JP2014150292A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source having less luminance unevenness while mounting a plurality of LED packages on a substrate with high density.SOLUTION: A light-emitting device 10 comprises at least eight LED packages 11 and a substrate 12. Every series-connected four LED packages 11, the four LED packages 11 are arranged on the substrate 12 in a manner such that LED chips 11a of the four LED packages 11 are located closer to the inner side (center side) of a cross. When the four LED packaged 11 which compose the cross form one LED package group, all of the LED package groups are arranged in a manner such that positions and aspects in a short direction (a direction of a short side of the substrate 12) are aligned.

Description

  The present invention relates to a light emitting device using an LED (light emitting diode).

  In recent years, white LEDs have been widely used for lighting applications, and the amount of light in the LEDs themselves has been increasing. However, in an instrument that requires a large amount of light, a single module is used by using a large number of LED packages. It is said. In addition, in order to obtain a high brightness by reducing the size of the instrument, efforts have been made to mount small LED packages on a substrate at high density.

  Conventionally, in order to obtain high brightness, there is an LED package in which an LED chip is three-dimensionally mounted such that an anode of another LED chip is connected to the cathode of one LED chip (see, for example, Patent Document 1).

JP 2009-70900 A Japanese Utility Model Publication No.58-177957 JP 2008-258264 A JP-A-7-133102 JP 2011-91344 A

  In the LED package of Patent Document 1, since the chip is three-dimensionally mounted, the upper chip overlaps the light emitting part of the lower chip, so that the light emitting part and the connecting part of the chip overlap, and the light extraction efficiency is reduced. There was a problem.

  For example, an object of the present invention is to obtain a light source with less luminance unevenness while mounting a plurality of LED packages on a substrate at a high density.

A light emitting device according to one embodiment of the present invention includes:
A plurality of LED packages in which LED (light emitting diode) chips are mounted at positions other than the center when viewed from the light emitting direction;
For each of four LED packages among the plurality of LED packages, the four LED packages are provided with a substrate arranged in a cross shape when viewed from the light emitting direction.

  According to one aspect of the present invention, since the above-described configuration is employed, it is possible to obtain a light source with less luminance unevenness while mounting a plurality of LED packages on a substrate at high density.

FIG. 3 is a top view of the light-emitting device according to Embodiment 1. The top view of the light-emitting device which concerns on a comparative example. FIG. 3 is a structural diagram of an LED chip according to the first embodiment. FIG. 6 is a top view of a light-emitting device according to a modification of the first embodiment. FIG. 6 is a top view of a light-emitting device according to a modification of the first embodiment. FIG. 6 is a top view of a light-emitting device according to a modification of the first embodiment. FIG. 6 is a top view of a light-emitting device according to Embodiment 2. FIG. 10 is a top view of a light-emitting device according to a modification of the second embodiment. FIG. 6 is a partial top view of a light-emitting device according to Embodiment 3. FIG. 10 is a partial top view of a light emitting device according to a modification of the third embodiment. FIG. 10 is a partial top view of a light emitting device according to a modification of the third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of each embodiment, the directions such as “up”, “down”, “left”, “right”, “front”, “back”, “front”, “back” are However, it is not intended to limit the arrangement or orientation of devices, instruments, parts, or the like.

Embodiment 1 FIG.
FIG. 1 is a top view of a light emitting device 10 according to the present embodiment. FIG. 2 is a top view of the light emitting device 90 according to the comparative example.

  First, the light emitting device 90 according to the comparative example will be described.

  In FIG. 2, the light emitting device 90 includes 16 LED packages 91 and a substrate 92.

  In each LED package 91, a blue LED chip 91a is mounted at a position other than the center of the LED package 91 as viewed from the light emitting direction. Although not shown, the LED chip 91a is covered with a translucent resin mixed with a yellow phosphor. The light of the blue LED chip 91a excites and emits the yellow phosphor, and white light is obtained by mixing the blue light and the yellow light. That is, the LED package 91 emits white light.

  Each LED package 91 has an anode 91b at one end and a cathode 91c at the other end.

  The substrate 92 has a wiring 92 a that connects one anode 91 b and the other cathode 91 c of the two LED packages 91 for each two adjacent LED packages 91.

  In the figure, anodes 91b of even-numbered LED packages 91 and cathodes 91c of odd-numbered LED packages 91 are arranged on a straight line X, and cathodes 91c of even-numbered LED packages 91 and odd-numbered from the left. Sixteen LED packages 91 are arranged so that the anodes 91b of the LED packages 91 are arranged on a straight line Y. That is, 16 LED packages 91 are arranged on the substrate 92 such that the positions in the short direction (the direction of the short side of the substrate 92) are aligned and the directions are staggered.

  As described above, in the example of FIG. 2, the direction of the anode 91b and the cathode 91c of the LED package 91 is the longitudinal direction (the direction of the long side of the substrate 92) in order to reduce the interval between the LED packages 91 and increase the mounting density. Alternately reversed wiring patterns are used. However, as shown in FIG. 2, the low-wattage LED package 91 for high-density mounting is often rectangular rather than square, and the blue LED chip 91a is mounted at the center of the package. Often not. Therefore, when the LED package 91 is mounted at a high density as shown in FIG. 2, the LED chips 91a are not arranged in a straight line in the longitudinal direction (the direction of the long side of the substrate 92), so the light source (white light) is neatly lined. May not be visible. Moreover, it becomes a light source with uneven brightness.

  Next, the light emitting device 10 according to the present embodiment will be described.

  In FIG. 1, the light emitting device 10 includes 16 LED packages 11 and a substrate 12.

  Each LED package 11 is mounted with an LED chip 11a serving as a light emitting source. Each LED package 11 has an anode 11b at one end and a cathode 11c at the other end.

  Here, the structure of the LED chip 11a is shown in FIG. As shown in FIG. 3, an N-type semiconductor 21 and a P-type semiconductor 22 are mounted on the substrate 20 of the LED chip 11a, and there is an electrode 23 for flowing electricity to the LED chip 11a. Thus, the LED chip 11a forms a PN junction with the P-type semiconductor 22 and the N-type semiconductor 21, and when a forward voltage is applied to the LED chip 11a, electrons and holes move in the LED chip 11a. Current flows. When electrons and holes collide with each other in the middle of movement, they are combined and recombined, so that the energy of electrons and holes is less than the original energy, and the excess energy generated at that time is the energy of light. It is converted into and emits light. Therefore, the LED chip 11a emits light at the joint portion of the PN junction.

  The LED chip 11 a is die-bonded directly to the LED package 11 with a gold wire or the like, and emits blue light when electric power is supplied to the LED package 11. Although not shown, the LED chip 11a is covered with a highly transmissive resin layer containing a yellow phosphor. As the resin, methyl silicone, epoxy resin, or the like is used. The yellow phosphor mixed in the resin layer is, for example, a YAG (yttrium, aluminum, garnet) phosphor. When excited by blue light emitted from the LED chip 11a, the spectrum is between 480 and 780 nm (nanometers). And emits light having a dominant wavelength in the vicinity of 560 nm. Since the two different wavelengths of light emitted from the LED chip 11a and the yellow phosphor are in a complementary color relationship, the combined light is pseudo white. That is, the LED package 91 emits white light.

  The LED package 11 has a longitudinal shape in which the direction from the anode 11b to the cathode 11c is the longitudinal direction of the LED package 11, and the LED chip 11a is mounted at a position shifted to the cathode 11c side from the center. That is, the LED chip 11a is mounted on the LED package 11 at a position other than the center in the direction from the anode 11b to the cathode 11c.

  The substrate 12 has a longitudinal shape, and 16 LED packages 11 are arranged along the longitudinal direction (the direction of the long side of the substrate 12).

  The substrate 12 has a wiring 12a that connects one anode 11b and the other cathode 11c of the two LED packages 11 for every two adjacent LED packages 11.

  In the present embodiment, the 16 LED packages 11 are mounted on the substrate 12 so that the directions from the anode 11b to the cathode 11c of the two LED packages 11 are reversed every two adjacent LED packages 11. Has been placed. In addition, for every two adjacent LED packages 11, the LED chips 11a of the two LED packages 11 are aligned on the same straight line A extending in the longitudinal direction (long side direction of the substrate 12). The LED packages 11 are arranged on the substrate 12. That is, the 16 LED packages 11 are shifted in position in the short direction (the direction of the short side of the substrate 12) and the substrate is shifted so that the LED chips 11a of the 16 LED packages 11 are arranged on one straight line A. 12 is arranged.

  As described above, in the present embodiment, the direction from the anode 11b to the cathode 11c of the two LED packages 11 is different from each other, and the 16 LED packages 11 are adjacent to each other. The 16 LED packages 11 are arranged on the substrate 12 so that the LED chips 11a are aligned on the straight line A when viewed from the light emitting direction. In the present embodiment, since the LED chip 11a is mounted at a position other than the center of the LED package 11, the LED package 11 in which the LED chips 11a are arranged on the same straight line A among the 16 LED packages 11 (this embodiment) In this form, both ends of all 16 LED packages 11) are not aligned on the same straight line as viewed from the light emitting direction. That is, in the present embodiment, unlike the comparative example described above, the positions of the 16 LED packages 11 in the short direction (the direction of the short side of the substrate 12) are alternately shifted. LED chips 11a can be arranged on the same straight line A.

  In the present embodiment, 16 LED packages 11 are connected in series, and the 16 LED packages 11 are arranged on the substrate 12 so that the electrically connected LED packages 11 are physically adjacent to each other. Has been. That is, for every two LED packages 11 that are physically adjacent, one anode 11b and the other cathode 11c of the two LED packages 11 are electrically connected. One anode 11b and the other cathode 11c of the two LED packages 11 are on the same side with respect to the straight line A, and one cathode 11c and the other anode 11b of the two LED packages 11 are a straight line A. 16 LED packages 11 are arranged on the substrate 12 so as to be opposite to the same side.

  As described above, in the present embodiment, as in the comparative example described above, since the 16 LED packages 11 are arranged in different directions, the intervals between the LED packages 11 are reduced, and the mounting density is increased. Can do. In addition, in the present embodiment, unlike the comparative example described above, the 16 LED packages 11 are arranged at different positions so that the LED chips 11a of the 16 LED packages 11 are arranged on the straight line A. , The light source (white light) looks neatly in a line shape, and uneven brightness is reduced. That is, in this embodiment, since the LED package 11 is arranged so that the LED chips 11a are arranged on a certain straight line on the substrate 12, a low-wattage package without a chip is mounted at a high density in the center of the package. In this case, the luminance unevenness of the LED can be reduced.

  The light emitting device 10 according to the present embodiment can be used for lighting fixtures such as downlights and grid lights.

  In the present embodiment, the light emitting device 10 includes 16 LED packages 11. However, the number of the LED packages 11 only needs to be plural, and can be changed as appropriate according to the use of the light emitting device 10.

  Further, in the present embodiment, a wiring pattern that connects all 16 LED packages 11 in series is used, but other wiring patterns may be used.

  In the present embodiment, the LED package 11 includes an LED chip 11a that emits blue light and a resin layer that includes a yellow phosphor that emits and emits light by the blue light. The LED chip 11a and the resin layer include As the phosphors included, those that emit light of other colors may be used, or a plurality of types having different emission colors may be used. For example, the LED package 11 may include an LED chip 11a that emits ultraviolet light. For example, the LED package 11 may include a resin layer including a red phosphor, a green phosphor, or the like as the resin layer. Further, for example, the odd-numbered LED packages 11 and the even-numbered LED packages 11 from the left in the drawing may have different emission colors (for example, color temperatures). That is, in the case where low-wattage LEDs of a plurality of colors as well as white are mounted on one board 12, the LED chips are arranged on one straight line on the board 12, and the LEDs arranged in one straight line are staggered. It is also possible to arrange LEDs of different colors. By doing so, color unevenness and brightness unevenness can be suppressed.

  Here, a modification is shown in FIG. FIG. 4 is a top view of the light emitting device 10 according to this modification (a configuration diagram when LEDs of different colors are arranged in FIG. 1). In the example of FIG. 4, the light emitting device 10 includes an LED package 11 that mounts an LED chip 11 a serving as a light source on a substrate 12, and an LED that mounts an LED chip 11 ′ a having a different color from the LED chip 11 a. The package 11 ′ is a line module provided with wirings 12a that are alternately arranged and connect the LED packages 11 and 11 ′. As described above, in the example of FIG. 4, the light-emitting device 10 includes eight LED packages 11 on which the LED chips 11 a are mounted, and eight LED chips 11 ′ a on which light-emitting colors different from the LED chips 11 a are mounted. LED package 11 '. In the substrate 12, the LED chips 11a and 11′a of these two types of LED packages 11 and 11 ′ are arranged in an alternating manner on a straight line A extending in the longitudinal direction (long side direction of the substrate 12). LED packages 11 and 11 'are arranged.

  Moreover, in this Embodiment, although the LED package 11 is elongate, the shape of the LED package 11 may be suitably changed according to the use etc. of the light-emitting device 10.

  Further, in the present embodiment, the LED chip 11a is mounted at a position shifted to the cathode 11c side from the center of the LED package 11, but the position of the LED chip 11a is other than the center of the LED package 11 when viewed from the light emitting direction. It may be a position, and can be appropriately changed according to the shape of the LED package 11, the use of the light emitting device 10, and the like. For example, the LED chip 11a may be mounted at a position shifted to the anode 11b side from the center of the LED package 11.

  Further, in the present embodiment, as shown in FIG. 1, the direction of all 16 LED packages 11 (the direction from the anode 11b to the cathode 11c) is parallel to the short direction (the direction of the short side of the substrate 12). However, the direction of the LED package 11 may be changed as appropriate. Here, a modification is shown in FIGS. 5 and 6 are top views of the light emitting device 10 according to the respective modifications. In the example of FIG. 5, the orientations of all 16 LED packages 11 are inclined 45 ° (an example of a predetermined angle) from the short direction (the direction of the short side of the substrate 12). On the other hand, in the example of FIG. 6, the direction of the odd-numbered LED package 11 from the left in the drawing is inclined by 30 ° (an example of a predetermined first angle) from the short direction (the direction of the short side of the substrate 12), The direction of the even-numbered LED packages 11 is inclined by −30 ° (an example of a predetermined second angle) from the short direction (the direction of the short side of the substrate 12).

  As described above, the light emitting device 10 according to the present embodiment is arranged on a certain straight line on the substrate 12 when the low watt LED package 11 in which the LED chip 11a is not mounted at the center of the package is mounted with high density. This is a line module in which the LED packages 11 are arranged so that the LED chips 11a are aligned. For example, the individual LED packages 11 are arranged in parallel with the short sides of the substrate 12, and particularly bright portions of the light emitting surface are arranged on a straight line in the long side direction. According to this embodiment, when there is no LED chip 11a in the center of the LED package 11, when the wiring pattern as shown in FIG. 1 is used for high-density mounting, the light emitting portion looks like a beautiful line, and the luminance A light source without unevenness can be obtained.

Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 7 is a top view of the light emitting device 10 according to the present embodiment.

  In FIG. 7, the light emitting device 10 includes 16 LED packages 11 and a substrate 12 as in the first embodiment.

  In the present embodiment, in the figure, the LED chips 11a of the odd-numbered LED packages 11 from the left are arranged on a straight line A extending in the longitudinal direction (long side direction of the substrate 12), and the even-numbered LED packages 11 are in the longitudinal direction. Sixteen LED packages 11 are arranged on the substrate 12 so as to be arranged on a straight line B extending in the direction of the long side of the substrate 12. That is, the positions of the 16 LED packages 11 in the short direction (the direction of the short side of the substrate 12) and the LED chips 11a of the 16 LED packages 11 are alternately arranged on the two straight lines A and B. Arranged in a different direction.

  In the present embodiment, for every two adjacent LED packages 11, one cathode 11c of the two LED packages 11 is outside the straight direction A (the short side direction of the substrate 12), The other cathode 11c of the two LED packages 11 is outside the straight line B in the short direction (the direction of the short side of the substrate 12), and both the anodes 11b of the two LED packages 11 are straight lines A and B. The 16 LED packages 11 are arranged on the substrate 12 so as to be between (inside).

  As described above, in the present embodiment, as in the first embodiment, since the 16 LED packages 11 are arranged in different directions, the intervals between the LED packages 11 are reduced, and the mounting density is increased. Can do. Also, in the present embodiment, unlike the first embodiment, the 16 LED packages 11 are shifted in position so that the LED chips 11a of the 16 LED packages 11 are alternately arranged on the straight lines A and B. Since they are arranged, the light source (white light) looks beautiful in two lines, and luminance unevenness is reduced. That is, in this embodiment, since the LED package 11 is arranged so that the LED chips 11a are arranged on two straight lines on the substrate 12, as in the first embodiment, a low wattage without a chip in the center of the package. Even when the above package is mounted at a high density, the luminance unevenness of the LED can be reduced.

  In the present embodiment, similarly to the first embodiment, a plurality of types of phosphors having different emission colors may be used as the phosphors included in the LED chip 11a and the resin layer. For example, as the 16 LED packages 11, two types (or three or more types) of LED packages 11 on which LED chips 11 a having different emission colors are mounted can be used. At this time, for example, in the drawing, the types of odd-numbered LED packages 11 from the left are unified, and the types of even-numbered LED packages 11 are unified. That is, the 16 LED packages 11 are arranged on the substrate 12 so that the LED chips 11a extend in the longitudinal direction (long side direction of the substrate 12) and are arranged on different straight lines A and B for each emission color. Accordingly, it is possible to provide the light emitting device 10 in which a line light source having a certain emission color and a line light source having another emission color are neatly arranged. Alternatively, for example, the types of the nth (n is an integer of 1 or more) and n + 1th LED packages 11 from the left may be unified, and the types of the (n + 2) th and n + 3th LED packages 11 may be unified.

  Here, a modification is shown in FIG. FIG. 8 is a top view of the light emitting device 10 according to this modification (a configuration diagram when LEDs of different colors are arranged in FIG. 7). In the example of FIG. 8, the LED chips 11 a and the LED chips 11 ′ a of a different color from the LED chips 11 a are arranged in series on the substrate 12 in a straight line from the left so that the LED chips 11 a a are different from each other. The LED packages 11 for mounting the LED chips 11 and the LED packages 11 ′ for mounting the LED chips 11′a are alternately arranged in pairs, and the LED chips 11a and the LED chips 11′a are arranged outside the substrate 12. It is arranged to stop by. By doing so, chips of different colors are arranged alternately on two lines instead of one line, and color unevenness and brightness unevenness can be eliminated. Each set of the LED package 11 and the LED package 11 'is electrically connected in series by a wiring 12a. As described above, in the example of FIG. 8, the light emitting device 10 includes eight LED packages 11 on which the LED chips 11 a are mounted and eight LED chips 11 ′ a on which light emitting colors different from the LED chips 11 a are mounted. LED package 11 '. On the substrate 12, the LED chips 11a and 11'a of these two types of LED packages 11 and 11 'are alternately arranged on a plurality of straight lines A and B extending in the longitudinal direction (long side direction of the substrate 12), and The LED chips 11a and 11′a of the 16 LED packages 11 and 11 ′ are closer to the outside of the substrate 12 in the short direction (the direction of the short side of the substrate 12) (LED package). The 16 LED packages 11 and 11 ′ are arranged so as to be located closer to the longer side closer to the substrate 12 than the center of 11 and 11 ′.

  As described above, in the light emitting device 10 according to the present embodiment, the LED packages 11 are arranged according to the orientation of the anode 11b and the cathode 11c, the LED packages 11 are arranged like two line light sources, and the LED chip. 11 a is arranged so as to face (bias) the outside of the substrate 12. According to this embodiment, the light source looks like two lines, and luminance unevenness can be eliminated.

Embodiment 3 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 9 is a partial top view of the light emitting device 10 according to the present embodiment.

  In FIG. 9, the light emitting device 10 includes at least eight LED packages 11 and a substrate 12.

  In the present embodiment, for each of the four LED packages 11 connected in series, the four LED packages 11 are arranged in a cross shape when viewed from the light emitting direction, and the positions of the LED chips 11a of the four LED packages 11 are arranged. The four LED packages 11 are arranged on the substrate 12 so that is closer to the inner side (center side) of the cross. When the four LED packages 11 constituting the cross are made into one LED package group, all the LED package groups are arranged with their positions and orientations in the short direction (the direction of the short side of the substrate 12) aligned. Therefore, the LED chips 11a are arranged on any one of the straight lines A, B, and C extending in the longitudinal direction (the direction of the long side of the substrate 12). That is, at least eight LED packages 11 are arranged in the short direction (the short side of the substrate 12) so that the LED chips 11a of at least eight LED packages 11 are arranged in a predetermined order on three straight lines A, B, C. The position and direction in the direction of

  As described above, in the present embodiment, the LED packages 11 are arranged in a cross so as to form three straight lines in the longitudinal direction of the substrate 12 and mounted on the substrate 12, and the positions of the LED chips 11a are all inside (positions near the center). . As a result, a line light source without luminance unevenness can be obtained. In the center of the cross, a transparent resin molded product 13 having a quadrangular pyramid shape is placed. Thereby, light can be further softened and glare can be reduced.

  In the present embodiment, similarly to the first embodiment, a plurality of types of phosphors having different emission colors may be used as the phosphors included in the LED chip 11a and the resin layer. For example, one LED package group can be composed of three types of LED packages 11 on which LED chips 11a having different emission colors are mounted. At this time, for example, in the figure, the types of the LED packages 11 on the upper side of the cross are unified, the types of the LED packages 11 on the left and right sides of the cross are unified, and the types of the LED packages 11 on the lower side of the cross are unified. That is, at least eight LED packages 11 are arranged on the substrate 12 so that the LED chips 11a extend in the longitudinal direction (long side direction of the substrate 12) and are arranged on different straight lines A, B, and C for each emission color. . Accordingly, it is possible to provide the light emitting device 10 in which a line light source having a certain emission color, a line light source having another emission color, and a line light source having another emission color are neatly arranged. Alternatively, for example, one LED package group may be configured by four types of LED packages 11 on which LED chips 11a of different emission colors are mounted. Alternatively, for example, one LED package group may be composed of two types of LED packages 11 on which LED chips 11a of different emission colors are mounted.

  Here, a modification is shown in FIG. FIG. 10 is a partial top view of the light emitting device 10 according to this modification. In the example of FIG. 10, the LED package 11 and the LED package 11 ′ different in color from the LED package 11 are mounted side by side so as to form three straight lines in the longitudinal direction of the substrate 12. The LED packages 11 and the LED packages 11 ′ having different colors are alternately arranged on the three straight lines in the longitudinal direction of the module, and the LED packages 11 and the LED packages 11 ′ are alternately arranged in the short direction. It is said. By adopting such an arrangement, it is possible to reduce color unevenness even in the case of mixed colors of light sources having different colors. In this case, the orientations of the LED chip 11a and the LED chip 11′a are all inward. By doing so, a line light source with no luminance unevenness is obtained. Placing the transparent resin-formed product 13 having a quadrangular pyramid at the center softens the light, and the effect of reducing glare can be obtained. As described above, in the example of FIG. 10, the light-emitting device 10 includes one type of LED package 11 on which the LED chip 11 a is mounted, and another type on which the LED chip 11 ′ a light emitting color different from the LED chip 11 a is mounted. LED package 11 '. In the substrate 12, the LED chips 11a and 11'a of these two types of LED packages 11 and 11 'are alternately arranged on a plurality of straight lines A, B and C extending in the longitudinal direction (long side direction of the substrate 12). The LED chips 11a and 11′a of the two types of LED packages 11 and 11 ′ are alternately arranged on a plurality of straight lines (not shown) extending in the short direction (the direction of the short side of the substrate 12). A plurality of LED packages 11, 11 ′ are arranged.

  FIG. 11 shows a modified example different from FIG. FIG. 11 is a partial top view of the light emitting device 10 according to this modification. In the example of FIG. 11, the LED package 11 and the LED package 11 ′ different in color from the LED package 11 are mounted side by side so as to form two straight lines in the longitudinal direction of the substrate 12. The LED packages 11 and the LED packages 11 ′ having different colors are alternately arranged on the two straight lines in the longitudinal direction of the module, and the LED packages 11 and the LED packages 11 ′ are alternately arranged in the short direction. It is said. By adopting such an arrangement, the same effect as in the example of FIG. 10 can be obtained. As described above, in the example of FIG. 11, the light-emitting device 10 includes one type of LED package 11 on which the LED chip 11 a is mounted, and another type on which an LED chip 11 ′ a light emitting color different from the LED chip 11 a is mounted. LED package 11 '. On the substrate 12, the LED chips 11a and 11'a of these two types of LED packages 11 and 11 'are alternately arranged on a plurality of straight lines A and B extending in the longitudinal direction (long side direction of the substrate 12), and A plurality of LED packages 11, 11 ′ of the two types of LED packages 11, 11 ′ are arranged alternately on a plurality of straight lines (not shown) extending in the short direction (the direction of the short side of the substrate 12). LED packages 11 and 11 'are arranged.

  As described above, regardless of the arrangement, the LED packages 11 and 11 ′ of different colors are always arranged alternately on a straight line extending in the short direction and the long direction, thereby causing uneven luminance. Light without color unevenness can be obtained.

  As mentioned above, although embodiment of this invention was described, you may implement in combination of 2 or more among these embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, this invention is not limited to these embodiment, A various change is possible as needed.

  10 light emitting device, 11, 11 ′ LED package, 11a, 11′a LED chip, 11b anode, 11c cathode, 12 substrate, 12a wiring, 13 transparent resin-formed product, 20 substrate, 21 N-type semiconductor, 22 P-type semiconductor, 23 electrodes, 90 light emitting devices, 91 LED package, 91a LED chip, 91b anode, 91c cathode, 92 substrate, 92a wiring.

Claims (6)

A plurality of LED packages in which LED (light emitting diode) chips are mounted at positions other than the center when viewed from the light emitting direction;
A light emitting device comprising: a substrate in which each of four LED packages among the plurality of LED packages is arranged in a cross shape when viewed from the light emitting direction.   For each of the four LED packages arranged on the substrate in a cross shape among the plurality of LED packages, the LED chips of the four LED packages are positioned closer to the inner side of the cross formed by the four LED packages. The light-emitting device according to claim 1.   For each of the four LED packages arranged on the substrate in a cross shape among the plurality of LED packages, an LED chip of one LED package out of the four LED packages extends in the long side direction of the substrate. The LED chips of the other two LED packages among the four LED packages are positioned on the second straight line extending in the long side direction of the substrate. 3. The light emitting device according to claim 1, wherein the LED chip of the remaining one LED package is positioned on a third straight line extending in a long side direction of the substrate.   For each of the four LED packages arranged on the substrate in a cross shape among the plurality of LED packages, the LED chips of the two LED packages out of the four LED packages extend in the long side direction of the substrate. The LED chips of the remaining two LED packages among the four LED packages are located on a first straight line and are located on a second straight line extending in the long side direction of the substrate. Item 3. A light-emitting device according to item 1 or 2. Each of the four LED packages arranged on the substrate in a cross shape among the plurality of LED packages further includes a quadrangular pyramid-shaped transparent member installed at the center of the cross formed by the four LED packages. The light-emitting device according to claim 1.   For each of the four LED packages arranged on the substrate in a cross shape among the plurality of LED packages, the LED chips of the two LED packages of the four LED packages are LED chips of the first emission color. 6. The LED chip of the remaining two LED packages among the four LED packages is an LED chip of a second light emission color different from the first light emission color. Light-emitting device.

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