TW429306B - Wafer sensor for measuring temperature distribution - Google Patents

Wafer sensor for measuring temperature distribution

Info

Publication number
TW429306B
TW429306B TW089112308A TW89112308A TW429306B TW 429306 B TW429306 B TW 429306B TW 089112308 A TW089112308 A TW 089112308A TW 89112308 A TW89112308 A TW 89112308A TW 429306 B TW429306 B TW 429306B
Authority
TW
Taiwan
Prior art keywords
sensor
wafer
temperature distribution
pads
silver
Prior art date
Application number
TW089112308A
Other languages
English (en)
Inventor
Masaki Hayashi
Original Assignee
Hayashi Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hayashi Denko Kk filed Critical Hayashi Denko Kk
Application granted granted Critical
Publication of TW429306B publication Critical patent/TW429306B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW089112308A 1999-09-03 2000-06-22 Wafer sensor for measuring temperature distribution TW429306B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25002699A JP3386762B2 (ja) 1999-09-03 1999-09-03 温度分布計測用ウエハセンサ

Publications (1)

Publication Number Publication Date
TW429306B true TW429306B (en) 2001-04-11

Family

ID=17201743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089112308A TW429306B (en) 1999-09-03 2000-06-22 Wafer sensor for measuring temperature distribution

Country Status (3)

Country Link
JP (1) JP3386762B2 (zh)
KR (1) KR100387449B1 (zh)
TW (1) TW429306B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109724712A (zh) * 2017-10-31 2019-05-07 上海微电子装备（集团）股份有限公司 温度检测装置及其制造方法和激光表面退火设备
TWI729361B (zh) * 2018-03-15 2021-06-01 德商賀利氏先進傳感器技術有限公司 溫度感測器元件及其輸送系統和生產方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086649A (ja) * 2001-09-07 2003-03-20 Anritsu Keiki Kk 温度センサ付きウエハ
KR100479233B1 (ko) * 2001-11-15 2005-03-25 동부아남반도체 주식회사 온도 센서 제조 방법
KR101669537B1 (ko) * 2015-02-03 2016-10-26 해성디에스 주식회사 플렉서블 온도센서 및 그 제조방법
KR102076293B1 (ko) * 2017-11-30 2020-03-02 (주)제이디 온도보정기능을 가지는 센서 장착 웨이퍼 보관 장치
KR102016401B1 (ko) * 2017-12-12 2019-09-02 (주)제이디 센서 장착 웨이퍼의 온도 보정 시스템
CN107860483A (zh) * 2017-12-26 2018-03-30 上海理好智能科技有限公司 一种带温度传感器的发热器及其制备方法
KR102076291B1 (ko) * 2019-07-10 2020-02-11 (주)제이디 센서 장착 웨이퍼의 온도 보정 시스템
KR102435940B1 (ko) * 2019-10-31 2022-08-24 세메스 주식회사 기판 휨 모니터링 장치, 기판 휨 모니터링 방법, 기판 처리 장비 및 기판형 센서
CN113375824B (zh) * 2021-05-21 2023-06-16 成都凯天电子股份有限公司 一种具有补偿单元的大气总温传感器及其计算、选取方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298636A (ja) * 1988-10-05 1990-04-11 Fujitsu Ltd 基板温度測定機構
JPH02254331A (ja) * 1989-03-29 1990-10-15 Mitsubishi Electric Corp 測温装置
JPH05135849A (ja) * 1991-11-11 1993-06-01 Canon Inc ヒーター及び定着装置
JP2001066194A (ja) * 1999-08-27 2001-03-16 Nec Kyushu Ltd 温度測定装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109724712A (zh) * 2017-10-31 2019-05-07 上海微电子装备（集团）股份有限公司 温度检测装置及其制造方法和激光表面退火设备
CN109724712B (zh) * 2017-10-31 2021-04-30 上海微电子装备（集团）股份有限公司 温度检测装置及其制造方法和激光表面退火设备
TWI729361B (zh) * 2018-03-15 2021-06-01 德商賀利氏先進傳感器技術有限公司 溫度感測器元件及其輸送系統和生產方法

Also Published As

Publication number Publication date
JP2001074562A (ja) 2001-03-23
KR20010029847A (ko) 2001-04-16
JP3386762B2 (ja) 2003-03-17
KR100387449B1 (ko) 2003-06-18

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees