TW432451B - Component heater for use in semiconductor manufacturing equipment - Google Patents
Component heater for use in semiconductor manufacturing equipment Download PDFInfo
- Publication number
- TW432451B TW432451B TW088115459A TW88115459A TW432451B TW 432451 B TW432451 B TW 432451B TW 088115459 A TW088115459 A TW 088115459A TW 88115459 A TW88115459 A TW 88115459A TW 432451 B TW432451 B TW 432451B
- Authority
- TW
- Taiwan
- Prior art keywords
- heater element
- heater
- patent application
- controller
- cavity
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 230000002079 cooperative effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000011343 solid material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 210000000481 breast Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Measuring Volume Flow (AREA)
- Control Of Temperature (AREA)
- Control Of Resistance Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/150,458 US6078030A (en) | 1998-09-09 | 1998-09-09 | Component heater for use in semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW432451B true TW432451B (en) | 2001-05-01 |
Family
ID=22534624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088115459A TW432451B (en) | 1998-09-09 | 1999-09-08 | Component heater for use in semiconductor manufacturing equipment |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6078030A (enExample) |
| EP (1) | EP1118051B1 (enExample) |
| JP (1) | JP2002524864A (enExample) |
| TW (1) | TW432451B (enExample) |
| WO (1) | WO2000014616A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7575616B2 (en) * | 2006-02-10 | 2009-08-18 | Entegris, Inc. | Low-profile surface mount filter |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4436674A (en) * | 1981-07-30 | 1984-03-13 | J.C. Schumacher Co. | Vapor mass flow control system |
| US4484472A (en) * | 1983-02-16 | 1984-11-27 | Emerson Electric Co. | Concentric rod and tube sensor for thermal mass flow controller and flow meter |
| US4778559A (en) * | 1986-10-15 | 1988-10-18 | Advantage Production Technology | Semiconductor substrate heater and reactor process and apparatus |
| US4794947A (en) * | 1986-11-29 | 1989-01-03 | Kabushiki Kaisha Nippon IC (also trading as Nippon IC, Inc.) | Mass flow controller |
| US5138973A (en) * | 1987-07-16 | 1992-08-18 | Texas Instruments Incorporated | Wafer processing apparatus having independently controllable energy sources |
| US5646334A (en) * | 1995-09-12 | 1997-07-08 | Seagate Technology, Inc. | Multisample dynamic headspace sampler |
| JPH0244211A (ja) * | 1988-08-04 | 1990-02-14 | Sharp Corp | フローセンサ |
| US5231291A (en) * | 1989-08-01 | 1993-07-27 | Canon Kabushiki Kaisha | Wafer table and exposure apparatus with the same |
| JPH03156509A (ja) * | 1989-11-14 | 1991-07-04 | Stec Kk | マスフローコントローラ |
| DE69111493T2 (de) * | 1990-03-12 | 1996-03-21 | Ngk Insulators Ltd | Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten. |
| WO1991019959A1 (en) * | 1990-06-14 | 1991-12-26 | Unit Instruments, Inc. | Thermal mass flow sensor |
| US5062446A (en) * | 1991-01-07 | 1991-11-05 | Sematech, Inc. | Intelligent mass flow controller |
| US5436172A (en) * | 1991-05-20 | 1995-07-25 | Texas Instruments Incorporated | Real-time multi-zone semiconductor wafer temperature and process uniformity control system |
| KR940011791B1 (ko) * | 1992-04-15 | 1994-12-26 | 금성일렉트론주식회사 | 온도안정화 매스 플로우 컨트롤러 센서 |
| US5439026A (en) * | 1992-12-11 | 1995-08-08 | Tokyo Electron Limited | Processing apparatus and flow control arrangement therefor |
| US5441076A (en) * | 1992-12-11 | 1995-08-15 | Tokyo Electron Limited | Processing apparatus using gas |
| US5455014A (en) * | 1993-07-20 | 1995-10-03 | Hughes Aircraft Company | Liquid deposition source gas delivery system |
| JP2794081B2 (ja) * | 1994-03-15 | 1998-09-03 | 工業技術院長 | 燃料電池発電システム |
| US5601366A (en) * | 1994-10-25 | 1997-02-11 | Texas Instruments Incorporated | Method for temperature measurement in rapid thermal process systems |
| US5660207A (en) * | 1994-12-29 | 1997-08-26 | Tylan General, Inc. | Flow controller, parts of flow controller, and related method |
| US5811762A (en) * | 1996-09-25 | 1998-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heater assembly with dual temperature control for use in PVD/CVD system |
| US5911238A (en) * | 1996-10-04 | 1999-06-15 | Emerson Electric Co. | Thermal mass flowmeter and mass flow controller, flowmetering system and method |
-
1998
- 1998-09-09 US US09/150,458 patent/US6078030A/en not_active Expired - Lifetime
-
1999
- 1999-09-03 JP JP2000569296A patent/JP2002524864A/ja not_active Abandoned
- 1999-09-03 EP EP99945336A patent/EP1118051B1/en not_active Expired - Lifetime
- 1999-09-03 WO PCT/US1999/019885 patent/WO2000014616A1/en not_active Ceased
- 1999-09-08 TW TW088115459A patent/TW432451B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1118051A1 (en) | 2001-07-25 |
| JP2002524864A (ja) | 2002-08-06 |
| US6078030A (en) | 2000-06-20 |
| EP1118051B1 (en) | 2004-03-17 |
| WO2000014616A1 (en) | 2000-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12090266B2 (en) | Indirectly heated capillary aerosol generator | |
| US5577552A (en) | Temperature controlling device for mask and wafer holders | |
| WO2002012972A3 (en) | Direct temperature control for a component of a substrate processing chamber | |
| CN100364623C (zh) | 用于加热血液或其它生理流体的装置 | |
| TWI628717B (zh) | 加熱汽化系統和加熱汽化方法 | |
| EP1615001A3 (en) | Mass flowmeter | |
| JP2024096179A (ja) | 液状のホットメルト接着剤の質量流量を測定するためのセンサー装置 | |
| SE505095C2 (sv) | Anordning för förgasning av vätska och dosering av sålunda åstadkommen gas | |
| CN118623473A (zh) | 按需加热器和温度控制系统及相关方法 | |
| JP2005530141A (ja) | 圧力センサとともに使用するための温度調整器 | |
| JP2003273026A (ja) | 液体材料気化供給装置 | |
| WO2004073354A1 (en) | Electric heat tracing | |
| TW432451B (en) | Component heater for use in semiconductor manufacturing equipment | |
| US5680987A (en) | Thermally actuated, air-atomizing spray shower apparatus | |
| US20070272239A1 (en) | Dual chamber humidifier | |
| JP6460522B2 (ja) | 熱風ヒータコントロールシステム | |
| KR102791520B1 (ko) | 히팅 파이프 모듈 | |
| KR100395657B1 (en) | Mass flow controller | |
| FR2701863B1 (fr) | Réacteur thermique à tube à passage direct de courant. | |
| CN101218475A (zh) | 用于提供气体的方法及设备 | |
| TW201510488A (zh) | 用於測定由載氣運送之蒸汽之質量流量的裝置 | |
| CN116387189A (zh) | 用于加热和温度监测的方法和设备 | |
| KR100199008B1 (ko) | 화학기상증착형 원자층 에피택시 장치 및 화학기상증착 장치의 액체소스 증기 공급장치 | |
| KR20220159099A (ko) | 온도 센서가 구비된 에어 히터 | |
| JPH06214658A (ja) | 温度調節機能付きマスフローコントローラ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |