TW430685B - Epoxy resin liquid composition for semiconductor encapsulation - Google Patents
Epoxy resin liquid composition for semiconductor encapsulationInfo
- Publication number
- TW430685B TW430685B TW086110550A TW86110550A TW430685B TW 430685 B TW430685 B TW 430685B TW 086110550 A TW086110550 A TW 086110550A TW 86110550 A TW86110550 A TW 86110550A TW 430685 B TW430685 B TW 430685B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- liquid composition
- resin liquid
- semiconductor encapsulation
- silicone
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21596296 | 1996-07-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW430685B true TW430685B (en) | 2001-04-21 |
Family
ID=16681132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086110550A TW430685B (en) | 1996-07-30 | 1997-07-24 | Epoxy resin liquid composition for semiconductor encapsulation |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR980012311A (de) |
DE (1) | DE19732500A1 (de) |
FR (1) | FR2751977B1 (de) |
TW (1) | TW430685B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629296B (zh) * | 2013-09-30 | 2018-07-11 | 長瀨化成股份有限公司 | 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001055431A (ja) * | 1999-08-19 | 2001-02-27 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
US6342309B1 (en) * | 1999-08-19 | 2002-01-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device |
KR100517075B1 (ko) | 2003-08-11 | 2005-09-26 | 삼성전자주식회사 | 반도체 소자 제조 방법 |
WO2009142065A1 (ja) * | 2008-05-21 | 2009-11-26 | ナガセケムテックス株式会社 | 電子部品封止用エポキシ樹脂組成物 |
JP5353629B2 (ja) * | 2008-11-14 | 2013-11-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62184017A (ja) * | 1986-02-08 | 1987-08-12 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
JP2570002B2 (ja) * | 1991-05-29 | 1997-01-08 | 信越化学工業株式会社 | フリップチップ用封止材及び半導体装置 |
DE4138411C2 (de) * | 1991-11-22 | 1995-01-26 | Bosch Gmbh Robert | Härtende Vergußmassen |
JP3147677B2 (ja) * | 1994-09-30 | 2001-03-19 | 株式会社村田製作所 | 液状エポキシ樹脂組成物 |
-
1997
- 1997-07-24 TW TW086110550A patent/TW430685B/zh active
- 1997-07-29 KR KR1019970035857A patent/KR980012311A/ko not_active Application Discontinuation
- 1997-07-29 DE DE19732500A patent/DE19732500A1/de not_active Withdrawn
- 1997-07-30 FR FR9709736A patent/FR2751977B1/fr not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629296B (zh) * | 2013-09-30 | 2018-07-11 | 長瀨化成股份有限公司 | 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE19732500A1 (de) | 1998-02-05 |
FR2751977A1 (fr) | 1998-02-06 |
FR2751977B1 (fr) | 1999-06-11 |
KR980012311A (ko) | 1998-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |