TW506623U - Multi-chip ball grid array packaging structure - Google Patents

Multi-chip ball grid array packaging structure

Info

Publication number
TW506623U
TW506623U TW89222519U TW89222519U TW506623U TW 506623 U TW506623 U TW 506623U TW 89222519 U TW89222519 U TW 89222519U TW 89222519 U TW89222519 U TW 89222519U TW 506623 U TW506623 U TW 506623U
Authority
TW
Taiwan
Prior art keywords
grid array
packaging structure
ball grid
chip ball
array packaging
Prior art date
Application number
TW89222519U
Other languages
English (en)
Inventor
Hung-Li Huang
Teng-Yueh Tsai
Ming-Liang Huang
Chung-Hung Lin
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89222519U priority Critical patent/TW506623U/zh
Publication of TW506623U publication Critical patent/TW506623U/zh

Links

TW89222519U 2000-12-22 2000-12-22 Multi-chip ball grid array packaging structure TW506623U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89222519U TW506623U (en) 2000-12-22 2000-12-22 Multi-chip ball grid array packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89222519U TW506623U (en) 2000-12-22 2000-12-22 Multi-chip ball grid array packaging structure

Publications (1)

Publication Number Publication Date
TW506623U true TW506623U (en) 2002-10-11

Family

ID=27621770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89222519U TW506623U (en) 2000-12-22 2000-12-22 Multi-chip ball grid array packaging structure

Country Status (1)

Country Link
TW (1) TW506623U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235425B2 (en) 2004-02-24 2007-06-26 Kabushiki Kaisha Toshiba Semiconductor device and fabrication method for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235425B2 (en) 2004-02-24 2007-06-26 Kabushiki Kaisha Toshiba Semiconductor device and fabrication method for the same

Similar Documents

Publication Publication Date Title
SG108245A1 (en) Ball grid array interposer, packages and methods
GB2325340B (en) Ball grid array package
AU2002352865A1 (en) Ball grid array package
AU2002217987A1 (en) Thermally and electrically enhanced ball grid array packaging
SG74679A1 (en) Ball grid array type package for semiconductor device
AU2563699A (en) Low profile ball grid array package
SG120216A1 (en) Single unit automated assembly of flex enhanced ball grid array packages
GB2358957B (en) Ball grid array module
SG75154A1 (en) Plastic ball grid array package
SG114573A1 (en) Ball grid array connector
GB2368718B (en) Ball grid array package semiconductor device having improved power line routing
GB9826937D0 (en) Cavity-down ball grid array module
TW443581U (en) Wafer-sized semiconductor package structure
TW506623U (en) Multi-chip ball grid array packaging structure
TW443578U (en) Ball grid array package structure
TW411035U (en) The packaging structure of the multi-chip ball grid arrays
GB2373924B (en) Ball grid array package
TW446184U (en) Ball grid array encapsulation structure
GB0114724D0 (en) A ball grid array
TW452192U (en) Ball grid array packaging to prevent the diffusion of encapsulation
SG115323A1 (en) Enhanced reliability ball grid array package
TW438052U (en) Ball pad structure of ball grid array package
TW407795U (en) Improvement of ball grid array packaging structure
TW484751U (en) A ball grid array package for multi-chip
SG83706A1 (en) Die-pad for ball grid array package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees