JPS61117887A - Method of mounting part to which surface is formed - Google Patents
Method of mounting part to which surface is formedInfo
- Publication number
- JPS61117887A JPS61117887A JP23842184A JP23842184A JPS61117887A JP S61117887 A JPS61117887 A JP S61117887A JP 23842184 A JP23842184 A JP 23842184A JP 23842184 A JP23842184 A JP 23842184A JP S61117887 A JPS61117887 A JP S61117887A
- Authority
- JP
- Japan
- Prior art keywords
- components
- soldering
- mounting
- parts
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は面付は部品、ｉ！装方法に係り、荷に、プラス
チックパッケージのフラットバンクＩＣ−？、チップ抵
抗、チップコンデンサー等の面付は部品をプリント板の
裏面に、高信頼性、高生産性をもってはんだリフロー接
続する面付は部品実装方法に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is applied to imposition of parts, i! Regarding the mounting method, flat bank IC-? Surface mounting, such as chip resistors, chip capacitors, etc., relates to a component mounting method that connects components to the back side of a printed circuit board by soldering reflow with high reliability and high productivity.
従来の実装方法は、日経エレクトロニクス°８２゜８．
１６号、１３６ｐに記載される様に、はんだペースト印
刷供給と雰囲気加熱方式と、接着剤仮固定およびフロー
ソルダリング方式とがあるが、前者は従来のスルーホー
ル挿入型ディスクリート部品と混合する場合、ディスク
リート部品を実装する前ＫＸ面付は部品用のはんだペー
スト印刷を行なわなければならない。又、プリント板の
裏面にはディスクリート部品のはんだ付は時、再加熱さ
れ部品落下するため実装できないという欠点があった。The conventional mounting method is Nikkei Electronics°82°8.
As described in No. 16, p. 136, there are two methods: a solder paste printing supply and atmosphere heating method, and an adhesive temporary fixing and flow soldering method, but when the former is mixed with conventional through-hole insertion type discrete components, Before mounting discrete components, KX imposition must print solder paste for the components. Furthermore, when soldering discrete components to the back side of a printed circuit board, there is a drawback that the components cannot be mounted because they are reheated and the components fall off.
後者は、プリント板の裏面に面付は部品を接着剤で仮固
定して、はんだ付けできるが、プラスチックパッケージ
の７ラツトバツクＩＣはフローはんだ付は時に溶けたは
んだが直接パッケージに触れて、パッケージにクラック
が発生し、耐湿性の信頼性が低下ｒるという欠点があっ
た。The latter can be soldered to the back of a printed circuit board by temporarily fixing the parts with adhesive, but with flow soldering for plastic packaged ICs, the melted solder may come into direct contact with the package and cause damage to the package. There was a drawback that cracks occurred and the reliability of moisture resistance decreased.
更に、これらの改良型としてはんだペーストをディスペ
ン丈−で供給し、フラットパックＩＣを搭載した後、は
んだ接続部分のみ、気相雰囲気のホットガスをふきつけ
てはんだ付けする方法も考えられるが、はんだ付は部−
ケ所毎にはんだを供給したり、−ケ所毎はんだを溶融す
る必要があるため、部品数量が少ない場合は良いが、数
量が多くなると作業工数が多大となり、生産性が悪いと
いう欠点があった。Furthermore, as an improved version of these methods, a method could be considered in which solder paste is supplied in dispense length, and after mounting a flat pack IC, the solder connection area is soldered by blowing hot gas in a vapor atmosphere, but it is not possible to solder the solder paste. Part-
Since it is necessary to supply solder to each location and to melt solder to each location, it is good when the number of parts is small, but when the number of parts is large, the number of man-hours increases and productivity is poor.
本発明の目的は、プリント板の表面にディスクリート部
品、裏面に７ラツトパツクＩＣ等の面付は部品を実装す
る方法において、ディスクＩＪ −ト部品のフローはん
だ付けを行なうと同時に、裏面面付は部品搭載バンドの
迎えはんだ付けを行ない、その後迎えはんだ付けされた
面付は部品を７ラツクスで仮固定後、赤外線加熱により
はんだリフロー接続を行なうことにより、高信頼性、高
生産性の面付は部品実装方法を提供することにある。The object of the present invention is to provide a method for mounting discrete components on the front surface of a printed circuit board and surface mounting components such as 7-ratpack ICs on the back surface, in which flow soldering of disk IJ-platform components is performed, and at the same time, components are mounted on the back surface. After the pick-up soldering of the mounting band is carried out, and after the pick-up soldering is performed, the parts are temporarily fixed with 7 lux, and then the solder reflow connection is performed using infrared heating. By doing so, the parts can be mounted with high reliability and high productivity. The purpose is to provide an implementation method.
本発明の特識は、表面のディスクリート部品をはんだ付
けすると同時に、裏面面付は部品搭載バンドが迎えはん
だされることに着目し、面付は部品のはんだ付は部に迎
えはんだを実施することにより、はんだ付は部が相方迎
えはんだされた状態で赤外線リフローはんだ付けされる
ことにある。The special feature of the present invention is that, at the same time as the discrete components on the front side are soldered, the component mounting band is picked up and soldered in the back side mounting, and the component mounting band is picked up and soldered in the side mounted part. Accordingly, the soldering process consists of infrared reflow soldering with the parts already soldered to each other.
本発明の処理工程を第１図により説明する。■スルーホ
ール２に挿入されたディスクリート部品１を７０−ソル
ダー９に流し、スルーホール２内のリードをはんだ付け
する。この時、裏面の面付は部品搭載パッド５も同時に
迎えはんだ付けされる。■ディスクリート部品の不要な
リードをリードカッター４で切ＩＩｙ？する。■あらか
じめ７ａ−ソルダー１０により迎えはんだ付けされた部
品６を真空吸着ヘッド７でプリント板３に搭載する。■
搭載されたフラットパックＩＣは、その後、赤外線ラン
プ８により、はんだ付は部を２４０〜２６０Ｃに５〜１
０秒加熱し、はんだ接続を終了する。The processing steps of the present invention will be explained with reference to FIG. (2) The discrete component 1 inserted into the through hole 2 is passed through the 70-solder 9, and the leads inside the through hole 2 are soldered. At this time, the component mounting pad 5 is simultaneously soldered to the back side. ■Cut unnecessary leads of discrete components with lead cutter 4 IIy? do. (2) The component 6, which has been pre-soldered using the 7a-solder 10, is mounted on the printed board 3 using the vacuum suction head 7. ■
The mounted flat pack IC is then soldered to 240 to 260C using an infrared lamp 8.
Heat for 0 seconds to complete solder connection.
これらを具体化する装置’ｌＥＺ図に示し、以下説明す
る。ＸＹテーブル１１上に回転、上、下する吸着ヘッド
７があり、プリント板搬送装置１２でリードカットされ
た後、反転されたプリント板３が定位置に位置決めされ
ている。又、７ツツトパツクＩＣ等の面付は部品は部品
トレー１３によりマガジンで供給される。吸、−ヘッド
７は部品トレーより部品を真空吸着し、フローツルター
１０にリード部のみ浸漬し、迎えはんだ付けを行ない、
その後、プリント板３の所定の位置に搭載ｒる。A device embodying these is shown in the diagram and will be described below. There is a suction head 7 that rotates, moves up and down on an XY table 11, and after the lead is cut by a printed board conveying device 12, the printed board 3 which is inverted is positioned at a fixed position. For surface mounting of 7-pack ICs, etc., parts are supplied in a magazine from a parts tray 13. - The head 7 vacuum suctions the component from the component tray, immerses only the lead part in the flow solder 10, and performs pick-up soldering.
Thereafter, it is mounted at a predetermined position on the printed board 3.
所定の部品ｆｆ載の終了したプリント板は赤外線す７０
−炉１４へ搬送トＶ−により送られる。The printed board on which the predetermined parts ff have been mounted is exposed to infrared light at 70
- sent to the furnace 14 by conveyor V-.
本発明によれば、ディスクリート部品を既に実装したプ
リント板の裏面に、液相の溶融はん７どを直接グラスチ
ックパッケージ等の熱衝撃に弱い面けけ部品に接触させ
ないでリフａ−はんだ付けできるため、高信頼性でしか
も高生産性のプリント板芙装ができる。According to the present invention, re-A-soldering can be performed on the back side of a printed circuit board on which discrete components have already been mounted, without directly contacting liquid-phase molten solder 7 with surface-mounted components that are susceptible to thermal shock, such as glass packages. Therefore, highly reliable and highly productive printed board mounting is possible.
第１図は本発明の作業方法と説明する工程図、第２図は
本地間の一実施例の実装装置の斜視図である。
１・・・ディスクリート部品、２・・スルーホール、３
・・・プリント板、４・・・リードカッター、５・・・
面付は部品搭孜ハツト、Ｇ・・・面付は部品、７・・・
吸着ヘッド、８・・・赤外、腺ラング、９・・・ディス
クリート部品用フａ−フルグー、ＩＯ・・・面付は部品
用フローツルター。FIG. 1 is a process diagram illustrating the working method of the present invention, and FIG. 2 is a perspective view of a mounting apparatus according to an embodiment of the present invention. 1... Discrete component, 2... Through hole, 3
...Printed board, 4...Lead cutter, 5...
Imposition is for parts, G... Imposition is for parts, 7...
Suction head, 8...infrared, gland rung, 9...Full goo for discrete parts, IO...Float sulter for parts.
Claims (1)
ラットパックＩＣ等の面付け部品を実装する方法におい
て、 前記ディスクリート部品のフローはんだ付けを行なうと
同時に、裏面面付け部品搭載パッドの迎えはんだ付けを
行ない、その後、迎えはんだ付けされた前記面付け部品
をフラックスで仮固定後、赤外線加熱によりはんだリフ
ロー接続を行なうことを特徴とする面付け部品実装方法
。[Claims] 1. In a method for mounting discrete components on the front surface of a printed circuit board and surface-mounted components such as flat pack ICs on the back surface, the flow soldering of the discrete components is simultaneously carried out, and at the same time, a surface-mounted component mounting pad on the back surface is mounted. 1. A surface-mounted component mounting method characterized by performing pick-up soldering, and then temporarily fixing the pick-up soldered surface-mounted components with flux, and then performing solder reflow connection by infrared heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23842184A JPS61117887A (en) | 1984-11-14 | 1984-11-14 | Method of mounting part to which surface is formed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23842184A JPS61117887A (en) | 1984-11-14 | 1984-11-14 | Method of mounting part to which surface is formed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61117887A true JPS61117887A (en) | 1986-06-05 |
Family
ID=17029955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23842184A Pending JPS61117887A (en) | 1984-11-14 | 1984-11-14 | Method of mounting part to which surface is formed |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61117887A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101005505B1 (en) | 2002-10-29 | 2011-01-04 | 신꼬오덴기 고교 가부시키가이샤 | Method of mounting electronic parts on wiring board |
-
1984
- 1984-11-14 JP JP23842184A patent/JPS61117887A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101005505B1 (en) | 2002-10-29 | 2011-01-04 | 신꼬오덴기 고교 가부시키가이샤 | Method of mounting electronic parts on wiring board |
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