TW432477B - Method for forming micro pattern of semiconductor device - Google Patents

Method for forming micro pattern of semiconductor device Download PDF

Info

Publication number
TW432477B
TW432477B TW088120704A TW88120704A TW432477B TW 432477 B TW432477 B TW 432477B TW 088120704 A TW088120704 A TW 088120704A TW 88120704 A TW88120704 A TW 88120704A TW 432477 B TW432477 B TW 432477B
Authority
TW
Taiwan
Prior art keywords
pattern
micro
test pattern
exposure
micropattern
Prior art date
Application number
TW088120704A
Other languages
English (en)
Chinese (zh)
Inventor
Seok-Kyun Kim
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Application granted granted Critical
Publication of TW432477B publication Critical patent/TW432477B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW088120704A 1998-12-30 1999-11-26 Method for forming micro pattern of semiconductor device TW432477B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-1998-0062023A KR100400294B1 (ko) 1998-12-30 1998-12-30 노광마스크

Publications (1)

Publication Number Publication Date
TW432477B true TW432477B (en) 2001-05-01

Family

ID=19568719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088120704A TW432477B (en) 1998-12-30 1999-11-26 Method for forming micro pattern of semiconductor device

Country Status (3)

Country Link
JP (1) JP2000195787A (ja)
KR (1) KR100400294B1 (ja)
TW (1) TW432477B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60306438T2 (de) * 2002-03-25 2007-01-04 Asml Masktools B.V. Verfahren und Vorrichtung zur Zerlegung von Halbleiter-Bauelementmustern in Phasen- und Chromregionen für chromfreie Phasenlithographie
JP4190227B2 (ja) * 2002-07-31 2008-12-03 富士通マイクロエレクトロニクス株式会社 フォトマスク、その設計方法及びそれを用いた半導体装置の製造方法
KR100697172B1 (ko) * 2002-07-31 2007-03-21 후지쯔 가부시끼가이샤 포토마스크
US7097945B2 (en) * 2003-04-18 2006-08-29 Macronix International Co., Ltd. Method of reducing critical dimension bias of dense pattern and isolation pattern
KR101714078B1 (ko) 2011-10-20 2017-03-23 현대자동차주식회사 오토레버장치
CN108732861A (zh) * 2018-04-26 2018-11-02 上海华力集成电路制造有限公司 一种集成电路研发用掩膜板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980026846A (ko) * 1996-10-11 1998-07-15 김광호 더미패턴을 갖는 마스크

Also Published As

Publication number Publication date
KR100400294B1 (ko) 2003-12-24
KR20000045465A (ko) 2000-07-15
JP2000195787A (ja) 2000-07-14

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees