paper sizes. I- _----ml In _ ------- 1¾ clothing II (Please Please read the notes on the back before filling in this page) Printed by the Consumers ’Cooperative of the Ministry of Economic Affairs, Intellectual Property Bureau, 507120 A7 B7 V. Description of the invention (&); Before the required accuracy level is reached, additional movement is required when the move is terminated Settling time. SUMMARY It is an object of the present invention to provide an improved method and a subsystem for generating a trajectory to be followed by a motor-driven stage when a microstructure is processed at a laser processing point. In order to accomplish the above and other objects of the present invention ', a trajectory method for producing a track driven by a motor when a microstructure is processed at a laser processing point is provided. The method includes receiving reference data representing the location of the microstructure to be processed, and based on that data, determining the most possible trajectories. When at least one set of motors drives the stage according to each possible trajectory, the resulting temperature change of the at least one set of motors is estimated. The method further includes determining a set of approximately optimal trajectories from the possible trajectories, wherein the positioning accuracy of the stage is maximized by following the approximately optimal trajectories. The at least one set of motors may include at least one set of coils, and the estimation step is based on the energy consumption of each possible trajectory in the at least one set of coils.

編1 ^裝 頁I 訂 經濟部智慧財產局員工消費合作社印製 之中 圈圈 線線 組組 一 一 少少 至至 該該 據之 依線 含軌 包的 地能 步可 一 各 進在 以計 可預 驟而 步式 計模 估的 亥« 二二 口 反Part 1 ^ Page I Orders Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed in the middle circle line groups, one by one, to as few as the number of the line can be included. Predictable and step-by-step model estimation

估 該 中 其 且 並 段 片 移 。 個 驟數 步多 之含 升包 上以 度可 溫線 起軌 引的 斤 匕匕 月 肯 量可 能各 耗 AN 消 量 匕匕 會 中 圈 線 組 ! 少 至 該 。 之 台 段 級 片-y 動 X 移 組 各 一 在 是 計 以 估 可 含 。 台 包驟級 聚 庐 亥 mir 三一 口 步的 L— CN I準 標 家 國 國 I中 一用 |適 度 張 一紙 本 |釐 公 經濟部智慧財產局員工消費合作社印製 507120 A7 ______B7 五、發明説明(屮) E亥估si*步驟可以估s十當馬達依據各可能的軌線驅動X -y級台時多數個馬達所導致之溫度改變。 該微構造可以被置放於被支撐於級台之半導體晶圓的 多數個空間分離的切片上。 微構造可以是晶片導線。 該晶片可以是半導體記憶體元件並且其中該導線將在 處理點上被消融以修補元件有缺陷的記憶胞。 至少一組可能的軌線可以具有一組加速度/減速曲線。 爲進一步完成上面的目的以及本發明之其他目的’一 稽用以產生當於雷射處理點處理微構造時被馬達驅動級台 循行的軌線子系統被提供。該子系統包含用以接收代表將 /£該處理點被處理之微構造的位置之參考資料之裝置’以 及依據該資料用以決定多數個可能的軌線之裝置。該子系 統也包含估計當至少一組馬達依據各可能的軌線驅動級台 時所導致的至少一組馬達之溫度改變的裝置。該子系統進 -步地包含一種用以從可能的軌線決定一組大致最佳軌線 之裝置,其中級台之定位精確度利用循行該大致最佳軌線 Π'ίϊ被最大化。 該至少一組馬達可包含至少一組線圈並且其中之估計 装置對於各可能的軌線估計在該至少一組線圈中被消耗的 該估計裝置可以包含該至少一組線圈之熱量反應模式 以預計對於各可能的軌線而在該至少一組線圈中消耗之能 ㊆所引起之溫度上升。 7 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ---------¾衣------1T------0 (請先閱讀背面之注意事項再填寫本頁) 507120 A7 B7 五、發明説明(S ) 各可能的軌線可以包含多數個移動片段並且其中估計 裝置估計在各移動片段之至少一組線圈中的能量消耗。 估計裝置可以估計當馬達依據各可能的軌線驅動x_y 級台時,所導致之多數個馬達溫度改變。 本發明之上面的目的以及其他的目的、特點、和優點 可以參照附圖自下面本發明之最佳模式的詳細說明而瞭 解。 圖形之槪要說明 第1圖是依據本發明展示主要子系統之一種記憶體修 補系統之詳細分解方塊圖; 第2圖是一種具有軌線資料流程之系統結構圖; 第3圖是一組範例圖示,其展示包含許多晶片、晶片 位置、鏈路群組以及參考區域被定位以形成一參考表面之 相關區域的一種晶圓處理位置; 第4圖是一種在晶片位置之內將被處理之倂排晶片鏈 路列之分解圖; 第5圖是各種移動片段型式之分解圖; 第6圖展示相對於時間之振幅以及展示移動片段之脈 波/行程曲線的圖形; 第7圖是相對於時間之振幅以及展示移動片段之脈波/ 脈波曲線的圖形;以及 第8圖是相對於時間之振幅以及展示移動片段之停止/ 跳躍/開始之曲線的圖形。 較佳實施例之詳細說明 8 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X297公釐) ---------裝-- (請先閱讀背面之注意事項再本頁)It is estimated that it should be moved in parallel. The number of steps in a few steps includes the monthly weight of the daggers that are lifted by the degree of warmth on the lifting bag. Each consumption of the AN consumption daggers will be in the circle line group! As little as it should be. Each of the stage-level films-y-movement X-shift groups is counted to be inclusive. The bag is gathered at Luhaimir in three steps. L-CN I quasi-standard home country and country I used in primary school | moderately printed on paper | printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the employee consumer cooperative 507120 A7 ______B7 V. Description of the invention (i) The Ei estimation step can estimate the temperature change caused by most motors when the motor drives the X-y stage according to each possible trajectory. The microstructure can be placed on a plurality of spaced apart slices of a semiconductor wafer supported on a stage. The microstructure can be a chip wire. The wafer may be a semiconductor memory element and wherein the wire will be ablated at a processing point to repair a defective memory cell of the element. At least one set of possible trajectories may have a set of acceleration / deceleration curves. In order to further accomplish the above object and other objects of the present invention, a trajectory subsystem for generating a trajectory tracked by a motor-driven stage when processing a microstructure at a laser processing point is provided. The subsystem includes a device for receiving reference data representing the microstructured location where the processing point will be processed, and a device for determining a plurality of possible trajectories based on the data. The subsystem also includes means for estimating changes in temperature of the at least one group of motors as the at least one group of motors drives the stage according to each possible trajectory. The subsystem further includes a device for determining a set of approximately optimal trajectories from possible trajectories, in which the positioning accuracy of the stage is maximized by following the approximately optimal trajectories. The at least one set of motors may include at least one set of coils and the estimation device therein estimates for each possible trajectory the consumption in the at least one set of coils. The estimation device may include a thermal response pattern of the at least one set of coils to predict the Each possible trajectory causes a temperature rise due to energy consumed in the at least one set of coils. 7 This paper size applies to China National Standard (CNS) A4 (210X297 mm) --------- ¾ clothing ------ 1T ------ 0 (Please read the note on the back first Please fill in this page again for details) 507120 A7 B7 V. Description of the invention (S) Each possible trajectory can contain a plurality of moving segments and wherein the estimation device estimates the energy consumption in at least one set of coils of each moving segment. The estimation device can estimate the temperature change of most of the motors when the motor drives the x_y stage according to each possible trajectory. The above and other objects, features, and advantages of the present invention can be understood from the following detailed description of the best mode of the present invention with reference to the drawings. Explanation of the figure: Figure 1 is a detailed exploded block diagram of a memory repair system showing the main subsystems according to the present invention; Figure 2 is a system structure diagram with a trajectory data flow; Figure 3 is a set of examples A diagram showing a wafer processing location containing a number of wafers, wafer locations, link groups, and reference areas positioned to form a relevant area of a reference surface; Figure 4 shows a wafer processing location within the wafer location An exploded view of a row of chip rows; Fig. 5 is an exploded view of various types of moving segments; Fig. 6 shows the amplitude with respect to time and a graph showing the pulse / stroke curve of the moving segments; Fig. 7 is relative to The amplitude of time and the graph showing the pulse / pulse curve of the moving segment; and Figure 8 is the graph of the amplitude with respect to time and the curve showing the stop / jump / start of the moving segment. Detailed description of the preferred embodiment 8 This paper size is applicable to China National Standard (CNS) A4 specification (210 X297 mm) --------- installed-(Please read the precautions on the back before this page)

、1T 夢丨 經濟部智慧財產局員工消費合作社印製 507120 A7 B7 五、發明説明(b ) 種雷射處理系統 般指示爲110,展示於第1圖 為濟部智慧財產局員工消費合作社印製 品圓4被置放在雷射處理系統110之內並且來自使用者界 面Π之資料庫資訊被提供以確認被消融以修補缺陷的記 憶胞之晶圓4上的鏈路(第3圖中之33)。 資料庫資訊被軌線規劃器12以及DSP爲主的控制器 15、16所使用並結合移動級台6、7,校準以定義軌線產 ΐ器之移動片段,該軌線產生器利用雷射、聚焦光學、以 及x-y級台6、7之操作被執行並且被定座標以消融鏈路, 如上面所示之實用性申請。這些操作包含以較佳高速精確 性級台6、7控制x-y移動並且當雷射產生脈衝時同時置放 光學元件以使處理雷射光束之中間細窄部分與鏈路33座 標同位。 所有的記憶體修補系統包含一些動態機構用以提供在 品圆表面以及焦點的平面之間的相對移動。在某些情況 中,這可能包含利用沿著Z軸移動以控制相對於固定高度 圯學通道之晶圓4的晶片高度。另外,本動作可以採用以 ”逐步"方式移動聚焦鏡片以便與來自現場的晶片之聚焦資 料所導出之深度位置同位。 藉由本系統,晶圓之全部的高度保持固定並且最後物 鏡的鏡片高度被線性伺服機構以及光學盒子1 8之控制器 1 4、1 7所控制。使用精確性置放系統於z-軸移動之較佳配 跨的鏡片或者光學元件的定位提供大約0.1 V m之z-軸解 析度或者更細微並在一般大約3 mm的移動最大範圍時具有 大約爲150Hz的3分貝”小信號”頻寬。 批衣-- (請先閲讀背面之注意事項再填寫本頁) 、?τ 線· 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 507120 A7 _____B7 五、發明説明(1 ) ”軌線規劃器” 1 2被採用以與移動系統6、7、1 7和相 關的DSP爲主的控制器16設計晶圓4之通道以及光束的 中間細窄部分位置5。軌線規劃器合倂來自使用者界面1 1 以及對齊系統(後者一般被裝設於精確性級台,例如,晶圓 級台)之資訊,該資訊係被使用於定義相對於座標系統中之 冃標的雷射處理點。該資訊從資料庫被導出,產生一組” 鏈路圖”、選擇、以及其他關於記億體修補操作相關的資 料。 熟習於移動控制以及估計之技術人員將了解高速記憶 體修補處理系統中精確的三度空間置放之容限預計需求。 在最大範圍是大約300mm或者更多之行程中,零點幾微米 相當於最新晶圓之整個面積。高於50毫米/秒的處理或者" 切割速率”是有利的。同時,美國專利Νο·6,144,1 18,茲配 合爲參考,詳細說明一種較佳晶圓置放系統。 經濟部智慧財產局員工消費合作社印製 接著參看第3圖,鏈路熔斷之系統一般將需要處理(亦 即雷射熔損)晶圓4上大量鏈路34之子集33。定義將被處 理之晶片鏈路的資訊被提供至控制程式。該程式依次將定 邊一些環繞將被處理之晶片3 5的一組參考位置32,亦即 -組晶片位置。該位置一般將包含足夠數量之點數以依據 移動系統控制所產生之命令,如上面所提到的實用性申請 之說明,而精確地定義晶圓以及鏡片系統循行之軌線。 產牛雷射脈波 雷射處理光束一般係由Q-切換YAG雷射所提供,該 雷射具有預定的脈波寬度、重覆速率、以及波長,如美國 10 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 導利第5,998,759號所披露。一組控制信號20被供應至雷 射以產生與晶片和鏡片之連續放置配合的一組脈波。熟習 於該技術之人員將會認識雷射之同位以及移動將很可能被 目舜間的或者累計的位置錯誤所複合。在較佳實施例中,調 整先前”安排”的雷射脈波之一組可調整放射延遲被包含以 補償此類位置錯誤。此更正之時間解析度最好是十億分之 秒或者更少。最好是,該完全錯誤更正是被一組"軌跡 向量"所定義,其將總計位置錯誤轉換爲延遲。這軌跡向 量可以被包含於轉換矩陣中,該矩陣被操作地連接到控制 器以動態地關連座標系統。 接著參看第2圖,軌線產生是指定、表示、並且實現 連續移動通道之程序。對於此處說明之系統而言,需要同 Φ化移動中的級台以及雷射發射,以至於各鏈路會被射擊 於中心。軌線產生結構展示於第2圖。光束移動是利用計 算來自應用資料之片段;來自片段之設定點;以及來自設 定點之伺服命令而被達成。 這機構中最主要功能性項目爲規劃器、產生器、以及 插入器。規劃器利用分析特定領域資料,例如:鏈路圖以 及修補資料而構成級台之通道。這模組之輸出是一組軌 線;一組移動片段之列表,各移動片段選擇性地與控制片 段配合。 當雷射束和將被處理鏈路之三維度座標被決定時,一 組移動控制程序採用第1圖之軌線規劃器或者產生器1 2 以便有效地處理目標結構。 ______11 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 507120 A7 B7 五、發明説明(气) 接著參看第4圖和第5圖,在較佳系統中,加速度和 速率曲線是與下面的’’移動片段”型式相關: 1. PVT(位置/速率/時間)片段1 10。其被使用於加速 至所需的位置以及速率。行經這片段所需的時間是選擇性 的:如果不被指定,最小時間會被計算出。 2. CVD(固定-速率/距離)片段Π1。這型式僅具有單 一純量規定··片段之通道長度。光束在指定距離內以固疋 速率移動。該速率係被先前片段的終止點所指定。程序控 制一般係在CVD片段時被執行。 3. CVT(固定·速率/時間)片段。這是與CVD片段相 同,但是係片段之持續被指定而非其長度。 4. 停止片段Π 3。這片段沒有規定·其儘可能快速地 停止級台。 ”損毀”代表雷射脈波之發射以切斷鏈路Π4。 再者,”停止’’片段終止移動,最好是儘可能地快速。 程序控制以及鏈路熔斷通常與固定速率片段相關。 在較佳系統中,加速度以及速率曲線被與DSP爲主的 伺服控制器1 6結合以產生晶片x-y移動。沿著光軸之鏡片 轉變與X,y移動配合,以至於當雷射產生脈衝時光束中 問細窄部分將被置放於晶片目標位置。光束中間細窄部分 之z座標可以在晶圓上任何兩組結構之間動態地被調整, 包含配置在單一晶片之同一列(沿著x或者y方向)上的相 鄰結構。例如,鏈路熔斷之Z-軸增量解析度(最小的高度 差量),最好大約是O.lym並具有大約0.05//m之限制。 12 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再1T dream 丨 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507120 A7 B7 V. Description of the invention (b) The general indication of the laser processing system is 110, which is shown in Figure 1. It is printed by the Consumer Cooperatives of the Ministry of Economics and Intellectual Property Bureau Circle 4 is placed within the laser processing system 110 and database information from the user interface Π is provided to confirm the link on wafer 4 (33 in Figure 3) that is ablated to repair the defective memory cell. ). The database information is used by the trajectory planner 12 and the DSP-based controllers 15 and 16 and combined with the mobile stage 6 and 7 to calibrate to define the mobile segment of the trajectory generator. The trajectory generator uses laser The operations of, focusing optics, and xy-stages 6, 7 are performed and coordinated to ablate the links, as shown in the practical application above. These operations include controlling the x-y movement with better high-speed accuracy stages 6 and 7 and simultaneously placing optical elements when the laser generates pulses so that the middle narrow portion of the processing laser beam is co-located with the 33 coordinate of the link. All memory repair systems include dynamic mechanisms to provide relative movement between the circular surface and the plane of the focal point. In some cases, this may include using a movement along the Z-axis to control the wafer height of the wafer 4 relative to a fixed height tunnel. In addition, in this action, the focusing lens can be moved in a "step-by-step" manner so as to be at the same position as the depth position derived from the focus data of the wafer from the scene. With this system, the entire height of the wafer remains fixed and the lens height of the objective lens is finally The linear servo mechanism and the controller 1 of the optical box 18 are controlled by the controllers 1, 4 and 17. The positioning of the lens or optical element with a better placement spanning the z-axis using the precision placement system provides a z- of approximately 0.1 V m Axis resolution or more subtle and has a "signal" bandwidth of 3 decibels at approximately 150 Hz at a maximum movement range of approximately 3 mm. Batch-(Please read the precautions on the back before filling this page),? τ line · This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 × 297 mm) 507120 A7 _____B7 V. Description of the invention (1) "Trajectory planner" 1 2 is used in conjunction with mobile systems 6, 7, 1 7 The relevant DSP-based controller 16 is used to design the channel 4 of the wafer 4 and the position of the narrow middle part of the beam 5. The trajectory planner combines the user interface 1 1 and the alignment system (the latter one Information that is installed on an accuracy level stage, such as a wafer level stage, that is used to define laser processing points relative to targets in the coordinate system. This information is derived from the database to generate a set of "Link diagrams", selections, and other information related to the operation of the memory repair. The technicians who are familiar with the movement control and estimation will understand the estimated demand for the accuracy of the three-dimensional space placement in the high-speed memory repair processing system. In strokes with a maximum range of approximately 300 mm or more, a few tenths of a micrometer is equivalent to the entire area of the latest wafers. Processing above 50 mm / s or " cutting rate " is advantageous. At the same time, U.S. Patent No. 6,144,118 is incorporated herein by reference for a detailed description of a preferred wafer placement system. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Referring next to Figure 3, a system with a broken link will generally need to process (ie, laser fuse) a large subset 33 of links 34 on the wafer 4. Information defining the chip link to be processed is provided to the control program. The program will in turn define a set of reference positions 32 around the wafer 35 to be processed, that is, a set of wafer positions. The location will generally contain a sufficient number of points to precisely define the trajectory of the wafer and lens system according to the commands generated by the mobile system control, as described in the utility application mentioned above. Cattle laser pulsed pulsed laser beams are generally provided by Q-switched YAG lasers. The lasers have a predetermined pulse width, repetition rate, and wavelength. For example, the US 10 paper standards are applicable to Chinese national standards ( CNS) A4 specification (210X297 mm) disclosed in No. 5,998,759. A set of control signals 20 are supplied to the laser to generate a set of pulse waves that cooperate with the continuous placement of the wafer and lens. Those skilled in this technology will recognize that laser parity and movement will likely be compounded by interpositional or cumulative position errors. In the preferred embodiment, adjusting one of the previously "arranged" sets of laser pulses to adjust the radiation delay is included to compensate for such positional errors. The time resolution for this correction is preferably in parts per billion or less. Preferably, this complete error correction is precisely defined by a set of " track vectors " which converts the total position error into a delay. This trajectory vector can be contained in a transformation matrix that is operatively connected to a controller to dynamically correlate the coordinate system. Referring next to Fig. 2, the trajectory generation is a procedure for designating, representing, and realizing continuous moving channels. For the system described here, it is necessary to synchronize the moving stage and laser emission so that each link will be fired at the center. The trajectory generation structure is shown in Figure 2. The beam movement is achieved by calculating segments from the application data; set points from the segments; and servo commands from the set points. The main functional items in this organization are planner, generator, and inserter. The planner uses the analysis of data in specific areas, such as link maps and patching data to form channels for the stage. The output of this module is a set of trajectories; a list of moving clips, each of which is selectively matched with the control clip. When the laser beam and the three-dimensional coordinates of the link to be processed are determined, a set of motion control programs uses the trajectory planner or generator 12 of Figure 1 to efficiently process the target structure. ______11 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 A7 B7 V. Description of the invention (Gas) Then refer to Figure 4 and Figure 5. In the preferred system, the acceleration and velocity curves are the same as The following "moving clip" patterns are relevant: 1. PVT (position / rate / time) clip 1 10. It is used to accelerate to the desired position and speed. The time required to travel through this clip is optional: if If not specified, the minimum time will be calculated. 2. CVD (Fixed-Rate / Distance) segment Π1. This type has only a single scalar rule. The segment channel length. The beam moves at a fixed rate within a specified distance. The rate is specified by the end point of the previous segment. Program control is generally performed during the CVD segment. 3. CVT (fixed rate / time) segment. This is the same as the CVD segment, but the duration of the segment is specified and It is not its length. 4. Stop segment 3. This segment is not specified. It stops the stage as quickly as possible. "Destroyed" represents the emission of a laser pulse to cut the link Π4. Furthermore, "Stop" Fragment termination moves, preferably as fast as possible. Program control and link blowout are usually associated with fixed-rate segments. In the preferred system, the acceleration and velocity profiles are combined with a DSP-based servo controller 16 to generate the chip x-y movement. The lens transition along the optical axis is coordinated with the X, y movement, so that when the laser generates a pulse, the narrow part of the beam will be placed at the target position of the wafer. The z-coordinate of the narrow part of the beam can be dynamically adjusted between any two groups of structures on the wafer, including adjacent structures arranged in the same column (along the x or y direction) of a single wafer. For example, the Z-axis incremental resolution (minimum height difference) of the link fusing is preferably about O.lym and has a limit of about 0.05 // m. 12 This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before

#f 經濟部智慧財產局員工消費合作社印製 507120 A7 B7 五、發明説明(L0 在系統之內的通道規劃所涉及的問題如下:給予啓始 的以及最後的位置和速率(向量)規定,找到可以滿足終止 點條件以及對於位置封包、最大速率、最大加速度和最大 電壓之限制的”最佳"軌線。 該最佳軌線使軌線”成本"減到最少。對於所給予的軌 線之”成本"係指軌線時間以及馬達線圈中被消耗的能量之 加權總和。時間之加權係數永遠是一單位(1.0)。能量之加 權係數是變數。 許多軌線可以滿足所需的終止點條件並滿足系統限 制。但是,與多種解法相關的成本可具有大規模的變動性。 本發明之演算法找到最佳解(最低的”成本”)並且使用該軌 線以便執行移動。 考慮一組簡單範例。在進行記憶體修補時時常遭遇的 軌線之規定稱爲”合倂”。雷射處理需要沿著鄰近的兩組短 線片段。該片段是共線的並且該片段以相同固定速率被處 理 組間隙存在於共線的片段之間 組”CV”片段可以 (請先閱讀背面之注意事項再填寫本頁) 裝· 、訂 被使用於越過間隙(亦即,使用與先前片段相同速率之固定 速率片段)。另外,間隙可以利用短暫的加速度/減速曲線 以稍微較少的時間被越過。CV解法之成本僅是越過間隙(距 離/速率)所需的時間,因爲CV片段中沒有能量消耗。然 而,加速度/減速曲線將會需要較少的時間但更大的能量消 耗。在這情形中,最佳選擇取決於能量消耗相對於成本函 數之時間的相對加權。 移動曲線 13 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 線 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 507120 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(U ) 軌線片段包含一組或者更多的區間。一組區間被定義 爲一組軌線子集,其中加速度受限制爲兩組變數之預定函 數:APK(峰値加速度振幅)以及Tint(區間之持續期間)。加 速度曲線之型式爲擺線式或者諧波式。因爲型式被預定, 僅需要振幅以及持續期以便在軌線區間時完全地指定移 動。 軌線是由一序列之連續的(時間、位置、速率、加速度 以及搖動)區間所構成,各區間具有可變化的持續以及加速 度振幅(可能爲零)。應注意到一組CV(固定速率)軌線片段 是一組具有ΑΡΚ = 0之單一區間。 第1圖之系統達成一組連續軌線而形成一組單一移動 曲線。單一移動曲線可以持續許多秒並且包含上百的軌線 片段。一般需要多重區間以滿足軌線片段之終止點規定。 區間一般可說明爲對應至”航行”或者”脈波"之"C”或者 ΠΡ”。一組C-片段具有ΑΡΚ = 0的特徵。一組P·片段具有非 零的A P K。 在先前給予的合倂範例中,航行解法包含一組單一 "C” 區問,而加速/減速解法是一組"P-P"解決辦法。其他的片 段組合是處理第1圖之系統所需的多種軌線規定所需的: (C、CP、PC、PP、PCP、PPPP、PPCPP)。 並非所有的解法型式都可應用於所給予的軌線片段。 例如,包含不同的啓始以及最後速度(Viovf)之軌線片段 便無法以C區間被滿足。 解決策略 14 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) Τ: Γ’--衣-- (請先閱讀背面之注意事項再^Γ本頁) 訂 507120 A7 B7 五、發明説明(\> ) k濟部智慧財產局員工消費合作社印製 CVT或者CVD片段之解法是簡單的(指定時間或者距 離之零加速度)。因爲時間被指定而能量消耗爲零,所以沒 有進行最佳化。CV片段將不進一步地討論。 PVT軌線片段之解決辦法較爲複雜。解決辦法包含下 面的步驟: 1. 分解向量規疋成爲X以及y軸規定。 2 · 分別找到各軸之最小成本解決辦法。 3 ·取得最緩慢軸之時間並且找到”迅速"軸之解決辦 法,那取決於相同”緩慢M經過時間的最小成本。 單一軸之最小成本解決辦法包含下面的步驟: 1 · 找到各有關的解決辦法型式(亦即,C、P、P C、C P、 等等)之最佳解決辦法。 2. 在多重形式之間選擇最佳解決辦法(如果多重解決 辦法存在)。 能量之相對成本被變數Kp所控制。Kp被使用於成本 公式,如下所示: 成本=Τ + Ε/Κρ 應注意到,Kp具有功率的維度。這提供選擇Kp之直 15 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ;_批衣-- (請先閱讀背面之注意事項再填寫本頁) 線 507120 A7 B7 五、發明説明(0 ) 覺的準則。如果Kp被設定爲大的,則消耗之能量的成本 便爲小的。產生之解決辦法將爲最小時間。反之,設定ΚΡ 爲小會使得能量”昂貴”,並且因此解決辦法將往往會以時 問爲代價來使功率最小化。 因爲Κρ是變數,它可被動態地設定。第1圖之系統 利用這能力以進一步地控制功率消耗(並且因此改進精確 度)。在生產操作時,一序列必須循行之軌線片段被提供至 通道規劃演算法。通道規劃演算法決定將在各移動片段時 被消耗之能量。使用線圈之熱量反應的簡單第一階模式, 通道規劃演算法將預料由軌線之能量消耗歷史引起的溫度 丨:升。 在包含許多短的加速度片段之軌線片段中,估計的溫 度可能會比所需的溫度上升更多。通道規劃演算法接著將 減低Κρ値以使移動最佳化解決辦法偏向較低的功率區 問。相反地,當估計的溫度上升非常小時,通道規劃演算 法將增加Κρ。 經濟部智慧財產局員工消費合作社印製 以真正的記憶體修補資料所達成之模擬揭示時間相對 於能量之相對成本的動態調整減小馬達溫度之變化。第1 岡系統之精確度對於溫度之改變速率相當敏感(但是並非特 別對於任何特定的溫度敏感)。級台溫度變化之主要來源係 軌線引起的馬達消耗功率之變化。以估計溫度之函數動態 地調整Κρ顯著地減低變化並且產生較高的精確性。 當執行一般的記憶體修補軌線時,馬達中功率消耗之 位準會受到Κρ強大的影響。但是,系統之全部產量是Κρ 16 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 507120 A7 B7 五、發明説明(ΐψ 的弱函數。因此,馬達消耗引起之級台誤差的構成要素可 以有效地以對於全部產量之較小影響的方式而被控制。因 爲χ-y級台顯著地快於競爭性提供,這形式之精確控制可 以被達成而於市場接受度不造成太大影響。 解決優點 最佳化多脈衝解決辦法提供下面的優點: 座續平穩的移動 通道規劃演算法允許以最少的停止在x-y平面上連續 地移動。移動曲線不受限於任何位置中斷以及所有搖動引 起之導數(加速度之導數)。這因而限制施加至級台之力量 的頻譜內容,因而減低級台以及支援結構之機械共振的激 (請先閱讀背面之注意事項再填寫本頁) 勵 減低功率消耗 軌線爲最佳化(依據時間相對於功率消耗之相對重要 訂 性) 消耗之最小變化 利用控制Kp爲預期馬達溫度之函數,一種減低溫度 變化並且因而增加精確性之簡單裝置被實現。 鏈路最佳化 如先前所述,將被切割之指定鏈路順序很少是引導鏈 路切割程序之最佳順序。此處說明之演算法重新安排鏈路 也且因而達成減少:1)執行時間;2)馬達功率消耗;以及 3)施加至系統之力量的頻譜內含。減低執行時間導致系統 之較高生產率。減低馬達功率消耗改進系統之精確度。藉 17 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 線 經濟部智慧財產局員工消費合作社印製 507120 A7 _____B7 五、發明説明(\<) 由避免可能會導致置放錯誤之結構上共振的激勵,減低力 t的頻譜內含改進精確度以及產量。 演算法則是依據習知的’’旅行銷售員"問題而被模式 化。但是,在這情況中,令人關心的是視察各鏈路群組之 成本的最小化而不是僅視察各群組之時間的最小化。分類 演算法同時也方便地處理一些限制先前記憶體修補系統之 性能的特殊情況以及條件。 第1圖之系統一般是以單一"處理點"處理多重晶片。 系統之範圍尺寸可以允許多達六個或者八個64M DRAM晶 片同時被處理。這過程稱爲多晶片對齊(MDA)。MDA之使 用利用將處理晶圓所需的對齊操作之數目從一晶片一次減 低至一處理點一次而提供了顯著的產量改進。對齊操作之 進行可能需要如單一晶片之鏈路切割大約相同的時間。 MDA引介另一機會以利用鏈路重新安排而改進產量。 相鄰晶片之鏈路群組可以是共線性的。處理共線群組而無 介於中間的PVT移動片段(亦即,加速/減速片段)通常是最 好的解決辦法。鏈路分類演算法考慮處理點之內所有群組 以便找到最佳序列。 經濟部智慧財產局員工消費合作社印製 演算法 演算法如下所示: 1. 聚集所有處理點之內需要被處理的鏈路群組。這 時常包含讀取具有修補資料之"修補檔案",如展示於第2 阔,並且可能進行轉換顧客資料格式成爲將被切割鏈路之 内部表不。 ___18 本紙張尺度適用中國國家標準(CNS ) A4規格(210X;297公釐) 507120 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明uw) 2.聯合相鄰群組。當讀取將被切割鏈路群組之列表 時’ ”聯合”相鄰群組成爲"聚集"。相鄰群組如果是共線的 便被聯合,群組可以在相同速率下被處理並且在一群組之 結束點和接著群組的開始點之間的間隙大於最小尺度並小 於最大尺度。 3 _確認”邊緣”群組。如果一聚集的結束點太靠近級 台封包之實際限制,則級台便無法具有足夠之加速度以全 速處理群組並且在”撞擊"級台行程之界限前停止。該聚集 利用將所有”鄰近”邊緣的鏈路排定至新的聚集並讓剩餘者 存留在原始的聚集而被切割成爲兩組聚集。新的較低的速 率被指定至邊緣聚集,以至於級台才能具有足夠空間以在 新的群組之最後鏈路以及級台行程之實際限制間的距離之 內達到新的切割速率。 4. 分類該聚集。分類的輸入是具有(任意的)方向指 定至各聚集的聚集(任意地)排序之列表。(方向指的是聚集 中之鏈路將被橫越的方向,向前或者向後)。分類處理之輸 出是一組以新的方向指定至各群組的相同鏈路群組之新的 序列。該重新被排序之列表爲最佳化。 5 . 處理該群組。該群組的排序列表被輸入至通道規 剷演算法。該群組以前述使用越過整組鏈路之單一連續的-移動軌線的順序被處理。 邊緣聚集 處理發生接近於行程界限之群組是任何記憶體修補系 統的一項挑戰。停止所需的距離爲速率平方的函數以及加 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) --------—装------、玎------0 (請先閱讀背面之注意事項再填寫本頁) 507120 A7 _______B7_ 五、發明説明) 速度的倒數。第1圖之系統中,在設計x-y級台時採用一 種折衷辦法以限定在使用者行程範圍的終端以及行程的實 際限制之間可用的’’過度行程’’數量。限定被選擇爲χ-y級 台之馬達設計最佳化的一部份。 如果級台是以最大切割速率(15〇毫米/秒)在使用者封 包之邊緣行進,則在使用者封包之邊緣以及行程之實際限 制(大約200 //M)之間的限制距離並不足以讓級台停止。一 組解決辦法爲減低最大切割速率以確保級台永遠都可以停 止。這是不需要的,因爲無必要增加內部鏈路群組之處理 時間。另一解決辦法爲對於整個聚集採用較低之速率。這 同時也不必要地增加處理時間。 此處採用之解決辦法爲使最小數目之鏈路接受較低的 速率限制。原始的聚集在並未接受減低之速率限制的第一 鏈路被分割而無視於原始的群組界線發生之位置。再者, 指定至”邊緣”鏈路之速率被選擇作爲標稱速率之整數的分 (1 /η)。一組範例將有助於解釋這機構的優點。 假設原始的群組具有4//Μ之鏈路間隙。而且,假設 使用中特定雷射所允許的最大Q_速率爲每秒20,000脈波。 處理時的最大速率將是80毫米/秒。對於接受最大速率30 米/秒平方管制的簡諧加速度曲線,級台將需要_200 // Μ以 便停止(或從停止到達切割速率)。假設群組中的一些鏈路 充分接近於使用者封包之邊緣,則該鏈路將需要較低的切 割速率。被選擇予原始聚集斷片之實際的速率將依據最小 値η被選擇’以至於新的速率將等於原始的速率除以η。 20 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公羞) (請先閱讀背面之注意事項再^^本頁) 、1Τ 經濟部智慧財產局員工消費合作社印製 ,經濟部智慧財產局員工消費合作社印製 507120 A7 ______B7 五、發明説明() 該η値利用從2開始並且增加直至產生速率足夠小以處理 聚集斷片中之最後的鏈路(最接近邊緣)並且級台保有足夠 之停止距離而被互動地獲得。 僅以V/n處理這聚集斷片將導致雷射發射速率被減低 至Q/n(這範例中,Q = 20,000)。這可能會對於那些接受不 同雷射Q-速率之斷片中的鏈路產生鏈路切割品質之不良變 化。這變化在介紹"損毀·每·間隙"(bpp)之觀念的演算法中 被消除。一般情形下,bpp= 1且雷射對各級台移動間隙發 射一次。當斷片以V/ri被處理時,bpp被設定爲η。第1 圖之系統辨識這參數並且以等於n*(V/n)/p = V/p = Q之固定 速率發射雷射。系統"假想"有n-1組"幽靈"鏈路同樣分佈 在每組自然鏈路之間。這迫使雷射Q_速率與被使用於所有 其他鏈路的Q-速率相同並且確保所有的鏈路都有一致的切 U1]品質 ° 演算法進一步達成影響接近使用者封包之邊緣的鏈路 之一種最佳化。鏈路分類演算法包含一組參數(T_settle), 它指定在群組之第一鏈路之前級台應該以切割速率持續多 久。一般而言,PVT片段(亦即,級台之加速/減速發生的 片段)將在CV片段(亦即,級台速率是固定並且雷射切割 發生的片段)之前。如果T_Settle被設定爲零,則將被切割 之第一鏈路會準確地發生在PVT片段之結束點以及CV片 段的開始處。在一些情況中,級台在缺乏任何安頓時間之 下無法充份地安頓至所需的精確性位準。這可能導致群組 中最先少數的鏈路的雷射誤置。 ______21 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇χ297公釐) --------— 装------1Τ------0 (請先閱讀背面之注意事項再填寫本頁) 507120 A7 ______B7 五、發明説明(^ ) T_settle參數可被使用以預先-擴展標稱CV片段至等 於V*T_settle之距離。這給予級台一些安頓時間並且以少 量的產量成本改進系統精確度。該參數一般是幾毫秒。 非零値的T_Settle値影響”邊緣”鏈路之處理。延伸CV 片段以容納T_Settle僅施加於片段之開始。演算法可任意 選擇切割一組鏈路群組之較佳方向。如果一組邊緣群組從 邊緣開始並且朝向封包內部移動而被處理,則容納T_settle 所需要之距離(D_settle)將進一步減低從0加速至V/n所需 要之距離。因爲第一鏈路位置被固定,這意味著將需要施 加一組更低的速率至群組,如果它是被”往內”處理。 如果群組被"往外"處理(級台正好在行程的實際限制之 前停止),D_settle距離會將鏈路朝向級台封包之內部延 伸,而不迫使進一步地降低斷片之切割速率。 明顯地,以"向外的M方向處理邊緣聚集斷片似乎是可 以使切割速率增加至最大限度。情況並非永遠如此。分類 演算法的功能是尋找最佳方向。 將聚集分類 經濟部智慧財產局員工消費合作社印製 分類從一開始位置(Pi)開始。這位置對應於位置對齊 操作結束時所抵達之最後位置(通常接近位置的角落)°開 始速率(Vi)被假設爲零。 分類演算法以兩組可能方向各決定處理所有’’可用的’’ 聚集之成本。成本的計算如下所示: 成本= Tpvt + Epvt/Kp + Tcvt 其中: __ 22 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部智慧財產局員工消費合作社印製 507120 Μ ____Β7_ 五、發明説明(>^ )#f Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Consumer Cooperatives 507120 A7 B7 V. Explanation of the Invention (L0 The channel planning within the system involves the following issues: give the initial and final position and rate (vector) regulations, find The "best" trajectory that meets the termination point conditions and limits on location packets, maximum speed, maximum acceleration, and maximum voltage. This optimal trajectory minimizes the "cost" of the trajectory. For the given trajectory The "cost of line" refers to the weighted sum of the time of the trajectory and the energy consumed in the motor coil. The weighting factor of time is always a unit (1.0). The weighting factor of energy is a variable. Many trajectories can meet the needs End point conditions and meet system constraints. However, the costs associated with multiple solutions can have large-scale variability. The algorithm of the present invention finds the best solution (the lowest "cost") and uses the trajectory to perform the movement. Consider A set of simple examples. The trajectory rule often encountered when performing memory repair is called "combination". Laser processing needs to follow Adjacent two sets of short-line segments. This segment is collinear and the segment is processed at the same fixed rate. Group gaps exist between collinear segments. Group "CV" segments are OK (please read the notes on the back before filling this page) The equipment is used to cross the gap (that is, using a fixed rate segment at the same rate as the previous segment). In addition, the gap can be crossed in a little less time using a short acceleration / deceleration curve. The cost of the CV solution is only Is the time required to cross the gap (distance / rate) because there is no energy consumption in the CV segment. However, the acceleration / deceleration curve will take less time but greater energy consumption. In this case, the best choice depends on Relative weighting of the time of energy consumption relative to the cost function. Movement curve 13 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Ministry of Economic Affairs Intellectual Property Bureau Employee Consumption Cooperative 507120 A7 B7 Ministry of Economy Wisdom Printed by the Consumer Cooperatives of the Property Bureau V. Invention Description (U) The track fragment contains a group or More intervals. A set of intervals is defined as a set of trajectory subsets, where acceleration is limited to a predetermined function of two sets of variables: APK (peak acceleration amplitude) and Tint (duration of interval). Type of acceleration curve It is trochoidal or harmonic. Because the pattern is predetermined, only the amplitude and duration are required to fully specify the movement during the trajectory interval. The trajectory is a series of continuous (time, position, velocity, acceleration and shaking) ) Interval, each interval has a variable duration and acceleration amplitude (may