TW429462B - Manufacturing method and processing device for semiconductor device - Google Patents

Manufacturing method and processing device for semiconductor device

Info

Publication number
TW429462B
TW429462B TW088106656A TW88106656A TW429462B TW 429462 B TW429462 B TW 429462B TW 088106656 A TW088106656 A TW 088106656A TW 88106656 A TW88106656 A TW 88106656A TW 429462 B TW429462 B TW 429462B
Authority
TW
Taiwan
Prior art keywords
manufacturing
wafer
polishing
semiconductor device
irregular pattern
Prior art date
Application number
TW088106656A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeo Moriyama
Kan Yasui
Yoshio Kawamura
Souichi Katagiri
Akinari Kawai
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW429462B publication Critical patent/TW429462B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW088106656A 1998-08-11 1999-04-26 Manufacturing method and processing device for semiconductor device TW429462B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22687298 1998-08-11
JP10127699A JP3770752B2 (ja) 1998-08-11 1999-04-08 半導体装置の製造方法及び加工装置

Publications (1)

Publication Number Publication Date
TW429462B true TW429462B (en) 2001-04-11

Family

ID=26442174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088106656A TW429462B (en) 1998-08-11 1999-04-26 Manufacturing method and processing device for semiconductor device

Country Status (4)

Country Link
US (1) US6612912B2 (https=)
JP (1) JP3770752B2 (https=)
KR (1) KR100574323B1 (https=)
TW (1) TW429462B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI606888B (zh) * 2013-07-24 2017-12-01 Disco Corp Crack thickness detection device
WO2018192285A1 (zh) 2017-04-17 2018-10-25 王宛婷 复合性材料
CN112025547A (zh) * 2020-09-15 2020-12-04 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113858034A (zh) * 2021-09-18 2021-12-31 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光系统

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6800020B1 (en) * 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
WO2002043923A1 (de) * 2000-11-29 2002-06-06 Infineon Technologies Ag Reinigungsvorrichtung zum reinigen von für das polieren von halbleiterwafern verwendeten poliertüchern
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
DE10314212B4 (de) * 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7658187B2 (en) * 2007-01-16 2010-02-09 John Budiac Adjustable stone cutting guide system
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP6243255B2 (ja) * 2014-02-25 2017-12-06 光洋機械工業株式会社 ワークの平面研削方法
CN104369104A (zh) * 2014-09-17 2015-02-25 浙江舜宇光学有限公司 一种可在线修锐金刚石丸片的装置、研磨机及其使用方法
CN104505337B (zh) * 2014-12-23 2017-05-17 无锡中微高科电子有限公司 一种不规则晶圆的减薄方法
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN113953909A (zh) * 2020-08-27 2022-01-21 薛震宇 一种建筑板材回收处理装置
CN112476243A (zh) * 2020-11-26 2021-03-12 华虹半导体(无锡)有限公司 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置
CN112892809B (zh) * 2021-02-05 2023-01-24 惠州大唐伟业电子有限公司 一种光学玻璃的超声加工装置
CN116936344B (zh) * 2023-07-24 2025-08-26 江苏邑文微电子科技有限公司 一种半导体材料的减薄抛光方法及减薄抛光装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184727A (ja) * 1982-04-23 1983-10-28 Disco Abrasive Sys Ltd シリコンウェ−ハの面を研削する方法
US5384986A (en) * 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
JPH07249601A (ja) 1994-03-10 1995-09-26 Hitachi Ltd 研削装置
JPH08168953A (ja) * 1994-12-16 1996-07-02 Ebara Corp ドレッシング装置
JPH0929630A (ja) * 1995-07-19 1997-02-04 Tokyo Seimitsu Co Ltd 表面研削方法
CN1197542A (zh) 1995-09-13 1998-10-28 株式会社日立制作所 抛光方法和设备
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
JP3111892B2 (ja) 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
DE69715952T2 (de) 1996-04-26 2003-08-07 Ebara Corp., Tokio/Tokyo Poliervorrichtung
KR100293863B1 (ko) * 1996-09-30 2001-09-17 아키오 하라 초지립공구와그제조방법
US5782675A (en) 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
JPH10128654A (ja) 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
DE69738012T2 (de) * 1996-11-26 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Halbleitervorrichtung und deren Herstellungsverfahren
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JP2845238B1 (ja) 1997-08-29 1999-01-13 日本電気株式会社 平面研磨装置
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
US6413149B1 (en) 1998-04-28 2002-07-02 Ebara Corporation Abrading plate and polishing method using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI606888B (zh) * 2013-07-24 2017-12-01 Disco Corp Crack thickness detection device
WO2018192285A1 (zh) 2017-04-17 2018-10-25 王宛婷 复合性材料
CN112025547A (zh) * 2020-09-15 2020-12-04 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113858034A (zh) * 2021-09-18 2021-12-31 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光系统

Also Published As

Publication number Publication date
KR100574323B1 (ko) 2006-04-26
JP3770752B2 (ja) 2006-04-26
KR20000017219A (ko) 2000-03-25
US6612912B2 (en) 2003-09-02
US20020119733A1 (en) 2002-08-29
JP2000117616A (ja) 2000-04-25

Similar Documents

Publication Publication Date Title
TW429462B (en) Manufacturing method and processing device for semiconductor device
DE69503408D1 (de) Vorrichtung zum chemisch-mechanischen Polieren mit verbesserter Verteilung der Polierzusammensetzung
TW376350B (en) Process for polishing a semiconductor device substrate
ATE296185T1 (de) Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau
EP1055486A3 (en) Dressing apparatus and polishing apparatus
TW344695B (en) Method for polishing semiconductor substrate
IL155856A0 (en) Abrasive article having a window system for polishing wafers, and methods
TW363218B (en) Integrated pad and belt for chemical mechanical polishing
EP1037262A3 (en) Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer
AU1683899A (en) Abrasive, method of polishing wafer, and method of producing semiconductor device
TW428225B (en) A method of polishing a surface of a substrate, a method of manufacturing semiconductor device, and an apparatus of manufacturing the same
CA2305106A1 (en) Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
EP0454362A3 (en) Backing pad, method for precision surface machining thereof, and method for polishing semiconductor wafer by use of the backing pad
HK1007701A1 (en) Polishing pad conditioning apparatus for wafer planarization process
WO2002053322A3 (en) System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
WO2002066206A3 (en) Wafer carrier and method of material removal from a semiconductor wafer
EP0874390A4 (en) GRINDING METHOD AND DEVICE
SG131737A1 (en) Polishing tool and polishing method and apparatus using same
GB2329601A (en) Methods and apparatus for the chemical mechanical planarization of electronic devices
TW376353B (en) Methods and apparatus for chemical mechanical planarization using a microreplicated surface
WO2003022523A1 (en) Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
TW355153B (en) A method for leveling abrasive cloth and device for the same
US6471566B1 (en) Sacrificial retaining ring CMP system and methods for implementing the same
TW375554B (en) Wafer holder for chemical and mechanical planarization machines
TW364867B (en) Polishing method, abrasive material, and polishing apparatus

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees