TW463262B - Device for substrate processing - Google Patents
Device for substrate processing Download PDFInfo
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- TW463262B TW463262B TW088121541A TW88121541A TW463262B TW 463262 B TW463262 B TW 463262B TW 088121541 A TW088121541 A TW 088121541A TW 88121541 A TW88121541 A TW 88121541A TW 463262 B TW463262 B TW 463262B
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- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000012545 processing Methods 0.000 title claims abstract description 30
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 230000036316 preload Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 51
- 239000004065 semiconductor Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
463262 經濟部智慧財產局員工消费合作社印製 A7 B7 五、發明說明（1.) 本發明係關於一種在流體容器内處理基板之裝置，其 具一可運動至流體容器上之基板接收裝置，此接收裝置至 少一對在侧邊之導引元件。 在製造程序’尤其是在半導體工業中，需要將基板以 一處理流體加以處理’其中之一例係晶片製造時基板之溼 處理。 在歐洲專利案ΕΡ-Β-0 385 536及德國專利案DE-A-197 03 646中描述了基板溼處理裝置，其中，基板可與基板載 體一起置於包含處理流體之容器内。基板，例如半導體晶 圓，藉一下降及舉升裝置，置於包含處理流體之容器内， 然後再以處理流體加以處理。在歷處理後，半導體晶圓藉 一刀狀之裝置’從處理流體中運動出，然後如在歐洲專利 案ΕΡ-Β-0 385 536中所述之馬拉哥尼(Marangoni)方法加以 脫乾，以便隨後由位於容器上、具晶圓用侧邊導軌之頂蓋 接收。在這些裝置中，處理基板用之槽及頂蓋係依一定之 尺寸’例如半導體晶圓之直徑65公釐、84公釐、95公寶、 130公釐，或200公釐來加以設計。 在這些習知之裝置十，為增加靈活之彈性，最好能處 理不同尺寸之基板。基本上設計裝置時係針對特定尺寸之 基板是有可能的’只要基板尺寸較此設計尺寸為小或相等， 均可被處理。此時，具較小尺寸之半導體晶圓，與具較大 尺寸之晶圓一樣，均可藉基板載體下降至容器内，或從容 器内舉升而出。在基板從容器内舉升而出並由頂蓋接收時 會產生問題’即為不狀寸之_，必舰供不同尺寸之 ‘紙張尺度適用中國國家揉準（CNS)A4規格（210 X 297公袭） -4- ίιι — llllllf i I — I f 11 訂 I I ! I (锖先《讀背面之注意事項再填寫本頁) 463262 五 B7 經濟部智慧財產局員工消費合作杜印製 '發明說明（2.) 頂蓋，使晶圓可於頂蓋内被導引a=與纏觸,並與晶置 抓取手臂伸人盛有㈣之槽内，在τ部之—對抓ΐ臂：=面，手臂被舉升，直到上部之抓: 2么於“體表面上，後上部之—對抓取手臂閉合以 =取阳圓’而上部之-對抓取手臂則張開，如此，晶圓完 全從處理親巾舉箱出。此複雜之 保證抓取手臂在穿過_表面時不會與晶酿觸，因為在 抓取手臂與晶圓之接觸面，可能聚集有流體，其 圓之脫乾。 ' 9 在專利案JP-5-36668A中顯示-基板抓取手臂，其與 上述者類似’不過除了二對抓取手臂外，另外有一對預設 之固定接收元件，以接收基板之上末端。 、 在專利案JP-2-905522A中可知一晶圓抓取手臂，其由 對上部、固定之接收元件，及一對可動之下部抓取手臂 組成。 在專利案·ΙΡ·7·169731Α中顯示一晶圓載體，其將半導 體晶圓固定在處理流體内，此載體有一下固持元件及二侧 之可調式固持元件，以接收具不同直徑之晶囷。 從上述習知之裝置出發，本發明之任務係為，創作— 簡單、有效率之裝置，以處理在流體容器内之基板，本裝 置具一可運動至流體容器上之基板接收裝置，具至少一對 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 锖 先 閱 面 之 注463262 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (1.) The present invention relates to a device for processing a substrate in a fluid container, which has a substrate receiving device that can be moved to the fluid container. The receiving device has at least one pair of guide elements on the side. In the manufacturing process, especially in the semiconductor industry, it is necessary to treat a substrate with a processing fluid. One example is the wet processing of the substrate during wafer manufacturing. A substrate wet processing apparatus is described in European patent case EP-B-0 385 536 and German patent case DE-A-197 03 646, in which a substrate can be placed together with a substrate carrier in a container containing a processing fluid. The substrate, such as a semiconductor wafer, is placed in a container containing a processing fluid by a lowering and lifting device, and then processed with the processing fluid. After processing, the semiconductor wafer is moved out of the processing fluid by a knife-shaped device, and then is desiccated as described in the Marangoni method described in European Patent Case EP-B-0 385 536, It is then received by a lid on the container with a wafer side rail. In these devices, the grooves and the cover for processing the substrate are designed according to a certain size ', such as a semiconductor wafer having a diameter of 65 mm, 84 mm, 95 gem, 130 mm, or 200 mm. In these conventional devices, in order to increase flexibility, it is better to handle substrates of different sizes. Basically, it is possible to design a device for a substrate of a certain size, as long as the substrate size is smaller or equal to the designed size, it can be processed. At this time, a semiconductor wafer with a smaller size can be lowered into the container by the substrate carrier, or lifted out from the container, like a wafer with a larger size. When the substrate is lifted out of the container and received by the top cover, it will cause problems. That is, it is not suitable. It must be provided for different sizes. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 Public attack) -4- ίι — llllllf i I — I f 11 Order II! I (锖 "Read the notes on the back side and then fill out this page) 463262 Five B7 Printed by the consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs. (2.) The top cover, so that the wafer can be guided in the top cover. = Face, the arm is lifted until the upper grip: 2 on the body surface, the upper back-closed to the grab arm = = take the Yang 'and the upper-open to the grab arm, so, The wafer is completely lifted out of the processing towel box. This complexity guarantees that the gripping arm will not touch the crystal when passing through the surface, because the fluid may collect on the contact surface of the gripping arm with the wafer, and its '9 is shown in patent JP-5-36668A-substrate grasping arm, which is similar to the above' except that it has two pairs of grasping Outside of the arm, there is a pair of preset fixed receiving elements to receive the upper end of the substrate. In the patent case JP-2-905522A, it is known that a wafer grasping arm consists of an upper part, a fixed receiving element, and a It is composed of a movable lower grip arm. In the patent case · IP · 7 · 169731A, a wafer carrier is shown, which fixes a semiconductor wafer in a processing fluid. This carrier has a holding element and adjustable holding elements on both sides. To receive crystal puppets with different diameters. Starting from the conventional device, the task of the present invention is to create a simple and efficient device to process the substrate in a fluid container. The device has a movable to fluid The substrate receiving device on the container has at least one pair of this paper size applicable to China National Standard (CNS) A4 specification (210 X 297 mm>)
項 I ' 1裝 頁I 1 訂 鎂 ^63262 經濟部智慧財彦局員工消费合作社印製 A7 -------_B7_ 五、發明說明（3·) 側邊導引元件’以此基板存放裝置，可以簡單方式接收不 同直徑之基板，並安全地進行導引β 本發明將以下述方法達成此任務：導引元件藉與基板 之接觸，及藉其運動而可相對運動，如此之優點為，導引 元件不需獨立之作動及控制機構，而可自動適應基板之大 小及形狀。因此’本裝置以簡單方式，而可接收及導引不 同尺寸之基板》 最好有一第二對可相對運動之導引元件，以使在較大 之範圍内可進行導引，及有較好之穩定性。此第二對導引 元件最好位於第一對導引元件之上。每一對導引元件均可 相互接近或遠離’以接收不同尺寸之基板，並使導引元件 可沿基板之外周圍運動》 根據一發明實施形式，導引元件係於基板接收裝置之 導引軌道内進行導引，此基板接收裝置最好為一頂蓋，導 引軌道則設計在頂蓋之頂面上。導引元件在頂蓋之導引軌 道内進行導引，形成相對而言較為簡單且不複雜之導引元 件導引動作，此導引動作造成導引元件間之相對運動β 根據另一優先之發明實施形式，至少有一對導引元件 是固定於一共同之轉動點上’而此共同之轉動點最好位於 導引元件之上方。藉此轉動軸承’可特別簡單地實現元件 間之相對運動，一對導引元件最好可使用一共同之轉動點。 在另一發明實施形式中，至少有一對導引元件可對另一轉 動點轉動，以得到一定形狀之，例如相對而言較平之轉動 運動。 X 297公釐） -6- I —ί II--' ^ i — — — — — — ^· —----I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局負工湞费合作社印袈 463262 A7 ------------ B7 五、發明說明（4.) 此轉動點，或是第一對導引元件之轉動點，最好是設 置於基板接收裝置内之最高點上，以使基板之相對運動有 較平，也就是儘可能小之高度分量。此時，若導引元件設 於處理流體表面附近亦具有其優點，如此，從處理流體中 運動出之基板，可儘早由導引元件接收，並由之導引。第 二對導引元件轉動點最好位於第一對導引元件轉動點之下 万，以便當基板完全被基板接收裝置接收時，構成一特別 之導引元件位置。 最好於導引元件及轉動點間設置連接桿，且第一對導 引元件之連接桿較第二對者為長。如此，尤其是在配合轉 動點位置後’第一對導引元件在處理流體表面上一小段距 離時會有較平之轉動特性。第二對導引元件必須保證，當 導引元件完全接收基板時，導引元件大約位在基板水平中 心線之上或是稍許在其下，如此可得較佳及安全之固持基 板。 為固持件於基板接收裝置内接收之基板，至少一對侧 邊導引元件可閉鎖。如此，以簡單方式即可使基板安全固 持於接收裝置内，以便與接收裝置一同輸送，而不需額外 之閉鎖元件。 為使導引元件能均勻導引基板，至少一對導引元件應 相對基板接收裝置之中心平面對稱設置。 根據一特別優先之發明實施形式，至少一對導引元件 有施加預力，此預力最好是由導引元件之自身重量，也就 是由重力產生。若此重力作用不夠大，導引元件最好額外 本紙張尺度適用中國画家標準（CNS)A4規格（210 X 297公釐） <請先《讀背面之沒f項再填窝本頁) ίItem I '1 Packing page I 1 Order Magnesium ^ 63262 Printed by the Consumers ’Cooperative of the Ministry of Economic Affairs, Smart Finance and Economics Bureau A7 -------_ B7_ V. Description of the invention (3 ·) Side guide element' is stored on this substrate The device can easily receive substrates of different diameters and guide them safely. The present invention will achieve this task by the following methods: the guide element can be moved relative to each other by contact with the substrate and its movement. The guide element does not need an independent actuation and control mechanism, but can automatically adapt to the size and shape of the substrate. Therefore, 'this device can receive and guide substrates of different sizes in a simple way. "It is best to have a second pair of guide elements that can move relative to each other, so that it can be guided in a larger range, and has better The stability. The second pair of guide elements is preferably located above the first pair of guide elements. Each pair of guide elements can approach or move away from each other to receive substrates of different sizes and allow the guide elements to move around the substrate. According to an embodiment of the invention, the guide elements are guided by the substrate receiving device. Guide is performed in the track. The substrate receiving device is preferably a top cover, and the guide track is designed on the top surface of the top cover. The guide element guides in the guide track of the top cover to form a relatively simple and uncomplicated guide element guide action. This guide action causes the relative movement between the guide elements β according to another priority. In the embodiment of the invention, at least one pair of guide elements is fixed on a common turning point, and this common turning point is preferably located above the guide element. This allows the relative movement between the elements to be achieved particularly easily, and it is preferred that a pair of guide elements can use a common turning point. In another embodiment of the invention, at least one pair of guide elements can be rotated to another turning point to obtain a certain shape, such as a relatively flat turning motion. X 297 mm) -6- I —ί II-- '^ i — — — — — — — ^ · —---- I (Please read the notes on the back before filling this page) Industrial Cooperative Cooperative Seal 463262 A7 ------------ B7 V. Description of Invention (4.) This rotation point, or the rotation point of the first pair of guide elements, is best set at At the highest point in the substrate receiving device, the relative movement of the substrate is relatively flat, that is, the height component is as small as possible. At this time, it is also advantageous if the guide element is provided near the surface of the processing fluid. In this way, the substrate moved out of the processing fluid can be received by the guide element as soon as possible and guided by it. The rotation point of the second pair of guide elements is preferably below the rotation point of the first pair of guide elements so that when the substrate is completely received by the substrate receiving device, a special position of the guide element is formed. A connecting rod is preferably provided between the guide element and the turning point, and the connecting rod of the first pair of guide elements is longer than the second pair. In this way, especially after the position of the turning point is matched, the first pair of guide elements will have a relatively flat turning characteristic when the distance on the surface of the processing fluid is small. The second pair of guide elements must ensure that when the guide element fully receives the substrate, the guide element is positioned above or slightly below the horizontal centerline of the substrate, so that a better and safer holding substrate can be obtained. To hold the substrate received by the holder in the substrate receiving device, at least one pair of side guide elements can be locked. In this way, the substrate can be safely held in the receiving device in a simple manner, so that it can be transported together with the receiving device without the need for an additional locking element. In order for the guiding element to uniformly guide the substrate, at least one pair of guiding elements should be symmetrically arranged with respect to the center plane of the substrate receiving device. According to a particularly preferred embodiment of the invention, at least one pair of guide elements has a pre-force applied, and this pre-force is preferably generated by the weight of the guide element itself, that is, by gravity. If the effect of gravity is not large enough, it is better to use additional guide elements. This paper size is in accordance with the Chinese painter's standard (CNS) A4 (210 X 297 mm) < Please read the "f" item on the back side before filling in this page) ί
463262 A7 B7 經濟部智窀財產局員工消費合作社印製463262 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs
五、發明說明（5·) 以一彈簧施加預力° 為使各對導引元件可輕易藉由於基板之進入而向外運 動，各導引元件間在靜止位置時有儘可能最小之距離。如 此確保基板可順利進入導引元件間，然後再將之撐開。 在一特別優先之發明實施形式中，導引元件係為具多 個導引缝之棒，此棒最好設計成滾筒形，以構成簡單之導 引元件結構。導引元件内之導引缝最好圍繞整個棒周圍， 使導引元件不必針對所接收或導引之基板作特別之定向。 為避免或降低導引元件及為增加導引基板間之磨擦， 導引元件最好可對其縱軸轉動。 以下將藉一較優先之實施例，並利用圖式說明本發明。 各圖式之内容如下： 圖一根據第一發明實施例，其具一基板接收裝置之基板 處理裝置之示意圖； 圖二根據第二發明實施例之基板接收裝置示意圖； 圖三根據另一發明實施例之基板接收裝置示意圖； 圖根據本發明基板接收裝置之示意接收及導引作 用順序； 圖五具不同直徑之晶圓從處理流體舉升出液面前之位置 示意圖，及基板接收裝置之靜止位置。 根據圖一，用於處理基板2之裝置1有一槽3及一在 槽3上之用以接收基板2之頂蓋4。槽3是由一主要為ν 形之底部5，及與之連接之侧壁6及7構成。在底部5内， 設有噴嘴9及排放口 1〇，以導入及排出處理流體，例如DI <請先W讀背面之注意事項再填寫本頁) 裝------丨丨訂---------续· 本紙張尺度適用中國困家標準（CNS)A4規格mo X 297公* ) B7 五、發明說明（6.) 水。 侧壁6及7之上緣各形成溢流緣12及13，其決定槽3 最大之液面高度。從溢流緣12及13溢出之處理流體，以 習知之方式排出》 在槽3内有一基板載具23用之舉升及下降裝置20， 及一刀狀之元件25，以後將此元件稱之為刀。基板載體23 及刀25可相互獨立舉升及下降，如同技術現況所習知者。 適當之舉升及下降裝置20可參見屬於同一申請人之，未公 佈之德國專利案DE-A-197 37 8〇2。為避免重複，此德國專 利案DE-A-19737 802之内容也引用為此申請書之内容。 在基板載體23内，於垂直紙面方向，成排裝有多個晶 圓2(圖中只見到其中之一個）’並由具缝之棒3〇支持。 圖一中顯示出刀25與晶圓2之最下端點接觸，且晶圓 2以DE-A-197 37 802中所描述之方式，從基板載體23中 舉出’且一部份運動進入將加以詳細描述之頂蓋4内。 在槽3上之頂蓋4有一氣體或混合氣體用之輸入口 32 ’此氣體用於晶圓2之脫乾，根據上述ΕΡ-Β-0 385 536 中習知之馬拉哥尼方法進行。 頂蓋4有第一對導引棒35，36在頂蓋内部、侧邊導引 基板2 ’另外有第二對導引棒39，4〇。導引棒35，36及39， 40上有未進一步示出之、環繞之導引缝。 第一對導引棒35，36係藉·連接桿45或46，以可轉動 方式固定在螺栓47上，而螺栓則係固定於頂蓋4之正艢上。 螺栓47之位置，及連接桿45或46之長度，如此之選定， 本紙張尺度適家標準（CNS)A4規格（2W x 297公X ; 經濟部智慧財產局員工消费合作社印製 46326 2 A7 ______B7__ 五、發明說明（7.) 使導引棒45，46相對螺栓47轉動時，可相對而言較平， 且在流體表面附近’導引棒之轉動運動是由連接桿決定。 導引棒39，40係以相同方式，藉連接桿49或50，以 可轉動方式固定在螺栓51上，而螺栓則是固定在頂蓋4之 正牆上。螺栓51之位置在螺栓π之下，且連接桿抑，％ 之長度較連接桿45，46者為短。螺栓51之位置，及連接 桿49，5〇之長度’如此之選定，使導引棒39，4〇之高度 在導引棒35，36之上，而且當頂蓋内有接收晶圓時，導引 棒39，40在晶圓水平中心線之上，或乏下一小距離。 導引棒35 ’ 36及/或導引棒39 ’ 4〇係以可對其縱轴轉 動方式，固定於連接桿上’而且二導引棒可相互互鎖，使 接收在頂蓋4内之晶圓2，可單獨由導引棒35，36及/或由 導引棒39，40固定。 圖二顯示本發明之另一實施例，其中兩對導引棒55， 56及59 ’ 60 ’以滑動方式’裝於導引軌道62，63或65， 66内，導引軌道則是設計在另—頂蓋68相對應之正牆67. 上(正牆只是示意顯示出）。雖然此導引轨道是以曲線形式 表示出，但也可是直線，而且尤其是下導引軌道可以是水 平設計’以令基板之導引盡可能在流體表面附近。在此情 況下’導引元件可由彈簧或其他適當方式相互施加預力。 圖三顯示另一發明實施例，其中導引棒75，76，79及 80係以可旋轉方式固定於螺栓81，82，83及84上。螺栓 81至84則是固定於另一頂蓋88相對立之正牆87(此牆只 是示意顯示出)上。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) -10- — lull — —--^--------訂 ----* 絲 (請先《讀背面之注$項再填寫本頁> 46326 2 經濟部智慧財彥局員工消費合作社印製 A7 五、發明說明（8·) 以下就—特定之晶圓直徑，藉示意之順序圖四a至d， 說明晶圓是如何被接收至頂蓋内，及如何被導引。圖四a 至d顯不根據圖—裝置之工作流程。成列置放之晶圓2藉 一未圖不出之刀，從處理流體中舉出，處理流體之表面以 符號90標示。 從圖四a可以看出，晶圖2之上緣首先與第一對導引 棒35 ’ 36接觸，並維持在導引缝之内。 從圖四b可以看出，晶圓2在繼續其舉升運動時，被 第一對導引棒35 , 36在侧邊導引。此時，導引棒35，36 被晶圓2撑開。另外，晶圓2之上緣與第二對導引棒， 40接觸，並維持在此導引缝内。晶圓2此刻由二對導引棒 在側邊導引，而晶圓圖示將此二對導引棒撐開。 當第一對導引棒穿越晶圓2之水平中心線後，如圖四 c所示，導引棒35 ’ ％延晶圓之下側滑動。導引棒35，36 因自身重力之作用，作相向之運動，而導引棒仍然繼績導 引晶圓2。 如圖四d所，晶圓2繼續被舉升’直到其完全從處 理流體舉出為止。此時’晶圓2已舉升夠高，第二對導引 棒39 ’ 40也都超越晶圓2之水平中心線，並沿晶圓2之下 侧滑動。另外’晶圓已舉升夠高度’使得晶圓此時只是藉 由第二對，也就是在上之導引棒39，40導引。 當然可將晶圓只舉升到一定高度，使晶圓正好從處理 流體中舉出，但仍同時由二對導引棒導引。根據此或圖四 d所示之位置’至少有一對導引棒由一未圖示出之裝置， 本紙張尺度適用中a國家標準（CNS)A4規格（210 X 297公爱） -11 - i ! i 訂·! I 韓 (請先《讀背面之注^^項再填寫本頁) 463262 經濟部智慧財彦局員工消费合作社印製 A7 B7 五、發明說明（9.) 例如一制動梢鎖住，使導引棒不再能相互向外運動。最後 刀運動退回’晶圓2即安全地由頂蓋4内之導引元件固持。 如此’晶圓在必要時也可與頂蓋一同運輸，或又被置入(已 脫乾之)基板載體23内。 要取出及降下晶圓2時，刀運動至與晶圓2接觸，導 引棒之直鎖被開啟，因而晶圓又被刀支承。隨後當晶圓下 降時，晶圓又被導引棒導引。晶圓與導引棒間之相對運動， 則與上述之順序相反。 圏五顯示當晶圓直徑不同時，晶圓在由處理流體舉升 出之前之晶圓.位置。所示之導引棒在靜止位置，各棒間有 距離，使晶圓可被導引入導引棒間，並將其向外撐開。從 圖五可以看出，不同直徑之晶圓可被接收入頂蓋内，並被 導引。 以上藉一優先之發明實施例說明本發明》專業人士可 作出更多之變化及設計，但都不背離此發明構思。除了不 同形狀之處理裝置及頂蓋外，也可為此類導引棒將不同之 導引裝置進行組合，例如將一對導引棒固定在一共同之轉 動點上，而將另一對固定在另一轉動點上。除了所顯示及 所描述之導引棒外，也可使用可相互運動之、具導引缝之 壁件。各導引元件間之預力，除了使用彈簧外，也可藉例 如使用高壓空氣或N2之氣壓裝置達到。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 -12- f III —---裝！| 訂.-----！# (請先Μ讀背面之注意事項再填寫本頁) 463262 ⑽Μ认3二…: 五、發明說明（10 '補充 Α7 J37 經濟部智慧財產局員工消費合作社印製 元件符號說明 1 裝置 65、66 導引軌道 2 基板 67 正牆 3 槽 68 頂蓋 4 頂蓋 75、76、79、80 導引棒 5 底部 8 卜 82、83、84 螺栓 6 ' 7 侧壁 87 正牆 9 噴嘴 90 表面 10 排放口 12、13 溢流緣 20 下降裝置 23 基板載體 25 刀狀之元件 30 棒 32 輸入口 35、36 導引棒 39、40 導引棒 45、46 連接桿 47 螺栓 49、50 連接桿 51 螺栓 55、56 導引棒 59、60 導引棒 62、63 導引軌道 (請先閱讀背面之沒意事項再填寫本頁) 私紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 一 12-1 »V. Description of the invention (5 ·) A spring is used to apply a pre-force ° In order to allow each pair of guide elements to easily move outwards due to the entry of the substrate, the minimum distance between the guide elements is possible in the static position. This ensures that the substrate can smoothly enter the guide element, and then it is extended. In a particularly preferred embodiment of the invention, the guide element is a rod with a plurality of guide seams. The rod is preferably designed in the form of a roller to form a simple guide element structure. The guide slit in the guide element preferably surrounds the entire circumference of the rod, so that the guide element does not need to be specifically oriented to the substrate being received or guided. In order to avoid or reduce the guide elements and to increase friction between the guide substrates, the guide elements are preferably rotatable about their longitudinal axes. In the following, a more preferred embodiment will be borrowed and the present invention will be explained using drawings. The contents of each drawing are as follows: Fig. 1 is a schematic diagram of a substrate processing apparatus having a substrate receiving device according to an embodiment of the first invention; Fig. 2 is a schematic diagram of a substrate receiving device according to a second embodiment of the invention; Fig. 3 is implemented according to another invention Example schematic diagram of a substrate receiving device; Figure shows the schematic receiving and guiding sequence of a substrate receiving device according to the present invention; Figure 5 Schematic diagram of the positions of wafers with different diameters before being lifted out of the processing fluid from the processing fluid, and the static position of the substrate receiving device . According to Fig. 1, the apparatus 1 for processing a substrate 2 has a groove 3 and a top cover 4 on the groove 3 for receiving the substrate 2. The groove 3 is constituted by a bottom 5 which is mainly v-shaped, and side walls 6 and 7 connected thereto. In the bottom 5, there is a nozzle 9 and a discharge port 10 for introducing and discharging the processing fluid. For example, DI < Please read the precautions on the back before filling this page.) Installation ------ 丨 丨 Order- -------- continued · This paper size is applicable to China Standard for Household Standards (CNS) A4 size mo X 297 male *) B7 V. Description of the invention (6.) Water. The upper edges of the side walls 6 and 7 form overflow edges 12 and 13, respectively, which determine the maximum liquid level height of the groove 3. The processing fluid overflowing from the overflow edges 12 and 13 is discharged in a conventional manner. In the groove 3, there is a lifting and lowering device 20 for a substrate carrier 23 and a knife-shaped element 25, which will be referred to as this element hereinafter Knife. The substrate carrier 23 and the knife 25 can be lifted and lowered independently of each other, as is known to the state of the art. A suitable lifting and lowering device 20 can be found in the unpublished German patent DE-A-197 37 802 belonging to the same applicant. To avoid repetition, the content of this German patent DE-A-19737 802 is also cited as the content of this application. In the substrate carrier 23, a plurality of crystal circles 2 (only one of which is seen in the figure) are mounted in a row in a direction perpendicular to the paper surface, and are supported by a seam-shaped rod 30. Figure 1 shows that the knife 25 is in contact with the lowermost end of the wafer 2, and the wafer 2 is listed from the substrate carrier 23 in the manner described in DE-A-197 37 802, and a part of the movement enters the The inside of the top cover 4 will be described in detail. The top cover 4 on the tank 3 has an input port 32 for gas or mixed gas. This gas is used to dry the wafer 2 according to the conventional Maragoni method in EP-B-0 385 536 described above. The top cover 4 has a first pair of guide rods 35, 36 inside the top cover, and guides the substrate 2 'on the side, and a second pair of guide rods 39, 40. The guide bars 35, 36 and 39, 40 are provided with circumferential guide seams, not shown further. The first pair of guide rods 35, 36 are rotatably fixed to the bolt 47 by the connecting rod 45 or 46, and the bolts are fixed to the front edge of the top cover 4. The position of the bolt 47 and the length of the connecting rod 45 or 46 are so selected. This paper is compliant with the family standard (CNS) A4 specification (2W x 297 male X; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 46326 2 A7 ______B7__ V. Explanation of the invention (7.) When the guide rods 45 and 46 are rotated relative to the bolt 47, they can be relatively flat, and the rotation motion of the guide rod near the fluid surface is determined by the connecting rod. Guide rod 39 In the same way, 40 is fixed to the bolt 51 in a rotatable manner by the connecting rod 49 or 50, and the bolt is fixed on the front wall of the top cover 4. The position of the bolt 51 is below the bolt π and connected The length of the rod is shorter than those of the connecting rods 45 and 46. The position of the bolt 51 and the length of the connecting rods 49 and 50 are selected so that the height of the guide rods 39 and 40 is at the height of the guide rods 35 and 40. , 36, and when there is a receiving wafer in the top cover, the guide rods 39, 40 are above the horizontal centerline of the wafer, or lack a small distance. Guide rods 35 '36 and / or guide rods 39 '40 is fixed on the connecting rod in such a way that its longitudinal axis can be rotated 'and the two guide rods can be mutually The interlocking enables the wafers 2 received in the top cover 4 to be fixed individually by the guide rods 35, 36 and / or by the guide rods 39, 40. Fig. 2 shows another embodiment of the present invention, in which two pairs The guide bars 55, 56 and 59 '60 are "slidingly" mounted in the guide rails 62, 63 or 65, 66, and the guide rails are designed on the front wall 67 corresponding to the other-the top cover 68. ( The main wall is only shown schematically.) Although this guide track is shown in a curved form, it can also be a straight line, and especially the lower guide track can be designed horizontally so that the guide of the substrate is as close to the fluid surface as possible. In this case, the guide elements can be pre-stressed with each other by a spring or other suitable means. Figure 3 shows another embodiment of the invention, in which the guide rods 75, 76, 79 and 80 are rotatably fixed to the bolts 81, 82. , 83 and 84. The bolts 81 to 84 are fixed to the opposite main wall 87 opposite the top cover 88 (this wall is only shown schematically). This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -10- — lull — —-- ^ -------- order ---- * silk (please read "Note on the backside $" Fill out this page again> 46326 2 Printed by the Consumer Finance Cooperative of the Ministry of Economic Affairs, Smart Finance and Economics Co., Ltd. A7. 5. Description of the invention (8 ·) The following is a specific wafer diameter. How to be received into the top cover and how to be guided. Figure 4a to d show the work flow of the device according to the figure. The wafers 2 placed in rows are borrowed from an unillustrated knife to process the fluid. In the example, the surface of the processing fluid is indicated by the symbol 90. As can be seen from Fig. 4a, the upper edge of the crystal figure 2 first contacts the first pair of guide rods 35'36 and is maintained within the guide slot. It can be seen from Fig. 4b that the wafer 2 is guided on the side by the first pair of guide rods 35, 36 as it continues its lifting movement. At this time, the guide rods 35 and 36 are stretched by the wafer 2. In addition, the upper edge of the wafer 2 is in contact with a second pair of guide rods 40 and is maintained in this guide slot. Wafer 2 is now guided on the side by two pairs of guide rods, and the wafer illustration stretches them out. After the first pair of guide rods pass through the horizontal centerline of wafer 2, as shown in Fig. 4c, the guide rod 35 '% slides on the lower side of the wafer. The guide rods 35 and 36 move opposite to each other due to the effect of their own gravity, and the guide rods continue to guide the wafer 2. As shown in Figure 4d, wafer 2 continues to be lifted 'until it is completely lifted from the processing fluid. At this time, 'wafer 2 has been lifted high enough, and the second pair of guide rods 39' 40 also exceed the horizontal centerline of wafer 2 and slide along the lower side of wafer 2. In addition, the 'wafer has been lifted high enough' so that the wafer is now guided only by the second pair, that is, the upper guide rods 39,40. Of course, the wafer can only be lifted to a certain height so that the wafer is just taken out of the processing fluid, but is still guided by two pairs of guide rods at the same time. According to this or the position shown in Figure 4d ', there is at least a pair of guide rods by an unillustrated device. This paper size is applicable to a national standard (CNS) A4 specification (210 X 297 public love) -11-i I order! I Han (please read "Note ^^ on the back side before filling out this page") 463262 Printed by the Consumer Finance Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs A7 B7 V. Description of the invention (9.) For example, a brake lock Hold, so that the guide rods can no longer move outward. Finally, the knife is moved back and the wafer 2 is safely held by the guide element in the top cover 4. In this way, the wafer can be transported together with the top cover when necessary, or it can be placed in the substrate carrier 23 (dried out). To remove and lower wafer 2, the knife moves to contact wafer 2, the direct lock of the guide bar is opened, and the wafer is supported by the knife again. Later when the wafer descends, the wafer is guided again by the guide rod. The relative movement between the wafer and the guide bar is the reverse of the above sequence. Figure 25 shows the wafer position before the wafer is lifted up by the processing fluid when the wafer diameter is different. The guide rods shown are in a rest position with a distance between the rods so that the wafer can be guided into the guide rods and spread outward. It can be seen from Figure 5 that wafers of different diameters can be received into the top cover and guided. The above description of a preferred embodiment of the invention illustrates that the present invention can make more changes and designs by a professional, but does not depart from the inventive concept. In addition to different shaped processing devices and top covers, different guiding devices can also be combined for this type of guide rod, such as fixing one pair of guide rods at a common point of rotation and fixing the other pair On another turning point. In addition to the guide bars shown and described, it is also possible to use wall parts with guide seams which can be moved relative to each other. In addition to the use of springs, the preload between the guide elements can also be achieved by using, for example, high-pressure air or a pneumatic device of N2. This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) -12- f III —--- installed! | Order .-----! # (Please read the precautions on the back first (Fill in this page) 463262 ⑽cognition 3 2 ...: V. Description of the invention (10 'supplementary A7 J37 Symbols printed by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives Symbol description 1 device 65, 66 guide rail 2 base plate 67 front wall 3 slot 68 Top cover 4 Top cover 75, 76, 79, 80 Guide rod 5 Bottom 8 Bu 82, 83, 84 Bolt 6 '7 Side wall 87 Front wall 9 Nozzle 90 Surface 10 Drain 12, 12, Overflow edge 20 Lowering device 23 Substrate carrier 25 Knife-shaped element 30 Rod 32 Input port 35, 36 Guide rod 39, 40 Guide rod 45, 46 Connecting rod 47 Bolt 49, 50 Connecting rod 51 Bolt 55, 56 Guide rod 59, 60 Guide rod 62, 63 guide rail (please read the unintentional matter on the back before filling this page) The private paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)-12-1 »
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19859468A DE19859468C2 (en) | 1998-12-22 | 1998-12-22 | Device for treating and handling substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW463262B true TW463262B (en) | 2001-11-11 |
Family
ID=7892264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088121541A TW463262B (en) | 1998-12-22 | 1999-12-09 | Device for substrate processing |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1145291A1 (en) |
| JP (1) | JP2002533921A (en) |
| KR (1) | KR20010089696A (en) |
| CN (1) | CN1331839A (en) |
| DE (1) | DE19859468C2 (en) |
| TW (1) | TW463262B (en) |
| WO (1) | WO2000038221A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10034744B4 (en) | 1999-08-26 | 2012-05-24 | Schaeffler Technologies Gmbh & Co. Kg | Method for determining the torque transmitted by a friction clutch of a power shift transmission coupled to a drive motor |
| DE10127042A1 (en) * | 2001-06-02 | 2002-12-12 | Astec Halbleitertechnologie Gm | Method for treating or handling substrates e.g. for wafers or silicon discs, involves supporting substrate in lower edge region on supporting elements |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2574411B2 (en) * | 1988-08-09 | 1997-01-22 | 富士通株式会社 | Supporting method for drying with pure water |
| JPH0290522A (en) * | 1988-09-28 | 1990-03-30 | Toshiba Corp | Wafer handling device for cleaning wafer |
| NL8900480A (en) * | 1989-02-27 | 1990-09-17 | Philips Nv | METHOD AND APPARATUS FOR DRYING SUBSTRATES AFTER TREATMENT IN A LIQUID |
| JPH0536668A (en) * | 1991-07-30 | 1993-02-12 | Toshiba Corp | Drying method for semiconductor substrate |
| US5301700A (en) * | 1992-03-05 | 1994-04-12 | Tokyo Electron Limited | Washing system |
| JP2888409B2 (en) * | 1993-12-14 | 1999-05-10 | 信越半導体株式会社 | Wafer cleaning tank |
| DE19703646C2 (en) * | 1996-04-22 | 1998-04-09 | Steag Micro Tech Gmbh | Device and method for treating substrates in a fluid container |
| US6041938A (en) * | 1996-08-29 | 2000-03-28 | Scp Global Technologies | Compliant process cassette |
| KR100226489B1 (en) * | 1996-12-28 | 1999-10-15 | 김영환 | Wafer support and transfer apparatus |
-
1998
- 1998-12-22 DE DE19859468A patent/DE19859468C2/en not_active Expired - Lifetime
-
1999
- 1999-12-03 CN CN99814921A patent/CN1331839A/en active Pending
- 1999-12-03 JP JP2000590200A patent/JP2002533921A/en active Pending
- 1999-12-03 EP EP99961055A patent/EP1145291A1/en not_active Withdrawn
- 1999-12-03 KR KR1020017008056A patent/KR20010089696A/en not_active Application Discontinuation
- 1999-12-03 WO PCT/EP1999/009450 patent/WO2000038221A1/en not_active Application Discontinuation
- 1999-12-09 TW TW088121541A patent/TW463262B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1145291A1 (en) | 2001-10-17 |
| WO2000038221A1 (en) | 2000-06-29 |
| JP2002533921A (en) | 2002-10-08 |
| DE19859468A1 (en) | 2000-07-06 |
| KR20010089696A (en) | 2001-10-08 |
| DE19859468C2 (en) | 2002-01-17 |
| CN1331839A (en) | 2002-01-16 |
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| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |