TW436940B - Ball grid array package having an expansion buffer insert and method of construction - Google Patents

Ball grid array package having an expansion buffer insert and method of construction Download PDF

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Publication number
TW436940B
TW436940B TW087121116A TW87121116A TW436940B TW 436940 B TW436940 B TW 436940B TW 087121116 A TW087121116 A TW 087121116A TW 87121116 A TW87121116 A TW 87121116A TW 436940 B TW436940 B TW 436940B
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Taiwan
Prior art keywords
expansion buffer
buffer insert
grid array
ball grid
patent application
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Application number
TW087121116A
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English (en)
Inventor
Darvin R Edwards
Steven K Groothuis
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Texas Instruments Inc
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Publication of TW436940B publication Critical patent/TW436940B/zh

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

經濟部中央標準局貝工消费合作杜印装 4369 4 0 at Β7 ------ — ----------- 五、發明説明（1 ) 發明技術領處 廣義而言’本發明與半導體晶片封裳的領域有關，更 明確地說，與具有膨脹緩衝插入件的球柵陣列封裝及其製 造方法有關。 發明背景 球柵陣列封裝（例如可從德州儀器公司獲得的^tar BGA封裝）是封裝半導體晶片中接近晶片尺寸的封裝。實 施傳統球柵陣列封裝的缺點是當封跤附接於印刷電路板 時，需要底部填料(underfill)才能獲得令人滿意的焊球壽 期。此項需求的起因是封裝的膨脹效果較接近半導體晶片 (例如矽）而非印刷電路板結果是，如果不使用底部填料 舒減應力，就會發生高的焊接應力，在反覆的應力之後焊 球終會毁壞。由於添加底部填料在製程中是相當耗時的步 驟及限制了重工率，很多使用球柵陣列封裴的業者都希望 能省去對底部填料的需要。 發明概述 根據本發明揭示一種具有膨脹緩衝插入件的球柵陣列 及製造的方法，由於不需要底部填料，因此它所提供的優 點超過先前發展的球柵陣列封裝。 根據本發明的一方面’球栅陣列封裝包括中間片 (interp〇ser)它的第一面上有絲（trace)，其反面上有相關的 焊球。膨脹緩衝插入件具有接線開口（b〇nd wke -3 - 本紙張认適用1CNS ) A4規格（21GX297公釐) ~ --- ---- 1 I I —1 — - HH ---訂 (請先閱讀背面之注意事項再填寫本頁)
發明說明 A7 B7 脹緩:Ϊ入::：間片的第一面耦合。半導體晶片與膨 插入件的反面耦合’並經由接線連接到 $=模製化合物包封住半導體晶片與膨脹緩衝插入件 實施例中，膨脹緩衝插入件是銅板。 ^據本發明的另—方面，提供_種製造球柵陣列封裝 緩衝括° ΐ膨脹緩衝插人件附著於中間片的第—面，膨腾 面有;t入件具有接線開°，中間片的第—面上有絲，其反 相_焊球。將半導體W附著於膨脹緩衝插入件的 導於及並&由接線連接_。接著以模製化合物包封住半 插心衝插入件。在某些實施例中’膨脹緩衝 报多相=:二,各個獨立的(單個成形)，也可以從 的應t發明?技術優岐不需使用底部填料來降低焊球上 二’而疋在球栅陣列封裝中的半導體晶#與中間片之 01嵌入膨脹緩衝插入件(例如銅板卜 以本發明的另一項技術優點是膨脹緩衝插入件的厚度可 與標準引線框的厚度相同„如此，膨脹緩衝插入件可以 $形為引線框的-部分，其上有標記孔(indexhGle)以結合 =片。因此’可以使用傳統的黏著、接線與模封設備來 造具有膨脹緩衝插入件的球柵陣列封裝。因此可以使中 間片材料的使用最少。 本發明的另一項技術優點是由於膨脹緩衝插入件傳播 熱的導熱性高，因此增進了熱性能。 本發明其它的技術優點可從附圖、說明及申請專利範 4 本紙張尺度適用中國國家標準（CNS ) A4現格（210X297公釐） ------------裝----- --訂 (請先閱讀背面之注意事項再填寫本頁) 鰱濟部中夬榡準局員工消費合作社印製 43β94〇 A7 _ 67________ 、發明説明（3) 圍中明瞭β 凰Aji述 參考以下的說明並配合附圖，將可完全暸解本發明與 它的優點，圖中相同的編號代表相同的特徵，其中·· 圖1是傳統球栅陣列封裝附著於印刷電路板的截面 圖’具有底部填料； 圖2是球栅陣列封裝附著於印刷電路板的一種實施例 戴面圖，它具有本發明的膨脹緩衝插入件； 圖3是在半導體晶片與中間片帶（interposer tape)間有 根據本發明之膨脹緩衝插入銅片的實施例透視圖； 圖4是圖3之中間片帶的截面圖；以及 圓5是使用銅引線框條片與單片的中間片製造本發明 之球柵陣列封裝的一種實施例透視圖。 經濟部中央標準局員工消費合作社印製 1- ^^^1 - - - - — It - II ^^^1 - - - f I 1 I i (請先閱讀背面之注意事項再填寫本頁) 圖1是傳統球柵陣列封裝的截面圖，以編號1〇表示， 它附著於印刷電路板且有底部填料。如圖所示，封裝1〇包 括半導體晶片12，它以晶片附著層14(例如黏著）將晶片12 與中間片16結合9模製化合物18包封住晶片12與晶片附著 層W，以保護晶片12與外部環境隔開。許多焊球與中間片 16耦合，提供與印刷電路板的連接，如圖所示。中間片16 與印刷電路板間提供有底部填料22，其材料會降低熱膨脹 的效果。由於封裝10與印刷電路板間的熱膨脹不匹配，底 本紙張尺度適用中國國家標率（CNS ) A4規格（210X297公釐） 4369 4 Ο Α7 Β7 經濟部中央橾準局員工消費合作社印裝 五、發明説明（4 ) 部填料22的目的是減輕焊球20上的應力，藉以延長焊球20 的壽期。如以上所述，添加底部填料是相當費時的過程’ 且是在封裝10已黏著於印刷電路板後執行。因此，提供不 需要底部填料22的封裝設計俾益甚大。 圖2是一種球柵陣列封裝實施例附接於印刷電路板的 截面圖，以編號24表示，且具有本發明的膨脹緩衝插入件。 如圖所示，封裝24與圖1的封裝10相同。不過’根據本發 明，膨脹缓衝插入件26置於晶片12與中間片16之間’且以 電氣絕緣的黏著層28附著於中間片16。膨脹缓衝插入件26 是由銅或其它材料製成’提供與印刷電路板類似的熱膨 服。 一般來說，球柵陣列封裝24的熱循環性能是印刷電路 板材料之厚度的強函數。藉在晶片12下方插入膨脹緩衝插 入件26(如銅板），在相同的熱條件下可降低焊球20上的應 變(例如3%)。晶片12則感受到較高的應力（例如超過10%)。 不過，晶片12可以忍受如此高的應力不會受損或疲勞。結 果，膨脹緩衝插入件26降低了焊球20上的應力並使它的壽 期延長，不但不需要底部填料22且不會影響晶片12的性 能。 圖3是根據本發明之膨脹緩衝插入銅板置於半導體晶 片與中間片帶40間的實施例透視圖。如圖所示，晶片30附 著於銅板32上，銅板32的作用即為本發明的膨脹緩衝插入 件。銅板32包括接線切口 34，它提供了接線36從晶片30到 銅板32下方接點的通道《電氣絕緣的黏箸層38耦合到銅板 -6- 本紙張尺度適用中國國家標準（CNS ) A4规格（210x297公釐） ---------▲-- (請先閱婧背面之注意事項再填寫本頁)
1T 436940 A7 B7 五、發明説明（5 ) —--- 32 ’並提供了軸板伽著於中⑽_的裝置。中間片 帶4〇包括銅絲42，它提供接線刺焊球Μ的電氣連/焊 球44位於中間片帶4〇的底側。必須瞭解的是，典型的中間 片帶40包括數量極多的絲42與焊球44。 根據本發明，銅板32提供球柵陣列封裝增進的熱循環 性能。藉銅板32與印刷電路板間的匹配，在焊球料上方與 下方所產生的熱膨脹相同，因此不需要底部填料也能減低 焊球44上的應力。當然，銅板32或其它的膨脹緩衝插入件 會對晶片3G產生額外的應力。不過，晶JOG如同絕大多數 的半導體（例如石夕），可施加極多次的應力不會受損，因為 晶片30不會像焊球44般地會因疲勞而受損。因此根據本發 明，使用膨脹緩衝插入件，如銅板32，藉其與印刷電路板 的熱膨脹匹配較佳’即可以不需要底部填料。 圖4是圖3之中間片帶4〇的截面圖。如圖所示，中間片 帶40提供銅絲42與焊球44所需的結構物β在中間片帶4〇與 膨脹緩衝插入件32結合後，即可連接接線36與絲42,因此， 晶片30經由焊球44連接到印刷電路板。 圖5是根據本發明使用銅引線框條帶與單件式中間片 經濟部中央標準局貝工消费合作社印裝 ^iBB 1^1 m^i 1 n· ff^— (請先閱讀背面之注意事項再填寫本頁) 製造球柵陣列封裝之實施例的透視圖。如圖所示，銅引線 框帶50包括標記孔52定義每一個銅板膨脹緩衝插入件β每 一個銅板插入件具有許多相關的接線切口 54，與圖3中所 示相同。單件式中間片56可附著於銅引線框帶50構成封裝 半導體晶片的基座部分。單件式中間片56具有銅絲58，它 與穿過接線切口的接線連接。銅絲58連接到單件式中間片 -7- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消費合作社印製 436940 A7 Γ ·. ： ： ： i /
_Β7_" :J 五、發明說明（6) 56底側相關的焊球。一旦單件式中間片56與每一個銅板插 入件結合，即可使用現行的製造設備製造球栅陣列封裝。 在另一種實施例中，中間片56可提供於引線框條帶 内，而膨脹缓衝插入件為單件式。此外，膨脹缓衝插入件 與中間片56都可結合在一起提供於引線框帶内。此允許使 用傳統的黏著、接線與模封設備根據本發明製造包含有膨 脹緩衝插入件的球栅陣列封裝。 雖然已對本發明做了詳盡的描述，但必須暸解的是， 多種的改變、取代與替換都不會偏離本發明申請專利範圍 中所定義的精神與範圍。 元件符號說明： 10 封裝 40 中間片帶 12 晶片 42 銅絲 14 晶片附者層 44 焊球 16 中間片 50 框帶 18 模製化合物 52 標記孔 20 焊球 54 接線切口 22 底部填料 56 單件式中間片 24 封裝 58 銅絲 26 膨脹緩衝插入件 28 黏著層 30 晶片 32 銅板 34 接線切口 36 接線 38 黏著層 本紙張尺度適用中國國家標準（CNS)A4規格（‘210 x 297公釐） ----I--------------訂--------- (請先閱讀背面之注意事項再填寫本頁)

Claims (1)

  1. 經濟部中央揉準局貝工消费合作社印St 4 3 6 9 4 0 as B8 C8 D8六、申請專利範圍 1. 一種球栅陣列封裝，包括： 中間片，在第一面有絲，且在反面有相關的焊球； 膨脹缓衝插入件，具有接線開口，膨脹缓衝插入件的 第一面與中間片的第一面耦合； 半導體晶片與膨脹緩衝插入件的反面耦合，半導體晶 片經由接線連接到絲；以及 模製化合物包封住半導體晶片與膨脹緩衝插入件。 2. 根據申請專利範圍第1項的球柵陣列封裝，其中的膨脹 緩衝插入件是銅板。 3. 根據申請專利範圍第2項的球柵陣列封裝，其中的接線 開口是成形於銅板上的切口。 4. 根據申請專利範圍第1項的球柵陣列封裝，其中的絲是 銅絲。 5. 根據申請專利範圍第1項的球柵陣列封裝，其中的膨脹 緩衝插入件是以電氣絕緣的黏著層與中間片耦合。 6. 根據申請專利範圍第1項的球柵陣列封裝，其中的半導 體晶片是以黏著層與膨脹緩衝插入件耦合。 7- —種製造球柵陣列封裝的方法，包括： 將膨脹緩衝插入件的第一面附著於中間片的第一面， 其中膨脹緩衝插入件具有接線開口，以及中間片的第 一面上具有絲，中間片的反面有相關的焊球； 將半導體晶片附著於膨脹缓衝插入件的反面； 將半導體晶片以接線連接到絲；以及 將半導體晶片與膨脹緩衝插入件封入模製化合物中。 -9- ---------装-------訂 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4规格（2l〇X297公釐） ABCD 436940 申請專利範圍 8. 根據申請專利範圍第7項的方法，其中的膨脹缓衝插入 件是成形於引線框條帶上的許多膨脹缓衝插入件其中 之一。 9. 根據申請專利範圍第8項的方法，其中的引線框條帶是 銅質引線框條帶。 10. 根據申請專利範圍第8項的方法，其中的中間片是單件 式的中間片。 (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印製 -10- 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇Χ297公釐）
TW087121116A 1997-12-19 1998-12-23 Ball grid array package having an expansion buffer insert and method of construction TW436940B (en)

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