KR101104763B1 - The light emitting device - Google Patents

Abstract

PURPOSE: A light emitting apparatus is provided to arrange a light emitting chip operated in all polarities between multiple light emitting chips which are operated according to the polarity of a power source, thereby improving light emitting efficiency. CONSTITUTION: A case body(110) supports a substrate(130). A light emitting device package(200A-200E) is loaded on the substrate. The light emitting device package comprises one or more light emitting chips. A connection terminal(120) supplies power by being electrically connected to the light emitting device package. A lens(140) is arranged in order to cover the light emitting device package by being connected to the case body.

Description

Light Emitting Device {THE LIGHT EMITTING DEVICE}

The present invention relates to a light emitting device. In particular, the present invention relates to an AC light emitting device including a light emitting diode.

A light emitting diode (LED) may form a light emitting source using compound semiconductor materials such as GaAs series, AlGaAs series, GaN series, InGaN series, and InGaAlP series.

Such a light emitting diode is packaged and used as a light emitting device that emits a variety of colors, and the light emitting device is used as a light source in various fields such as a lighting indicator for displaying a color, a character display, and an image display.

The technical problem to be achieved by the present invention is to provide a lighting device including a plurality of light emitting device package having a plurality of light emitting diodes driven simultaneously.

The present invention relates to a substrate; At least two first light emitting device packages disposed on the substrate and connected in series with each other in a reverse direction with respect to an AC power source; At least two second light emitting device packages disposed on the substrate and connected in parallel with the first light emitting device package with respect to the AC power source and connected in series with each other in a reverse direction; And at least one third light emitting device package coupled between a first contact between the at least two first light emitting device packages and a second contact between the at least two second light emitting device packages; The first to third light emitting device packages include a plurality of light emitting diodes, and when the first to third light emitting device packages are driven, the plurality of light emitting diodes included in the driven light emitting device packages simultaneously emit light. A light emitting device for alternating current is proposed.

The first and second light emitting device packages may be alternately driven in half cycles of the AC power, and the third light emitting device package may be driven in all cycles.

A plurality of light emitting diodes of each of the first to third light emitting device packages may be connected in series.

The at least two first light emitting device packages may include a first polarity first light emitting device package connected with a first polarity between a first input terminal of the AC power source and the first contact point, and a first of the first contact point and the AC power source. A second polarity first light emitting device package coupled between a second input terminal with a second polarity opposite to a first polarity, wherein the at least two second light emitting device packages comprise a first input terminal and the second contact point of the AC power source; A second polarity second light emitting device package connected with the second polarity between the first polarity and a second polarity light emitting device package connected with the first polarity between the second contact point and the second input terminal of the AC power source; Can be.

At least one third light emitting device package may be connected in series with the first polarity first light emitting device package at a first polarity at the first contact point.

The first to third light emitting device packages may include light emitting chips in which the plurality of light emitting diodes are formed.

In the light emitting chip, the plurality of light emitting diodes may form a matrix cell.

The driving voltage applied to each of the light emitting diodes may satisfy the following equation.

V _driving = V _SOURCE / (mx L)

(V _SOURCE is the maximum value of the AC power, m is the number of the light emitting device package connected in series, L is the number of light emitting diodes included in one light emitting chip, V _driving means the driving voltage applied to one light emitting diode do.)

The driving voltage may be equal to or less than a threshold driving voltage of each of the light emitting diodes.

In the light emitting chip, the plurality of light emitting diodes may form a 6 × 6 matrix cell.

When the driving voltage is equal to the threshold driving voltage of the light emitting diode, the plurality of light emitting diodes may form a 5 × 5 matrix cell.

The cell in which the pad of the light emitting chip is formed may have a larger area than other cells.

The first to third light emitting device packages may include a body in which a cavity is formed, first and second conductive members separated in the cavity, and electrically connected to the first and second conductive members and mounted in the cavity. And a light emitting chip in which the plurality of light emitting diodes are formed, and a resin material filling the cavity.

The AC light emitting device may include a case body supporting the substrate, a connection terminal installed on the case body and receiving power from an external power source, and a plurality of first to third light emitting device packages formed on the substrate. It may include.

As the present invention, a plurality of cells formed in one light emitting chip are formed in the same structure, and a plurality of cells in one light emitting chip are connected in series and simultaneously driven, thereby simplifying the connection between the cells and increasing the number of masks used. The manufacturing process is simplified and economical. In addition, the luminous efficiency can be improved by forming a plurality of light emitting chips for driving according to the polarity of the power source and the light emitting chips for driving at all polarities with respect to the AC power source.

1 is a perspective view of a light emitting device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating the light emitting device package illustrated in FIG. 1.
3 is a circuit diagram of the light emitting device of FIG. 1.
4A and 4B show the operation of the light emitting device of FIG. 3 at a positive power source.
5A and 5B illustrate the operation of the light emitting device of FIG. 3 in a negative power source.
FIG. 6 is a detailed circuit diagram of an embodiment of the light emitting device of FIG. 1.
FIG. 7 is a top view of the light emitting chip according to the detailed circuit diagram of FIG. 4.
8 is a cross-sectional view taken along the line II ′ of the light emitting chip of FIG. 7.
FIG. 9 is a cross-sectional view taken along line II-II ′ of the light emitting chip of FIG. 7.
10 is an exploded perspective view of a light emitting device according to a second embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. .

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

The present invention relates to a light emitting device including a plurality of light emitting chips having a plurality of light emitting cells, the light emitting device including a plurality of light emitting chips selectively emitting light according to an alternating voltage, and a light emitting chip that always emits light regardless of the polarity of the AC voltage. In this case, when each light emitting chip is operated, a plurality of light emitting cells constituting the light emitting chip simultaneously generate light.

Hereinafter, a light emitting device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 9.

1 is a perspective view of a light emitting device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view illustrating a light emitting device package shown in FIG. 1, and FIG. 3 is a circuit diagram of the light emitting device of FIG. 1.

Referring to FIG. 1, the light emitting device 100 is installed in a case body 110, a plurality of light emitting device packages 200A-200E installed in the case body 110, and a case body 110, and supplies power from an external power source. It may include a connection terminal 120 provided.

The case body 110 is preferably formed of a material having good heat dissipation properties, for example, may be formed of a metal or a resin.

The light emitting device packages 200A to 200E are mounted on the substrate 130.

The substrate 130 may be a circuit pattern printed on the insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and the like. It may include.

In addition, the substrate 130 may be formed of a material that reflects light efficiently, or the surface may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

Each of the light emitting device packages 200A to 200E includes at least one light emitting chip, and each of the light emitting chips may include a plurality of light emitting diodes (LEDs) forming each cell.

The light emitting diode may include a colored light emitting device for emitting colored light of red, green, blue or white color, and a UV light emitting device for emitting ultraviolet light (UV, UltraViolet).

In addition, a fluorescent sheet may be further disposed on a traveling path of light emitted from the light emitting device packages 200A to 200E, and the fluorescent sheet changes the wavelength of light emitted from the light emitting device packages 200A to 200E. When the light emitted from the light emitting device packages 200A-200E has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting device packages 200A-200E may finally pass white light through the fluorescent sheet. Will be shown.

The fluorescent sheet may simultaneously cover the plurality of light emitting device packages 200A-200E. Alternatively, the fluorescent sheet may be formed of a sealing material for sealing each of the light emitting device packages 200A-200E.

The connection terminal 120 may be electrically connected to the light emitting device packages 200A-200E to supply power. According to FIG. 1, the connection terminal 120 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 120 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

In addition, as shown in FIG. 1, the lens 140 further includes a lens 140 connected to the case body 110 to cover the light emitting device packages 200A to 200E. The lens 140 may be formed of transparent or translucent glass, and the substrate 130 on which the light emitting device packages 200A-200E are mounted may have a circumferential hemispherical shape.

In the light emitting device 100 as described above, at least one of a light guide member, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet is disposed on a path of the light emitted from the light emitting device packages 200A-200E. The desired optical effect can be obtained.

At this time, an odd number of the light emitting device packages 200A to 200E may be arranged. For example, five light emitting device packages 200A to 200E may be arranged in a matrix form as shown in FIG. 1. In detail, four light emitting device packages 200A-200D may be arranged in a matrix, and one light emitting device package 200E may be disposed in a central area of the four light emitting device packages 200A-200D.

In this case, each of the light emitting device packages 200A to 200E may have the same structure.

In detail, as illustrated in FIG. 2, the light emitting device packages 200A to 200E include a body 210 including a cavity, a light emitting chip 300, a resin material 260, and first and second conductive members 230 and 240. .

The body 210 may be injection molded to a predetermined shape, including any one material of polyphthalamide (PPA), liquid crystal polymer (LCP), syndiotactic polystyrene (SPS), or ceramic (ceramics), but is not limited thereto. It doesn't work. The upper portion 220 of the body 210 is formed with a cup-shaped cavity 215 to a predetermined depth. The side surface of the cavity 215 may be formed to be inclined by a predetermined angle with respect to an axis perpendicular to the bottom surface.

 The body 210 has a plurality of first and second conductive members 230 and 240 arranged horizontally.

The first and second conductive members 230 and 240 are exposed to the inside of the cavity 215 and are electrically separated from each other. Both ends of the first and second conductive members 230 and 240 are exposed to the outside of the body 210 to serve as electrodes, and the region used as the electrode may be bent to the lower portion of the body 210 as shown in FIG. 2. Reflecting materials may be coated on surfaces of the first and second conductive members 230 and 240 exposed inside the cavity 215.

The light emitting chip 300 is bonded to the bottom surface of the cavity 215 between the first conductive member 230 and the second conductive member 240, and the first and second conductive members 230 and 240 are connected through the respective wires 250. ) Can be connected.

The light emitting chip 300 may be mounted using a wire bonding, die bonding, or flip bonding method selectively, and the bonding method may be changed according to the chip type and the electrode position of the chip.

 The light emitting chip 300 may selectively include a semiconductor light emitting diode manufactured using a compound semiconductor of Group III and Group V elements, such as AlInGaN, InGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs, and the like. have.

In addition, each light emitting chip 300 may be composed of a blue LED chip, a yellow LED chip, a green LED chip, a red LED chip, a UV LED chip, an amber LED chip, a blue-green LED chip, and the like.

The structure of the light emitting chip 300 will be described later in detail.

In addition, the first and second conductive members 230 and 240 may be electrically connected to a protection element such as a zener diode (not shown) to protect the light emitting chip 300.

Meanwhile, a reflective layer (not shown) may be formed on the side surface of the cavity 215, and the resin material 260 is formed by filling the cavity 215. The resin 260 may include a transparent silicon or epoxy material and may include a phosphor.

Referring back to FIG. 1, two light emitting device packages 200A and 200D arranged diagonally among four light emitting device packages 200A to 200D arranged on the substrate 130 are simultaneously driven and adjacent light emitting device packages ( 200C, 200B) are alternately driven to generate light.

That is, in FIG. 1, the fourth LED package 200D and the diagonal of the first LED package 200A and the first LED package 200A are simultaneously driven, and the third LED package 200C and the diagonal thereof are simultaneously driven. The second LED package 200B is simultaneously driven, and the operation of the first and fourth LED package 200A and 200D and the operation of the second and third LED package 200B and 200C are alternately performed. do.

In this case, the fifth light emitting device package 200E formed in the central region emits light in the entire cycle of the AC power supply 150.

The light emission of the light emitting device packages 200A to 200D proceeds by applying the AC power source 150.

3 to 5, the five light emitting device packages 200A to 200E connected to the AC power supply 150 are shown as light emitting diodes because they each operate as one light emitting diode.

The first light emitting device package 200A and the adjacent second light emitting device package 200B are connected in series in a reverse direction between the first input terminal n1 and the second input terminal n2, and the third light emitting device package 200C. And the fourth light emitting device package 200D adjacent thereto are connected in series in a reverse direction between the first input terminal n1 and the second input terminal n2, and are connected to the first input terminal n1. The three light emitting device packages 200A and 200C are connected in parallel in opposite directions, and the second and fourth light emitting device packages 200B and 200D connected to the second input terminal n2 are connected in parallel in opposite directions.

In this case, the node between the first and second light emitting device packages 200A and 200B is defined as the first node n3, and the node between the third and fourth light emitting device packages 200C and 200D is defined as the second node ( As defined by n4), the fifth light emitting device package 200E is connected between the first node n3 and the second node n4.

Therefore, the fifth light emitting device package 200E is connected in series with the first light emitting device package 200A in the forward direction at the first node n3, and is connected to the third light emitting device package 200C at the second node n4. Serial connection in forward direction.

That is, the first input terminal n1 is connected to the negative electrode of the first light emitting device package 200A and the positive electrode of the third light emitting device package 200C, and the second input terminal n2 is the second light emission. It is connected to the negative electrode of the device package 200B, and is connected to the positive electrode of the fourth light emitting device package 200D.

The first node n3 is connected to the positive electrode of the first light emitting device package 200A, the positive electrode of the second light emitting device package 200B, and the negative electrode of the fifth light emitting device package 200E. The second node n4 is connected to the negative electrode of the third light emitting device package 200C, the negative electrode of the fourth light emitting device package 200D, and the positive electrode of the fifth light emitting device package 200E.

An AC power source 150 is connected between the first input terminal n1 and the second input terminal n2, and a resistor for matching between the AC power source 150 and the first input terminal n1 or the second input terminal n2. R1 or a capacitor (not shown) may be connected.

As shown in FIG. 4A, when a positive voltage is applied from the AC power supply 150 to the first input terminal n1 for a half period T / 2 of one cycle T, as shown in FIG. 2 The light emitting device packages 200C, 200E, and 200B are conducted. Therefore, the light emitting chip 300 of the light emitting device packages 200C, 200E, and 200B generates light, and the first and fourth light emitting device packages 200A and 200D are not driven by the reverse voltage.

Meanwhile, as shown in FIG. 5A, when a negative voltage is applied to the first input terminal n1 during the next half cycle, the first, fifth, and fourth light emitting device packages 200A, 200E, and 200D become conductive. Therefore, the light emitting chip 300 of the light emitting device packages 200A, 200E, and 200D generates light, and the third and second light emitting device packages 200C and 200B are not driven.

At this time, the AC power supply 150 may be a commercial voltage of 220V, and having a frequency of 60Hz, the period T may be 1/60 seconds.

Therefore, the light emitting device 100 constantly lights the naked eye by generating light alternately between the third and second light emitting device packages 200C and 200B and the first and fourth light emitting device packages 200A and 200D for a short time. It can be recognized by examining.

At this time, since the fifth light emitting device package 200E connected between the light emitting device packages emitting light alternately emits light at the entire period T of the AC power supply 150, the light emitting effect similar to that of the two light emitting device packages emits light. You can get it.

Therefore, by disposing the light emitting device package 200E between the first and second nodes n3 and n4, double light emission efficiency may be obtained.

In the above description, the light emitting device packages 200E disposed at the first and second nodes n3 and n4 are represented as one. Alternatively, a plurality of light emitting device packages may be arranged in series.

In this case, the light emitting chips 300 in each of the light emitting device packages 200A to 200E may include a plurality of light emitting diodes, and the light emitting diodes constituting the light emitting chip 300 may be as shown in FIG. 6.

6 is a detailed circuit diagram according to an embodiment of the light emitting device.

Referring to FIG. 6, each light emitting device package 200A-200E includes the same number of light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l in the light emitting chip 300. , DE1-DE l ), and the plurality of light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l , DE1-DE l are in series in one light emitting chip 300. It is connected.

That is, and the negative electrode of the first light emitting device l of emission in the (200A) diodes (DA1-DA l) of the first light emitting diode (DA1) connected to the first input terminal (n1), a positive electrode of claim 2 is connected to the negative electrode of the light emitting diode DA2. The series connection is connected to the first l- 1 light emitting diode DA l -1, and the positive electrode of the first l light emitting diode DA l is connected to the first light emitting diode DE1 of the fifth light emitting device package 200E. The first light emitting device package 200A and the fifth light emitting device package 200E are connected in series in the forward direction by being connected to the negative electrode of the first electrode and the first node n3.

The claim in a plurality of light emitting diode (DE1-DE l) also connected in series, and the last light-emitting diode of claim l light emitting diode (DE l) the amount of the second node (n4) electrode of the fifth light emitting device package (200E) 4 is connected to the negative electrode of the first light emitting diode DD1 of the light emitting device package 200D.

A fourth plurality of light emitting diodes (DD1-DD l) of the light emitting device (200D) also connected in series, and the last light-emitting diode of claim l light emitting diode connected to the (DD l) the amount of the second input terminal (n2) electrode do.

On the other hand, the negative electrode of the third light emitting device (200C) the first light emitting diode and the positive electrode of the (DC1) connected to the first input terminal (n1), the end of the l-emitting diode (DC l) of the 5 light-emitting end of the l light emitting diode (DE l) both being of the electrodes and connected at a second node (n4) a third light emitting device (200C) and the fifth light emitting device (200E) of the device package (200E) is Serial connection in forward direction.

A plurality of light emitting diodes DB1-DB l of the second light emitting device package 200B are also connected in series, and a positive electrode of the first light emitting diode DB1 is connected to the first node n3, and the last light emission is performed. the negative electrode of the diode of the light emitting diode of claim l (l DB) is connected to the second input terminal (n2).

In this way, each light emitting device a plurality of light emitting diodes (DA1-DA l, DB1- DB l, DC1-DC l, DD1-DD l, DE1-DE l) in the (200A-200E) are series-connected to synchronizer .

For a plurality of light emitting device (200A-200E), the plurality being connected in series with a light emitting diode (DA1-DA l, DB1- DB l, DC1-DC l, DD1-DD l, DE1-DE l), specifically The plurality of light emitting diodes DA 1 -DA 1 , DD 1 -DD 1 , and DE 1 -DE 1 of the first, fifth, and fourth light emitting device packages 200A, 200E, and 200D are connected in series for a half period to supply a power source 150. Divides the voltages applied to the first and second input terminals n1 and n2.

On the other hand, the plurality of light emitting diodes DB1-DB l, DC1-DC l , DE1-DE l of the second, fifth and third light emitting device packages 200B, 200E, and 200C are connected in series for another half period. The voltage applied to the first and second input terminals n1 and n2 is distributed from 150.

Light-emitting diodes DA1-DA l, DB1-DB l, DC1-DC l , connected in series by connecting the fifth light emitting device package 200E between an intermediate node and an intermediate node of another light emitting device package 200A-200D connected in series; DD1-DD l, DE1-DE l) increasing the suhyo the light emitting diodes (DA1-DA l, DB1- DB l, DC1-DC l, DD1-DD l, DE1-DE l) to lower the driving voltage applied to the Can be.

That is, the light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l , and DE1-DE l are applied to one light emitting device package 200A-200E according to the following equation. The driving voltage V _driving is determined.

[Equation]

That is, V _driving = V _SOURCE / (mx L)

At this time, V _SOURCE is the maximum value of the AC power supply 150, m is the number of light emitting device packages 200A-200E connected in series, L is a light emitting diode (DA1-DA l ) in one light emitting device package (200A-200E) , DB1-DB l , DC1-DC l , DD1-DD l , DE1-DE l ).

Therefore, when driving, the number of light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l , DE1-DE l is controlled to control the number of light emitting diodes DA1-DA l , DB1-. DB l , DC1-DC l , DD1-DD l, DE1-DE l ) It can be set so that the driving voltage is smaller than the threshold driving voltage to withstand and is larger than the threshold voltage.

By controlling the number of light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l , DE1-DE l as described above, the light emitting diodes DA1-DA l , DB1-DB l , DC1 -DC l , DD1-DD l , DE1-DE l ) can be prevented from deterioration and can be operated stably.

In the above, the number L of the light emitting diodes DA1-DA l , DB1-DB l, DC1-DC l , DD1-DD l , and DE1-DE l of one LED package 200A-200E is limited to 34. Alternatively, the number L of the light emitting diodes may be adjusted so that the critical driving voltage is 3.2V as the driving voltage.

That is, when the number L of light emitting diodes of one light emitting device package 200A-200E is 23, the divided driving voltage V _driving applied to each light emitting diode may satisfy 3.2V, which is a threshold driving voltage of the light emitting diodes. Can be.

Hereinafter, 34 light emitting diodes (DA1-DA l, DB1-DB l, DC1-DC l , DD1-DD l, DE1-DE l ), ( l = 34) are connected in series in one package 200A-200E. At this time, 34 light emitting diodes (DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l, DE1-DE l ) in one light emitting device package (200A-200D) is one light emitting chip ( It will be described as formed in 300).

Hereinafter, an example of the light emitting chip 300 of the light emitting device 100 according to the present embodiment will be described with reference to FIGS. 7 to 9.

FIG. 7 is a plan view of a light emitting chip according to the detailed circuit diagram of FIG. 6, FIG. 8 is a cross-sectional view of the light emitting chip of FIG. 7 taken along line II ′, and FIG. 9 is a view of the light emitting chip of FIG. One cross section.

Referring to FIGS. 7 to 9, one light emitting chip 300 mounted in each light emitting device package 200A-200E includes a plurality of light emitting diodes, for example, 34 light emitting diodes.

The light emitting chip 300 has two pads 390 and 391 formed at corners thereof, and the pads 390 and 391 are formed of conductive members 230 and 340 and wires 250 of the light emitting device packages 200A and 200E. ), Etc., are electrically connected.

Since each of the light emitting diodes DA1-DA l , DB1-DB l , DC1-DC l , DD1-DD l , DE1-DE l functions as one cell in one light emitting chip 300, hereinafter, each light emitting diode a (DA1-DA l, DB1- DB l, DC1-DC l, DD1-DD l, DE1-DE l) is designated as the light emitting cells.

A plurality of light emitting cells are arranged on the substrate 310.

The plurality of light emitting cells are arranged in a matrix form on the substrate 310, and when the number of light emitting cells is 34, the light emitting cells may have a matrix form of 6 × 6. It can have an area of twice.

The substrate 310 may be an insulating or conductive substrate 310, for example, sapphire or silicon carbide (SiC).

Each of the light emitting cells may include a first conductivity type semiconductor layer 330, a second conductivity type semiconductor layer 350 and a first conductivity type semiconductor layer disposed on one region of the first conductivity type semiconductor layer 330. An active layer 340 is included between the 330 and the second conductivity type semiconductor layer 350.

The first and second conductive semiconductor layers 330 and 350 are n-type and p-type, or p-type and n-type, respectively.

The first conductive semiconductor layer 330, the active layer 340, and the second conductive semiconductor layer 350 may be formed of a gallium nitride-based semiconductor material, that is, (B, Al, In, Ga) N.

The active layer 340 may be a semiconductor layer formed of a multi-quantum well structure.

In FIGS. 8 and 9, the buffer layer 320 is further included between the substrate 310 and the first conductivity-type semiconductor layer 330. However, the buffer layer 320 may be deleted.

In addition, a plurality of patterns may be formed on the surface of the substrate 310, and light may be scattered by the plurality of patterns to increase light emission efficiency.

The transparent electrode layer 360 is formed on the second conductive semiconductor layer 350.

The transparent electrode layer 360 transmits light generated by the active layer 340 and distributes and supplies current to the second conductive semiconductor layer 350.

At this time, the stacked structure on the first conductive semiconductor layer 330 is formed to have a smaller area than the upper surface of the first conductive semiconductor layer 330, the first upper surface on which the transparent electrode layer 360 is formed And a second upper surface through which the first conductive semiconductor layer 330 is exposed.

A first insulating layer 370 is formed to cover the entirety of the light emitting chip, and the first insulating layer 370 exposes the transparent electrode layer 360 and the second upper surface of the first conductive semiconductor layer 330. Openings 371 and 372 to be included.

Wiring 380 connecting the opening 372 exposing the first conductivity-type semiconductor layer 330 and the opening 371 exposing the transparent electrode layer 360 of a neighboring cell on the first insulating layer 370. This is formed to connect neighboring cells in series.

A second insulating layer 375 is formed on the entire surface of the chip to cover the wiring 380, and the second insulating layer 375 prevents the wiring 380 from being contaminated by moisture or the like. 380 and the light emitting cells are prevented from being damaged.

The second insulating layer 375 includes an opening that exposes the wiring 380 on the transparent electrode layer 360 of the cell in the corner region and the wiring 380 on the first conductive semiconductor layer 330. It is formed in all areas except the pads 390 and 391 to be connected to the package.

The wiring 380 exposed by the opening of the second insulating layer 375 is pads 390 and 391 connecting to an external package, and the selected cells are defined as first and last cells.

As such, a plurality of cells formed in one light emitting chip 300 are formed in the same structure, and a plurality of cells in one light emitting chip 300 are connected in series and simultaneously driven to simplify the connection between cells. The number of masks to be reduced is simplified, making the manufacturing process simple and economical.

In addition, since the leakage current is reduced by simplifying the connection of the wiring 380 in the light emitting chip 300, device reliability may be secured.

On the other hand, the side wall of the light emitting cell is formed to be inclined with respect to the upper surface of the substrate 310 may be narrower toward the top. The inclination of the sidewalls improves the emission efficiency of the light generated in the active layer 240 and helps the conformal deposition of other layers to be formed on the light emitting cells.

Meanwhile, the light emitting device 100 of the present invention may connect a plurality of light emitting cells in one light emitting chip in parallel according to the number and driving voltage of the cells.

That is, the plurality of light emitting cells forming one row are connected in series, and the plurality of columns are connected in parallel so that the entire light emitting chip may include a plurality of light emitting diodes in parallel.

In the above description, one light emitting device package 200A-200E is described as including 34 light emitting diodes. However, the present invention is not limited thereto, and one light emitting device package 200A-200E includes 23 light emitting diodes. May have a matrix structure of 5 × 5.

10 is an exploded perspective view of a light emitting device according to a second embodiment of the present invention.

Referring to FIG. 10, another lighting device 1000 according to the present invention includes a fluorescent cover 1220, a light emitting device, and a main body 1210.

The main body 1210 includes an accommodating part accommodating a light emitting device and power terminals 1230 located at both ends of the accommodating part. The fluorescent cover 1220 and the light emitting device are mounted in the accommodating part of the main body 1210. In addition, a power supply device (not shown) connected to the power terminal 1230 to supply power may be connected to or included in the main body 1210. Switched-mode power supply (SMPS) may be used as the power supply.

In addition, the main body 1210 may further include a ballast (not shown) that is connected to a fluorescent lamp in series with a choke coil wound around a core to prevent an increase in current.

The light emitting device includes at least one light emitting device package 200A-200E that emits light by electric power received from a power supply device, and a module substrate 1240 on which the light emitting device packages 200A-200E are mounted.

The fluorescent cover 1220 is coupled to the main body 1210, the fluorescent cover 1220 is a plate shape having a constant thickness, the plate shape is a cross-sectional shape of the cross-sectional shape, the cross-sectional shape is a semi-circular shape, cross section The shape of the semi-elliptic, the shape of the cross section may be provided in a variety of shapes, such as an open polygon.

The fluorescent cover 1220 may be spaced apart from the light emitting device.

The fluorescent cover 1220 includes a plurality of phosphors therein, and when the light is received from the light emitting device 1210, the phosphor emits light while being excited and transitions to the ground state.

The lighting apparatus 1000 of FIG. 10 may apply a light emitting device including the light emitting device packages 200A to 200E having the structure described with reference to FIGS. 1 to 9.

That is, the light emitting device packages 200A to 200E arrange the fifth light emitting device package 200E emitting light at every cycle among the five light emitting device packages 200A to 200E shown in FIG. Since the third and second light emitting device packages 200C and 200B are positioned between the first and fourth light emitting device packages 200A and 200D, the light emitting device packages 200A to 200E that are formed in a row alternately emit light. It can have

In addition, since the light emitting device packages 200A-200E include a bar type light emitting chip 300, which is not a matrix type, the first to fifth light emitting device packages 200A-200E may be formed of a bar type substrate ( 1240 may be alternately formed over the heat.

The structure of the light emitting chip 300 and the structure of the package of the light emitting device package 200A-200E is not limited to the above description, but a plurality of light emitting diodes of one light emitting device package 200A-200E are driven simultaneously to emit light. Is the same.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Light emitting device 100, 1000
Case body 110
Connector 120
Light emitting device package 200A, 200B, 200C, 200D, 200E
Light emitting chip 300
AC power supply 150

Claims (14)

Board;
At least two first light emitting device packages disposed on the substrate and connected in series with each other in a reverse direction with respect to an AC power source;
At least two second light emitting device packages disposed on the substrate and connected in parallel with the first light emitting device package with respect to the AC power source and connected in series with each other in a reverse direction; And
At least one third light emitting device package connected between a first contact between the at least two first light emitting device packages and a second contact between the at least two second light emitting device packages
Including,
Each of the first to third light emitting device packages includes a plurality of light emitting diodes, and when the first to third light emitting device packages are driven, the plurality of light emitting diodes included in the driven light emitting device package are simultaneously driven. Light emitting device for alternating current to generate light. The method of claim 1,
And the first and second light emitting device packages are alternately driven in half cycles of the AC power, and the third light emitting device package is driven at all cycles. The method of claim 1,
And a plurality of light emitting diodes of each of the first to third light emitting device packages are connected in series. The method of claim 1,
The at least two first light emitting device package
A first polarity first light emitting device package connected to a first polarity between a first input terminal of the AC power source and the first contact point; and
A second polarity first light emitting device package connected between the first contact point and the second input terminal of the AC power source with a second polarity opposite to a first polarity;
The at least two second light emitting device package
A second polarity second light emitting device package connected between the first input terminal of the AC power source and the second contact with the second polarity; and
And a first polarity second light emitting device package connected between the second contact point and the second input terminal of the AC power source with a first polarity. The method of claim 4, wherein
And at least one third light emitting device package is connected in series with the first polarity first light emitting device package in a first polarity at the first contact point. The method of claim 5,
And the first to third light emitting device packages include light emitting chips on which the plurality of light emitting diodes are formed. The method of claim 6,
The light emitting device of claim 1, wherein the plurality of light emitting diodes form a matrix cell. The method of claim 7, wherein
The driving voltage applied to each of the light emitting diodes satisfy the following equation.
V _driving = V _SOURCE / (mx L)
(V _SOURCE is the maximum value of AC power, m is the number of the light emitting device package connected in series, L is the number of light emitting diodes included in one light emitting chip, V _driving means the driving voltage applied to one light emitting diode do.) The method of claim 8,
And the driving voltage is equal to or less than a threshold driving voltage of each of the light emitting diodes. The method of claim 7, wherein
The light emitting chip is an alternating light emitting device in which the plurality of light emitting diodes form a 6X6 matrix cell. The method of claim 8,
When the driving voltage is equal to the threshold driving voltage of the light emitting diode,
The light emitting chip is an alternating light emitting device in which the plurality of light emitting diodes form a 5X5 matrix cell. The method according to claim 10 or 11, wherein
The cell in which the pad of the light emitting chip is formed has an area larger than that of other cells. The method of claim 6,
The first to third light emitting device package,
Body with cavity formed,
First and second conductive members separated in the cavity;
The light emitting chip electrically connected to the first and second conductive members and mounted in the cavity, wherein the plurality of light emitting diodes are formed; and
An alternating light emitting device comprising a resin material filling the cavity. The method of claim 1,
The AC light emitting device,
A case body for supporting the substrate,
A connection terminal installed in the case body and receiving power from an external power source, and
An alternating light emitting device including a lens covering a plurality of first to third light emitting device packages formed on the substrate.

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