KR100574323B1 - 반도체장치의 제조방법 및 가공장치 - Google Patents

반도체장치의 제조방법 및 가공장치 Download PDF

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Publication number
KR100574323B1
KR100574323B1 KR1019990032722A KR19990032722A KR100574323B1 KR 100574323 B1 KR100574323 B1 KR 100574323B1 KR 1019990032722 A KR1019990032722 A KR 1019990032722A KR 19990032722 A KR19990032722 A KR 19990032722A KR 100574323 B1 KR100574323 B1 KR 100574323B1
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KR
South Korea
Prior art keywords
grindstone
powder
polishing
holding
semiconductor wafer
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Expired - Fee Related
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KR1019990032722A
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English (en)
Korean (ko)
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KR20000017219A (ko
Inventor
야스이칸
카타기리소우이치
모리야마시게오
카와무라요시오
카와아이료우세이
니시무라사다유키
사토마사히코
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
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Publication of KR20000017219A publication Critical patent/KR20000017219A/ko
Application granted granted Critical
Publication of KR100574323B1 publication Critical patent/KR100574323B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1019990032722A 1998-08-11 1999-08-10 반도체장치의 제조방법 및 가공장치 Expired - Fee Related KR100574323B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP98-226872 1998-08-11
JP22687298 1998-08-11
JP99-101276 1999-04-08
JP10127699A JP3770752B2 (ja) 1998-08-11 1999-04-08 半導体装置の製造方法及び加工装置

Publications (2)

Publication Number Publication Date
KR20000017219A KR20000017219A (ko) 2000-03-25
KR100574323B1 true KR100574323B1 (ko) 2006-04-26

Family

ID=26442174

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990032722A Expired - Fee Related KR100574323B1 (ko) 1998-08-11 1999-08-10 반도체장치의 제조방법 및 가공장치

Country Status (4)

Country Link
US (1) US6612912B2 (https=)
JP (1) JP3770752B2 (https=)
KR (1) KR100574323B1 (https=)
TW (1) TW429462B (https=)

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US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6800020B1 (en) * 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
WO2002043923A1 (de) * 2000-11-29 2002-06-06 Infineon Technologies Ag Reinigungsvorrichtung zum reinigen von für das polieren von halbleiterwafern verwendeten poliertüchern
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
DE10314212B4 (de) * 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7658187B2 (en) * 2007-01-16 2010-02-09 John Budiac Adjustable stone cutting guide system
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP6113015B2 (ja) * 2013-07-24 2017-04-12 株式会社ディスコ 割れ厚さ検出装置
JP6243255B2 (ja) * 2014-02-25 2017-12-06 光洋機械工業株式会社 ワークの平面研削方法
CN104369104A (zh) * 2014-09-17 2015-02-25 浙江舜宇光学有限公司 一种可在线修锐金刚石丸片的装置、研磨机及其使用方法
CN104505337B (zh) * 2014-12-23 2017-05-17 无锡中微高科电子有限公司 一种不规则晶圆的减薄方法
CN108721677B (zh) 2017-04-17 2021-11-19 广西美丽肤医疗器械有限公司 复合性材料
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN113953909A (zh) * 2020-08-27 2022-01-21 薛震宇 一种建筑板材回收处理装置
CN112025547B (zh) * 2020-09-15 2021-11-02 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN112476243A (zh) * 2020-11-26 2021-03-12 华虹半导体(无锡)有限公司 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置
CN112892809B (zh) * 2021-02-05 2023-01-24 惠州大唐伟业电子有限公司 一种光学玻璃的超声加工装置
CN113858034B (zh) * 2021-09-18 2023-06-30 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光系统
CN116936344B (zh) * 2023-07-24 2025-08-26 江苏邑文微电子科技有限公司 一种半导体材料的减薄抛光方法及减薄抛光装置

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPS58184727A (ja) * 1982-04-23 1983-10-28 Disco Abrasive Sys Ltd シリコンウェ−ハの面を研削する方法
US5384986A (en) * 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
JPH07249601A (ja) 1994-03-10 1995-09-26 Hitachi Ltd 研削装置
JPH08168953A (ja) * 1994-12-16 1996-07-02 Ebara Corp ドレッシング装置
JPH0929630A (ja) * 1995-07-19 1997-02-04 Tokyo Seimitsu Co Ltd 表面研削方法
CN1197542A (zh) 1995-09-13 1998-10-28 株式会社日立制作所 抛光方法和设备
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
JP3111892B2 (ja) 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
DE69715952T2 (de) 1996-04-26 2003-08-07 Ebara Corp., Tokio/Tokyo Poliervorrichtung
KR100293863B1 (ko) * 1996-09-30 2001-09-17 아키오 하라 초지립공구와그제조방법
US5782675A (en) 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
JPH10128654A (ja) 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
DE69738012T2 (de) * 1996-11-26 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Halbleitervorrichtung und deren Herstellungsverfahren
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JP2845238B1 (ja) 1997-08-29 1999-01-13 日本電気株式会社 平面研磨装置
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
US6413149B1 (en) 1998-04-28 2002-07-02 Ebara Corporation Abrading plate and polishing method using the same

Also Published As

Publication number Publication date
JP3770752B2 (ja) 2006-04-26
KR20000017219A (ko) 2000-03-25
US6612912B2 (en) 2003-09-02
US20020119733A1 (en) 2002-08-29
TW429462B (en) 2001-04-11
JP2000117616A (ja) 2000-04-25

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