TW498396B - Spin processing apparatus - Google Patents
Spin processing apparatus Download PDFInfo
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- TW498396B TW498396B TW089114952A TW89114952A TW498396B TW 498396 B TW498396 B TW 498396B TW 089114952 A TW089114952 A TW 089114952A TW 89114952 A TW89114952 A TW 89114952A TW 498396 B TW498396 B TW 498396B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
五、發明說明（i ) [發明所屬之技術] [領域]此發明是有關一種旋轉裝置藉由使基板旋轉及 噴灑處理液達成洗滌等處理之。 [習知技藝] 例如半導體裝置及液晶顯示裝置等的製造過程上， 在製造作為基板的半導體晶片或玻璃基板上形成電路時， 皆會經過成膜或攝影等流程，在這些流程上，須反覆對上 記基板進行成膜及洗淨處理。 而上記基板的洗淨處理及诜淨後的乾燥處理須使用 旋轉處理裝置。此旋轉處理裝置含有杯狀體，而此杯狀體 内部有可被驅·動旋轉之旋轉裝置。而此旋轉裝置設有固定 裳置’在此固定裝置上基板可裝卸自如的被固定在上面。 對被固定在上記固定裝置上的基板，從上方處理液 用噴嘴朝其回路成形面的上方喷灑處理液。此外，除了基 板上方之外，其下方的洗淨度有時也會被要求，此時可裝 設朝基板下方喷灑處理液之下方處理液用喷嘴。 上記基板之下方部分設置下方處理液喷嘴時，上記 杯體内設有喷頭，此喷頭中含有下方處理液用喷嘴及可吹 出氣體將處理後之基板下方吹乾之氣體用喷嘴等。 【發明所欲解決之課題】 依此構造，為處理基板下方而從下方處理液用喷嘴 中噴出之處理液的一部分，會於基板的裡側形成反射，滴 至上記喷頭上面。而滴在喷頭上的處理液會在基板進行乾 燥處理過程時’被因基板旋轉而在基板下方所產生的亂流 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 χ 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 i I I J---•訂------I--. 經濟部智慧財產局員工消費合作社印製 4 發明說明（2) 所σ人政，並附著於洗淨後的基板裡側，成為污染基板的原 因。 而本發明即是提供一種旋轉處理裝置，可使朝基板 之下方部位喷灑之處理液，即使於基板下方因反射而滴下 ’也不會殘留或附著在噴頭上面。 【解決課題之手段】 申請專利範圍第1項之發明是有關一種有關可使基板 疑轉，並可於基板之下面施以處理液之噴灑之旋轉處理裝 置此旋轉處理裝置之特徵為含有一杯體及配設於此杯體 之内。卩，可被驅動旋轉之旋轉裝置，以及裝設於此旋轉裝 置上，使上記基板可裝卸自如之固定裝置。以及包括被此 固定裝置上所ϋ定，裝設於與上記基板下方相對之喷頭， 並含有此喷頭之上方敞開而形成之凹槽。以及與凹槽相 貫通，可將滴入凹槽之處理液排出之排液裝置。 申請專利範圍第2項之發日㈣請項第_項所載之旋轉 處理裝置。其特徵為上記凹槽因敞開之噴頭由上往下口徑 見縮小而成一圓錐形（漏斗形）。 申請專利範圍第3項之發明申請項第一項所載之旋轉 處理裝置。其特徵為上記凹槽之内部設有通上下之溝槽。 申請專利範圍第4項之發明中請項第—項所載之旋轉 處理裝置。特徵為上記下部處理液用喷嘴設於上記喷頭之 凹槽内面。 申請專利範圍第5項之發明中請項第—項所載之旋轉 處理裝置。其特徵為上記下部處理液用嘴嘴，設於上記凹 A7V. Description of the invention (i) [Technology to which the invention belongs] [Field] This invention relates to a rotating device for processing such as washing the substrate by rotating the substrate and spraying the processing liquid. [Know-how] For example, in the manufacturing process of semiconductor devices and liquid crystal display devices, when a semiconductor wafer or a glass substrate is manufactured as a substrate and a circuit is formed, they all go through processes such as film formation or photography. In these processes, it must be repeated. The above-mentioned substrate is subjected to film formation and cleaning processing. For the above substrate cleaning process and drying process after cleaning, a rotary processing device is required. The rotary processing device includes a cup-shaped body, and the cup-shaped body has a rotating device that can be driven and rotated. And this rotating device is provided with a fixed position. On this fixing device, the substrate is detachably fixed on it. The substrate to be fixed to the above-mentioned fixture was sprayed with the processing liquid from above by a nozzle for the processing liquid toward the circuit forming surface. In addition, the cleaning degree below the substrate may be required in addition to the upper side of the substrate. At this time, a nozzle for a processing liquid that sprays the processing liquid below the substrate may be installed. When a lower processing liquid nozzle is provided on the lower part of the above substrate, a nozzle is provided in the upper cup body, and this nozzle includes a nozzle for the lower processing liquid and a gas nozzle for blowing out the dried substrate below the processed substrate. [Problems to be Solved by the Invention] According to this structure, a part of the processing liquid ejected from the processing liquid nozzle for processing the lower part of the substrate is reflected on the inner side of the substrate and drips onto the above-mentioned nozzle. And the processing liquid dropped on the nozzle will be turbulent flow generated by the substrate rotation under the substrate during the drying process of the substrate. The paper size applies the Chinese National Standard (CNS) A4 specification (21〇 × 297 mm) (Please read the precautions on the back before filling this page) Install i II J --- • Order ------ I--. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 Invention Description (2) Human administration, and adhesion to the back side of the cleaned substrate, became a cause of contamination of the substrate. And the present invention is to provide a rotary processing device, which can spray the processing liquid sprayed on the lower part of the substrate, even if it is dripped under the substrate due to reflection, it will not remain or adhere to the nozzle. [Means for solving the problem] The invention of item 1 of the scope of patent application relates to a rotary processing device capable of spraying a processing liquid underneath the substrate, and the rotary processing device is characterized by containing a glass body. And arranged in this cup body. Well, a rotating device that can be driven to rotate, and a fixing device installed on the rotating device to make the above-mentioned substrate detachable. And a nozzle which is fixed on the fixing device and is arranged opposite to the bottom of the above substrate, and includes a groove formed by opening above the nozzle. And a drainage device which penetrates into the groove and can discharge the treatment liquid dripped into the groove. The issue date of item 2 of the scope of patent application: please ask for the rotary processing device in item _. It is characterized by a conical shape (funnel shape) as the groove in the above note is reduced from the top to the bottom of the nozzle. The rotary processing device described in the first item of the invention application item No. 3 of the patent application scope. It is characterized in that a groove is provided on the inside of the above groove. The invention in item 4 of the scope of patent application requires the rotary processing device as set out in item No. 1. It is characterized in that the nozzle for the lower processing liquid of the above-mentioned is provided on the inner surface of the groove of the above-mentioned nozzle. The invention claimed in item 5 of the invention claims the rotating processing device as set out in item No. 1. It is characterized in that the mouth for the lower processing liquid of the above is provided in the above concave A7
發明說明（ 槽，可將滴落凹槽内的處理液，順上記引導溝槽確 貫’有效率地排出。 (請先閱讀背面之注意事項再填寫本頁) 依申請項4之聲明，A 4 在喷頭之凹槽内面形成開口，成 ' 為下部處理液用喷嘴。 >此’下部處理液用噴嘴可與噴頭-體形成，不需 使用其他零件。 ㈣請項5之聲明，為使下部處職时嘴朝基板之 旋轉中心噴射處理液， 利用基板旋轉所生之遠心力，使喷到基板下面的處 . 理液能分散至全面。 ， 依申請項6之聲日月，為使下部處理液用㈣嗜射於基 板下面而反射的處理液 都能確實通過凹槽，予以排出。 依申請項7之聲明，為於喷頭設立葉片，、藉由基之板 方疋轉，產生一股由喷頭上方向凹槽内流動的氣流，使喷頭 • 上方浮遊之霧狀處理液能確實、有效率地流入凹槽内，並 加以排出。 經濟部智慧財產局員工消費合作社印製 依申請項8之聲明，為喷頭之凹槽裡内裝設氣體用喷 嘴’朝基板之旋轉中心 噴射氣體’可確實執行基板下面，經處理液處理後 之乾燥處理。 依申請項8之聲明，為旋轉體之上面側與基板之下面 側之間裝設亂流防止蓋，以抑制亂流產生。此亂流防止蓋 形成一開口部，與喷頭之凹槽相對應。同時、設置可進入 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Description of the invention (Slot, the treatment liquid dripping into the groove can be discharged accurately and efficiently according to the guide groove. (Please read the precautions on the back before filling this page.) According to the statement of application item 4, A 4 An opening is formed on the inner surface of the groove of the spray head, and becomes 'the nozzle for the lower processing liquid. ≫ This' nozzle for the lower processing liquid can be formed with the nozzle body, without using other parts. ㈣Please declare in item 5, In order to spray the treatment liquid toward the center of rotation of the substrate when the lower part is in office, the telecentric force generated by the rotation of the substrate is used to spray the treatment below the substrate. The liquid can be dispersed to the whole. In order to make the lower processing liquid reflect the treatment liquid which is radiated below the substrate, the processing liquid reflected can be surely discharged through the groove. According to the statement of the application item 7, in order to set up a blade on the nozzle, turn it through the base plate. , A stream of air flowing in the groove from the nozzle head is generated, so that the misty treatment liquid floating above the nozzle head can flow into the groove surely and efficiently and be discharged. Based on application item 8 It is stated that a gas nozzle 'injecting gas toward the center of rotation of the substrate' is installed in the groove of the nozzle, and the drying process after the substrate is treated with the treatment liquid is surely performed. According to the statement in application item 8, it is the rotating body. A turbulent flow prevention cover is installed between the upper side and the lower surface of the substrate to suppress the occurrence of turbulent flow. This turbulent flow prevention cover forms an opening corresponding to the groove of the nozzle. At the same time, the setting can enter 7 paper sizes Applicable to China National Standard (CNS) A4 (210 X 297 mm)
上圮凹槽内的遮蔽部，可防止因亂流產生的霧狀處理液附 著於基板下面。由於可進入上記凹槽内的遮蔽部，防止處 理液等經由噴嘴上面流入亂流防止蓋裡面。 經濟部智慧財產局員工消費合作社印製 【發明之實施態樣】 此一發明之實施的態樣，參照圖面說明如下： 第2圖所示，此一發明之旋轉處理裝置，有一杯體 。此杯體（1)是由設置在承載板（2)上之下杯體（3)、與圖未 不出之設置在下杯體（3)上侧之上下驅動機構之可上下自 由驅動的上杯體（4)所構成。 上記下杯體（3)之底壁的中心部位，與承載板之間 藉通孔（5)形成貫通，又上記下杯體（3)之周壁（3約，滑溜 自在地嵌插於上記上杯体（4)的二重構造之周壁（4a)，由此 等周壁構造成一迷路。 上a己上杯體（4)為一開口，此上杯體（4)受驅動下降時 ，可取出如後述杯體（1)内所處理過，可作為基板的如半 導体積体基板U、並供給未處理過的基板。又、上記下杯 體（3)之底壁，連接著按所定間隔朝順著周方向的複數排 出管（6)之一端，他端與圖未示出之幫浦連接貫通。由此 可排出上記基板的淨洗與乾燥處理之際，飛散於上記杯體 (1)内面的處理液。 上記杯體（1)之下方配置一板狀基座（7)。此基座（7)位 於上記杯體（1)之通孔（5)相對應之位置，形成一安裝孔（8) ，構成驅動步驟之微電脈震抗制馬達（9)之固定子（9a)的上 端部，即嵌入固定於此安裝孔（8)。 本紙張尺度適用中國國家鮮（CNS)A4規格(210 X 297公髮） r —1 ------ 1·裝-----Ί (請先閱讀背面之注意事項再填寫本頁) #- 五、發明說明（6 ) 經濟部智慧財產局員工消費合作社印製The shielding part in the upper groove prevents the mist-like processing liquid from being attached to the bottom of the substrate due to turbulence. Since it can enter the shielding part in the groove mentioned above, it prevents the treatment fluid from flowing into the turbulent flow prevention cover through the nozzle. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Implementation Mode of the Invention] The implementation mode of this invention will be explained with reference to the drawings as follows: As shown in Figure 2, the rotation processing device of this invention has a cup. The cup body (1) is an upper and lower freely driveable upper and lower drive mechanism provided on the upper and lower cup bodies (3) of the carrier plate (2) and an upper and lower driving mechanism provided on the upper side of the lower cup body (3), which is not shown in the figure. Cup body (4). The center part of the bottom wall of the cup body (3) is formed through the through hole (5) between the bearing plate and the peripheral wall (about 3) of the cup body (3), which is inserted in the above note smoothly. The peripheral wall (4a) of the double structure of the cup body (4) is configured as a labyrinth. The upper cup body (4) is an opening. When the upper cup body (4) is driven to lower, it can be taken out. As described later in the cup (1), it can be used as a substrate, such as a semiconductor integrated substrate U, and supply the unprocessed substrate. The bottom wall of the cup (3) is connected to the bottom wall at a predetermined interval. One end of the plurality of discharge pipes (6) along the circumferential direction is connected to a pump (not shown) through the other end. As a result, the substrate can be ejected and scattered in the upper cup (1) during cleaning and drying processes. The inner surface of the treatment liquid. A plate-shaped base (7) is arranged below the upper cup (1). This base (7) is located at a position corresponding to the through hole (5) of the upper cup (1) to form a mounting The hole (8) is the upper end of the holder (9a) of the micro-electropulse anti-motor (9) constituting the driving step, that is, it is embedded and fixed in this mounting hole (8). This paper size is applicable to China National Fresh (CNS) A4 specification (210 X 297 public hair) r —1 ------ 1 · pack ----- Ί (Please read the precautions on the back before filling this page) #-V. Description of the invention (6) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
A7 B7 上記固定子（9a)成筒狀形，内部嵌插同為筒狀形的旋 轉子（9b)，可自在旋轉。此旋轉子（9b)上端面接合固定於 筒狀形之連結體（11)下端面，成為一體。此連結體（丨丨）之 下端面开> 成一比上記固定子（9a)之内徑尺寸更大的鍔部 (11a)。此鳄部（na)接合於上記固定子（9a)之上端面，可摺 動自在。因之旋轉子（9b)之旋轉不受阻撓，可抗制旋轉子， (9b)不致從固定子（9a)脫落。 上兄連結體（11) ’由上記杯體（1)之通孔（5)向其内部 突出，上端面裝設固定一圓板狀旋轉體（12)。此旋轉體（12) 如第1圖所示，由下板（13a)與上板（l3b)所接合，成為二重 構造，其徑方向中心部形成一通孔（14)。 如第2圖所示、上記下杯體（3)之通孔（5)之周邊部，突 設環狀壁（3b)、上記旋轉体（12)之外周面垂設環狀壁（12b) ，其内周面與上記環狀壁（3b)之外周面相對，此環狀壁（3b) 與環狀壁〔12b)，成為迷路構造，以防止處理液回入旋轉 體（12) 〇 上記旋轉體（12)上面為周方向所定間隔，實施的形態 是以60度間隔突設六個主部（15)(第1圖僅出示2個）。此主 部（15)外嵌滑動軸承（16)，滑動軸承（16)由插入、而能旋 轉自如的保持部材（17)支持著。 上記保持部材（17)，如第1圖所示，上部形成一與上 記主部（15)之外徑尺寸相若之大徑部（18),此大徑部（18) 下面再形成一受上記滑動軸承（16)所支持的軸部（19)。上 記大徑部（18)上面之中心部突設一圓錐狀支持針（2ι)，於A7 B7 The above-mentioned holder (9a) is in a cylindrical shape, and the rotor (9b), which is also cylindrical in shape, is inserted inside and can rotate freely. The upper end surface of the rotor (9b) is fixed to the lower end surface of the cylindrical coupling body (11), and is integrated. The lower end face of this connecting body (丨 丨) is opened into a crotch portion (11a) having a larger inner diameter than the above-mentioned holder (9a). This crocodile part (na) is joined to the upper end surface of the above-mentioned holder (9a), and can be folded freely. Therefore, the rotation of the rotor (9b) is not obstructed, and it can resist the rotor, and (9b) does not fall off from the stator (9a). The upper brother connecting body (11) 'protrudes from the through hole (5) of the upper cup body (1) to the inside, and a disc-shaped rotating body (12) is fixed on the upper end surface. As shown in Fig. 1, the rotating body (12) is joined by the lower plate (13a) and the upper plate (l3b) to form a double structure, and a through hole (14) is formed at the center portion in the radial direction. As shown in FIG. 2, the peripheral part of the through hole (5) of the upper cup body (3) is provided with a ring-shaped wall (3 b), and the outer wall of the rotary body (12) is provided with a ring-shaped wall (12 b). The inner peripheral surface is opposite to the outer peripheral surface of the annular wall (3b) described above. The annular wall (3b) and the annular wall (12b) form a labyrinth structure to prevent the treatment liquid from returning to the rotating body (12). The upper surface of the rotating body (12) is a predetermined interval in the circumferential direction, and the implementation form is to protrude six main portions (15) at 60-degree intervals (only two are shown in the first figure). The main part (15) is externally fitted with a plain bearing (16), and the plain bearing (16) is supported by a holding member (17) which is inserted and can rotate freely. As shown in the first figure, the holding member (17) of the above-mentioned is formed with a large-diameter portion (18) on the upper portion which is similar to the outer diameter of the main portion (15) of the above-mentioned portion. The shaft portion (19) supported by the plain bearing (16). A conical support pin (2ι) is protruded from the center of the upper diameter part (18).
本紙張尺㈣@目家標準（CNS)A4規格（210 X 297公爱 (請先閱讀背面之注意事項再填寫本頁) 裝 · •線.Size of this paper @ 目 家 标准 (CNS) A4 specification (210 X 297 public love (please read the precautions on the back before filling this page).
-·1 H ϋ I 9 經濟部智慧財產局員工消費合作社印製 Α7 ________Β7_____ 五、發明說明（7 ) 徑方向周邊部偏心位置突設一逆紡錐（taper)狀鎖針（22)。 上記六根保持部材（17)的支持針（21)上面，載置上記 基板U，其底面由支持針（21)所支持。在此狀態下，如第3 圖所示，上記鎖針（22)當接於基板U的外周面，即基板U 保持與旋轉體（12)成為一體。 如後述，旋轉体（12)竣轉（公轉）時，上記保持部材（17) 由第3圖以X所示狀態，轉為鎖線γ所示狀態旋轉（自轉）， 因之、上記鎖針（22)對保持部材（17)之旋轉中心產生偏心 旋轉，可解除上記鎖針（22)對上記基板u之保持狀態。 如第1圖所示，上記保持部材（17)之各轴部（19)下端部 ，突出旋轉體（12)之底面，其下端部嵌合固定著扇形變速 器所組成之子齒輪（23)。各子齒輪（23)經由上記連結體（11) 之外周面軸承（24)，與所設可旋轉自如的平齒輪所組成的 母齒輪（25)嚙合。此母齒輪（25)如第3圖所示、對應六個子 齒輪（23)之間隔，以周方向所定間隔，形成六個凸部（25^ 。各凸部（25a)之先端外周面，各形成與上記子齒輪（23)嚙 合的齒。 第1圖所示，上記連結體⑴）之外周面，做為付勢功 能，設有拍攝線圈狀片爪（26)，其上端與上記連結體⑼ 係合，他端與上記母齒輪（25)係合，使母齒輪（25)依第3圖 箭頭所示的旋轉方向（反時針方向）付勢。因此、上記子齒 輪（23)如同圖箭頭⑽示，依時針方向付勢。又因保持部 材（Π)對子齒輪（23)之回轉產連動，使上記鎖針⑽由旋 轉體⑽之中心方向偏心旋轉’當接於奇板的外周面。 本紙張尺度適用中明冢標準（CNS)A4規格⑵q χ 29 1 ______----- (請先閱讀背面之注意事項再填寫本頁) · 裝-----·---•訂----------· 1 H ϋ I 9 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 ________ Β7 _____ V. Description of the invention (7) A counter-taper-shaped lock pin (22) is protruded at the eccentric position of the peripheral part in the radial direction. On the support pins (21) of the six holding members (17) described above, the above-mentioned substrate U is placed, and the bottom surface is supported by the support pins (21). In this state, as shown in FIG. 3, the lock pin (22) described above is connected to the outer peripheral surface of the substrate U, that is, the substrate U remains integrated with the rotating body (12). As described later, when the rotating body (12) is completely rotated (revolved), the above-mentioned holding member (17) is rotated from the state shown by X in FIG. 3 to the state shown by the lock line γ (rotation). Therefore, the above-mentioned lock pin ( 22) An eccentric rotation is generated to the rotation center of the holding member (17), and the holding state of the upper locking pin (22) to the upper substrate u can be released. As shown in Fig. 1, the lower end portion of each shaft portion (19) of the holding member (17) described above protrudes from the bottom surface of the rotating body (12), and the lower end portion is fitted and fixed with a sub-gear (23) composed of a sector transmission. Each of the sub-gears (23) meshes with a mother gear (25) composed of a rotatable flat gear via an outer peripheral surface bearing (24) of the coupling body (11) described above. As shown in FIG. 3, this mother gear (25) corresponds to the interval of six sub-gears (23), and six convex portions (25 ^) are formed at a predetermined interval in the circumferential direction. The outer peripheral surface of the tip of each convex portion (25a), each Tooths that mesh with the upper gear (23) are shown in Figure 1. As shown in Figure 1, the outer peripheral surface of the upper gear is provided with an imaging coil claw (26) as the supporting function. The upper end is connected to the upper gear. ⑼ Engage, the other end is engaged with the above-mentioned mother gear (25), so that the mother gear (25) is charged in the direction of rotation (counterclockwise) shown by the arrow in Figure 3. Therefore, the gear (23) in the previous note is shown in the arrow on the figure, and it moves in the clockwise direction. In addition, the rotation of the holding member (Π) to the sub-gear (23) is linked, so that the above-mentioned lock pin ⑽ is eccentrically rotated from the center of the rotary body ’'to be connected to the outer peripheral surface of the odd plate. This paper size is applicable to Zhongmingzuka Standard (CNS) A4 specification ⑵q χ 29 1 ______----- (Please read the precautions on the back before filling out this page) · Packing ----- · --- • Order- --------
10 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 上記鎖針（22)施行解除基板U之上鎖狀態，由如第2圖 所示解除機構（31)所施行。此解除機構（31)具備附有引導 裝置的解除缸筒（32)。此解除缸筒（32)直立裝設於一端裝 •在固定子（9a)下端底面、狀似L字狀的框區（33)的另一端， 並使軸線垂直。 - 上記解除缸筒（32)的驅動軸（34)連結於折曲成曲軸狀 的臂（35)的下端。此臂（35)之上端部通過形成於上記基座（7) ® 的插通孔（7a)，延伸至上記母齒輪（25)之下面近旁，在其 上端垂直、直立設置解除針（36)。 第3圖所示，上記保持部材（17)之鎖針（22)當接於基板 U之外周面，於基板U受保持之狀態下，作動上記解除缸 ^ 筒（32)，使驅動軸（34)依突出方向驅動，臂（35)產生連動 時，設在臂（35)上端的解除針（36)與上記母齒輪（25)之一 凸部（25a)側面係合，可阻止上記母齒輪（25)向箭頭A方向 旋轉。 、 φ 上記解除針（36)阻止了母齒輪（25)向箭頭A方向回轉 的狀態下，驅動微電脈震抗制馬達（9)，使旋轉子（9b)依箭 頭C方向旋轉時，上記回轉體（12)對捩扭線圈狀爪片（26) 之附勢力產生抗拒，而與連結體（11)一體旋轉。 如使上記旋轉體（12)向箭頭C方向以角度0旋轉時， 母齒輪（25)便不與旋轉體（12) —體回轉，僅回轉体（12)與 旋轉子（9b)以角度0 —體旋轉。 因之、嚙合於上記母齒輪（25)之上記子齒輪（23)便與 旋轉體（12)—體公轉，同時自轉，因此，與此子齒輪（23) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 11 --I-----^--------- (請先閱讀背面之注意事項再填寫本頁) 4£S396 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（9 ) 一體設置之保持部材（17)辨依箭頭B方向之逆方向，即反 時針方向旋轉。結果、保持部材（17)由第3圖之X所示狀態 轉為Y所示狀態，鎖針（22)由基板U之外周面往離方向偏 心旋轉，可解除此鎖針（22)對基板U之保持狀態。 又、上記旋轉子（9b)之下端裝設如第2圖所示之測定 器（37)，此測定器（37)由上記裝置在固定子（9a)下端面之 感應器（38)加以檢出。感應器（38)檢出測定器（37)的位置 ，此位置被認為上記旋轉子（9b)的旋轉角度之原點，依此 認定，以抗制上記旋轉子（9b)的旋轉角度。 上記旋轉子（9b)内部插通一中空狀固定軸（41)。此固 定軸（41)之下端部嵌入固定在上記微電脈震抗制馬達（9)之 下方所配置之支持部材（42)的安裝孔（42a)。上記支持部材 (42)裝有剎車缸筒（43)，並使軸線垂直安置著。此剎車缸 筒（43)之驅動軸（44)裝有剎車鞋（45a)。 當剎車缸筒（43)作動時，其驅動軸（44)被朝上昇方向 驅動，剎車鞋（455)與上記固定子（9a)壓接於下面之剎車碟 (45b)，阻止旋轉子（9b)旋轉。 即、上記捩扭線圈狀爪片（26)之復元力加到旋轉子（9b) 時，也就是使旋轉體（12)對捩扭線圈狀爪片（26)之附勢力 產生抗拒，由微電脈震抗制馬達（9)作動，依箭頭方向， 作角度0旋轉，以解除鎖針（22)對基板U之封鎖狀態’如 遇停電等原因，致微電脈震抗制馬達（9)之驅動力消失’ 仍可藉捩扭線圈狀爪片（26)之復元力，阻止上記旋轉體（12) ，使其不致回到箭頭C之逆方向旋轉。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 12 (請先閱讀背面之注意事項再填寫本頁)10 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (8) The lock pin (22) mentioned above is used to release the locked state of the substrate U, which is implemented by the release mechanism (31) as shown in Figure 2. This release mechanism (31) includes a release cylinder (32) with a guide. This release cylinder (32) is installed upright at one end. • At the other end of the L-shaped frame area (33) on the bottom surface of the lower end of the holder (9a), the axis is vertical. -The drive shaft (34) of the release cylinder (32) is connected to the lower end of the arm (35) bent into a crankshaft shape. The upper end of the arm (35) extends through the insertion hole (7a) formed in the base (7) ® of the upper arm, to the lower side of the upper gear of the upper arm (25), and a release pin (36) is vertically and uprightly arranged on the upper end. . As shown in FIG. 3, when the locking pin (22) of the holding member (17) is connected to the outer peripheral surface of the substrate U, and the substrate U is held, the cylinder ^ cylinder (32) is activated to make the drive shaft ( 34) When driving in the protruding direction, when the arm (35) is linked, the release pin (36) provided on the upper end of the arm (35) is engaged with the side of one of the convex parts (25a) of the master gear (25) to prevent the master The gear (25) rotates in the direction of arrow A. , Φ In the state that the release pin (36) prevents the mother gear (25) from turning in the direction of arrow A, the micro-pulse vibration suppression motor (9) is driven to rotate the rotor (9b) in the direction of arrow C. The rotating body (12) resists the attached force of the torsion coil-shaped claw piece (26), and rotates integrally with the connecting body (11). If the rotating body (12) is rotated in the direction of the arrow C at an angle of 0, the mother gear (25) will not rotate with the rotating body (12), and only the rotating body (12) and the rotating body (9b) will rotate at an angle of 0. —Body rotation. Therefore, the sub-gear (23) meshing with the above-mentioned main gear (25) revolves with the rotating body (12) and rotates at the same time, so this sub-gear (23) applies the Chinese national standard (CNS) ) A4 size (210 X 297 mm) 11 --I ----- ^ --------- (Please read the notes on the back before filling this page) 4 £ S396 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the employee consumer cooperative A7 B7 V. Description of the invention (9) The integrated holding part (17) is identified in the reverse direction of the arrow B direction, that is, counterclockwise rotation. As a result, the holding member (17) is changed from the state shown by X in FIG. 3 to the state shown by Y. The lock pin (22) is eccentrically rotated from the outer peripheral surface of the substrate U, and the lock pin (22) can be released from the substrate. U remains. In addition, a measuring device (37) as shown in FIG. 2 is installed at the lower end of the above-mentioned rotor (9b), and this measuring device (37) is inspected by an inductor (38) of the above device on the lower end of the holder (9a). Out. The sensor (38) detects the position of the measuring device (37). This position is regarded as the origin of the rotation angle of the above-mentioned rotator (9b). Based on this, it is determined to resist the rotation angle of the above-mentioned rotator (9b). A hollow fixed shaft (41) is inserted into the rotor (9b) described above. The lower end portion of this fixed shaft (41) is fixed in the mounting hole (42a) of the supporting member (42) arranged below the micro-pulse shock-resistant motor (9) described above. The support member (42) described above is equipped with a brake cylinder (43), and the axis is placed vertically. The drive shaft (44) of this brake cylinder (43) is equipped with brake shoes (45a). When the brake cylinder (43) is actuated, its drive shaft (44) is driven in the upward direction, and the brake shoe (455) and the above-mentioned holder (9a) are crimped to the brake disc (45b) below to prevent the rotor (9b) ) Spin. That is, when the restoring force of the twisted coiled claw piece (26) is added to the rotor (9b), that is, the rotating body (12) resists the attached force of the twisted coiled claw piece (26). The electric shock resistance motor (9) is actuated and rotated at an angle of 0 according to the direction of the arrow to release the lock state of the locking pin (22) from the substrate U. In the event of a power outage, the micro electric shock resistance motor (9) is caused. The driving force of) disappears' It is still possible to prevent the rotating body (12) from rotating in the opposite direction of the arrow C by restoring the force of the coiled claw piece (26). This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 12 (Please read the precautions on the back before filling this page)
▼裝-----；---訂---------線I▼ Load -----; --- Order --------- Line I
五、發明說明（10 )V. Description of the invention (10)
---------桌—— (請先閱讀背面之注意事項再漆寫本頁) 於上記鎖針（22)解除基板u的封鎖狀態，由圖未示出 之機器人搬出上記旋轉體（12)處理過的基板u，並供給未 處理過的基板。 為了使機器人順利搬出、並供給基板U，如遇停電等 凊事發生時’藉由捩扭線圈狀爪片（26)之復元力，旋轉體 (12)不致回到與箭頭C方向相反的逆方向，因之立設於旋 轉體（12)之保持部材（17)的位置不生變化。 故而上d #彳車缸筒（43) ’可防止停電時，·通過基板u 之下面側導入的機器臂碰撞保持部材（17)，致無法搬出並 供給基板U。--------- Table—— (Please read the precautions on the back before painting this page) Unlock the board u in the lock pin (22) above, and take it out of the robot and rotate it. The body (12) processes the substrate u, and supplies the unprocessed substrate. In order to smoothly move the robot out and supply the substrate U, in the event of a power outage, etc., by turning the restoration force of the coil-shaped claw piece (26), the rotating body (12) will not return to the reverse direction opposite to the direction of arrow C. As a result, the position of the holding member (17) standing on the rotating body (12) does not change. Therefore, the upper d # 彳 car cylinder (43) 'can prevent the robot arm introduced through the lower side of the substrate u from colliding with the holding member (17) during a power failure, so that it cannot be carried out and supplied to the substrate U.
上記固定軸（41)之上端部在旋轉體(12)之通孔14的對 I 向位置。此固定軸（41)之上端嵌入固定著噴頭（46)。此喷 訂 頭（46)突出於旋轉體（12)之上面側，其外周部有收納突設 ! 在上記通孔（14)之周邊部的環狀壁（47)的環狀溝（48)，其 ] 下面形成開放狀態。即、環狀壁（47)與環狀溝（48)形成迷 ! 路構造，以阻止飛散於旋轉体（12)上面側的處理液通過通 f 孔（14)，沿固定軸（41)流出杯体（1)外部。 | 上記喷頭（46)如第4圖與圖5所示，其上面形成開放的 ] 痤齊Sri曰慧讨查笱員二消費^阼昧印製The upper end of the fixed shaft (41) is at the position I facing the through hole 14 of the rotating body (12). The upper end of the fixed shaft (41) is embedded and fixed with a spray head (46). This spray head (46) protrudes from the upper side of the rotating body (12), and its outer peripheral portion is provided with a storage protrusion! The annular groove (48) of the annular wall (47) in the peripheral portion of the above-mentioned through hole (14) , Its] forms an open state below. In other words, the annular wall (47) and the annular groove (48) form a lost structure to prevent the processing liquid scattered on the upper side of the rotating body (12) from passing through the through-hole (14) and flowing out along the fixed axis (41). Cup body (1) outside. The above-mentioned nozzle (46) is shown in Fig. 4 and Fig. 5, which is open on the top] S 齐 Sri
凹槽（51)。此凹槽（51)由上部遞縮至下部形成圓錐形小徑 | 。喷頭（46)上面上§己凹槽（51)之周邊部，向徑方向外方， | | 形成低低傾斜的傾斜面（52)。 ! 上記凹槽（51)的底部有形成排液部的排液孔（53)。此 | 排液孔（53)之一端形成開口，另一端連接於排液管（54)(第 | 1圖所示）之一端。此排液管（54)之另一端與上記排出管（6) j 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 13 ΛΜ3ΜGroove (51). This groove (51) is tapered from the upper part to the lower part to form a conical small diameter |. The peripheral part of the groove (51) on the upper surface of the nozzle (46) is outward in the radial direction, and | | forms a low-inclined inclined surface (52). ! At the bottom of the groove (51), there is a drain hole (53) that forms a drain. One end of the | drainage hole (53) forms an opening, and the other end is connected to one end of the drainage pipe (54) (shown in FIG. 1). The other end of this drainage pipe (54) and the above-mentioned discharge pipe (6) j This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 13 ΛΜ3Μ
同樣，連接於圖未示出的吸引幫浦。 如第4圖所示，上記喷頭（46)由三個先端開口在上記 凹槽（51)内面的下部處理液用喷嘴（55)，與一個下部氣体 用噴嘴（56)以周方向約90度間隔所形成。即、各喷嘴（55) 、（56)是由穿設在上記喷頭（46)的管路所成，先端成為開 口在凹槽（51)内面的噴嘴孔（55a)、（56a)。 各噴嘴（55)、（56)之基端，各連通在上記喷頭（46)下 面開口設置的第1、第2的接續孔（57)、（58)。如第1圖所示 ’第1之接續孔（57)接續於處理液供給管（59)，第2之接續 孔（58)與接續於氣體供給管（61)。 下部處理液用喷嘴（55)於洗淨處理時，通過處理液供 給管（59) ’向保持部材（17)所保持的基板^下面喷射純水 、過酸化水素水、氟酸等處理液，下部氣體用喷嘴（56)， 於乾燥處理時，通過氣体供給管（61)，喷射窒素等氣体。 各噴嘴（5 5)、（56)的噴射方向，對噴頭（46)之軸線〇 所定角度形成傾斜，即、下部處理液用喷嘴（55)定向保持 部材（17)所保持之基板u之旋轉 中心部喷射處理液。又、 下部氣體用噴嘴（56)亦定向基板U之徑方向中心部、即旋 轉中心部噴射氣體。 由此、處理液受旋轉的基板U之遠心力，可分散至背 面全部，於基板U反射的處理液，可全部滴入凹槽（51)之 内’同時，氣体亦可作用於基板U全部。 又、處理液亦可朝基板U的旋轉中心稍微偏差的位置 噴射。此時，最好以基板U之下面反射的處理液，能滴入 本紙張尺度適用中國國家標準（CNS)A4規格⑵Q χ 297公爱） (請先閱讀背面之注咅？事項再填寫本頁)Similarly, it is connected to a suction pump (not shown). As shown in Fig. 4, the upper nozzle (46) has three nozzles (55) for the lower treatment liquid, which are open on the inner surface of the upper groove (51), and one lower nozzle (56) for about 90 in the circumferential direction. Degree intervals are formed. That is, each of the nozzles (55) and (56) is formed by a pipe passing through the nozzle (46) described above, and the tip ends are nozzle holes (55a) and (56a) which are opened on the inner surface of the groove (51). The base ends of the nozzles (55) and (56) communicate with the first and second connection holes (57) and (58), respectively, which are provided below the nozzle head (46). As shown in Fig. 1, the first connection hole (57) is connected to the processing liquid supply pipe (59), and the second connection hole (58) is connected to the gas supply pipe (61). During the cleaning process, the lower processing liquid nozzle (55) sprays processing liquids such as pure water, super-acidified hydrogen water, and fluoric acid through the processing liquid supply pipe (59) 'on the substrate held by the holding member (17), During the drying process, the lower gas nozzle (56) sprays gas such as cholin through a gas supply pipe (61). The spraying directions of the nozzles (5, 5) and (56) are inclined with respect to the angle of the axis (0) of the nozzle (46), that is, the rotation of the substrate u held by the nozzle (55) for the lower processing liquid is held by the holding member (17). The center part sprays a processing liquid. The lower gas nozzle (56) also directs the gas toward the center portion of the substrate U in the radial direction, that is, the rotation center portion. As a result, the processing solution can be dispersed to the entire back surface by the telecentric force of the rotating substrate U, and the processing solution reflected on the substrate U can all be dropped into the groove (51). At the same time, the gas can also be applied to the entire substrate U. . Further, the processing liquid may be ejected toward a position where the rotation center of the substrate U is slightly deviated. At this time, it is best to use the treatment liquid reflected under the substrate U, which can be dripped into the standard of this paper. Applicable to China National Standard (CNS) A4 (Q χ 297). (Please read the note on the back? Matters before filling out this page. )
-裝-----·—訂---------線L 經濟部智慧財產局員工消費合作社印製 14 五、發明說明（12 )-Install ----- · Order --------- line L Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 14 V. Description of Invention (12)
氣体亦可朝基板U 凹槽（51)之角度，喷射處理液。同樣， 的旋轉中心，稍微偏差的位置喷射。 上記凹槽（51)之内部，沿上下方 隔 〇上下方向，以周方向所定間 面，順 ’形成複數引導溝槽（62)。此引導溝槽（62)，可將 U反射，而滴入凹槽（51)的處理液，沿凹槽内土 利導向排液孔C53)。The gas can also spray the processing liquid toward the angle of the U-groove (51) of the substrate. Similarly, the center of rotation is ejected at a slightly offset position. A plurality of guide grooves (62) are formed along the interior of the groove (51) in the above-mentioned direction along the upper and lower intervals and in the circumferential direction. This guide groove (62) can reflect U, and the treatment liquid dripped into the groove (51) is guided to the drainage hole C53 along the inside of the groove.
一又、喷頭（46)之上方、如第4圖所*，以周方向18〇度 間隔’沿徑方向形成-對安裝溝槽（63)，其先端連通於上 記凹槽（51)。此安裝溝槽（63)各設先端部突出於上記凹槽 (51)裡的葉片（64)。 上記葉片（64)之形成，可使上記基㈣與旋轉體（12) 一體旋轉時、此基板U的下面側之徑方位中心部，因基板 u之方疋轉，產生}疋轉方向之氣流，流入凹槽（51)。 因此，尤其乾燥處理時，可高有率地將浮遊的霧狀 處理液導入凹槽（5 1 )，加以排出。 第1圖所示，上記旋轉體（12)之上面側設有亂流防止 蓋（66)。此亂流防止蓋（66)在由上記保持部材（17)所保持 的基板U之下面側位置，其周邊部形成可供上記部保持部 材（17)之上部露出的第一開口部（6乃。第二開口部（68)之 周邊部形成折曲的、可深入凹槽（51)内的遮蔽部（69)。又 、此遮蔽部（69)與喷頭（46)之凹槽（51)内面，為非接觸狀 態。 上記亂流防止蓋（66)覆蓋於旋轉體（12)之凹凸狀上面 。因此、抑制伴隨旋轉體（12)旋轉所發生的亂流，可防止 本紙張尺度刺巾_國家標準（CNS)A4規格（210 X 297公爱） 經濟部智慧財產局員工消費合作社印製 五、發明說明（13 ) 洗淨基板U後、含有塵埃的處理液在杯體（1)内任意飛散、 例如飛進、附著於基板U之下面側。尤其依所定間隔，設 疋上ό己亂流防止蓋（6 6)上面部與基板U下面部之間隔，可 提高抑制亂流的效果。 又、由於IL流防止蓋（66)設有可進入喷頭（45)之凹槽 (51)内的遮蔽部（69)，可閉塞第2開口部（68)之喷頭（46)與 亂流防止蓋（66)之間的間隙。 由此、可防止洗淨處理時，杯體（1)内飛散的處理液 飛入、附著於IL流防止蓋（66)内面側，於乾燥處理時，再 飛散、附著於祈板U。 旋轉体（12)之保持部材（22)所保持的基板υ之上方， 配置有上部處理液用喷嘴（71)，及上部氣體用喷嘴（72)。 由上部處理液用喷嘴（71)朝基板U喷射處理液，上部氣體 用喷嘴（72)喷射窒素等乾燥用氣体。 再將上記所構成的旋轉處理裝置，處理基板U之洗淨 處理之情形，說明如下： 在供給基板U予旋轉体（12)之前，保持部材（17)的鎖 針（22)處於解除狀態。即、解除缸筒（32)作動，解除針（36) 與母齒輪25之凸部（25a)之側面係合的狀態下，旋轉體（12) 如第3圖箭頭C所示之方向，抗拒捩扭線圈狀爪片（26)之附 勢力’以角度0旋轉。由此、使保持部材（17)旋轉，因此 鎖針（22)作偏心旋轉。此鎖針（22)的位置，在支持針（21) 所支持的基板U之外周面、比所定尺寸徑方向外方更遠離 地方。Again, above the nozzle (46), as shown in Fig. 4 *, a pair of mounting grooves (63) are formed in the radial direction at an interval of 180 ° in the circumferential direction, and the tips thereof communicate with the above-mentioned grooves (51). Each of the mounting grooves (63) has a blade (64) whose tip end protrudes from the groove (51) described above. The above-mentioned blade (64) is formed so that when the above-mentioned base ㈣ and the rotating body (12) rotate together, the center of the radial direction of the lower side of the substrate U is rotated by the side of the substrate u to generate airflow in the direction of rotation. Into the groove (51). Therefore, especially during the drying process, the floating mist-like treatment liquid can be introduced into the groove (5 1) with high efficiency and discharged. As shown in Fig. 1, a turbulent flow prevention cover (66) is provided on the upper surface side of the above-mentioned rotating body (12). The turbulent flow prevention cover (66) is located on the lower side of the substrate U held by the above-mentioned holding member (17), and its peripheral portion forms a first opening portion (6) where the upper portion of the above-mentioned holding member (17) can be exposed. The peripheral portion of the second opening portion (68) forms a shielding portion (69) that is bent and can penetrate into the groove (51). Furthermore, the shielding portion (69) and the groove (51) of the nozzle (46) ) The inner surface is in a non-contact state. The turbulent flow prevention cover (66) described above covers the uneven surface of the rotating body (12). Therefore, the turbulent flow caused by the rotation of the rotating body (12) can be suppressed to prevent the paper scale from thorn Towel _National Standard (CNS) A4 (210 X 297 public love) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (13) After cleaning the substrate U, the treatment solution containing dust is in the cup (1) The inner surface is scattered randomly, for example, flying in and adhering to the lower side of the substrate U. In particular, the space between the upper surface of the upper surface and the lower surface of the substrate U is set at a predetermined interval, which can improve the ability to suppress the turbulent flow. The effect is that the IL flow prevention cover (66) is provided with a groove (51) that can enter the nozzle (45) The shielding portion (69) inside can close the gap between the nozzle (46) and the turbulence prevention cover (66) of the second opening (68). This prevents the cup (1) from being washed during the cleaning process. ) The processing liquid scattered inside flows into and adheres to the inner side of the IL flow prevention cover (66), and is scattered and attached to the praying plate U during the drying process. The substrate held by the holding member (22) of the rotating body (12) Above the υ, an upper processing liquid nozzle (71) and an upper gas nozzle (72) are arranged. The upper processing liquid nozzle (71) sprays the processing liquid toward the substrate U, and the upper gas nozzle (72) sprays choline and the like. The drying gas. The cleaning process of the rotary processing device and the substrate U as described above is described as follows: Before the substrate U is supplied to the rotating body (12), the locking pin (22) of the material (17) is held. In the released state, that is, when the cylinder (32) is released and the release pin (36) is engaged with the side of the convex portion (25a) of the mother gear 25, the rotating body (12) is shown as arrow C in FIG. 3 In the direction, the attached force of the coil-shaped claw piece (26) resisting torsion is rotated at an angle of 0. Thus, the holding The material (17) rotates, so the lock pin (22) rotates eccentrically. The position of the lock pin (22) is further away from the outer peripheral surface of the substrate U supported by the support pin (21) than outside the direction of the specified diameter. .
本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公tT 16 (請先閱讀背面之注意事項再填寫本頁) -裝 翁——訂---------This paper size applies to China National Standard (CNS) A4 specifications (21 × 297 male tT 16 (please read the precautions on the back before filling out this page) -Installation-Order ---------
經齊邨智慧財產局員工消費合作社印製 A7 .----B7____^__ 五、發明說明（14 ) 鎖針（22)處於解除狀態時，由圖未示出之機器人，將 臂通過保持部材（17)之間，供給未處理的基板u予旋轉体 - (12)上。即、保持基板U的臂由旋轉體（12)上面進入、降 下’將基板U授予支持針（21)，然後退出，以完成基板u 之供給。 於供給基板U之際，剎車缸筒（43)作動，剎車鞋（45a) _ 壓接剎車碟，以阻止旋轉子（9b)旋轉。因此、於供給基板 時’縱使有如停電等情發生，可藉捩扭線圈狀爪片（26)之 復元力，防止上記旋轉子（9b)向與箭頭所示之逆方向旋轉 〇 因之、上記剎車缸筒（43)，可使旋轉體（12)維持一定 的旋轉角度，縱遇停電等情事，亦不致發生諸如微電脈震 抗制馬達（9)之驅動力消失時，因旋轉體（12)仍在旋轉，機 器人的臂可能撞擊保持部材（17)，致無法供給基板u之情 形0Printed A7 by the Consumer Cooperative of the Qicun Intellectual Property Bureau .---- B7 ____ ^ __ V. Description of the invention (14) When the lock pin (22) is in the released state, a robot (not shown) passes the arm through the holding member In (17), the unprocessed substrate u is supplied onto the rotating body-(12). That is, the arm holding the substrate U enters and lowers from the top of the rotating body (12) to grant the substrate U to the support pin (21), and then exits to complete the supply of the substrate u. When the substrate U is supplied, the brake cylinder (43) is activated, and the brake shoes (45a) _ are crimped to the brake disc to prevent the rotor (9b) from rotating. Therefore, when the substrate is supplied, even if a power outage occurs, the restoration force of the coil-shaped claw piece (26) can be used to prevent the above-mentioned rotor (9b) from rotating in the direction opposite to that shown by the arrow. Therefore, the above The brake cylinder (43) can keep the rotating body (12) at a certain rotation angle, and even in the event of a power outage, it will not cause the driving force of the micro-electric pulse shock resistance motor (9) to disappear. 12) It is still rotating, and the arm of the robot may hit the holding member (17), so that the substrate u cannot be supplied. 0
方疋轉體（12)經供給基板u之後，解除缸筒（32)之驅動 則被解除，解除針（36)即脫離母齒輪（25)之凸部（25a)。由 此、齒輪（25)受捩扭線圈狀爪片（26)之附勢力，依箭頭A 方向旋轉’驅使子齒輪（23)與保持部材（17)—体向箭頭B 方向旋轉。 保持部材（17)朝箭頭B方向旋轉之際，裝設於此保持 部材（17)之鎖針（22)即朝與基板u之外周面當接的方向， 偏心旋轉。故、上記基板U即由鎖針（22)所保持。 基板U由鎖針（22)所保持時，剎車缸筒（43)即解除驅 一裝-------—訂---------線 (請先閱讀背面之注意事項再填寫本頁)After the square-shaped turning body (12) passes the supply substrate u, the driving of the release cylinder (32) is released, and the release needle (36) is released from the convex portion (25a) of the mother gear (25). As a result, the gear (25) is subject to the force of the twisted coil-shaped claw (26), and is rotated in the direction of arrow A 'to drive the sub-gear (23) and the holding member (17)-body to rotate in the direction of arrow B. When the holding member (17) rotates in the direction of arrow B, the lock pin (22) mounted on the holding member (17) rotates eccentrically in a direction that is in contact with the outer peripheral surface of the substrate u. Therefore, the above-mentioned substrate U is held by the lock pin (22). When the base plate U is held by the lock pin (22), the brake cylinder (43) is released and the drive is installed. ---------- Order --------- (Please read the precautions on the back first (Fill in this page again)
經濟部智慧財產局員工消費合作社印製 動’刹車鞋（45a)對旋轉子（9b)之阻止狀態亦被解除。然後 作動微電脈震抗制馬達（9)，驅動旋轉體（12)旋轉，同時在 基板U之上面與下面，由上部處理液用噴嘴（71)及下部處 理液用噴嘴（55)，噴射處理液，以洗淨此基板U之上下面 部〇 下部處理液用噴嘴（55)朝半導体積体回路U之旋轉中 心之噴射處理液，藉基板U旋轉產生的離心力，朝徑方向 外方流動，可確實處理基板U之下面部❶ 而且第2開口部（68)之周邊部設有可進入凹槽51内的 遮蔽部（69)，可防止飛入、附著於亂流防止蓋（66)裡面的 處理液，於乾燥處理之際，再飛散、附著於在基板1；。 由下部處理液用噴嘴（55)喷射的於半導体積体回路 下面反射的處理液，大都可滴立喷嘴（46)的凹槽（5丨）内。 此凹槽（51)成圓錐狀，且其内面沿上下方向形成引導溝槽 (62)，因此、可順利導引滴入凹槽（51)的處理液，流入底 部的排液孔（53)，經排液管54排出。 基板U之洗淨處理完了後，其上下面上部氣体用喷嘴 (71)及下部氣体用喷嘴（56)即喷出乾燥用氣体，同時與旋 轉體（12)—起使基板u高速旋轉，以除去附著基板u上下 面的處理液，使其乾燥。 下部氣體用喷嘴（56)朝基板U之控方向外方喷射氣體 ，可妥善執行基板U之下面側全面的乾燥處理。 上記基板U之下面侧設有亂流防止蓋（66)，旋轉体（12) 高速旋轉時，其上面之凹凸狀可防止發生亂流。因之、芙 (請先閱讀背面之注意事項再填寫本頁) ·'裳 ·The blocking status of the brakes (45a) on the rotor (9b) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs was also lifted. Then, the micro-electropulse anti-vibration motor (9) is operated to drive the rotating body (12) to rotate, and the upper and lower surfaces of the substrate U are sprayed from the upper processing liquid nozzle (71) and the lower processing liquid nozzle (55). The processing liquid is used to clean the upper and lower portions of the substrate U. The lower processing liquid nozzle (55) sprays the processing liquid toward the center of rotation of the semiconductor integrated circuit U. The centrifugal force generated by the rotation of the substrate U flows outward in the radial direction. The lower surface of the substrate U can be processed reliably. The shielding portion (69) that can enter the groove 51 is provided at the peripheral portion of the second opening (68). It can prevent flying and attach to the turbulent flow prevention cover (66). The processing solution is scattered and attached to the substrate 1 during the drying process. Most of the processing liquid reflected from the lower surface of the semiconductor integrated circuit sprayed from the lower processing liquid nozzle (55) can be dropped into the groove (5 丨) of the vertical nozzle (46). The groove (51) is conical, and the inner surface of the groove (51) forms a guide groove (62) in the up-down direction. Therefore, the processing liquid dripped into the groove (51) can be smoothly guided to flow into the drain hole (53) at the bottom. , Discharged through the drainage pipe 54. After the cleaning process of the substrate U is completed, the upper gas nozzle (71) and the lower gas nozzle (56) spray the drying gas, and simultaneously rotate the substrate u with the rotating body (12) at high speed to The processing liquid on the upper and lower surfaces of the attached substrate u is removed and dried. The lower gas nozzle (56) sprays gas outwardly in the control direction of the substrate U, which can properly perform a comprehensive drying process on the lower side of the substrate U. A turbulence prevention cover (66) is provided on the lower side of the substrate U, and when the rotating body (12) rotates at a high speed, the uneven shape on the upper surface can prevent turbulence. Therefore, Fu (Please read the precautions on the back before filling in this page)
1818
發明說明（ 經濟部智慧財產局員工消費合作社印製 板U之下面侧浮遊的霧狀處理液可從排出管順利排出，不 致再從杯體（1)中飛出，附著於基板U。 、又、基板u南速旋轉時，此基板U之下面側徑方向周 邊P即因離〜力’產生朝徑方向外方流動的氣流，可順 利排出浮遊於基板U之下面側徑方向周邊部的霧狀處理液 一方面，基板U之徑方向中心部，因基板11之旋轉， 產生頗大的離心力，霧狀處理液，有難於從其下面侧中心 邛排出之情开>。不過、基板U之下面側中心部，因基板u 之旋轉，產生以同方向旋轉方的氣流，此氣流可藉由裝設 於喷頭（46)的葉片（64)，將其導入凹槽（5i)内。 因此、即使霧狀處理液浮遊於基板U下面侧中心部， 仍可藉上記葉片（64)所生的氣流，一起導入凹槽（51)裡， 再由接續於此凹槽（51)的排液管（54)排出，以可防止基板 U之下面部受到污染。· 乾燥處理終了後，旋轉体（12)停止旋轉，感應器（38) 隨即以脈波驅動旋轉體（12)使其旋轉至測定器（37)所檢出 的原點位置，並作動解除缸筒（32)，使解除針（36)係合於 母齒輪之凸部（25a)之側面。 繼之、使微電脈震抗制馬達（9)的旋轉子（9a)依所定頻 數旋轉，使旋轉體（12)抗拒捩扭線圈狀爪片（26)之附勢力 ，朝箭頭C方向，作角度0旋轉；即以解除針（36)阻止母 齒輪（25)旋轉，僅使旋轉体（12)旋轉。因此、可使旋轉體（12) 抗拒捩扭線圈狀爪片（26)之附勢力’而旋轉。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 19 ^--------^---------- (請先閱讀背面之注意事項再填寫本頁)Description of the invention (The misty processing liquid floating on the lower side of the printed board U of the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can be smoothly discharged from the discharge pipe, so that it will not fly out of the cup body (1) and adhere to the substrate U. When the substrate u rotates at a south speed, the periphery P of the lower side diameter direction of the substrate U generates an airflow flowing outward in the radial direction due to the force, and the mist floating on the periphery of the lower side diameter direction of the substrate U can be smoothly discharged. On the one hand, the processing center of the substrate U in the radial direction generates a large centrifugal force due to the rotation of the substrate 11, and it is difficult to discharge the mist processing solution from the center of the lower side of the substrate U. However, the substrate U The central part of the lower side generates an airflow that rotates in the same direction due to the rotation of the substrate u. This airflow can be introduced into the groove (5i) by the blade (64) installed on the nozzle (46). Therefore, even if the mist-like treatment liquid floats on the center of the lower side of the substrate U, it can still be introduced into the groove (51) by the airflow generated by the above mentioned blade (64), and then discharged by the row following this groove (51). The liquid pipe (54) is discharged to prevent the lower face of the substrate U Contaminated. · After the drying process is completed, the rotating body (12) stops rotating, and the sensor (38) then drives the rotating body (12) with a pulse wave to rotate to the origin position detected by the measuring device (37), and Actuate the release cylinder (32), so that the release pin (36) is attached to the side of the convex portion (25a) of the mother gear. Next, the rotor (9a) of the micro-pulse shock-resistant motor (9) is set as required Frequency rotation makes the rotating body (12) resist the force of the twisted coiled claw (26), and rotates in the direction of arrow C at an angle of 0; that is, the release pin (36) prevents the mother gear (25) from rotating, only The rotating body (12) rotates. Therefore, the rotating body (12) can be rotated against the force of the twisted coil-shaped claws (26). This paper size is applicable to China National Standard (CNS) A4 (210 X 297) Love) 19 ^ -------- ^ ---------- (Please read the notes on the back before filling this page)
五、發明說明（ 17 由此、與上δ己母齒輪（25)喊合的子齒輪（23)便與旋轉 體（12) —體公轉，同時自轉，使保持部材（丨7)對其自轉產 生連動，朝與箭頭Β相反方向旋轉，以解除鎖針（22)對基 板U之上鎖狀態。 基板u之上鎖狀態被解除時，即作動剎車缸筒（43)以 固定旋轉子（9b)，可阻止旋轉體（12)藉捩扭線圈狀爪片（26) 之復元力，朝與箭頭C方向相反的方向旋轉，此時，由圖 未示出之機器人，自杯体（1)中，取出處理過的基板U。 自旋轉體（12)取出處理過的基板u被後，隨即供給未 處理過的基板U，重復上述工程，得執行基板洗淨及 乾燥處理。 (請先閱讀背面之注意事項再填寫本頁) 裝 ，---- 經濟部智慧財產局員工消費合作社印製 一方面、下部處理液用喷嘴（55)與下部氣體用噴嘴（56) 都與喷頭（46)形成穿設的通路，因此、設置上記喷嘴（55) 、（58)，不需使用零件，可減少零件數，以求結構之簡略 化與廉價化。 此發明不限定於上記一實施的態樣，在不逸脫發明要 曰之範圍内，有種種變通之可能。例如基板並不限定半導 体積体回路U，液晶表示裝置用的玻璃基板亦 可。要之， 本發明適用於要求高精密度洗淨處理的基板。 【發明之效果】 依請求項1之發明，裝設向基板之下面喷射處理液之 下部處理液用喷嘴的喷頭上面，形成敞開的凹槽，可排出 滴入凹槽内之處理液。 因此、可防止以處理液處理基板之際，處理液附著 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公釐） 20 訂 經濟部智慧財產局員工消費合作社印製 朗（18) _ I邊於噴頭上面·，於洗淨處理後之乾燥處理時，可防止 处理液再由噴頭飛起、附著於基板背面。 步依叫求項2之發明，使設置於喷頭的凹槽形狀為圓錐 因此、滴入凹槽内之處理液，可沿其傾斜的内周面 丨員利排出，以防止殘留喷頭裡面的處理液，於乾燥處理時 起0 依睛求項3之發明，喷頭的凹槽之内面側，順上下方 形成引導溝槽。 因此、滴落凹槽内之的處理液，可沿引導溝槽順利 出以防止附著、殘留於凹槽内面側的處理液，於乾燥 處理時飛起。 依請求項4之發明，下部處理液用喷嘴設置於噴頭之 凹槽裡面，開口形成。 因此、下部處理液用喷嘴可與喷頭一体成形，無需 另用零件’以求構成之簡略化與廉價化。 依請求項5之發明，使下部處理液用喷嘴可向基板之 方疋轉中心喷射處理液。 因此、處理液可藉基板旋轉所生的遠心力，分散於 基板下面之全部，可提高處理液之處理效果。 依請求項6之發明，可使下部處理液用喷嘴所喷射， 於基板下面反射的處理液，滴入喷頭之凹槽裡面。 因此、使基板之下面反射的處理液，皆可通過凹槽 ’確實排出；亦可防止基板反射的處理液，在杯体裡飛散 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 21 --------- I ^---------^ (請先閱讀背面之注意事項再填寫本頁) 、 U Ο Λ 1 Q Α7 五、發明說明（ B7 經濟部智慧財產局員工消費合作社印製 ’附著於基板。 ，產:二之方發明，於噴頭設置葉片’藉基板之旋轉 、方流向凹槽的氣流。 因此、於教、陸_ ^ _ ”处理之際，可使喷頭上方浮遊的霧狀 處理液，高效率、 甘 + 確實的流入凹槽，並加以排出，防止 其附著、污染基板。 A依哨求項8之發明，噴頭之凹槽裡面，裝設可向基板 疋轉中心嘴射氣體之氣体用噴嘴。 因此、乾燥處理時，基板下面全部都可確實處理。 依明求項9之發明，旋轉體之上面側與基板之下面側 之間叹置抑制亂流的亂流防止蓋，此亂流防止蓋形成一 開口部，與喷頭之凹槽相冑向，並言免置可進入凹槽 内的遮 敝部。 因此、可防止基板下面側之氣流產生紛亂，故、霧 狀處理液不易附著。而且、由於上記遮蔽部之設置，可防 止喷頭之上面部與亂流防止蓋之間產生隙縫，以防止飛入 亂流防止蓋的處理液或霧狀液等，於乾燥處理時，再流出 附著於基板下面。 【圖面簡單說明】 【第1圖】 表示此發明之實施的態樣之旋轉體部分的擴大斷面 圖。 【第2圖】 同態樣之全體構成的縱斷面圖。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 22 (請先閱讀背面之注意事項再填寫本頁)V. Description of the invention (17 As a result, the sub-gear (23) that meshes with the upper δ female gear (25) revolves with the rotating body (12) and rotates at the same time, so that the holding member (丨 7) rotates on it. When interlocking occurs, rotate in the direction opposite to arrow B to release the locking state of the locking pin (22) on the substrate U. When the locking state of the substrate u is released, the brake cylinder (43) is actuated to fix the rotor (9b) ), Which can prevent the rotating body (12) from rotating in the direction opposite to the arrow C by the restoring force of the twisted coil-shaped claw piece (26). At this time, a robot (not shown) from the cup body (1) The processed substrate U is taken out. After the processed substrate u is taken out from the rotating body (12), the untreated substrate U is immediately supplied, and the above process is repeated to perform substrate cleaning and drying processing. (Please read first Note on the back, please fill in this page again). The equipment is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. On the one hand, the lower nozzle (55) for the treatment liquid and the lower nozzle (56) for the gas are printed with the nozzle (46). ) To form a penetrating passage, therefore, the nozzles (55) and (58) described above are provided. The use of parts can reduce the number of parts, in order to simplify and cheapen the structure. This invention is not limited to the implementation described above, there are various possibilities within the scope of the invention, such as the substrate The semiconductor integrated circuit U is not limited, and a glass substrate for a liquid crystal display device may be used. In fact, the present invention is applicable to a substrate that requires high-precision cleaning treatment. [Effects of the Invention] According to the invention of claim 1, the installation direction is The upper surface of the nozzle of the nozzle for spraying the processing liquid on the lower surface of the substrate is formed with an open groove to discharge the processing liquid dripped into the groove. Therefore, it is possible to prevent the processing liquid from adhering to the substrate when the substrate is processed with the processing liquid. Paper size applies Chinese National Standard (CNS) A4 specification (21 × 297 mm) 20 Orders printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs (18) _ I side on the print head, dry after washing and processing During processing, the processing liquid can be prevented from flying up from the nozzle and adhering to the back of the substrate. The invention according to claim 2 is to make the shape of the groove provided on the nozzle be conical, so that it drips into the groove. The treatment liquid can be discharged along the inclined inner surface of the nozzle to prevent residual treatment liquid in the nozzle. When the drying process is started, according to the invention of item 3, the inner side of the groove of the nozzle is smooth. A guide groove is formed on the upper and lower sides. Therefore, the treatment liquid dripping into the groove can be smoothly discharged along the guide groove to prevent the treatment liquid from adhering and remaining on the inner side of the groove to fly up during the drying process. According to the invention of claim 4, the nozzle for the lower processing liquid is provided in the groove of the nozzle, and the opening is formed. Therefore, the nozzle for the lower processing liquid can be integrally formed with the nozzle, and no additional parts are needed to simplify and reduce the structure. According to the invention of claim 5, the nozzle for the lower processing liquid can spray the processing liquid toward the center of the substrate. Therefore, the processing liquid can be dispersed under the substrate by the telecentric force generated by the rotation of the substrate, which can improve the processing liquid. The processing effect. According to the invention of claim 6, the lower processing liquid can be sprayed by the nozzle, and the processing liquid reflected under the substrate can be dropped into the groove of the nozzle. Therefore, the processing liquid reflected on the bottom of the substrate can be surely discharged through the groove; the processing liquid reflected on the substrate can also be prevented from scattering in the cup body. This paper is in accordance with China National Standard (CNS) A4 (210 X 297). (Mm) 21 --------- I ^ --------- ^ (Please read the notes on the back before filling out this page), U Ο Λ 1 Q Α7 V. Description of the invention ( B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, attached to the substrate. Production: Erfang's invention, the blade is set on the nozzle, 'the airflow that flows to the groove by the rotation of the substrate. Therefore, Yu Jiao, Lu _ ^ _ "When processing, the mist-like treatment liquid floating above the nozzle can flow into the groove with high efficiency and certainty, and be discharged to prevent it from adhering to and contaminating the substrate. A According to the invention of claim 8, the nozzle Inside the groove, a gas nozzle is installed which can inject gas to the center of the substrate. Therefore, during the drying process, all the lower surface of the substrate can be reliably processed. According to the invention of item 9, the upper side of the rotating body and the substrate The turbulence prevention cover that suppresses turbulence is sighed between the lower sides, The turbulent flow prevention cover forms an opening, facing the groove of the nozzle, and avoids the shielding portion that can enter the groove. Therefore, the airflow on the lower side of the substrate can be prevented from being disturbed. The liquid is not easy to adhere to. Furthermore, due to the above-mentioned shielding part, a gap can be prevented between the upper face of the nozzle and the turbulent flow prevention cover, so as to prevent the treatment liquid or mist liquid from flying into the turbulent flow prevention cover, etc., for drying At that time, it flows out and adheres to the bottom of the substrate. [Brief description of the drawing] [Figure 1] An enlarged cross-sectional view of a rotating body part showing an embodiment of the invention. [Figure 2] The overall structure of the same shape Longitudinal section view. This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 public love) 22 (Please read the precautions on the back before filling this page)
I Σ---- 訂---------線 II Σ ---- order --------- line I
經濟部智慧財產局員工消費合作社印製 發明說明（20 ) 【第3圖】 同二樣撤除亂流防止蓋後之旋轉體平面圖 【第4圖】 同悲樣之噴頭之平面圖 【圖5】 同悲樣第4圖之沿χ_ X線之斷面圖。 1…杯體 12··.旋轉體 17…保持部材(保持機構) 21···支持針（保持機構） 22…销針（保持機構）46…喷頭 51…凹槽 元件標號對照 53·.·排液孔（排液部） 55···下部處理液用喷嘴 56…下部氣體用喷嘴 62…引道溝槽 64…葉片 66.··亂流防止蓋 68···第2開口部 ^--------^---------^ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 23Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Consumer Cooperatives (20) [Figure 3] The same plan view of the rotating body after removing the turbulent flow prevention cover [Figure 4] The plan view of the same sprinkler nozzle [Figure 5] Tragic section 4 along the χ_ X line. 1 ... cup 12 ... rotating body 17 ... holding member (holding mechanism) 21 ... support pin (holding mechanism) 22 ... pin (holding mechanism) 46 ... nozzle 51 ... groove element reference number 53 ... · Drain hole (liquid discharge portion) 55 ··· Nozzle 56 for lower treatment liquid ... Nozzle 62 for lower gas 62 · Guide groove 64 ... Blade 66. ·· Cross flow prevention cover 68 ··· Second opening ^ -------- ^ --------- ^ (Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ) twenty three
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| Application Number | Priority Date | Filing Date | Title |
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| JP21215799A JP4327304B2 (en) | 1999-07-27 | 1999-07-27 | Spin processing equipment |
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| TW498396B true TW498396B (en) | 2002-08-11 |
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| TW089114952A TW498396B (en) | 1999-07-27 | 2000-07-26 | Spin processing apparatus |
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| TW (1) | TW498396B (en) |
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| KR101423050B1 (en) | 2008-06-23 | 2014-07-25 | 주식회사 케이씨텍 | Apparatus for holding a substrate |
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| JPS63185029A (en) * | 1987-01-28 | 1988-07-30 | Hitachi Ltd | Wafer treatment apparatus |
| JPH0697136A (en) * | 1992-09-17 | 1994-04-08 | Hitachi Ltd | Method and equipment for cleaning substrate |
| TW434052B (en) * | 1996-02-20 | 2001-05-16 | Pre Tech Co Ltd | Washing device of disk to be washed |
| EP0898301B1 (en) * | 1997-08-18 | 2006-09-27 | Tokyo Electron Limited | Apparatus for cleaning both sides of a substrate |
-
1999
- 1999-07-27 JP JP21215799A patent/JP4327304B2/en not_active Expired - Fee Related
-
2000
- 2000-07-19 KR KR1020000041399A patent/KR100654697B1/en active IP Right Grant
- 2000-07-26 TW TW089114952A patent/TW498396B/en not_active IP Right Cessation
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| TWI404130B (en) * | 2008-02-14 | 2013-08-01 | Tokyo Electron Ltd | Liquid treatment apparatus |
| TWI408013B (en) * | 2010-09-24 | 2013-09-11 | Sparking Power Technology Co Ltd | Easy-guiding element cleaning machine |
| CN103996598A (en) * | 2013-02-14 | 2014-08-20 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN103996598B (en) * | 2013-02-14 | 2017-01-11 | 斯克林集团公司 | Substrate processing apparatus and substrate processing method |
| US9997382B2 (en) | 2013-02-14 | 2018-06-12 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| US10755951B2 (en) | 2013-02-14 | 2020-08-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| TWI711082B (en) * | 2013-02-14 | 2020-11-21 | 斯克林集團公司 | Substrate processing apparatus |
| CN106716605A (en) * | 2014-09-30 | 2017-05-24 | 芝浦机械电子株式会社 | Substrate processing device |
| TWI585842B (en) * | 2014-09-30 | 2017-06-01 | Shibaura Mechatronics Corp | Substrate processing device |
| US10607863B2 (en) | 2014-09-30 | 2020-03-31 | Shibaura Mechatronics Corporation | Substrate processing apparatus |
| CN106716605B (en) * | 2014-09-30 | 2021-06-08 | 芝浦机械电子株式会社 | Substrate processing apparatus |
| TWI760960B (en) * | 2019-12-26 | 2022-04-11 | 日商Ｓｕｍｃｏ股份有限公司 | Cleaning apparatus and cleaning method for workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100654697B1 (en) | 2006-12-07 |
| JP4327304B2 (en) | 2009-09-09 |
| JP2001044159A (en) | 2001-02-16 |
| KR20010049817A (en) | 2001-06-15 |
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