TW429413B - Projection exposure device, projection exposure method, optical cleaning method, and the method of fabricating semiconductor device - Google Patents

Projection exposure device, projection exposure method, optical cleaning method, and the method of fabricating semiconductor device

Info

Publication number
TW429413B
TW429413B TW87117021A TW87117021A TW429413B TW 429413 B TW429413 B TW 429413B TW 87117021 A TW87117021 A TW 87117021A TW 87117021 A TW87117021 A TW 87117021A TW 429413 B TW429413 B TW 429413B
Authority
TW
Taiwan
Prior art keywords
wafer
transmittance
exposure
optical system
projection exposure
Prior art date
Application number
TW87117021A
Other languages
English (en)
Chinese (zh)
Inventor
Taro Ogata
Masahiro Nei
Original Assignee
Nippon Kogaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk filed Critical Nippon Kogaku Kk
Application granted granted Critical
Publication of TW429413B publication Critical patent/TW429413B/zh

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW87117021A 1997-12-08 1998-10-14 Projection exposure device, projection exposure method, optical cleaning method, and the method of fabricating semiconductor device TW429413B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33710497 1997-12-08
JP06702198A JP4029200B2 (ja) 1997-12-08 1998-03-17 投影露光装置、投影露光方法、光洗浄方法および半導体デバイスの製造方法

Publications (1)

Publication Number Publication Date
TW429413B true TW429413B (en) 2001-04-11

Family

ID=26408226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87117021A TW429413B (en) 1997-12-08 1998-10-14 Projection exposure device, projection exposure method, optical cleaning method, and the method of fabricating semiconductor device

Country Status (2)

Country Link
JP (1) JP4029200B2 (https=)
TW (1) TW429413B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121541419A (zh) * 2026-01-19 2026-02-17 中国科学院光电技术研究所 多工况补偿器参数计算方法、系统、介质和程序产品

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586954B2 (ja) * 2003-04-04 2010-11-24 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US7671347B2 (en) * 2006-10-10 2010-03-02 Asml Netherlands B.V. Cleaning method, apparatus and cleaning system
JP5314433B2 (ja) * 2009-01-06 2013-10-16 ギガフォトン株式会社 極端紫外光源装置
JP5312959B2 (ja) * 2009-01-09 2013-10-09 ギガフォトン株式会社 極端紫外光源装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121541419A (zh) * 2026-01-19 2026-02-17 中国科学院光电技术研究所 多工况补偿器参数计算方法、系统、介质和程序产品

Also Published As

Publication number Publication date
JP4029200B2 (ja) 2008-01-09
JP2002025880A (ja) 2002-01-25

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees