45596 8 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（I ) [發明領域] 本發明係有關於一種積體電路封裝技術，特別是有關 於一種可防止塌陷之球栅陣列式（BaU Grid Array, BGA)封 裝單元銲結方法’其可用以將BGA封裝單元銲結至電路板 上’但不會使得BGA封裝單元之表面塌陷至電路板的表面 上。 [發明背景] 球栅降列（Ball Grid Array，BGA)為一種先進的積艘電 路封裝技術’其特點在於採用一基板來安置半導體晶片’ 並於該基板背面植置上複數個銲球（s〇lder balls)。於進行 表面竊接程序（Surface Mounting Technology, SMT)時，便 可藉由此些鋒球將整個的BGA封裝單元錄結至印刷電路 板上。 第1A至1C圖為剖面結構示意圖，其中即顯示一習知 之BGA封裝單元銲結方法。 請首先參閱第1A圖，此習知之BGA封裝單元輝結方 法係用以將一 BGA封裝單元1〇〇銲結至一電路板u〇;其 中BGA封裝單元100之背面預先形成有複數個銲墊ι〇1 ; 而電路板U0之正面則預先形成有複數個對應之鋒塾 111 » 於進行表面藕接程序時’第一個步驟為提供一球柵陣 列120 ’其中之各個録球之材質例如為pb/Sn 37/63 (37% 的船和63 %的錫），且分別配置於對應之封裝單元録墊ι〇1 與電路板銲墊1U之間β 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 16066 I. Γ ^ 裝--------訂---------線 {請先閱讀背面之沒意事項再填寫本頁> 經濟部智慧財產局員工消費合作社印絜 五、發明說明（2 請接著參閱第1B圖’下一個步雄為進行一迴鋅程序 (solder refi〇w)，其中所用之熔銲溫度為等於或大於球栅陣 列120中之各個銲球的熔點，藉此而熔化球栅陣列中 之各個銲球’使得球栅陣列120中之各個銲球可迴銲於其 對應之電路板銲墊1Π上。此即將BGA封裝單元100鲜結 至電路板110。 然而上述之BGA封裝單元銲結方法的一項問題在於 球柵陣列I 20中的銲球於熔化時，其材質會由剛性轉變成 可塑性，因此易於導致BGA封裝單元1〇〇塌陷至電路板 110 上。 如第1C圖所示，若BGA封裝單元1〇〇於迴銲過程中 文到不正常之下壓力量、或是BGA封裝單元1〇〇之背面有 不平整之凸出部分’則均有可能導致球栅陣列丨2〇中溶化 之銲球被擠壓成朝向側邊溢散，造成球柵陣列12〇卡之相 鄰銲球之間形成短路現象。 美國專利第 5,841,198 號”BALL GRID ARRAY PACKAGE EMPLOYING SOLID CORE SOLDER BALLS，'即 採用一種硬核銲球（solid core solder balls)來防止BGA封 裝單元於於迴銲過程中塌陷至電路板上。此硬核銲球包括 一外殼部分和一核心部分；其中核心部分之熔點大於外殼 部分之熔點。於迴銲過程中，此核心部分即可提供一支撐 作用，防止BGA封裝蕈元塌陷至電路板上。然而此專利技 術卻有以下缺點。第一項缺點為硬核銲球之製程成本遠大 於一般習用之銲球、因此應用上不符合成本效益。第二項 Μ氏張纥度適用由國围家標* iCMS)A.l邋格公釐： 16066 -------------裝--------訂---------線 <猜先閱讀背面之注意事項再填寫本頁) 455968 ·Α745596 8 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (I) [Field of Invention] The present invention relates to an integrated circuit packaging technology, and in particular to a ball grid array type capable of preventing collapse (BaU Grid Array, BGA) Package unit bonding method 'It can be used to bond BGA package units to a circuit board' but does not cause the surface of the BGA package unit to collapse onto the surface of the circuit board. [Background of the Invention] Ball Grid Array (BGA) is an advanced building block circuit packaging technology 'characterized by the use of a substrate for semiconductor wafers' and a plurality of solder balls (s 〇lder balls). During the Surface Mounting Technology (SMT) process, the entire BGA package unit can be recorded on the printed circuit board by these balls. Figures 1A to 1C are schematic cross-sectional structure diagrams, which show a conventional method for bonding BGA package units. Please refer to FIG. 1A first. The conventional BGA packaging unit glow junction method is used to bond a BGA packaging unit 100 to a circuit board u〇; a plurality of bonding pads are formed on the back of the BGA packaging unit 100 in advance. ι〇1; and the front side of the circuit board U0 is pre-formed with a plurality of corresponding edges. 111 »When performing the surface bonding process, the first step is to provide a ball grid array 120. It is pb / Sn 37/63 (37% of boats and 63% of tin), and is respectively arranged between the corresponding packaging unit recording pad ι〇1 and circuit board soldering pad β This paper size applies Chinese national standards (CNS ) A4 specification (210 X 297 public love) 16066 I. Γ ^ installed -------- order --------- line {Please read the unintentional matter on the back before filling this page > Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, India. 5. Description of the invention (2 Please refer to Figure 1B.' The next step is to perform a solder refi ow process, where the welding temperature is equal to or greater than The melting point of each solder ball in the ball grid array 120, thereby melting each solder ball in the ball grid array 'makes the ball Each solder ball in the array 120 can be re-soldered to its corresponding circuit board pad 1Π. This will freshly knot the BGA package unit 100 to the circuit board 110. However, a problem with the above-mentioned method of soldering the BGA package unit is the ball grid When the solder balls in the array I 20 are melted, the material of the solder balls will change from rigid to plastic, so it is easy to cause the BGA package unit 100 to collapse onto the circuit board 110. As shown in FIG. 1C, if the BGA package unit 100 is During the reflow process, the amount of pressure under abnormal conditions in China, or uneven protrusions on the back of the BGA package unit 100, may cause the solder ball melted in the ball grid array 20 to be squeezed. Scattered towards the side, causing a short circuit between the adjacent solder balls of the ball grid array 120 cards. US Patent No. 5,841,198 "BALL GRID ARRAY PACKAGE EMPLOYING SOLID CORE SOLDER BALLS," that is, a hard core solder ball ( solid core solder balls) to prevent the BGA package unit from collapsing to the circuit board during the reflow process. The hard core solder ball includes a shell portion and a core portion; wherein the melting point of the core portion is greater than the shell portion The melting point. During the reflow process, this core can provide a support function to prevent the BGA package mushrooms from collapsing to the circuit board. However, this patented technology has the following disadvantages. The first disadvantage is the process of hard core solder balls The cost is far greater than the conventional solder balls, so it is not cost-effective in application. The second M-squared degree is applicable by the national standard of the house * iCMS) Al mm mm: 16066 ----------- --Install -------- order --------- line < guess first read the notes on the back before filling out this page) 455968 · Α7
3 16066 經 濟 部 智 慧 财 A 局 消 費 合 ί; 社 印 η 一及第二銲球群 一銲球群包含複 二銲球群則包含 殼部分和一核心 一 _球群的溶 熔點。 一銲球群具有一 第一銲球群的熔 Α7 -------------Β7 _ 五、發明說明（4 ) 間’以及（4)進行一迴銲程序，用以將該第 分別迴銲於其對應之銲墊上。 於本發明之第一實施例中，上述之第 數個均質銲球，且具有一特定熔點；而第 複數個硬核銲球；各個硬核銲球包括一外 部分；其中外殼部分的熔點大致等於該第 點’而核心部分的溶點則大於外殼部分的 於本發明之第二實施例中，上述之第 特定之溶點；而第二銲球群之熔點則大於 點。 上述之球栅陣列式封裝單元銲結方法可防止Bga封 裝單元於迴銲過程中塌陷至電路板上。於迴銲過程中，當 第一銲球群被完全熔化時’第二銲球群僅有外殼部分被嫁 化（第一實施例之情況）、或完全不被熔化（第二實施例之情 況）；因此於迴銲過程中，第二銲球群可提供一支撐作用’ 以防止BGΑ封裝單元塌陷至電路板上。 [圖式簡述] 本發明之實質技術内容及其實施例已用圖解方式詳 細揭露繪製於本說明書所附之圖式之中。此些圖式之内容 簡述如下： 第1A至1C圖（習知技術）為刮面結構示意圖，其中顯 示一習知之BGA封裝單元銲結方法： 第2A至2C圈為剖面結構示意圖，其中顯示本發明之 BGA封裝單元銲結方法之第一實施例： 16066 ---------------------訂--------- {請先閱讀背面之注意事項再填寫本頁> 4 經濟部智慧財產局員工消費合作社印製 5 596 8 A7 _B7_五、發明說明（5 ) 第3A至3C圖為剖面結構示意圖，其t顯示本發明之 BG A封裝單元銲結方法之第二實施例。 [圖式標號] 100 BGA封裝單元 101 封裝單元銲墊 110 電路板 111 電路板銲墊 12 0 球柵陣列 120a 溢散之銲球 200 BGA封裝單元 201 封裝單元銲墊 210 電路板 211 電路板銲墊 220 球柵陣列 221 第一銲球群（均質銲球） 222 第二銲球群（硬核銲球） 222a 第二銲球群222之外殼部分 222b 第二銲球群222之核心部分 300 BGA封裝單元 301 封裝單元銲墊 310 電路板 311 電路板銲墊 3 20 球栅陣列 321 第一銲球群（低熔點銲球） {請先閱讀背面之沒意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5 16066 i 五、 A7 87 發明說明（6 ) 322 第二銲球群（高熔點銲球） [發明實施例] 以下即配合所附圖式之第2A至2C圖和第3A至3C 圖’分別詳細揭露說明本發明之BGA封裝單元銲結方法之 二個實施例》 茗一實施例（第2A至 以下即配合所附圖式之第2A至2C圖，詳細揭露說明 本發明之BG A封裝單元銲結方法之第一實施例β 請首先參閱第2Α圖，於此實施例中，本發明之 封裝單元銲結方法係用以將一 BGA封裝單元2〇〇銲結至一 電路板210;其中BGA封裝單元200之背面預先形成有複 數個銲墊201;而電路板21〇之正面則預先形成有複數個 對應之銲墊211。 本發明之BGA封裝單元銲結方法之第一實施例的特 點在於採用一特殊之球栅陣列22〇，其包括一第一銲球群 221和一第二銲球群222 ’且此二銲球群221、222係以一 交互間隔方式配置於球栅陣列22〇之中。第一銲球群2η 包含複數個均質銲球’且係以一特定溶點之銲料製成，例 如為PW63n銲球群切則包含複數個硬核鲜 球’每-個硬核鏵球包括一外殼部分2以和一核心部分 ⑽：其中外殼部分^之溶點大致等於第-銲球群川 之熔點，其材質例如亦為Pb/Sn 37/63 ;而核心部分”几 之溶點則大於外殼部分222a m.材質例如為銅(Cu) 銲料Pb/S”5,5(95%的錯和5%的錫且其具有一 16066 I n n n u l · n n- <n n n n 1 .^1 n n n I <請先M讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 ^55968 A7 ------B7____ 五、發明說明（7 ) 預定之直徑。 請接著參閱第2B圖，下一個步騍為進行一迴銲程序， 其中所施加之熔銲溫度為等於或大於第一銲球群22丨和第 二銲球群222之外殼部分222a的熔點，但小於第二銲球群 222之核心部分222b的熔點，藉此而熔化第一銲球群221 的整體部分和第二銲球群222的外殼部分222a，但不熔化 第二銲球群222的核心部分222b，使得第一銲球群221的 整體部分和第二銲球群222的外殼部分222a因此而迴銲於 其對應之電路板銲墊211上。 如第2C圖所示，於上述之迴銲程序中，若BGa封裝 單元200受到不正常之下壓力量、或是BGA封裝單元2〇〇 的背面有不平整之凸出部分，則由於第二銲球群222之核 心部分222b並未熔化而保持堅硬之材質，因此可提供一支 撐作用，不會使得BGA封裝單元200塌陷至電路板21〇 上》 第二實施例（第3A黾3Γ： Μ、 以下即配合所附圖式之第3Α至3C圖，詳細揭露說明 本發明之BGA封裝單元銲結方法之第二實施例， 請首先參閱第3Α圖’於此實施例f，本發明之bga 封裝單元鋒結方法係用以將一 BGA封裝單元300銲結至一 電路板310;其t BGA封裝單元300之背面預先形成有複 數個鋒整*301;而電路板310之正面則預先形成有複數個 對應之銲墊3 11。 本發明之BGA封裝單元銲結方法之第二實施例的特 (請先閱ΐι背面之注意事項再填寫本頁) 震--------訂---------線 經濟部智慧財產局ΜΚ工消費合作杜印黎 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 7 16066 κι Β73 16066 Ministry of Economic Affairs, Bureau of Intellectual Property, Bureau of Economics and Consumer Affairs, the first and second solder ball groups. A solder ball group containing a complex solder ball group includes a shell part and a core melting point. A solder ball group has a melt A7 of a first solder ball group ------------- B7 _ V. Description of the invention (4) Room 'and (4) Perform a reflow procedure for This first part is re-soldered to its corresponding pad. In the first embodiment of the present invention, the above-mentioned several homogeneous solder balls have a specific melting point; and the plurality of hard-core solder balls; each hard-core solder ball includes an outer portion; wherein the melting point of the shell portion is approximately The melting point of the core part is greater than the shell part. In the second embodiment of the present invention, the above-mentioned first specific melting point; and the melting point of the second solder ball group is greater than the point. The method for bonding the ball grid array packaging unit described above can prevent the BGA packaging unit from collapsing onto the circuit board during the reflow process. During the reflow process, when the first solder ball group is completely melted, only the shell portion of the second solder ball group is married (in the case of the first embodiment), or not melted at all (in the case of the second embodiment) ); Therefore, during the reflow process, the second solder ball group can provide a support function to prevent the BGA package unit from collapsing onto the circuit board. [Brief Description of the Drawings] The essential technical content of the present invention and its embodiments have been disclosed in detail in the drawings in the drawings attached to this specification. The contents of these diagrams are briefly described as follows: Figures 1A to 1C (conventional technology) are schematic diagrams of scraped surface structures, which show a conventional method of bonding BGA packaging units. Circles 2A to 2C are schematic diagrams of cross-sectional structures, which show The first embodiment of the method for bonding BGA packaging units of the present invention: 16066 --------------------- Order --------- {Please first Read the notes on the back and fill in this page> 4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 596 8 A7 _B7_ V. Description of the invention (5) Figures 3A to 3C are schematic diagrams of cross-sectional structures, and t shows the present invention The second embodiment of the method for bonding BG A package units. [Symbol] 100 BGA package unit 101 package unit pad 110 circuit board 111 circuit board pad 12 0 ball grid array 120a spilled solder ball 200 BGA package unit 201 package unit pad 210 circuit board 211 circuit board pad 220 Ball grid array 221 First solder ball group (homogeneous solder ball) 222 Second solder ball group (hard core solder ball) 222a Shell part of the second solder ball group 222b Core part of the second solder ball group 222 300 BGA package Unit 301 Package unit pad 310 Circuit board 311 Circuit board pad 3 20 Ball grid array 321 First solder ball group (low melting point solder ball) {Please read the unintentional matter on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 5 16066 i V. A7 87 Description of the invention (6) 322 Second solder ball group (high melting point solder ball) [Invention Example] The following is in accordance with the drawings Figures 2A to 2C and Figures 3A to 3C 'respectively disclose in detail two embodiments illustrating the method for bonding the BGA package unit of the present invention.' First embodiment (2A to 2) Figure 2C, detailing the BG A of the present invention First Embodiment of the Packaging Unit Bonding Method β Please refer to FIG. 2A first. In this embodiment, the packaging unit bonding method of the present invention is used to bond a BGA packaging unit 200 to a circuit board 210. Among them, the back side of the BGA packaging unit 200 is pre-formed with a plurality of bonding pads 201; and the front side of the circuit board 21 is pre-formed with a plurality of corresponding pads 211. The first embodiment of the BGA packaging unit bonding method of the present invention It is characterized by adopting a special ball grid array 22, which includes a first solder ball group 221 and a second solder ball group 222 ′, and the two solder ball groups 221 and 222 are arranged on the ball grid in an interactive spaced manner. In the array 22, the first solder ball group 2η contains a plurality of homogeneous solder balls 'and is made of a specific melting point solder. For example, for the PW63n solder ball group cut, it includes a plurality of hard core fresh balls' per one The hard core ball includes a shell part 2 and a core part: the melting point of the shell part ^ is approximately equal to the melting point of the first solder ball group, and the material is, for example, Pb / Sn 37/63; and the core part " Its melting point is larger than the shell part 222a m. The material is, for example, copper ( Cu) solder Pb / S "5,5 (95% error and 5% tin and it has a 16066 I nnnul · n n- < nnnn 1. ^ 1 nnn I < please read the precautions on the back first (Fill in this page again.) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ 55968 A7 ------ B7____ 5. Description of the invention (7) The predetermined diameter. Please refer to FIG. 2B. The next step is to perform a reflow process, in which the applied welding temperature is equal to or greater than the melting point of the shell portion 222a of the first solder ball group 22 丨 and the second solder ball group 222. But is smaller than the melting point of the core portion 222b of the second solder ball group 222, thereby melting the entire portion of the first solder ball group 221 and the outer shell portion 222a of the second solder ball group 222, but not melting the second solder ball group 222 The core portion 222b allows the entire portion of the first solder ball group 221 and the outer shell portion 222a of the second solder ball group 222 to be re-soldered to the corresponding circuit board pads 211. As shown in FIG. 2C, in the above-mentioned reflow process, if the BGa package unit 200 receives an abnormal amount of downward pressure, or the back surface of the BGA package unit 200 has uneven protrusions, then the second The core portion 222b of the solder ball group 222 is not melted and remains a hard material, so it can provide a supporting effect without causing the BGA package unit 200 to collapse onto the circuit board 21. The second embodiment (3A 黾 3Γ: Μ The following is a detailed description of the second embodiment of the method for bonding the BGA packaging unit of the present invention in conjunction with the 3A to 3C diagrams of the attached drawings. Please refer to FIG. 3A first. In this embodiment f, the bga of the present invention The packaging unit front junction method is used to bond a BGA packaging unit 300 to a circuit board 310; the back side of the t BGA packaging unit 300 is pre-formed with a plurality of front-ends * 301; and the front side of the circuit board 310 is pre-formed A plurality of corresponding solder pads 3 11. The characteristics of the second embodiment of the method for bonding BGA packaging units of the present invention (please read the precautions on the back side before filling this page) -------- MKU Industrial Consumer Cooperation Li this paper scale applicable Chinese National Standard (CNS) A4 size (210 X 297 mm) 7 16066 κι Β7
五、發明說明（8 16066 點在於採用一特殊之球柵陣列320,其包括—第—銲球群 j21和一第二銲球群322，且此二銲球群321、322係以一 父互間隔方式配置於球柵陣列32〇之中。此二銲球群m、 322中之各個銲球的體積係大致為相等。 此第二實施例與前述之第一實施例之不同之處在於 第一銲球群321和第二銲球群322全為均質銲球，但第二 銲球群322之溶點為大於第一銲球群321之溶點，較佳之 實施方式為至少大^。第―鋒球群321之材質可例如為V. Description of the invention (8, 16066 points is the use of a special ball grid array 320, which includes-the first solder ball group j21 and a second solder ball group 322, and the two solder ball groups 321, 322 are connected by a parent The spacing method is arranged in the ball grid array 32. The volume of each solder ball in the two solder ball groups m and 322 is approximately equal. The difference between this second embodiment and the aforementioned first embodiment is that the One solder ball group 321 and the second solder ball group 322 are all homogeneous solder balls, but the melting point of the second solder ball group 322 is greater than the melting point of the first solder ball group 321, and the preferred embodiment is at least ^. ―The material of the front ball group 321 may be, for example,
Pb/Sn 37/63，而第二銲球群322之材質則可例如 95/5 。 π ㈣ 請接著參閱第3Β圖，下一個步驟為進行—第一迴銲 程序’其中所施加之料溫度為等於或大於鮮球群 321的炫點’但小於第二銲球群切的溶點，藉此而僅溶 化第一銲球群321，但不溶化第二銲球群322,使得第一録 球群321迴銲於其對應之電路板料3u^此第一迴鲜 程序係僅進行至第-銲球群321黏附至其對應之電路板鋒 堅^11的一部分面積3為止α 於上述之第一迴銲程序中，由於第二銲球群322並未 溶化而仍保持堅硬之材質，因此可支樓住封裝單元 ’不會使得BGA封裝單元3⑽因第一銲球群321之炫 化而塌陷至電路板31〇上。 請接著參閱第3C圖，下一個步驟為進行一第二迴鋒 程序1中所施加之㈣溫度為等於或大於第二薛球群 ^藉此而同f化第—銲球群32!和第二鲜， ^ g imi (CNJGiAi k cno，297 ^ ^ -------^ ftf"閱^背面^^意事項再填寫本頁> 5 5968Pb / Sn 37/63, and the material of the second solder ball group 322 can be 95/5, for example. π ㈣ Please refer to Figure 3B. The next step is to carry out the first reflow procedure 'where the temperature of the applied material is equal to or greater than the dazzling point of the fresh ball group 321' but smaller than the melting point cut by the second solder ball group. In this way, only the first solder ball group 321 is melted, but the second solder ball group 322 is not melted, so that the first recording ball group 321 is re-soldered to its corresponding circuit board 3u. The first solder ball group 321 is adhered to a part of the area 3 of the corresponding circuit board edge ^ 11. In the first reflow process described above, because the second solder ball group 322 has not melted, it still maintains a hard material. Therefore, the supportable packaging unit 'will not cause the BGA packaging unit 3' to collapse onto the circuit board 31o due to the dazzling of the first solder ball group 321. Please refer to FIG. 3C. The next step is to perform a second back traverse procedure. The applied temperature is equal to or greater than the second Xueqiu group. Er Xian, ^ g imi (CNJGiAi k cno, 297 ^ ^ ------- ^ ftf " Read ^ back ^ ^ Matters and fill in this page again> 5 5968
五、發明說明（9 ) 群322’使得第一銲球群321更進一步迴銲於其對應之電 路板銲墊311上，並同時使得第二銲球群322開始進行迴 銲，直至第一銲球群321完全黏附至其對應之電路扳銲墊 311的整個面積上為止β 經此第二迴銲程序之後，第一銲球群321將完全黏附 至其對應之電路板銲塾311的整個面積上，但第二辑球群 322將僅黏附至其對應之電路板銲墊311的一部分面積； 亦即第一銲球群321之銲墊黏附面積名大於第二銲球群 322之銲墊黏附面積a〆由於第一銲球群321和第二銲球 群322中的各個銲球的體積為相等，因此迴銲之後的第二 鲜球群322的高度會大於迴鲜之後的第一銲球群321的高 度’而此高度較大之第二銲球群3 22即可提供一支撐作用 至BGA封裝單元300 ’使得BG Α封裝單元300不會因第 一銲球群321之高度於迴銲之後變小而塌陷至電路板 上。 [結論] 综而言之’本發明提供了一種新穎之BGA封裝單元銲 結方法’其可防止BG A封裝單元於迴銲過程中塌陷至電路 板上。於迴銲過程中，當第一銲球群被完全熔化時，第二 銲球群僅有外殼部分被熔化（第一實施例之情況）、或完全 不被熔化（第二實施例之情況）；因此於迴銲過程中，第二 銲球群即可提供一支撐作用，以防止BGA封裝單元塌陷至 電路板上。 以上所述僅為本發明之較佳實施例而已，並非用以限 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂---I-----線 經濟部智慧財i局員工消費合作社印製 本紙張尺度適用中國困家標準（CNS)A4規格（210 X 297公釐） 9 16066 A7 B7 五、發明說明（W ) 定本發明之實質技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申請專利範圍中°任何他人所完成 之技術實想或方法，若是與下述之申請專利範圍所定義者 為完全相同 '或是為一種等效之變更’均將被視為涵蓋於 此專利範圍之中。 --— 1--I — — — !- i I I I I — I 訂-----^ ---I (請先閱讀背面之注意事項再填寫本頁) 趣濟邹智%时產局員X消費会作社印製 .义度適用中國國家標準（CNS)乂丨規珞mo < 297公货 10 ! 6066V. Description of the invention (9) Group 322 'enables the first solder ball group 321 to be re-soldered to its corresponding circuit board pad 311, and at the same time causes the second solder ball group 322 to begin re-soldering until the first solder The ball group 321 is completely adhered to the entire area of its corresponding circuit pad 311. After this second reflow process, the first solder ball group 321 will be completely adhered to the entire area of its corresponding circuit board pad 311. Above, but the second series of ball groups 322 will only adhere to a portion of the area of their corresponding circuit board pads 311; that is, the name of the bonding area of the pads of the first group of balls 321 is greater than that of the second group of balls 322 Area a〆 Since the volume of each solder ball in the first solder ball group 321 and the second solder ball group 322 is equal, the height of the second fresh ball group 322 after re-welding is greater than that of the first solder ball after re-fresh The height of the group 321 'and the larger second solder ball group 3 22 can provide a support to the BGA package unit 300' so that the BG A package unit 300 will not be re-soldered due to the height of the first solder ball group 321 It then becomes smaller and collapses onto the circuit board. [Conclusion] In summary, the present invention provides a novel method for bonding BGA package units, which can prevent the BG A package units from collapsing onto the circuit board during the reflow process. During the re-soldering process, when the first solder ball group is completely melted, only the shell portion of the second solder ball group is melted (in the case of the first embodiment) or not melted at all (in the case of the second embodiment) Therefore, during the reflow process, the second solder ball group can provide a support function to prevent the BGA package unit from collapsing onto the circuit board. The above is only a preferred embodiment of the present invention, and is not intended to be limited (please read the precautions on the back before filling this page). -------- Order --- I ----- Printed by the Consumer Finance Cooperative Bureau of the Ministry of Online Economy, Smart Consumer Finance Bureau, the paper size is applicable to the Chinese Standard for Household Standards (CNS) A4 (210 X 297 mm) 9 16066 A7 B7 V. Description of the Invention (W) range. The essential technical content of the present invention is broadly defined in the scope of the patent application below. Any technical idea or method completed by others, if it is exactly the same as that defined in the scope of patent application below, or is a kind of etc. All effective changes are deemed to be covered by this patent. --- 1--I — — —!-I IIII — I order ----- ^ --- I (Please read the notes on the back before filling this page) Printed by the Society. Applicability is subject to Chinese National Standards (CNS) 乂 丨 乂 珞 297public goods 10! 6066