TW491409U - Mechanism for pressing the outer leads of thin film package - Google Patents

Mechanism for pressing the outer leads of thin film package

Info

Publication number
TW491409U
TW491409U TW090206812U TW90206812U TW491409U TW 491409 U TW491409 U TW 491409U TW 090206812 U TW090206812 U TW 090206812U TW 90206812 U TW90206812 U TW 90206812U TW 491409 U TW491409 U TW 491409U
Authority
TW
Taiwan
Prior art keywords
pressing
thin film
film package
outer leads
package
Prior art date
Application number
TW090206812U
Other languages
English (en)
Inventor
Chuen-Rung Chen
Original Assignee
Hannstar Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hannstar Display Corp filed Critical Hannstar Display Corp
Priority to TW090206812U priority Critical patent/TW491409U/zh
Priority to US09/930,802 priority patent/US6742695B2/en
Priority to JP2001323794A priority patent/JP3623771B2/ja
Publication of TW491409U publication Critical patent/TW491409U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW090206812U 2001-04-27 2001-04-27 Mechanism for pressing the outer leads of thin film package TW491409U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW090206812U TW491409U (en) 2001-04-27 2001-04-27 Mechanism for pressing the outer leads of thin film package
US09/930,802 US6742695B2 (en) 2001-04-27 2001-08-14 Soldering machine for tape carrier package outer leads
JP2001323794A JP3623771B2 (ja) 2001-04-27 2001-10-22 テープキャリアパッケージアウターリードの圧着機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090206812U TW491409U (en) 2001-04-27 2001-04-27 Mechanism for pressing the outer leads of thin film package

Publications (1)

Publication Number Publication Date
TW491409U true TW491409U (en) 2002-06-11

Family

ID=21683365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090206812U TW491409U (en) 2001-04-27 2001-04-27 Mechanism for pressing the outer leads of thin film package

Country Status (3)

Country Link
US (1) US6742695B2 (zh)
JP (1) JP3623771B2 (zh)
TW (1) TW491409U (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108766763B (zh) * 2018-06-07 2020-06-09 芜湖市亿仑电子有限公司 一种电容器用四引脚电极封装定位装置
CN109702289A (zh) * 2019-02-27 2019-05-03 安徽米兰电子科技有限公司 一种通讯线路板定位焊接装置
CN110153556A (zh) * 2019-05-16 2019-08-23 安徽瑞祥工业有限公司 一种铝合金激光焊浮动定位机构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812581A (en) * 1969-11-24 1974-05-28 Wells Electronics Method for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly
US3997100A (en) * 1973-09-10 1976-12-14 Raytheon Company Method of beam lead bonding
JPS61140368A (ja) * 1984-12-14 1986-06-27 Japan Ranpu Kk 非接触型のハンダ付け加工装置
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
JPH0746307B2 (ja) * 1988-05-18 1995-05-17 シャープ株式会社 表示装置
JP3314088B2 (ja) * 1992-06-08 2002-08-12 栄修 永田 ハンダ付け方法およびハンダ付け装置
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
US6250537B1 (en) * 2000-03-06 2001-06-26 Delphi Technologies, Inc. Self-cleaning soldering thimble assembly
TW483792B (en) * 2001-03-21 2002-04-21 Hannstar Display Corp Stroke and pressure adjusting device for welding operation in soldering machine

Also Published As

Publication number Publication date
JP2002329748A (ja) 2002-11-15
US20020158105A1 (en) 2002-10-31
US6742695B2 (en) 2004-06-01
JP3623771B2 (ja) 2005-02-23

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model