TW448588B - LED lamp of edge emitting type - Google Patents
LED lamp of edge emitting type Download PDFInfo
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- TW448588B TW448588B TW088123055A TW88123055A TW448588B TW 448588 B TW448588 B TW 448588B TW 088123055 A TW088123055 A TW 088123055A TW 88123055 A TW88123055 A TW 88123055A TW 448588 B TW448588 B TW 448588B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
Description
448 5 8 8 修正 ·Ί修正' 案號 88123055 五、發明說明（1) 本發明所屬的技術領域448 5 8 8 Amendment · "Amendment" Case No. 88123055 V. Description of the invention (1) Technical field to which the present invention belongs
本發明係有關，例如合適於行動電話等的液晶顯示的 後光之侧面發光型LED燈，尤其是有關具有均一指向特 性，並且在LED元件之間的偏差小的小型化側發光型LED 燈。 以往的技術 做為以往的側面發光型led燈，例如有特開平 1 0-2 90 0 29號公報所開示者。 圖8表示此一側面發光型LED燈。此LED燈1是，如同該 圖（a)所示，在裝LED元件用基板2上面，裝置第一led元件 5a及第二LED元件5b，而以透明成型樹脂封裝這些LED元件 5a、5b而成的。在裝LED元件用基板2的表面2a及背面2b 上’分別形成共電極3 c ’在基板2的一方的侧面2 ^處就分 別形成第一個別電極3 a，在另—方的側面2 d處就分別形成 第二個別電極3b，表面2a的共通電極3c與背面2b的共通電 極3c是以切半的鍍於穿孔洞壁上的電鍍的連接電鍍4，加以 連接。第一及第二LED元件5a、5b是在其上面具有第一電 極’在下面具有第二電極。第一LED元件5a的第一雪極是 以結合線6連接於第-個別電極3a，第二通元件讣的第一The present invention relates to, for example, a side-emission type LED lamp suitable for a back light of a liquid crystal display of a mobile phone or the like, and particularly to a miniaturized side-emission type LED lamp having uniform directivity and a small deviation between LED elements. Conventional technology As a conventional side-emitting LED lamp, for example, there is a device disclosed in Japanese Patent Application Laid-Open No. 10-2 90 0 29. FIG. 8 shows such a side-emitting LED lamp. This LED lamp 1 is such that, as shown in (a) of the figure, a first LED element 5a and a second LED element 5b are mounted on a substrate 2 for mounting an LED element, and these LED elements 5a and 5b are encapsulated with a transparent molding resin. Into. A common electrode 3 c is formed on each of the front surface 2 a and the back surface 2 b of the substrate 2 on which the LED element is mounted. A first individual electrode 3 a is formed on one side surface 2 ^ of the substrate 2, and the other side surface 2 d is formed. A second individual electrode 3b is formed at each place. The common electrode 3c on the front surface 2a and the common electrode 3c on the back surface 2b are connected by a half-plated connection plating 4 plated on the wall of the perforated hole. The first and second LED elements 5a and 5b have a first electrode on the upper side and a second electrode on the lower side. The first snow electrode of the first LED element 5a is connected to the first individual electrode 3a by a bonding wire 6, and the first of the second pass element 讣
電極是以結合線6連接於第二個別電極3b，第-及第二LED 二⑪的第二電極是以導電性接著劑連接於表面的 共通電極3c。 當要實裝此L E D元件1於印说丨 Μ電路板1 0時，就如同圖 8(b)所示—般，將裝LED元件用| ^就如υα --------暴板的端面2c向下立設於The electrode is connected to the second individual electrode 3b with a bonding wire 6, and the second electrode of the first and second LEDs is connected to the common electrode 3c with a conductive adhesive on the surface. When the LED element 1 is to be mounted on the printed circuit board 10, as shown in FIG. 8 (b), the LED element will be mounted with | ^ as υα -------- storm The end face 2c of the board is standing down
2001.04. 02. 0042001.04. 02. 004
WChenlin\19991103\PATENT\hir 11039amend01 .ptc 第 4 W 448588WChenlin \ 19991103 \ PATENT \ hir 11039amend01 .ptc 4 W 448588
印刷電路板1 Ο，將露出於裝LED元件用其 別電極3a、3b及共通電極3c，與指對於"印^ f面仏的個 配線圖型11a、lib、11c，以銲劑12加以連接。 的 線圖型lla、Ub、11C之間流通電流，從苐—及配 件的5a、5b經由模塑樹脂17向印刷電路板1〇表 2 及第二顏色的光線8a、8b。 知对弟一 圖9表示水平方向的指向特性。此LED燈1是如 圖所示’對兩個LED元件5a、5b持有同一的指向特性:°因 此當做為液晶顯示器的背光使用時即能防止液晶顯示器的 顏色深淺不均。 > 本發明所要解決的課題 然而，如使用以往的側面發光型L E D燈，則因為模塑 樹脂1 7是具有矩形狀，所以如同圖9所示，其角部1 7a引起 指向性的甚大變化，而無法對液晶顯示器均一地照射光 線。 又在LED元件5a、5b所排列的方向設有連接基板2的表 面2a及背面2b的共通電極3c的電鍍4’ ，因此當實裝於印刷 電路板10上時，高度尺寸就變大，又因為個別電極3a、3b 是被設置於基板2的側面2d ’所以寬度尺寸也變大。在周 端面具有電極的如此構造時，如搭載三個以上的LE D元 件，電極構造則複雜化，而大变化。 在另一方面，若是從發光側看以斜方向配置兩個L ED 元件5a、5b，則能減低高度尺寸，但是因為在顏色之間的The printed circuit board 10 is exposed to the other electrodes 3a, 3b and the common electrode 3c for mounting the LED element, and the wiring patterns 11a, lib, and 11c for the " printed surface f, respectively, are connected by the flux 12 . A current flows between the line patterns 11a, Ub, and 11C, and the light rays 8a, 8b of the second color are transmitted to the printed circuit board 10 from Table 5 and the second color through the resin 5a and 5b through the molding resin 17.知 对 一一 Figure 9 shows the directional characteristics in the horizontal direction. This LED lamp 1 has the same directional characteristics for the two LED elements 5a and 5b as shown in the figure: °. Therefore, when used as a backlight of a liquid crystal display, the color unevenness of the liquid crystal display can be prevented. > Problems to be Solved by the Invention However, if a conventional side-emitting LED lamp is used, since the molding resin 17 has a rectangular shape, as shown in FIG. 9, the corner 17a causes a large change in directivity. It is not possible to illuminate the liquid crystal display uniformly. In addition, in the direction in which the LED elements 5a and 5b are arranged, a common electrode 3c for connecting the common electrode 3c on the front surface 2a and the back surface 2b of the substrate 2 is provided. Therefore, when mounted on the printed circuit board 10, the height dimension becomes larger, and Since the individual electrodes 3a and 3b are provided on the side surface 2d 'of the substrate 2, the width dimension also becomes larger. When such a structure is provided with an electrode on the peripheral surface, if three or more LED devices are mounted, the structure of the electrode becomes complicated and changes greatly. On the other hand, if two L ED elements 5a and 5b are arranged obliquely as viewed from the light emitting side, the height dimension can be reduced.
448588 月 年 曰 修正 鍊 88123055 五、發明說明（3) 水平方向的指向性不同，所以將在液晶顯示器上產生顏色 深淺的不均。 因此本發明的目的是在於提供一種指向特性是均一 的、並且在LED元件之間偏差少的側面發光型UD燈。 亚且，本發明的目的是在於提供一種圖謀小型化的側面發 光型LED燈。 為解決課題的手段 本發明是為了達成上述的目的，提供一種側面發光型 LED燈，其特徵在於具備：複數LEJ)元件，列狀的配置於基 板表面上’及凸透鏡’其向上述複數led元件的列方向伸 長並同時覆蓋於上述複數led元件上，以便整形上述複數 LED π件的發射光成為具有所定的展開角度之光線發射 者。 -根據上述構成’藉著複數LED元件的列狀配置，能在 LED几件之間減少指向特性的偏差。並且，藉著以凸透鏡 整形複數LED元件的發射光成為具有所定的展開角度之光 線發射，能獲得均一的指向特性。 本發明是為了達成上述的目的，提供一種側面發光型 L E D k其特徵在於具備：由絕緣部材所成的基板，形成 於上述基板表面的表電極，形成於上述基板背面的背電 極連接上述表電極與上述背電極的穿洞電鍍（錢於洞壁 上的電鍍），以及連接於上述表電極的複數^^元件者。 根據上述構成’藉著以穿洞電鐘連接表電極與背電448588 Month or year Correction chain 88123055 V. Description of the invention (3) The directivity in the horizontal direction is different, so unevenness in color and depth will be generated on the LCD. It is therefore an object of the present invention to provide a side-emission type UD lamp with uniform directional characteristics and less variation between LED elements. It is another object of the present invention to provide a side-light emitting type LED lamp which is intended to be miniaturized. Means for Solving the Problems The present invention is to achieve the above-mentioned object, and provides a side-emitting type LED lamp, which is characterized by comprising: a plurality of LEJ elements, which are arranged in a row on a substrate surface, and a convex lens, which faces the plurality of LED elements. The column direction is extended and covered on the plurality of LED elements at the same time, so that the emitted light of the plurality of LED π pieces is shaped as a light emitter having a predetermined spreading angle. -According to the above-mentioned configuration ', by arranging a plurality of LED elements in a row, it is possible to reduce variations in the directional characteristics among several LEDs. Furthermore, by shaping the emitted light from the plurality of LED elements with a convex lens to emit light with a predetermined spreading angle, uniform directional characteristics can be obtained. In order to achieve the above object, the present invention provides a side-emitting LED k, comprising a substrate made of an insulating material, a surface electrode formed on the surface of the substrate, and a back electrode formed on the back surface of the substrate connected to the surface electrode. Through-hole plating (plating on the wall of the hole) with the back electrode, and plural ^^ elements connected to the surface electrode. According to the above-mentioned structure, 'the electrode and the back electricity are connected by a through-hole electric clock.
第6頁 2001.04. 02. 006 448588 _案號88123055 车月日 你ιΤ_ 五、發明說明（4) 極’能使之比以設在基板侧面的金屬連接者更小型化。 發明的實施形態 圖1 (a )’（ b )表示有關本發明的第一實施形態的側面 發光型LED燈。該側面發光型LED燈1具有：裝LED元件用基 板2 ;紅色系LED元件5R、綠色系LED元件5G及藍色系LED元 件5B ’係在該裝LED元件用基板2的表面2a上以與端面直交 的方向排成一列；以凸透鏡（在該圖（a)上以點線表示）7， 封裝LEDtl件5R、5G '5B ’並整形各LED元件5R、5G、5B的 發射光成為具有所定的展開角度之光線發射。 裝L E D元件用基板2係以高耐熱性的材料，例如玻璃環 氧樹脂或氧化鋁等所成，而在表面2a形成共通電極3C、紅 色用電極3R、綠色用電極3G及藍色用電極3β，在其背面2b 是如同該圖（b)所不’形成紅色用電極⑽、綠色用電極3G 及監色用電極3B，經穿洞電鍍4與表面2a的紅色用電極 3R、綠色用電極3G及藍色用電極3B連接。表面2a的共通電 極3c與背面2b的綠色用電極3G '紅色用電極3R、藍色用電 極3B是為了謀求其在印刷電路板上實作容易化，延伸到端 面2c。裝LED元件用基板2是最好使用表面2&能對各LE[)元 件5R、5G、5B的全發光波長具有高光線反射率者，例如白 色者。由此能提高光效率，使能謀求低電力化。2e是表示 基板2的前面’ 2d是表示基板2的側面。 紅色乐LED元件5R是，發射主發光波長約為6〇〇〜7〇〇nm 的紅色系光線者，例如，由InGaAlp(銦.鎵.鋁磷）系Page 6 2001.04. 02. 006 448588 _Case No. 88123055 Car Moon Day You 5_ Description of the invention (4) The pole can make it smaller than a metal connector provided on the side of the substrate. Embodiments of the invention Fig. 1 (a) '(b) shows a side-emitting LED lamp according to a first embodiment of the present invention. The side-emitting LED lamp 1 includes: a substrate 2 for mounting LED elements; a red LED element 5R, a green LED element 5G, and a blue LED element 5B 'on the surface 2a of the LED element mounting substrate 2 to communicate with The end faces are aligned in a row in a direction orthogonal to each other; convex lenses (indicated by dotted lines in the figure (a)) 7 are used to package the LED elements 5R, 5G '5B' and shape the emitted light of each LED element 5R, 5G, 5B to have a predetermined The light is emitted at a wide angle. The substrate 2 for mounting LED elements is made of a material having high heat resistance, such as glass epoxy resin or alumina, and a common electrode 3C, a red electrode 3R, a green electrode 3G, and a blue electrode 3β are formed on the surface 2a. On the back surface 2b, the red electrode ⑽, the green electrode 3G, and the color monitoring electrode 3B are formed as shown in (b) of the figure, and the through-hole plating 4 and the red electrode 3R and the green electrode 3G on the surface 2a are formed. And the blue electrode 3B is connected. The common electrode 3c on the front surface 2a and the green electrode 3G 'on the back surface 2b are provided for the red electrode 3R and the blue electrode 3B to facilitate implementation on a printed circuit board and extend to the end surface 2c. The substrate 2 for mounting the LED element is preferably a surface 2 & one having a high light reflectance for the full emission wavelength of each LE [) element 5R, 5G, 5B, for example, a white one. As a result, light efficiency can be improved, and power reduction can be achieved. 2e indicates the front surface of the substrate 2; 2d indicates the side surface of the substrate 2. The red Le LED element 5R emits red light with a main emission wavelength of about 600 to 700 nm. For example, it is made of InGaAlp (indium.gallium.aluminum-phosphorus) system.
\\Chenlin\1999U03\PATE\T\hirll039amend01.ptc 第7頁 2001.04. 02. 007 448 5 8 8 Λ._η 曰 _SS__88123055 五、發明說明（5) 半導體所成，在上面備有第一電極，在下面備有第二電 極。紅色紅ED元件㈤是，以結合線6對上面的第―電極與 紅色用電極3 R做電氣性的連接，並以導電性接著劑對下面 的第二電極與共通電極3C做電氣性的連接。 綠色系LED元件5〇是，發射主發光波長約為51〇〜58〇· 的綠色系光線者，例如，由GaP(磷化鎵）系的半導體所 成，，上面備f第—的電極與第二的電極。綠色系LED元 件5G是，以接著劑對下面與共通電極3C做機械性的連接， 以結合線6對第一的電極與綠色用電極3G做電氣性的連 接’並以結合線6對第二的電極與共通電極3C做電氣性連 接。 “監色系LED元件5B是，發射主發光波長約為42〇〜5〇5麗 的監色系光線者，例如，由GaN(氮化鎵）系的半導體所 成上面備有第一的電極與第二的電極。藍色系LED元 件5B是’以接著劑對下面與共通電極3C做機械性的連接， 以結合線6對第—的電極與藍色用電極3B做電氣性的連 接’並以結合線6對第二的電極與共通電極3C做電氣性的 連接。\\ Chenlin \ 1999U03 \ PATE \ T \ hirll039amend01.ptc Page 7 2001.04. 02. 007 448 5 8 8 Λ._η _SS__88123055 V. Description of the invention (5) It is made of a semiconductor and has a first electrode on it. A second electrode is provided below. The red-red ED element ㈤ is electrically connected to the upper first electrode and the red electrode 3 R by a bonding wire 6, and electrically connects the lower second electrode to the common electrode 3C with a conductive adhesive. . The green LED element 50 is a light emitting green light having a main emission wavelength of about 51 to 58 °. For example, it is made of a GaP (gallium phosphide) -based semiconductor. Second electrode. The green LED element 5G is mechanically connected to the common electrode 3C below with an adhesive, and the first electrode is electrically connected to the green electrode 3G by a bonding wire 6 and the second electrode is connected to the second electrode 6 by a bonding wire. The electrodes are electrically connected to the common electrode 3C. "The monitor color LED element 5B emits a monitor color light having a main light emission wavelength of about 42-50 nm. For example, a GaN (gallium nitride) -based semiconductor is provided with a first electrode on it. And the second electrode. The blue LED element 5B is 'mechanically connected to the common electrode 3C with an adhesive, and the first electrode and the blue electrode 3B are electrically connected with the bonding wire 6' The second electrode is electrically connected to the common electrode 3C by the bonding wire 6.
UChen!in\]999ll03\PATENT\hi rll〇39amend01.ptc 第 8 頁 2001.04. 02.008 ^ 凸透鏡7是’由透明的環氧系樹脂、或配合具有光擴 散效果的充填劑之半透明環氧系樹脂所構成而具有半球形 狀’並在與端面2C平行的面上，對各LEI)元件5R、5G、π 具有同一的指向特性。並且，凸透鏡7是在比各LED元件 5R、5G、5B的發光面更後面處具有焦點。由此，能擴散發 射各LED元件5R、5G、5B的發射光。若需要狹小角度的光 448 5 8 8 _iR_88123055UChen! In \] 999ll03 \ PATENT \ hi rll〇39amend01.ptc Page 8 2001.04. 02.008 ^ The convex lens 7 is a translucent epoxy resin made of a transparent epoxy resin or a filler with a light diffusion effect. The structure has a hemispherical shape and has the same directivity characteristics for each LEI) element 5R, 5G, and π on a plane parallel to the end surface 2C. The convex lens 7 has a focal point further behind the light emitting surfaces of the LED elements 5R, 5G, and 5B. As a result, the light emitted from each of the LED elements 5R, 5G, and 5B can be diffused and emitted. If you need a narrow angle of light 448 5 8 8 _iR_88123055
5G.、5B的發光面 五、發明說明¢6) 線時，則使用焦點在於比各led元件5R 更前方處的凸透鏡7就可以。 圖2表示電路構成。此LED燈1是，如同該圖所示，具 有各LED元件5R、5G、5B的一端成為共通端子的4端子構 成。也就是說，各LED元件5R、5G、5B的陽極是被連接於 共通端子15C，而各LED元件5R、5G、5B的陰極是分別被連 接於端子15R ' 15G、15B。藉著使各LED元件5R、5G、5B同 時發光、或各別發光、或組合兩個發光，就能發光7種類 的顏色。 其次’參照圖面來說明L E D燈1的製造方法。 圖3(a)、3(b)、3(c)表示複數個LED用基板。首先， 如同圖3(a)所示，為了製作裝複數led元件用基板2本發明 使用一種複數個LED用基板20。此複數個LED用基板20是具 有多個基板部21 ，裝置成為縱方向m個（例如4 2個）、橫方 向η個（例如1 5個）合計m X n個（例如630個）的裝LED元件用 基板2 ’並且一個基板部21是具有，例如3. 65 X 2. 1 5mm的 大小’而做為該複數個LED用基板20全體具有，例如68 X 101mm的大小。如同該圖3(b)所示，在基板20的各基板部 21的表面2a ’形成共通電極3C、紅色用電極3R、綠色用電 極3G、及藍色兩電極3B，如同該圖3(c)所示，各基板部2 i 的背面2b ’形成紅色用電極3R、綠色用電極3G、及藍色用 電極3B ’並且以穿洞電鍍4，分別連接各基板部21的表背 面的紅色用電極3R、綠色用電極3G、及藍色用電極3B。 其次’在各基板部21，如同圖1所示一般裝置各LED元件5G., 5B light-emitting surface 5. Description of the invention ¢ 6), it is sufficient to use a convex lens 7 whose focus is more forward than each LED element 5R. FIG. 2 shows a circuit configuration. This LED lamp 1 has a four-terminal structure in which one end of each of the LED elements 5R, 5G, and 5B is a common terminal, as shown in the figure. That is, the anodes of the LED elements 5R, 5G, and 5B are connected to the common terminal 15C, and the cathodes of the LED elements 5R, 5G, and 5B are connected to the terminals 15R '15G, 15B, respectively. By letting each of the LED elements 5R, 5G, and 5B emit light at the same time, or emitting light separately, or combining two lights, seven types of colors can be emitted. Next, a method for manufacturing the LED lamp 1 will be described with reference to the drawings. 3 (a), 3 (b), and 3 (c) show a plurality of LED substrates. First, as shown in FIG. 3 (a), the present invention uses a plurality of LED substrates 20 in order to produce a substrate 2 for mounting a plurality of LED elements. The plurality of LED substrates 20 includes a plurality of substrate portions 21, and the device has a total of m × n (for example, 630) m (for example, 42) in the vertical direction and η (for example, 15) in the horizontal direction. The LED element substrate 2 ′ and one substrate portion 21 have a size of, for example, 3. 65 × 2.1 5 mm ′, and the plurality of LED substrates 20 have a size of, for example, 68 × 101 mm. As shown in FIG. 3 (b), a common electrode 3C, a red electrode 3R, a green electrode 3G, and two blue electrodes 3B are formed on the surface 2a 'of each substrate portion 21 of the substrate 20, as in FIG. 3 (c). As shown in the figure, the back surface 2b 'of each substrate portion 2 i forms a red electrode 3R, a green electrode 3G, and a blue electrode 3B', and is plated with a through hole 4 to connect the red surface for the front and back surfaces of each substrate portion 21. The electrode 3R, the green electrode 3G, and the blue electrode 3B. Next, in each substrate portion 21, each LED element is generally mounted as shown in FIG.
\\Chen1i η\19991!03\PATENT\h irll039amend01.ptc 第9頁 2001.04. 02. 009 448588 案號 88123055 五、發明說明（7)\\ Chen1i η \ 19991! 03 \ PATENT \ h irll039amend01.ptc page 9 2001.04. 02. 009 448588 case number 88123055 V. Description of the invention (7)
B 修正 5R、5G、5B ’利用印刷或轉移模等的工法以凸透鏡7封裝 各LED兀件5R、5G、5B之後，切斷分割各LED元件5R、5G、 基板部21，以製造m χ η個LED燈1。 圖4(a)、4(b)表示指向特性。此LED燈1是，如同該圖 (a)所不’將水平方向的指向特性依照凸透鏡7的特性，使 指向角度（半值角）Θ廣幅化丨4〇度。又，在垂直方向的指 向特性，即如同該圖（b)所示，依照凸透鏡7的角部7a的影 響顯現若干的變化。 圖5(a) 、（b)表不將本LED燈1實裝在印刷基板上的狀 態。將基板2的端面2c向下裝在印刷基板〗〇上，以銲線五2 分別連接共通電極3C與共通電極線丨1(：、綠色用電極3G與 綠色用電極線11 G、紅色用電極3R與紅色用電極線〗丨R、藍 色用電極3B與藍色用電極線11B，由此，藉著在電極線 1 1 C、1 1 G、1 1 R、1 1 B之間流通電流，就從各LED元件5R、 5G、5B，通過過凸透鏡7平行地發射綠色系光線“、紅色 系光線8R、藍色系光線8B於印刷基板丨〇的表靣。 根據上述的第一實施形態的LED燈1，因為將各^^元 件5R、5G ' 5B以與端面2c直交的方向排列為一列，所以在 LED元件之間水平方向指向特性的偏差很小，而做為液晶 顯示器的背光使用時’能防止液晶顯示器的顏色深淺不3曰 均。 又’因為藉著凸透鏡7整形各LED元件5R、5G、5B的發 射光線’所以能獲得均一的指向特性。 並且’因為使用在各LED元件5R、5G、5B的發光面更B Amend 5R, 5G, 5B 'After packaging each LED element 5R, 5G, 5B with a convex lens 7 using a method such as printing or transfer mold, cut off and divide each LED element 5R, 5G, and substrate portion 21 to produce m χ η LED lights 1. 4 (a) and 4 (b) show directional characteristics. This LED lamp 1 has a wide directional angle (half angle) θ of 40 degrees in accordance with the characteristics of the convex lens 7 in accordance with the characteristics of the convex lens 7 as shown in (a) of the figure. In addition, the directivity characteristics in the vertical direction, that is, as shown in (b) of this figure, there are several changes in accordance with the influence of the corner portion 7a of the convex lens 7. 5 (a) and 5 (b) show a state where the LED lamp 1 is mounted on a printed circuit board. The end surface 2c of the substrate 2 is mounted on the printed substrate downwardly, and the common electrode 3C and the common electrode line are respectively connected with the welding wire 5 2 (:, the green electrode 3G and the green electrode line 11 G, and the red electrode 3R and red electrode wire 丨 R, blue electrode 3B and blue electrode wire 11B, thereby, by passing a current between the electrode wires 1 1 C, 1 1 G, 1 1 R, 1 1 B The green light rays, the red light rays 8R, and the blue light rays 8B are emitted from the LED elements 5R, 5G, and 5B in parallel through the convex lens 7 to the surface of the printed circuit board. According to the first embodiment described above, The LED lamp 1 is arranged as a row in a direction orthogonal to the end surface 2c, so the deviation of the horizontal direction characteristics between the LED elements is small, and it is used as the backlight of the liquid crystal display. At the same time, 'the color depth of the liquid crystal display can be prevented from being uneven. Also,' because the convex lens 7 shapes the emitted light of each LED element 5R, 5G, 5B ', it can obtain uniform pointing characteristics. And' because it is used in each LED element 5R, 5G, 5B are more luminous
\\Chen1i η\19991103\PATENT\h i r11039amend01.1 第10頁 2001.04.02. 010 448588 -1S_88123055_ 年月 a ^ 五、發明說明（8) 後方處具有焦點的凸透鏡7，所以能以廣大的角度發射光 線’而做為液晶顯示器的背光使用時，能容易地在導光板 的面内做均一的擴散，而能使液晶顯示器全體做均一發 光。 並且’在基板2的表面2a及背面2b形成電極3C、3G ' 3R、3B ’以穿洞電鍍4連接表面以及背面2b的電極％、 3R、3B ’同時以間距0. 5mm接近配置各LED元件5R、5G、5B 使成為晶片大小以下的間隔，因此能謀求小型，輕量化。 |列如’能做到大小為寬3. 5mm、厚2mm、高2mm的小型化， 重量為0,018g的輕量化。 又’藉著各LED元件5R、5G、5B的接近，能提高混色 性’降下LED燈1的高度’也能薄型化導光板。 又’因為裝有發光RGB三原色光的LED元件5R、5G、 5B ’所以做為液晶顯示器的背光使用時，能實現顯示器的 全色化。 並且，因為使用該複數個LED基板20，所以量產性 高’而能以較廉價製造LED燈。 圖6表示有關本發明第實施形態的側面發光型led燈。 此第二實形態是，使凸透鏡7成為略半球狀者。由此，垂 直方向的指向特性就沒有如同圖4 (b )所示一般大的變化。 圖？表示有關本發明第三實施形態的側面發光型LED 燈。此第三實施形態是，使凸透鏡7的角部7a成為圓滑形 狀者。由此，能謀求垂直方向的指向特性的均一化。 上述實施形態是就使用三個L E D元件的情形加以說明\\ Chen1i η \ 19991103 \ PATENT \ hi r11039amend01.1 Page 10 2001.04.02. 010 448588 -1S_88123055_ Month a ^ V. Description of the invention (8) Convex lens 7 with focus at the rear, so it can be emitted at a wide angle When light is used as a backlight of a liquid crystal display, it can easily diffuse uniformly in the surface of the light guide plate, and can make the entire liquid crystal display uniformly emit light. And 'the electrodes 3C, 3G are formed on the surface 2a and the back surface 2b of the substrate 2' 3R, 3B 'through hole plating 4 to connect the electrodes on the surface and the back surface 2b%, 3R, 3B' at the same time with the pitch 0.5mm close to each LED element 5R, 5G, and 5B are spaced below the chip size, so they can be reduced in size and weight.列 如 ’can achieve miniaturization with a size of 3.5mm in width, 2mm in thickness, and 2mm in height, and a light weight of 0,018g. Further, 'the approach of the LED elements 5R, 5G, and 5B can improve the color mixing property', and the height of the LED lamp 1 can be reduced, and the light guide plate can be made thin. Furthermore, since the LED elements 5R, 5G, and 5B that emit light of three primary colors of RGB are installed, when used as a backlight of a liquid crystal display, full colorization of the display can be achieved. In addition, since the plurality of LED substrates 20 are used, the mass productivity is high, and the LED lamp can be manufactured at a relatively low cost. Fig. 6 shows a side-emitting LED lamp according to a first embodiment of the present invention. In this second embodiment, the convex lens 7 is formed into a hemispherical shape. Therefore, the directivity in the vertical direction does not change as much as shown in FIG. 4 (b). Figure? A side-emitting LED lamp according to a third embodiment of the present invention is shown. In this third embodiment, the corner portion 7a of the convex lens 7 is rounded. This makes it possible to uniformize the directivity in the vertical direction. The above embodiment is described in the case of using three LED devices.
\\Chenlin\19991103\PATENT\hirll039amend01.ptc 第 11 頁 2001.04. 02.011 • 4 4 8 5 8\\ Chenlin \ 19991103 \ PATENT \ hirll039amend01.ptc Page 11 2001.04. 02.011 • 4 4 8 5 8
___案號 88123055 五、發明說明（9) 的，在使用兩個LED元件時當也能適用本發明。又，上述 實施形‘樣是就發光紅色系、綠色系、藍色系的LED元件的 組合加以說明的，當也可以組合發光38〇nm(紫色）、 590ηπι( κ色）等其他波長（包括紅外、紫外）的光線之led元 件。又，LED元件是除了在上面具有第一及第二的電極， 在上面具有第一的電極、在下面具有第二電極者之外，也 可以使用在下面具有第一及第二的電極者。 發明的效果 如同上述所說明的，根據本發明的侧面發光型led 燈’因為以列狀配置複數個LED元件，所以LED元件之間的 指向特性的偏差變小，又因為以凸透鏡整形複數個LED元 件的發射光’所以能獲得均一的指向特性〇 並且’因為以穿洞電鍍連接表電極與背電極，所以能 圖謀小塑化。___ Case No. 88123055 5. In the description of the invention (9), the present invention can also be applied when two LED elements are used. In addition, the above-mentioned embodiment is described in combination of emitting red, green, and blue LED elements, and other wavelengths (including 380 nm (purple), 590 nm (κ color), etc.) may be combined. Infrared, ultraviolet) led components. The LED element may include a first electrode and a second electrode on the upper surface, a first electrode on the upper surface, and a second electrode on the lower surface. Alternatively, the LED element may have first and second electrodes on the lower surface. Advantageous Effects of Invention As explained above, according to the side-emitting type LED lamp according to the present invention, since a plurality of LED elements are arranged in a row, the deviation in the directional characteristics between the LED elements is reduced, and the plurality of LEDs are shaped by a convex lens. The emitted light of the element can obtain a uniform directional characteristic, and can be small plasticized because the surface electrode and the back electrode are connected by through-hole plating.
2001.04. 02.012 448588 修正 曰 ___案號 88123055 圖式簡單說明 圖1 (a)為從正面看有關本發明第一實施形態的側面發 光型LED燈之斜視圖、（b)為從背面看該側面發光型LEE)燈 之斜視圖。 圖2表示有關第一實施形態的側面發光sLEI)燈之電路 構成圖。 圖3 (a)表示有關第一實施形態的取複數個用基板之平 面圖’3(b)為主要部正面圖’3(c)為從正面透視的主要部 背面圖。 圖4 (a)表示第一實施形態的側面發光型led燈之水平 方向指向特性圖’4(b)表示此側面發光型LED燈之垂直方 向指向特性圖。 圖5 (a)為從前方看的第一實施形態之側面發光型l £ d 燈的實裝狀態斜視圖，5 (b)為從後方看的此側面發光型 LED燈之實裝狀態斜視圖β 圖β表示有關本發明第二實施形態的側面發光型LE D 燈、以及其水平方向指向特性圖。 圖7表示有關本發明第三實施形態之側面發光型l ε D燈 的侧面圖。 圖8 (a)為從正面看的以往的側面發光型LED燈之斜視 圖，（b)表示此側面發光型LED燈實裝狀態的斜視圖。 圖9表示以往的側面發光型L E D燈之水平方向指向特性 圖。 圖號說明2001.04. 02.012 448588 Amended ___ Case No. 88123055 Brief description of the drawings Figure 1 (a) is a perspective view of a side-emitting LED lamp according to a first embodiment of the present invention viewed from the front, (b) is viewed from the back Angled view of a side-emitting LEE) lamp. Fig. 2 shows a circuit configuration of a side-emitting sLEI) lamp according to the first embodiment. Fig. 3 (a) is a plan view of a plurality of substrates according to the first embodiment; '3 (b) is a front view of the main portion; and 3 (c) is a rear view of the main portion viewed from the front. Fig. 4 (a) shows the horizontal directivity characteristics of the side-emitting LED lamp according to the first embodiment. Fig. 4 (b) shows the vertical directivity characteristics of the side-emitting LED lamp. Fig. 5 (a) is an oblique view of the side-emission type l £ d lamp according to the first embodiment when viewed from the front, and 5 (b) is an oblique view of the side-emission type LED lamp when viewed from the rear. β FIG. β is a side-emission type LED lamp according to the second embodiment of the present invention, and its horizontal directivity characteristic diagram. Fig. 7 is a side view showing a side-emission type l ε D lamp according to a third embodiment of the present invention. Fig. 8 (a) is a perspective view of a conventional side-emitting LED lamp viewed from the front, and (b) is a perspective view showing a mounted state of the side-emitting LED lamp. Fig. 9 is a diagram showing a horizontal directivity characteristic of a conventional side-emitting LED lamp. Drawing number description
\\Chenlin\]999!!03\PATHNT\hirn〇39amend〇].ptc 第13頁 2001.04. 02.013 448588 _案號 88123055_年月日_修正 圖式簡單說明 1.. .側面發光型LED燈 2.. .裝LED元件用基板 2a. ..表面 2b. ..背面 2c. ..端面 2d. ..側面 2e. ..前面 3B. ..藍色用電極 3C_ ..共通電極 3G. ..綠色用電極 3R. ,.紅色用電極 3 a . ..第一的個別電極 3b. ..第二的個別電極 3c. ..共通電極 4.. .穿洞電鍍 4’ . ..連接電鍍 5B. ..藍色系LED元件 5G. ..綠色系LED元件 5R. ..紅色系L E D元件 5a . ..第一LED元件 5b. ..第二LED元件 6.. .結合線 7.. .凸透鏡 8B、9B.,.藍色系光線\\ Chenlin \] 999 !! 03 \ PATHNT \ hirn〇39amend〇] .ptc Page 13 2001.04. 02.013 448588 _Case No. 88123055 .. substrate for mounting LED elements 2a .. front surface 2b .. back surface 2c .. end surface 2d .. side surface 2e .. front 3B .. blue electrode 3C_ .. common electrode 3G ... Green electrode 3R ..., Red electrode 3a ... First individual electrode 3b ... Second individual electrode 3c ... Common electrode 4 ... Through hole plating 4 '... Connection plating 5B .. Blue LED element 5G ... Green LED element 5R ... Red LED element 5a ... First LED element 5b ... Second LED element 6 .... Convex lenses 8B, 9B ..., blue light
\\Chenlin\1999ll03\PATENT\hirll039amend01.ptc 第 14 頁 200L 04. 02. 014 448588 __1號 88123055 A_3 修正 圖式簡單說明 8G 8R 8a . 8b. 10. 11a lie 1 1 G 11R 11B 12. 17. 15C 15G 20. 21. 1 7a...模塑樹脂角部 9 G..,綠色系光線 9R...紅色系光線 第一顏色光線 第二顏色光線 印刷基板 11 b、11 c...配線圖型 .共通電極線 .綠色用電極線 .紅色用電極線 .藍色用電極線 銲線 模塑樹脂 .共通端子 15R 、 15B...端子 複數個L E D用基板 基板部\\ Chenlin \ 1999ll03 \ PATENT \ hirll039amend01.ptc Page 14 200L 04. 02. 014 448588 __1 No. 88123055 A_3 Modified drawing simple description 8G 8R 8a. 8b. 10. 11a lie 1 1 G 11R 11B 12. 17. 15C 15G 20. 21. 1 7a ... Molding resin corner 9 G .., green light 9R ... red light 1st color light 2nd color light printed substrate 11 b, 11 c ... Wiring diagram Type. Common electrode wires. Green electrode wires. Red electrode wires. Blue electrode wire bonding resin. Common terminals 15R, 15B ... terminals.
WChenlirA 19991103\PATENT\hirll039amend01.ptc 第15頁 2001.04.02.015WChenlirA 19991103 \ PATENT \ hirll039amend01.ptc Page 15 2001.04.02.015
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35517299A JP2001177156A (en) | 1999-12-14 | 1999-12-14 | Side emitting led lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW448588B true TW448588B (en) | 2001-08-01 |
Family
ID=18442369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088123055A TW448588B (en) | 1999-12-14 | 2000-01-07 | LED lamp of edge emitting type |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2001177156A (en) |
| KR (1) | KR20010064820A (en) |
| TW (1) | TW448588B (en) |
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| CN102324456A (en) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | A kind of high-power LED encapsulation structure |
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| DE102004001312B4 (en) | 2003-07-25 | 2010-09-30 | Seoul Semiconductor Co., Ltd. | Chip light-emitting diode and method for its production |
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-
1999
- 1999-12-14 JP JP35517299A patent/JP2001177156A/en active Pending
- 1999-12-20 KR KR1019990059155A patent/KR20010064820A/en not_active Application Discontinuation
-
2000
- 2000-01-07 TW TW088123055A patent/TW448588B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8558446B2 (en) | 2005-02-18 | 2013-10-15 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
| TWI419375B (en) * | 2005-02-18 | 2013-12-11 | Nichia Corp | Light emitting device provided with lens for controlling light distribution characteristic |
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| CN102324456A (en) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | A kind of high-power LED encapsulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001177156A (en) | 2001-06-29 |
| KR20010064820A (en) | 2001-07-11 |
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