be zero). It should be noted that a set of CV (fixed rate) trajectory segments is a set of single intervals with APK = 0. The system of Figure 1 Reach a set of continuous trajectories to form a set of single moving curves. A single moving curve can last many seconds and contain hundreds of trajectory segments. Multiple intervals are generally required to meet the termination point requirements for trajectory segments. Intervals can generally be described as corresponding to "navigation" or "pulse C" or Π ". A set of C-segments has the feature of APK = 0. A set of P · segments has a non-zero APK. Previously In the example given, the navigation solution contains a single set of "C" zones, while the acceleration / deceleration solution is a set of "P-P" solutions. The other segment combinations are required to handle the various trajectory regulations required by the system in Figure 1: (C, CP, PC, PP, PCP, PPPP, PPCPP). Not all solution types are applicable to the given trajectory segment. For example, trajectory segments containing different start and final velocities (Viovf) cannot be satisfied in the C interval. Solution 14 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Τ: Γ '-clothing-(Please read the precautions on the back before ^ Γ this page) Order 507120 A7 B7 V. Invention Explanation (\ >) The solution for printing CVT or CVD fragments by the Consumer Cooperatives of the Ministry of Economic Affairs and Intellectual Property Bureau is simple (zero acceleration at specified time or distance). Because time was specified and energy consumption was zero, no optimization was performed. CV fragments will not be discussed further. The solution to the PVT trajectory segment is more complicated. The solution includes the following steps: 1. Decompose the vector gauge into X and y axis specifications. 2 · Find the minimum cost solution for each axis separately. 3. Take the slowest axis time and find a "quick" axis solution, which depends on the same "slow" minimum cost of elapsed time. The minimum cost solution for a single axis consists of the following steps: 1. Find the best solution for each type of solution (ie, C, P, PC, CP, etc.). 2. Choose the best solution between multiple forms (if multiple solutions exist). The relative cost of energy is controlled by the variable Kp. Kp is used in the cost formula as follows: Cost = T + Ε / Κρ It should be noted that Kp has the dimension of power. This provides the choice of Kp straight 15 paper sizes applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm); _ approved clothing-(Please read the precautions on the back before filling this page) Line 507120 A7 B7 V. Invention Explain (0) the criteria of perception. If Kp is set to be large, the cost of energy consumed is small. The resulting solution will be minimal. Conversely, setting Kp to be small would make the energy "expensive", and therefore the solution would often be to minimize power at the cost of time. Because Kρ is a variable, it can be set dynamically. The system of Figure 1 uses this capability to further control power consumption (and therefore improve accuracy). During production operations, a sequence of track segments must be provided to the channel planning algorithm. The channel planning algorithm determines the energy that will be consumed during each moving segment. Using the simple first-order mode of the thermal response of the coil, the channel planning algorithm will predict the temperature caused by the energy consumption history of the trajectory: rise. In a trajectory segment containing many short acceleration segments, the estimated temperature may rise more than required. The channel planning algorithm will then reduce Kρ 値 to bias the mobile optimization solution towards lower power areas. Conversely, when the estimated temperature rise is very small, the channel planning algorithm will increase κρ. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics. Simulations achieved with real memory patching data reveal the dynamic adjustment of the relative cost of time to energy to reduce changes in motor temperature. The accuracy of the No. 1 system is quite sensitive to the rate of change of temperature (but not particularly sensitive to any particular temperature). The main source of stage temperature change is the change in motor power consumption caused by trajectory. Dynamically adjusting Kp as a function of estimated temperature significantly reduces variation and produces higher accuracy. When performing general memory repair trajectory, the power consumption level in the motor will be strongly affected by κρ. However, the total output of the system is κρ 16 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 A7 B7 V. Description of the invention (ΐψ is a weak function. Therefore, the composition of the stage error caused by motor consumption Factors can be effectively controlled in a way that has a small impact on overall output. Because χ-y stages are significantly faster than competitive provision, this form of precise control can be achieved without much impact on market acceptance Solution Advantages The optimized multi-pulse solution provides the following advantages: The stable moving channel planning algorithm allows continuous movement on the xy plane with minimal stops. The movement curve is not limited to any position interruption and all shaking Derivative (derivative of acceleration). This limits the frequency content of the force applied to the stage, thereby reducing the excitation of the mechanical resonance of the stage and supporting structure (please read the precautions on the back before filling this page) to reduce power consumption. The trajectory is optimized (depending on the relative importance of time relative to power consumption) By using the control Kp as a function of the expected motor temperature, a simple device that reduces temperature variations and thus increases accuracy is implemented. Link Optimization As previously mentioned, the designated link sequence to be cut is rarely the guide link The optimal sequence of cutting procedures. The algorithm described here rearranges the links and thus reduces: 1) the execution time; 2) the power consumption of the motor; and 3) the frequency content of the force applied to the system. Reduced execution time leads to higher productivity of the system. Reduce motor power consumption and improve system accuracy. Borrowing 17 This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507120 A7 _____B7 V. Inventive Note (\ <) It may cause placement errors by avoiding The structural resonance excitation reduces the spectrum of the force t to improve accuracy and yield. The algorithm is modeled according to the conventional 'travel salesman' problem. However, in this case, what is of interest is the minimization of the cost of inspecting each link group rather than the minimization of the time of inspecting only each group. The classification algorithm also conveniently handles special cases and conditions that limit the performance of previous memory repair systems. The system of Figure 1 generally processes multiple wafers with a single " processing point ". The system's range size allows up to six or eight 64M DRAM wafers to be processed simultaneously. This process is called multi-wafer alignment (MDA). The use of MDA provides significant yield improvements by reducing the number of alignment operations required to process a wafer from one wafer at a time to one processing point at a time. The alignment operation may take approximately the same time as a single wafer dicing. MDA introduces another opportunity to take advantage of link rearrangement to improve yield. Link groups of adjacent chips may be collinear. Processing collinear groups without intervening PVT moving segments (ie, acceleration / deceleration segments) is usually the best solution. The link classification algorithm considers all groups within the processing point in order to find the best sequence. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economics The algorithm is as follows: 1. Aggregate the link groups that need to be processed within all processing points. This often includes reading the "repair file" with the repair data, as shown in the second frame, and may convert the customer data format into an internal representation of the link to be cut. ___18 This paper size applies the Chinese National Standard (CNS) A4 specification (210X; 297 mm) 507120 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention uw) 2. Joint adjacent groups. When reading the list of link groups to be cut, the 'joint' neighboring groups become " aggregate ". Adjacent groups are combined if they are collinear. Groups can be processed at the same rate and the gap between the end point of a group and the start point of a subsequent group is larger than the minimum scale and smaller than the maximum scale. 3 _Confirm the "Edge" group. If the end point of an aggregation is too close to the actual limit of the stage packet, the stage cannot have enough acceleration to process the group at full speed and stop before the limit of the "impact" stage stroke. The aggregation uses the "all" proximity The link at the edge is scheduled to the new aggregate and the remainder stays in the original aggregate and is cut into two sets of aggregates. The new lower rate is assigned to the edge aggregate so that the stage has enough space to The new cutting rate is reached within the distance between the last link of the new group and the actual limit of the stage travel. 4. Classify the aggregation. The input to the classification is an aggregation with (arbitrary) direction assigned to each aggregation (arbitrary) (Ground) Sorted list. (Direction refers to the direction in which the links in the aggregation will be traversed, forward or backward.) The output of the classification process is a group of identical link groups assigned to each group in a new direction. The new sequence of the group. The reordered list is optimized. 5. Process the group. The sorted list of the group is entered into the channel gauge algorithm. The group uses the previously described The order of a single continuous-moving trajectory across the entire set of links is processed. Edge aggregation processing occurs as a group close to the stroke limit is a challenge for any memory patching system. The distance required to stop is a function of the square of the rate And the size of this paper is applicable to Chinese National Standard (CNS) A4 specification (210X297mm) ---------- install ------, 玎 ------ 0 (Please read the Please fill in this page again for attention) 507120 A7 _______B7_ V. Description of the invention) The reciprocal of speed. In the system of Figure 1, a compromise method is adopted when designing the xy stage to limit the end of the user's travel range and the actual limit of the travel The number of "overstrokes" that can be used between. Limits the part of the motor design optimized for the χ-y stage. If the stage is at the maximum cutting rate (15 mm / sec) at the user The edge of the packet travels, the limit distance between the edge of the user's packet and the actual limit of the stroke (about 200 // M) is not enough to stop the stage. One set of solutions is to reduce the maximum cutting rate to ensure the stage Can always Stop. This is not necessary because there is no need to increase the processing time of the internal link group. Another solution is to use a lower rate for the entire aggregation. This also unnecessarily increases the processing time. This is used here The solution is to make the minimum number of links accept the lower rate limit. The original aggregation is split on the first link that did not accept the reduced rate limit regardless of where the original group boundary occurred. Furthermore, specify The rate to the "edge" link is chosen as a fraction of the nominal rate (1 / η). A set of examples will help explain the advantages of this mechanism. Assume that the original group has a 4 // M link Gap. Also, assume that the maximum Q_ rate allowed for a particular laser in use is 20,000 pulses per second. The maximum rate during processing will be 80 mm / s. For a simple harmonic acceleration curve that accepts a maximum rate of 30 m / s squared, the stage will need _200 // Μ to stop (or reach the cutting rate from stopping). Assuming that some links in the group are sufficiently close to the edge of the user packet, the link will require a lower cut rate. The actual rate selected for the original aggregated fragment will be selected based on the minimum 値 η so that the new rate will be equal to the original rate divided by η. 20 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 public shame) (Please read the notes on the back before ^^ this page), 1T Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative, Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 507120 A7 ______B7 V. Invention Description () The η 値 utilization starts from 2 and increases until the generation rate is small enough to handle the last link (closest to the edge) in the aggregated fragment and the stage is kept adequate Stop distance and get interactively. Processing this aggregated fragment only at V / n will cause the laser emission rate to be reduced to Q / n (in this example, Q = 20,000). This may cause poor changes in link cut quality for links in segments that accept different laser Q-rates. This change is eliminated in the algorithm that introduces the concept of "damage. Every gap" (bpp). Under normal circumstances, bpp = 1 and the laser is fired once at each stage's moving gap. When the slice is processed at V / ri, bpp is set to η. The system in Figure 1 recognizes this parameter and emits a laser at a fixed rate equal to n * (V / n) / p = V / p = Q. The system " imaginary " has n-1 groups of " ghost " links are also distributed between each group of natural links. This forces the laser Q_rate to be the same as the Q-rate used on all other links and ensures that all links have a consistent U1 cut.) The quality algorithm further achieves the effect of affecting links near the edge of the user packet. An optimization. The link classification algorithm includes a set of parameters (T_settle), which specifies how long the stage should last at the cutting rate before the first link in the group. In general, the PVT segment (i.e., the segment where acceleration / deceleration of the stage occurs) will precede the CV segment (i.e., the segment where the stage rate is fixed and laser cutting occurs). If T_Settle is set to zero, the first link to be cut will happen exactly at the end point of the PVT segment and the beginning of the CV segment. In some cases, the stage cannot fully settle to the required level of accuracy without any settling time. This may cause laser misplacement of the first few links in the group. ______21 The size of this paper is applicable to Chinese National Standard (CNS) A4 (21〇297 mm) ---------- installed ------ 1T ------ 0 (Please read the Note: Please fill in this page again) 507120 A7 ______B7 V. Description of the invention (^) The T_settle parameter can be used to pre-expand the nominal CV segment to a distance equal to V * T_settle. This gives the stage some settling time and improves system accuracy with a small amount of production cost. This parameter is usually a few milliseconds. A non-zero T_Settle () affects the processing of "edge" links. Extend the CV segment to accommodate T_Settle applied only to the beginning of the segment. The algorithm can arbitrarily choose the preferred direction for cutting a group of link groups. If a group of edge groups is processed starting from the edge and moving towards the inside of the packet, the distance required to accommodate T_settle (D_settle) will further reduce the distance required to accelerate from 0 to V / n. Because the first link position is fixed, this means that a lower set of rates will need to be applied to the group if it is processed "inwardly". If the group is processed "out" (the stage stops just before the actual limit of the stroke), the D_settle distance will extend the link towards the inside of the stage packet without forcing a further reduction in the cutting rate of the fragment. Obviously, processing the edge-gathering fragments in the " outward M direction seems to maximize the cutting rate. This is not always the case. The function of the classification algorithm is to find the best direction. Gathering and sorting Printing and sorting of employee cooperatives by the Intellectual Property Bureau of the Ministry of Economy starts from the beginning position (Pi). This position corresponds to the last position (usually near the corner of the position) reached at the end of the alignment operation. The starting rate (Vi) is assumed to be zero. The classification algorithm determines the cost of processing all the 'available' aggregates in two possible directions. The calculation of the cost is as follows: Cost = Tpvt + Epvt / Kp + Tcvt where: __ 22 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507120 Μ ____ Β7_ V. Description of the invention (> ^)

Tpvt爲自(Pi ; Vi)移動至群組開始之時間;Tpvt is the time from (Pi; Vi) to the start of the group;

Epvt爲在移動時馬達線圈中之能量消耗:Epvt is the energy consumption in the motor coil when moving:

Kp爲被施加至馬達能量之加權係數(功率單位);以及Kp is the weighting factor (power unit) applied to the motor energy; and

Tcvt爲完成CV片段所需的時間。 對於各聚集而言,移動被假設爲開始於(Pi; Vi)。各 聚集有兩組成本數値被計算出-各方向一組。不同方向的成 本可能顯著地不同。 稱爲N_level之參數被使用於控制分類演算法。如果 N_level被設定爲1,則展示最低成本的聚集/方向組合被 選擇爲第一處理聚集。它從”可用的”聚集列表被移除並且 被置於”程序列表”的開頭。開始位置(Pi : Vi)被更新以便 反映處理第一聚集之終止時達到的位置以及(非零)速率。 分類演算法重新計算所有可用的聚集/方向之成本。應 注意到由於顯著不同的開始狀況,決定於第二級台之成本 與被獲得於第一級台的成本沒有任何關聯。非零開始和結 束速率對於成本之影響可能不明顯。從可用群組中選擇最 低成本聚集/方向組合的程序執行直至沒有可用聚集爲止。 參數N_level控制最佳聚集順序的搜尋範圍。在上面 所給予的範例中,N_level被設定爲1,選擇最佳聚集/方 向以便處理之結果不被考慮。選擇最佳聚集很可能導致依 序聚集之較低效率的順序。 除了找到最好的解決辦法之外,如果該選擇的所有結 果可被探測,則可以做出真正最佳選擇。那麼,考慮所有 的結果,最佳解決辦法即被選擇。 --------1¾衣------、玎------0 (請先閱讀背面之注意事項再填寫本頁)Tcvt is the time required to complete the CV fragment. For each aggregation, the movement is assumed to start at (Pi; Vi). Each aggregation has two sets of cost figures-one for each direction. Costs in different directions can be significantly different. A parameter called N_level is used to control the classification algorithm. If N_level is set to 1, the aggregation / direction combination that exhibits the lowest cost is selected as the first processing aggregation. It is removed from the "Available" aggregate list and placed at the beginning of the "Program List". The starting position (Pi: Vi) is updated to reflect the position reached at the end of processing the first aggregation and the (non-zero) rate. The classification algorithm recalculates the cost of all available aggregations / directions. It should be noted that due to the significantly different starting conditions, there is no correlation between the cost determined by the second stage and the cost obtained by the first stage. The impact of non-zero start and end rates on costs may not be significant. The procedure of selecting the lowest cost aggregation / direction combination from the available groups is performed until no aggregation is available. The parameter N_level controls the search range of the best aggregation order. In the example given above, N_level is set to 1, and the best aggregation / direction is selected so that the processing result is not considered. Choosing the best aggregation is likely to result in a less efficient order of sequential aggregation. In addition to finding the best solution, if all the results of that choice can be detected, a truly best choice can be made. Then, considering all the results, the best solution is chosen. -------- 1¾ Clothing ------, 玎 ------ 0 (Please read the precautions on the back before filling in this page)

507120 A7 __________ B7 五、發明説明(Μ ) 例如,假設開始時有十組(1 0)需要分類之聚集。二十 組(20)聚集/方向之啓始組合的成本將被考慮。我們可以從 這二十組列表中選擇最佳五組(例如)。接著,這五組列表 進一步地被檢查。對於五組中之各組而言,將考慮尙未被 處理的十八組(18 = 2* 9)聚集。從這列表,選擇最好的五組 並且對於十六組(16 = 2 *8)聚集考慮五組中之各組。接著, 最好五組被選自這列表且其餘聚集被考慮。這程序繼續直 至沒有未被分類的聚集爲止。接著計算最先五組聚集之各 組總和成本。總和的成本是利用選自所有基本聚集選擇的 最佳解決辦法之成本的總和而被獲得。之後,一組聚集被 選擇並且可再次在剩餘組集中重複全部處理程序。 顯然地,對於大量的聚集而言,這徹底的搜尋以便找 到最佳聚集在計算上是非常昂貴。一般具有多重晶片位置 之修補資料可能在十組聚集至上百的聚集的範圍內。對於 具有許多聚集之位置而言,徹底的搜尋會過分耗時。 幸運地,真正修補資料之經驗指示詳盡徹底的搜尋在 1-位準深度(N_leVel=l)搜尋時的好處很小。如果N_level 被設定爲3(例如),則搜尋將在3-位準被執行。 經濟部智慧財產局員工消費合作社印製 應注意到連續的搜尋位準僅於第一位準之後在最佳Μ 聚集(Μ = 5,如上所述)被達成。雖然這可能導致次佳順序 被選擇的機會,但是與”不適當的"第一選擇相關的額外成 本無法被有益的結果(在依序的搜尋位準上發現)所彌補。 有一組性質上的論據可支援在Μ或者NJevel是大數 値時分類法則不獲益的試驗性觀測。對於一般的修補資 24 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 507120 經濟部智慧財產局員工消費合作社印製 A7 __ B7 五、發明説明(>>) 料,級台將花費總計時間的80%至90%之間在CV片段中 發射雷射。重新安排資料並未影響CV處理時間。重新安 排使PVT時間(少量)最佳化並且可對於被消耗的能量具有 顯著的影響。但是’一旦可用聚集的"適當"通道被發現 (N__level=l),設定N_level爲2或者3僅會導致少數百分 比的進一步節省時間。將分類進行至最大位準導致比在 N_level = 3時有極小改進。 雖然N_level之大數値僅有少量的改進’以N_level 在1至3範圍內之分類對於能量消耗以及頻譜內容具有顯 著的影響。分類法則找機會節省動量(因爲如果節省動量’ 則沒有能量被消耗)。例如’當相鄰晶片之兩組聚集可被處 理而無介於中間的pvt片段時’級台動量便被節省。相鄰 鏈路群組時常出現。分類將找到一組平穩的移動曲線,它 從一組列中鏈路群組的結束點轉移至另列中鏈路群組的開 始點。這平穩的曲線一般是比傳統進行轉移於三組級台: 停止、跳躍、開始的曲線更快速,消耗較少的能量並且具 有更低的頻譜內容。 最後,一組範例將展示爲何選擇處理邊緣鏈路群組之 方向並非永遠明顯的。考慮聚集在+X邊緣位置之末端。 假設原始的聚集必須被分爲兩組而產生聚集斷片。如果該 斷片聚集於+X方向被處理,相較於如果它由於T_settle 的衝擊而於方向被處理,它可以較高的速率被處理。在 聚集分類(假設N_leve】 = l)時,假定選擇原始的聚集以+χ 方向處理。在接著的分類法則中,處理斷片之成本利用假 (請先閱讀背面之注意事項再填寫本頁) •裝‘ 訂 線 m I -I 1 i - · 25_ 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 507120 A7 B7 五、發明説明(>>) 經濟部智慧財產局員工消費合作社印製 定+X處理以及-X處理而被決定。成本將依據方向之函數 的不同可達成速度而考慮CV片段中時間差量。但是,斷 片無法以如先前聚集之相同速率被處理。在先前聚集(原始 的聚集,現在被切割)的結束點以及斷片間時常不具有足夠 的距離以允許級台減速至+X斷片速率。試圖以循行原始 的聚集之+X橫越的+X方向處理斷片的相關成本導致迅速 的減速(從原始的聚集)至_x速率,接著增速至較低的+X 速率以越過該位置。 於-X方向越過斷片之成本時常較少,因爲級台能夠進 行較平穩的轉移(亦即較低的能量消耗)以停止於接近封包 末端並且接著增速至較低的速率(-X方向)以即時抵達聚集 斷片之最外面鏈路。加權之能量節省(E/Kp)時常比增加之 Tcv時間更顯著。 解決辦法之利益 聚集分類在與先前實施的比較中展示下列利益: 1. 演算法考慮跨越過整個位置的鏈路。這導致在分 類被以晶片接晶片準則達成時無法被實現的最佳化(節省動 量之機會)被實現。 2 演算法明確地考慮到接近封包邊緣之群組並且以 僅接受致動機構限制之最有效的方式處理它們。 3. 演算法考慮到啓始及最後速度以及在一組群組的 結束點和接著群組的開始點之間的距離。這使得附近群組 的合倂爲明確。先前的演算法會僅依據預置距離準則合倂 附近的群組。選擇適當的距離臨限以合倂成爲非常重要議 26 本紙張尺度適用中國國家標準(CNS ) A4規格(2】0X297公釐) (請先閱讀背面之注意事項再H本頁) 裝. 訂 線 507120 A7 B7 五、發明説明(y+) 題。在演算法中,合倂任何附近的群組之唯一動機是爲了 減低需要被分析之聚集的數目。這導致較先前的演算法更 短的合倂距離之選擇(亦即,不合倂相隔大於X之群組)。 分類將連續放置"未合倂”聚集,並可能在群組之間以PVT 片段替代CV片段。亦即,如果啓始”聚集"級台並未合倂 聚集,則它們仍然可以被分類步驟所合倂。 < 4. 相反地,’’未合倂”聚集可能在序列外較易被處理。 當所檢視之軌線是由於分類具有對應於處理點之四組角落 的四組不同的開始位置開始之相同資料所產生時,這成爲 明顯的。 5 . 演算法內含地減低與處理點相關的頻譜內容以及 能量消耗。因爲功率消耗被包含於成本公式中,最佳化處 理成本導致較低的能量消耗。較不顯著的或許是相同最佳 化導致較長持續之較少加速度脈波。 片段計劃 多重脈波曲線是過度受限制的-曲線的參數比邊界條件 更多。在許多情況中,可以使用多於一組脈波以及行程之 組合來調適於邊界條件;對於單一組合而言,也許有無限 數之解決辦法。 簡要地參考特定的區間組合,脈波以P代表,而行程 以C代表;例如,脈波/航行/脈波片段將被稱爲PCP。當 相關時,吾人將會在最小時間將被計算("Μ ”),以及時間 被指定("Τ")的情況之間區別。例如,可以具有PCP-Μ以 及PC Ρ-Τ解決辦法,但事實上,它們是完全不同。 27 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) ,—辦衣-- (請先閱讀背面之注意事項再填寫本頁)507120 A7 __________ B7 V. Description of the Invention (M) For example, suppose that there are ten groups (10) at the beginning that need to be classified. The cost of the initial set of twenty (20) clusters / directions will be considered. We can select the best five groups from this list of twenty groups (for example). These five sets of lists are then examined further. For each of the five groups, eighteen groups of untreated (18 = 2 * 9) clusters will be considered. From this list, select the best five groups and consider each of the five groups for a group of sixteen groups (16 = 2 * 8). Next, preferably five groups are selected from this list and the remaining aggregations are considered. This process continues until there are no unclassified aggregates. Then calculate the total cost of each group of the first five groups. The sum of the costs is obtained using the sum of the costs of the best solution selected from all the basic aggregation options. After that, one set of aggregates is selected and all processing procedures can be repeated again in the remaining set. Obviously, for a large number of aggregates, this thorough search to find the best aggregate is computationally very expensive. Patch data with multiple wafer locations may range from ten clusters to hundreds of clusters. For locations with many clusters, a thorough search can be time consuming. Fortunately, the experience of truly patching the data indicates that exhaustive searches at 1-level depth (N_leVel = l) are of little benefit. If N_level is set to 3 (for example), the search will be performed at the 3-level. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs It should be noted that the continuous search level is reached only after the first level at the optimal M-aggregation (M = 5, as described above). Although this may lead to the opportunity for the next best order to be selected, the additional costs associated with "inappropriate" first choices cannot be made up for by beneficial results (found at sequential search levels). There is a set of properties The argument can support experimental observations that the classification rule does not benefit when M or NJevel is a large number. For general repair capital 24 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 Ministry of Economic Affairs Printed by A7 __ B7 of Intellectual Property Bureau Employee Cooperatives V. Invention Description (> >) It is expected that the stage will spend between 80% and 90% of the total time to launch lasers in CV clips. Rescheduling the data did not Affects CV processing time. Rescheduling optimizes PVT time (small amount) and can have a significant impact on the energy consumed. But 'once available " appropriate " channels are found (N__level = l), set N_level Being 2 or 3 results in only a small percentage of further time savings. Carrying the classification to the maximum level results in a small improvement over N_level = 3. Although the number of N_level is large Only a few improvements' Classification with N_level in the range of 1 to 3 has a significant impact on energy consumption and spectrum content. The classification rules look for opportunities to save momentum (because if you save momentum ', no energy is consumed). For example,' Dangxiang The two sets of clusters on adjacent wafers can be processed without intermediate pvt fragments, and 'stage' momentum is saved. Groups of adjacent links often appear. Classification will find a set of smooth moving curves, which starts from a set of columns The end point of the middle link group is transferred to the start point of another middle link group. This stable curve is generally transferred to three groups of stages than the traditional one: stop, jump, and start curves are faster and consume less. And has lower spectrum content. Finally, a set of examples will show why the direction of choosing to deal with edge link groups is not always obvious. Consider clustering at the end of the + X edge position. Assume that the original clustering must be divided into Two groups produce aggregated fragments. If the fragment is aggregated and processed in the + X direction, compared to if it is processed in the direction due to the impact of T_settle, it can High rate is processed. When clustering classification (assume N_leve] = l), it is assumed that the original clustering is selected to be processed in the + χ direction. In the following classification rule, the cost of processing fragmentation is false (please read the precautions on the back first) (Fill in this page again.) • Binding 'm1 -I 1 i-· 25_ This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 A7 B7 5. Description of the invention (> >) Economy The Ministry of Intellectual Property Bureau employee consumer cooperatives set up + X processing and -X processing and are determined. The cost will take into account the time difference in the CV segment according to the different speeds of the direction function. However, fragments cannot be processed at the same rate as previously gathered. The end point of the previous gather (the original gather, now cut) and the fragments often do not have enough distance between them to allow the stage to decelerate to + X fragment rate. The associated cost of attempting to process the fragment in the + X direction of the original aggregate and the + X traversal resulted in a rapid deceleration (from the original aggregate) to the _x rate, and then increased to a lower + X rate to cross the position . The cost of crossing the fragment in the -X direction is often less, because the stage can make a smoother transfer (that is, lower energy consumption) to stop near the end of the packet and then increase to a lower rate (-X direction) To reach the outermost link of the aggregate segment in an instant. Weighted energy savings (E / Kp) are often more significant than increased Tcv time. Benefits of the solution Aggregation classification shows the following benefits in comparison with previous implementations: 1. The algorithm considers links that span the entire location. This results in optimizations (opportunities to save momentum) that cannot be achieved when the classification is achieved with the wafer-to-wafer criteria. 2 The algorithm explicitly considers groups near the edge of the packet and treats them in the most efficient way that only accepts the limits of the actuating mechanism. 3. The algorithm takes into account the start and end velocities and the distance between the end point of a group and the start point of a subsequent group. This makes the combination of nearby groups clear. Previous algorithms combined nearby groups based on preset distance criteria only. It is very important to choose an appropriate distance threshold to meet the requirements. 26 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2) 0X297 mm. (Please read the precautions on the back before H page). Binding. 507120 A7 B7 V. Explanation of invention (y +). In the algorithm, the only motivation for combining any nearby groups is to reduce the number of aggregates that need to be analyzed. This leads to the choice of shorter combined distances (i.e., groups that are not separated by more than X) than previous algorithms. The classification will be continuously placed " uncombined " aggregates, and CVT fragments may be replaced with PVT segments between groups. That is, if the initial " aggregated " stage is not aggregated, they can still be classified The steps are combined. < 4. Conversely, "uncombined" clustering may be easier to process outside the sequence. When the track being reviewed starts because the classification has four different start positions corresponding to the four sets of corners corresponding to the processing point This becomes obvious when the same data is generated. 5. The algorithm inherently reduces the spectrum content and energy consumption associated with the processing point. Because power consumption is included in the cost formula, optimizing the processing cost results in lower energy Consumption. Less significant may be that the same optimization results in longer sustained pulses with less acceleration. Segment planning multiple pulse curves are overly restricted-the curve has more parameters than boundary conditions. In many cases, it is possible Use more than one set of pulse wave and stroke combinations to adjust to the boundary conditions; for a single combination, there may be an infinite number of solutions. Briefly refer to a specific interval combination, the pulse wave is represented by P, and the stroke is represented by C ; For example, the pulse / navigation / pulse segment will be called PCP. When relevant, we will be calculated at the minimum time (" Μ "), and the time is The difference between the case of a given ("; Τ & quot). For example, there can be PCP-M and PC P-T solutions, but in fact they are completely different. 27 This paper size applies to China National Standard (CNS) Α4 specification (210X297 mm),-clothing-(Please read the precautions on the back before filling this page)

、1T 線 經濟部智慧財產局員工消費合作社印製 507120 A7 ______B7五、發明説明(/) 經濟部智慧財產局員工消費合作社印製 許多不同的區間組合,或者結構型式,將被製作。如 果吾人不具備一般解’ 一些邊界條件之設定將具有無限多 之解。有時,多於一組型式會解決邊界條件。在那些情況 中,便會選擇最低成本之解法。對於各型式,-M以及-T 兩種解法皆會被製作。目前被解決之型式是: *第6圖之脈波/行程:這產生C、P、CP、以及PC片 段。 *第7圖之脈波/脈波:這產生pp以及PCP片段。脈 波具有相同加速度振幅但是相反的符號;脈波時間是獨立 的。如果第一脈波之結束點的速率超過最大値,則最高速 率之航行區間被使用,而形成一 PCP片段。 *第8圖之停止/跳躍/開始:這也被稱爲一種Z移動。 這產生一組PPCPP片段並且-T解法同時可產生一組 PPCPCP片段。如果沒有其他的解法合適的話,這是最後 的解法。其包含立即的停止、PCP點對點移動且停止至"級 台之點”,以及接著最後脈波以增速至最後位置和速率。 這片段型式一般會比其他的型式需要更多的時間以及 更多的能量。但是,觀察位置限制會使之對於少數,最好 不常的邊界條件集是重要的。 解決所給予的多軸PVT片段之策略如下所示: 1 .得到各軸之最小時間移動(亦即,解決軸-M問題)。 從這些時間挑選最大的。使用被指定的時間(軸-T)解法解 決其他的軸。 下面的序列被使用於解決最小時間以及指定時間兩者 28 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再本頁〕 -裝. -丁 · 、-'口 線 507120 A7 B7 五、發明説明(vb) 問題: 1 ·試圖設計一組PC以及PP片段;保留一組各型式 之最佳可行的解法列表。 如果有可行的解法,則以挑選具有最低成本的一 ili ' 3. 如果到目前爲止沒有可行的解法,則設計一組停 !丨:/跳躍/開始移動。 可行性檢查包含數値的檢查,例如,區間時間是非負 數的,以及實際的檢查,例如,電壓、速率、和位置限制 卜被違背。 下面的圖表是對於擺線式以及諧波式多脈波加速度所 Θ出公式之摘要。 (請先閱讀背面之注意事項再填寫本頁) -裝· 、-2'口 線 •經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 29 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 507120 A7 B7 五、發明説明(>rp 經濟部智慧財產局員工消費合作社印製Line 1T Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507120 A7 ______B7 V. Invention Description (/) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Many different combinations of sections, or structural types, will be produced. If we do n’t have a general solution, some boundary conditions will have infinite solutions. Sometimes more than one set of patterns will resolve the boundary conditions. In those cases, the lowest cost solution is chosen. For each type, both -M and -T solutions will be made. The currently resolved types are: * Pulse / Stroke in Figure 6: This produces C, P, CP, and PC segments. * Pulse / Pulse in Figure 7: This produces pp and PCP fragments. Pulses have the same acceleration amplitude but opposite signs; pulse times are independent. If the speed at the end point of the first pulse exceeds the maximum threshold, the navigation zone with the highest speed is used to form a PCP segment. * Stop / Jump / Start in Figure 8: This is also called a Z-movement. This produces a set of PPCPP fragments and the -T solution can simultaneously produce a set of PPCPCP fragments. If no other solution is appropriate, this is the last solution. It includes immediate stop, PCP point-to-point movement and stop to the "level of the stage", and then the last pulse to increase to the final position and velocity. This fragment type generally takes more time and more than other types. More energy. However, observing position constraints will make it important for a few, preferably infrequent, boundary condition sets. The strategy for solving the given multi-axis PVT segment is as follows: 1. Get the minimum time movement of each axis (Ie, solve the axis-M problem). Pick the largest from these times. Use the specified time (axis-T) solution to solve the other axes. The following sequence is used to solve both the minimum time and the specified time. Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before this page) -Packing. -Ding ·, -'mouth line 507120 A7 B7 V. Description of invention (vb) Question : 1 · Try to design a set of PC and PP fragments; keep a list of the best feasible solutions of each type. If a feasible solution is available, choose the one with the lowest cost. So far, there is no feasible solution, so design a set of stop! 丨: / jump / start to move. The feasibility check includes the check of the number, for example, the interval time is non-negative, and the actual check, such as voltage, rate, And the position limit are violated. The following chart is a summary of the formula for the cycloidal and harmonic multi-pulse acceleration Θ. (Please read the precautions on the back before filling this page) -installed, -2 ' Mouthline • Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs X Consumption Cooperatives 29 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 A7 B7 V. Description of the invention (> rp Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Print

Item Cycloid Harmonic \ Acceleration IT « /4sin —r ; zos~rj ; Velocity , AT AT τγ v⑴=V ----COS~ T J! T . 1 A Λ T . 2«Tf v(f) = v ♦ 一r- --sin—* 2 4/r T Position ί p(/)= r — A . AT3 ( 2.rt 〆/)· 1 Jerk ί — ,、Ajt 711 7(0= — cosy xA . Irtt j(J)- — sin— j Single Pulse ! i 2AT Δ v -- z τ AT: Δρ* Tv, * r AJl = Γν/*~ A 丁 Δ v =—— Ar Δρ = /v, * 一--— 4 aP =Γν/ -— | 1 Stan or Stop KtiV1 Δ/7 =- H 4A Αν: Δρ=— A i PoinMo-Point ί ! Motion ί I 2 AT1 Δ/7 = K AT1 st —^一一 | Pulse Energy i 1 I εΛ[Ά 2\ Kr J -i(f) 30 本紙張尺度適用中國國家標準(CNS ) A4規格(210X29?公釐) Ί V Γ1 衣--(請先閱讀背面之注意事項再填寫本頁) 507120 A7Item Cycloid Harmonic \ Acceleration IT «/ 4sin —r; zos ~ rj; Velocity, AT AT τγ v⑴ = V ---- COS ~ TJ! T. 1 A Λ T. 2« Tf v (f) = v ♦ a r- --sin- * 2 4 / r T Position ί p (/) = r — A. AT3 (2.rt 〆 /) · 1 Jerk ί —, Ajt 711 7 (0 = — cosy xA. Irtt j (J)-— sin— j Single Pulse! I 2AT Δ v-z τ AT: Δρ * Tv, * r AJl = Γν / * ~ A Ding Δ v = —— Ar Δρ = / v, * 一- — 4 aP = Γν / -— | 1 Stan or Stop KtiV1 Δ / 7 =-H 4A Αν: Δρ = — A i PoinMo-Point ί! Motion ί I 2 AT1 Δ / 7 = K AT1 st — ^ 一一 | Pulse Energy i 1 I εΛ [Ά 2 \ Kr J -i (f) 30 This paper size applies to China National Standard (CNS) A4 specification (210X29? Mm) Ί V Γ1 clothing-(Please read the precautions on the back first (Fill in this page again) 507120 A7

裝 訂 507120 A7 B7 五、發明説明(:/|) 雖然完成本發明之最佳模式已經被詳細說明’熟悉本 )叫泪關技術者將會知道有各種不同的設計以及實踐本發 丨之Vf施例,如下面的申請專利範圍所定義。 經濟部智慧財產局員工消費合作社印製 2 3 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 507120 A7 B7 五、發明説明(y>) 作標號對照表 4......晶圓 6 ' 7......移動級台 11......使闬者界面 1 2……軌線規劃器 14' 17......控制器 15' 16......控制器 i 8......光學盒t 3 2……參考位置 3 3……鏈路子集 3 4……鏈路 ^ 5…·…品片 10……雷射處理系統 10……PVT(位置/速率/時間)片段 11……CVD(固定-速率/距離)片段 13……停止片段 14……鏈路 裝 i 線 (請先閱讀背面之注意事項再填寫本頁) ,¾濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐)Binding 507120 A7 B7 V. Description of the invention (: / |) Although the best mode for completing the present invention has been explained in detail 'familiar with this) The person called tear off technology will know that there are various designs and practices of Vf For example, as defined in the patent application scope below. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 2 3 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 507120 A7 B7 V. Description of the invention (y >) For reference, refer to Table 4 .... .Wafer 6 '7 ... mobile stage 11 ... user interface 1 2 ... trace planner 14' 17 ... controller 15 '16. .... controller i 8 ... optical box t 3 2 ... reference position 3 3 ... link subset 3 4 ... link ^ 5 ... · ... piece 10 ... laser processing system 10 ... PVT (position / rate / time) segment 11 ... CVD (fixed-rate / distance) segment 13 ... Stop segment 14 ... Link-mounted i cable (please read the precautions on the back before filling this page) , ¾ Printed by the Consumers' Cooperative of the Ministry of Economic Affairs and Intellectual Property of the People's Republic of China. The paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm).

Claims (1)

經濟部智慧財產局員工消費合作社印制衣 507120 AS B8 CS D8 夂、申請專利範圍 1· 一種供用以當在雷射處理點處理微構造物時產生 欲由馬達驅動級台循行之軌線的方法,該方法包含有: 接收參考資料,其代表在該處理點將被處理之微構造 物位置; 依據該資料而決定多數組可能的軌線; 估計當至少一組馬達依據各可能的軌線而驅動該級台 時所導致之至少一組馬達之溫度改變;以及 從可能的軌線中決定一些大致最佳軌線,其中該級台 之定位精確度利用循行該大致最佳軌線而被最大化。 2 . 如申請專利範圍第1項之方法,其中至少一組馬 .包含至少一組線圈並且其中之估計步驟是依據在至少一 組線圈中各可能的軌線之估計消耗的能量。 3 ·如申請專利範圍第2項之方法,其中該估計步驟 包含:依據對至少一組線圈之熱反應模式而預計在各可能的 軌線之該至少一組線圈中消耗能量所引起溫度上升之步 驟。 4. 如申請專利範圍第3項之方法,其中各可能的軌 線包含多數個移動片段,並且其中該估計步驟包含估計在 芥移動片段之該至少一組線圈中能量消耗的步驟。 5 .如申請專利範圍第1項之方法,其中該級台是一 稽χ-y級台。 6.如申請專利範圍第5項之方法,其中該估計步驟 佔計當馬達依據各可能的軌線驅動x-y級台時多數個馬達 所導致之溫度改變。 34 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 0l U —^ U —— I I I I ·11111111 AVI I . (請先閱讀背面之注意事項再填寫本頁) 507120 經濟部智慧財產局員工消費合作社印製 AS BS CS D8 、申請專利範圍 7 . 如申請專利範圍第1項之方法,其中該微構造物 被置放於被級台所支撐之半導體晶圓的多數個空間分離的 晶片上。 8. 如申請專利範圍第7項之方法,其中該微構造物 是晶片導線。 9. 如申請專利範圍第8項之方法,其中該晶片是半 導體記憶體元件並且其中該導線將在該處理點上被消融以 修補該元件的有缺陷記憶胞。 】〇·如申請專利範圍第1項之方法,其中至少一組可 能的軌線具有一種加速/減速曲線。 . 11. 一種當在雷射處理點上處理微構造物時產生被馬 達驅動級台循行的軌線之子系統,該子系統包含: 用以接收參考資料之裝置,其代表在該處理點上將被 處理之微構造物的位置; 依據該資料用以決定多數個可能的軌線之裝置; 用以估計當至少一組馬達依據各可能的軌線驅動級台 時所導致之至少一組馬達之溫度改變的裝置;以及 用以從該等可能的軌線中決定一組大致最佳軌線的裝 趵,其中該級台之定位精確度利用循行大致最佳軌線而被 .Μ大化。 1 2 .如申請專利範圍第1 1項之子系統,其中該至少一 組馬達包含至少一組線圈並且其中之估計裝置對各可能的 軌線估計在該至少一組線圈中被消耗的能量。 1 3 .如申請專利範圍第1 2項之子系統,其中該估計裝 35 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 507120 AS B8 CS DS 六、申請專利範圍 置包含該至少厂組線圈之一組熱量反應模型以對於各可能 的軌線預計在該至少一組線圈中消耗之能量所引起的溫度 上升。 14. 如申請專利範圍第13項之子系統,其中該等各可 能的軌線包含多數個移動片段,並且其中該估計裝置估計 在各移動片段之至少一組線圈中的能量消耗。 15. 如申請專利範圍第n項之子系統,其中該級台是 一種X - y級台。 1 6.如申請專利範圍第1 5項之子系統,其中該估計裝 置估計當馬達依據各可能的軌線驅動x-y級台時所導致之 .多數個馬達之溫度改變。 1 7 ·如申請專利範圍第1 1項之子系統,其中該等至少 一組可能的軌線具有一種加速/減速通道。 1 8.如申請專利範圍第1 1項之子系統,其中該微構造 物被置放在被級台所支撐之半導體晶圓之多數個空間分離 的晶片上。 19.如申請專利範圍第18項之子系統,其中該微構造 物是晶片導線。 2 0.如申請專利範圍第19項之子系統,其中該晶片是 半導體記憶體元件並且其中該導線在該處理點上將被消融 以便修補元件的有缺陷記憶胞。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------衣--------訂---------線 (請先閱讀背面之注意事項再填寫本頁)Printed clothing 507120 AS B8 CS D8 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 夂, patent application scope 1 · A type for producing a trajectory to be followed by a motor-driven stage when processing microstructures at a laser processing point Method, the method includes: receiving reference data, which represents the positions of microstructures to be processed at the processing point; determining multiple arrays of possible trajectories based on the data; it is estimated that when at least one group of motors is based on each possible trajectory, The temperature change of at least one set of motors caused by driving the stage; and determining some of the approximate best trajectories from the possible trajectories, wherein the positioning accuracy of the stage is determined by following the approximate best trajectory maximize. 2. The method according to item 1 of the patent application scope, wherein at least one set of horses includes at least one set of coils and the estimation step therein is based on the estimated energy consumed by each possible trajectory in the at least one set of coils. 3. The method according to item 2 of the patent application range, wherein the estimating step includes: predicting the temperature rise caused by the energy consumed in the at least one set of coils of each possible trajectory based on the thermal response pattern to the at least one set of coils step. 4. The method of claim 3, wherein each possible trajectory includes a plurality of moving segments, and wherein the estimating step includes a step of estimating energy consumption in the at least one set of coils of the moving segments. 5. The method according to item 1 of the scope of patent application, wherein the stage is an χ-y stage. 6. The method according to item 5 of the patent application, wherein the estimation step accounts for the temperature change caused by the majority of motors when the motors drive the x-y stage according to each possible trajectory. 34 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 0l U — ^ U — IIII · 11111111 AVI I. (Please read the precautions on the back before filling this page) 507120 Ministry of Economic Affairs Wisdom Printed AS BS CS D8 by the Consumer Cooperative of the Property Bureau and applied for the scope of patent 7. The method of the first scope of the patent application, wherein the microstructure is placed in a plurality of space-separated semiconductor wafers supported by the stage. On the wafer. 8. The method of claim 7 in which the microstructure is a chip wire. 9. The method of claim 8 in which the wafer is a semiconductor memory element and wherein the wire is to be ablated at the processing point to repair a defective memory cell of the element. [0] The method according to item 1 of the scope of patent application, wherein at least one set of possible trajectories has an acceleration / deceleration curve. 11. A subsystem that generates a trajectory that is followed by a motor-driven stage when a microstructure is processed at a laser processing point, the subsystem includes: a device for receiving reference materials, which is represented at the processing point The position of the microstructure to be processed; the device used to determine the most possible trajectories based on the information; used to estimate the at least one set of motors caused when the at least one set of motors drives the stage according to each possible trajectory Means for changing the temperature; and a device for determining a set of approximately optimal trajectories from among the possible trajectories, wherein the positioning accuracy of the stage is tracked using the approximately optimal trajectory. Into. 12. The subsystem according to item 11 of the scope of patent application, wherein the at least one set of motors includes at least one set of coils and the estimation device therein estimates, for each possible trajectory, the energy consumed in the at least one set of coils. 1 3. If the subsystem of item 12 in the scope of patent application, the estimated paper size of 35 papers is applicable to China National Standard (CNS) A4 (210 X 297 mm) ------------ -Install -------- Order --------- line (please read the precautions on the back before filling this page) Printed by 507120 AS B8 CS DS of the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption Cooperative The scope of the patent application includes a set of thermal response models of the at least one set of coils to predict the temperature rise caused by the energy consumed in the at least one set of coils for each possible trajectory. 14. The subsystem as claimed in claim 13, wherein each of the possible trajectories includes a plurality of moving segments, and wherein the estimation device estimates the energy consumption in at least one set of coils of each moving segment. 15. For the subsystem of item n in the scope of patent application, the stage is an X-y stage. 16. The subsystem according to item 15 of the scope of patent application, wherein the estimation device estimates the temperature change of most motors caused when the motor drives the x-y stage according to each possible trajectory. 17 • The subsystem of item 11 in the scope of patent application, wherein the at least one set of possible trajectories has an acceleration / deceleration channel. 1 8. The subsystem according to item 11 of the patent application scope, wherein the microstructure is placed on a plurality of space-separated wafers of a semiconductor wafer supported by a stage. 19. The subsystem of claim 18, wherein the microstructure is a chip wire. 2 0. The subsystem of claim 19, wherein the wafer is a semiconductor memory element and wherein the wire is to be ablated at the processing point to repair a defective memory cell of the element. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------ clothing -------- order --------- (Please read the notes on the back before filling this page)
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